TLP155E
TOSHIBA Photocoupler IRED + Photo IC
TLP155E
Plasma Display Panel (PDP)
Industrial Inverter
MOS FET / IGBT Gate Driver
Unit: mm
6
5
4
4.55 ± 0.15
The Toshiba TLP155E consists of an infrared emitting diodes and integrated
high gain, high-speed photodetectors. The TLP155E is housed in the SO6
package.
The photodetector has an internal Faraday shield that provides a guaranteed
common-mode transient immunity of ±15 kV/μs. TLP155E is suitable for direct
gate driving circuit for IGBTs or power MOSFETs.
3
1
3.7 ± 0.15
Package type:
Peak Output Current : IOP = ±0.6 A (max)
Guaranteed performance over temperature:
Threshold Input Current:
IFLH = 7.5 mA (max)
Propagation delay time :
tpLH / tpHL = 200 ns (max)
Common mode transient immunity
:
±15 kV/μs (min)
Isolation voltage
:
3750 Vrms (min)
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A
File No.E67349
VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)
CQC-approved: GB4943.1, GB8898 Thailand Factory
SO6
0.4
0.15
Buffer logic type (Totem pole output)
0.1 2.1 ± 0.1
7.0 ± 0.4
0.5 min
1.27
-40 to 100 °C
2.54
JEDEC
―
JEITA
―
TOSHIBA
11-4L1
weight: 0.08 g (typ.)
Pin Configuration (Top View)
1
1:ANODE
3:CATHODE
4:GND
5:VO (Output)
6:VCC
6
5
3
4
SHIELD
Note 1: When a EN 60747-5-5 approved type is needed,
please designate the Option(V4).
Truth Table
Schematic
Input
LED
M1
M2
Output
H
ON
ON
OFF
H
L
OFF
OFF
ON
L
(M1)
IF
1+
VF
3−
Construction Mechanical Ratings
Creepage distance
5.0 mm (min)
Clearance distance
5.0 mm (min)
Insulation thickness
0.4 mm (min)
ICC 6
VCC
(M2)
SHIELD
IO 5
VO
4
GND
Start of commercial production
2010-08
© 2019
Toshiba Electronic Devices & Storage Corporation
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TLP155E
Absolute Maximum Ratings (Ta = 25 °C)
Characteristics
Symbol
Rating
Unit
IF
20
mA
ΔIF /°C
-0.63
mA/°C
Forward Current
Forward Current Derating
LED
Pulse Forward Current
(Ta ≥ 92°C)
(Note 1)
IFPT
1
A
Reverse Voltage
VR
5
V
Input Power Dissipation
PD
40
mW
ΔPD/°C
-1.2
mW/°C
Input Power Dissipation Derating (Ta ≥ 92°C)
Tj
125
°C
“H” Peak Output Current (Note 2)
IOPH
-0.6
A
“L” Peak Output Current (Note 2)
IOPL
0.6
A
Output Voltage
VO
35
V
Supply Voltage
VCC
35
V
PO
80
mW
ΔPO/°C
-2.0
mW/°C
Tj
125
°C
Operating frequency (Note 3)
f
250
kHz
Operating Temperature Range
Topr
-40 to 100
°C
Storage Temperature Range
Tstg
-55 to 125
°C
Lead Soldering Temperature (10 s)
Tsol
260
°C
Isolation Voltage (AC, 60 s, R.H.≤ 60 %) (Note 4)
BVs
3750
Vrms
DETECTOR
Junction Temperature
Output Power Dissipation
Output Power Dissipation Derating (Ta ≥ 85°C)
Junction Temperature
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant
change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the
operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc.).
Note 1: Pulse width ≤ 1 μs, 300 pps.
Note 2: Exponential waveform pulse width PW ≤ 2 μs, f ≤ 10 kHz, VCC = 20 V, Ta = -40 to 100 °C
Note 3: Exponential waveform pulse width PW ≤ 80 ns, IOPH ≥ -0.25 A, IOPL ≤ 0.25 A, VCC = 20V, Ta = -40 to 100 °C
Note 4: This device is regarded as a two terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6.
Recommended Operating Conditions
Characteristics
Symbol
Min
Typ.
Max
Unit
Input Current, High Level (Note 1)
IFLH
10
-
15
mA
Input Voltage, Low Level
VFHL
0
-
0.8
V
Supply Voltage*
Peak output current
Operating Temperature
VCC
10
-
30
V
IOPH/ IOPL
-
-
±0.2
A
Topr
-40
-
100
°C
* This item denotes operating range, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Note 1: Input signal rise time (fall time) < 0.5 μs.
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TLP155E
Electrical Characteristics (Ta = −40 to 100 °C, unless otherwise specified)
Symbol
Test
Circuit
VF
―
IF = 10 mA, Ta = 25 °C
∆VF/∆Ta
―
Input reverse current
IR
Input capacitance
CT
Characteristics
Forward voltage
Temperature coefficient of forward
voltage
“H” Level
IOPH1
Test Condition
Min
Typ.*
Max
Unit
1.40
1.55
1.80
V
IF = 10 mA
―
-1.8
―
mV/°C
―
VR = 5 V, Ta = 25 °C
―
―
10
μA
―
VF = 0 V, f = 1 MHz, Ta = 25 °C
―
60
―
pF
VCC = 15 V
IF = 10 mA
V6-5 = 4 V
―
-0.5
-0.2
1
V6-5 = 10 V
―
―
-0.4
V5-4 = 2 V
0.2
0.5
―
V5-4 = 10 V
0.4
―
―
IO = −100 mA,
IF = 10 mA
6.0
8.4
―
IO = 100 mA,
VF = 0.8 V
―
0.3
1.0
IF = 10 mA
―
1.5
3.0
IF = 0 mA
―
1.5
3.0
IOPH2
Output current
(Note 1)
“L” Level
IOPL1
VCC = 15 V
IF = 0 mA
2
IOPL2
“H” Level
3
VOH
VCC = 10 V
Output voltage
A
V
“L” Level
VOL
4
“H” Level
ICCH
5
“L” Level
ICCL
6
VCC = 10 to 20 V
VO=Open
Threshold input current
L → H
IFLH
―
VCC = 15 V, VO > 1 V
―
1.0
7.5
mA
Threshold input voltage
H → L
VFHL
―
VCC = 15 V, VO < 1 V
0.8
―
―
V
VCC
―
10
―
30
V
Supply current
Supply voltage
―
mA
*All typical values are at Ta=25°C.
Note:
This product is more sensitive than conventional products to electrostatic discharge (ESD) owing to its low
power consumption design. It is therefore all the more necessary to observe general precautions regarding
ESD when handling this component.
Note 1: Duration of IO time ≤ 50 μs, 1 pulse
Isolation Characteristics (Ta = 25 °C)
Characteristics
Symbol
Capacitance input to output
Test Condition
CS
VS = 0 V , f = 1MHz
Isolation resistance
RS
R.H. ≤ 60 %, VS = 500 V
Isolation voltage
BVS
AC, 60 s
Min
Typ.
Max
Unit
(Note 1)
―
0.8
―
pF
(Note 1)
1×1012
1014
―
Ω
3750
―
―
Vrms
Note 1: This device is regarded as a two terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6.
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TLP155E
Switching Characteristics (NOTE)(Ta = −40 to 100 °C, unless otherwise specified)
Characteristics
Propagation delay time
Symbol
Test
Circuit
Test Condition
Min
Typ.*
Max
L → H
tpLH
Ta = 25 °C
IF = 0 → 10 mA
―
120
170
H → L
tpHL
Ta = 25 °C
IF = 10 → 0 mA
―
120
170
L → H
tpLH
VCC = 20 V
IF = 0 → 10 mA
50
120
200
H → L
tpHL
Rg = 30 Ω
IF = 10 → 0 mA
50
120
200
IF = 0 ↔ 10 mA
-85
―
85
IF = 0 ↔ 10 mA
―
5
50
7
Propagation delay skew (Note 1)
Switching time dispersion
tpsk
Cg = 1 nF
F = 250 kHz
Duty = 50 %
| tpHL-tpLH |
ns
Output rise time (10−90 %)
tr
IF = 0 → 10 mA
―
35
―
Output fall time (90−10 %)
tf
IF = 10 → 0 mA
―
15
―
−15
―
―
Common mode transient immunity at
HIGH level output
CMH
8
Common mode transient immunity at
LOW level output
CML
VCM =1000
Vp-p
VCC = 20 V
Ta = 25 °C
IF = 10 mA
VO (min) = 16 V
Unit
kV/μs
IF = 0 mA
VO (max) = 1 V
15
―
―
( * ): All typical values are at Ta = 25 °C.
Note: A ceramic capacitor (0.1 μF) should be connected from pin 6 (VCC) to pin 4 (GND) to stabilize the operation of the
high gain linear amplifier. Failure to provide the bypass may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
Note 1: Propagation delay skew is defined as the difference between the largest and smallest propagation delay time (i.e.
tpHL or tpLH) of multiple samples. Evaluations of these samples are conducted under identical test conditions
(supply voltage, input current, temperature, etc.).
© 2019
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TLP155E
Test Circuit 1: IOPH
1
Test Circuit 2: IOPL
1
6
6
V6-5
A
IF
IOPH
5 0.1μF
5
VCC
0.1μF
IOPL
A
VCC
V5-4
3
3
4
Test Circuit 3: VOH
1
6
Test Circuit 4: VOL
1
VO
V
6
0.1μF
VOL
VF
IF
5 0.1μF
3
4
IO
5
VCC
3
4
V
IO
VCC
4
*VOH =VCC-VO
Test Circuit 5: ICCH
6
IF
Test Circuit 6: ICCL
ICCH
6
ICCL
A
A
0.1μF
0.1μF
5
3
1
5
VCC
3
4
© 2019
Toshiba Electronic Devices & Storage Corporation
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VCC
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TLP155E
Test Circuit 7: tpLH, tpHL, tr, tf, |tpHL-tpLH|
IF=10mA (P.G)
(f=250kHz, duty=50%, tr=tf=5ns)
6
1
0.1 μF
IF
5
3
IF
VO
Rg = 30 Ω
tr
VOH
tf
VCC
Cg = 1
nF
90%
50%
10%
VO
4
tpHL
tpLH
VOL
Test Circuit 8: CMH, CML
IF
1
6
VCM
SW
A
B
5
1000 V
90%
0.1μF
VO
10%
tr
tf
VCC
• SW A: IF = 10 mA
4
3
VO
VCM
+
−
CMH
16V
1V
CML
• SW B: IF = 0
mA
CML
=
CMH = −
800 V
tr (μs)
800 V
tf (μs)
CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with the output
voltage in the LOW (HIGH) state.
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TLP155E
I F – Ta
Input forward current IF
Input forward current IF
(mA)
(mA)
I F – VF
Ta = 100°C
80°C
50°C
25°C
0°C
−20°C
−40°C
Input forward voltage
VF (V)
Ambient temperature Ta (°C)
IFLH – Ta
VCC = 15 V
VO > 1 V
Threshold input current (L/H)
IFLH (mA)
Output power dissipation PO (mW)
P O – Ta
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
ICCL – Ta
ICCH – Ta
High-level supply current ICCH (mA)
Low-level supply current ICCL (mA)
This curve shows the maximum
limit to the input forward current.
IF = 0 mA
VCC = 30 V
Ambient temperature Ta (°C)
IF = 10 mA
VCC = 30 V
Ambient temperature Ta (°C)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TLP155E
VOL – Ta
VOH – Ta
IF = 10 mA
IO = -100 mA
(V)
High-level output voltage VOH
Low-level output voltage VOL
(V)
VF = 0.8 V
IO = 100mA
VCC = 10 V
VCC = 30 V
Ambient temperature Ta (°C)
VCC= 30 V
VCC = 10 V
Ambient temperature Ta (°C)
(VOH – VCC) – IOPH
VCC = 15 V
IF = 10 mA
High-level output voltage drop
VOH – VCC (V)
Low-level output voltage VOL
(V)
VOL – IOPL
VCC = 15 V
IF = 0 mA
Ta = 100°C
Ta = 25°C
Ta = 100°C
Ta = 25°C
Ta = −40°C
Peak low-level output current IOPL
(A)
Peak high-level output current IOPH
tpLH, tpHL, |tpHL – tpLH| – VCC
(A)
tpLH, tpHL, |tpHL – tpLH| – Ta
Ta = 25°C, f = 250 kHz, Duty = 50%
Propagation delay time, Pulse width distortion
tpLH, tpHL, |tpHL – tpLH| (ns)
Propagation delay time, Pulse width distortion
tpLH, tpHL, |tpHL – tpLH| (ns)
Ta = −40°C
Rg = 30 Ω, Cg = 1 nF, IF = 10 mA
tpLH
tpHL
|tpHL － tpLH|
Supply voltage VCC (V)
IF = 10 mA, f = 250 kHz, Duty = 50%
Rg = 30 Ω, Cg = 1 nF, VCC = 20 V
tpLH
tpHL
|tpHL － tpLH|
Ambient temperature Ta (°C)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
© 2019
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TLP155E
Propagation delay time, Pulse width distortion
tpLH, tpHL, |tpHL – tpLH| (ns)
tpLH, tpHL, |tpHL – tpLH| – IF
Ta = 25°C, f = 250 kHz, Duty = 50%
Rg = 30 Ω, Cg = 1 nF, VCC = 20 V
tpLH
tpHL
|tpHL － tpLH|
Input forward current
IF
(mA)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
© 2019
Toshiba Electronic Devices & Storage Corporation
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TLP155E
PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &
GENERAL STORAGE
(1) Precautions for Soldering
When soldering, please prevent the temperature rise of this product as much as possible within the
following conditions for both soldering iron method and reflow method.
The following profile is indicated as the maximum value of the heat resistance of this product.
Depending on the type of solder paste to be used, please set the preheat temperature and
thermal temperature to optimized temperature within the profile.
1) When Using Soldering Reflow
An example of a temperature profile when lead(Pb)-free solder is used
The soldering temperature profile is based on the package surface temperature
(See the figure above.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being
2 weeks.
2) When using soldering Flow
Preheat the device at a temperature of 150 °C (package surface temperature) for 60 to 120
seconds.
Mounting condition of 260 °C within 10 seconds is recommended
Flow soldering must be performed once.
3) When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3
seconds not exceeding 350 °C
Heating by soldering iron must be done only once per lead
© 2019
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TLP155E
(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.
2) When transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5 ˚C
to 35 ˚C, and relative humidity should be maintained at between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature
changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices while they are in storage.
8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.
© 2019
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TLP155E
Specification for Embossed–Tape Packing (TPL)(TPR) for SO6 Coupler
1. Applicable Package
Package
Product Type
SO6
Mini-flat coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example)
TLP155E (TPL,E)
[[G]]/RoHS COMPATIBLE (Note)
Tape type
Device name
3. Tape Dimensions
3.1 Specification Classification Are as Shown in Table 1
Table 1 Tape Type Classification
Tape type
Classification
Quantity
(pcs / reel)
TPL
L direction
3000
TPR
R direction
3000
3.2 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Direction of Tape
L direction
R direction
Figure 1
© 2019
Toshiba Electronic Devices & Storage Corporation
Device Orientation
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TLP155E
3.3 Empty Device Recesses Are as Shown in Table 2.
Table 2
Empty Device Recesses
Standard
Occurrences of 2 or more
successive empty device
recesses
Remarks
Within any given 40mm section of
tape, not including leader and trailer
0 device
Single empty device
recesses
6 devices (max) per reel
Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns
only for a cover tape.
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3.
+0.1
φ1.5 −0
G
A
K0
12.0 ± 0.3
B
D
E
0.3 ± 0.05
F
φ1.6 ± 0.1
2.95 ± 0.2
Unit: mm
Figure 2
Tape Forms
Table 3 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
Symbol
Dimension
Remark
A
4.0
―
B
7.6
―
D
5.5
Center line of indented square hole and sprocket hole
E
1.75
Distance between tape edge and hole center
F
8.0
G
4.0
+0.1
Cumulative error -0.3 (max) per 10 feed holes
+0.1
Cumulative error -0.3 (max) per 10 feed holes
K0
2.6
© 2019
Toshiba Electronic Devices & Storage Corporation
Internal space
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TLP155E
3.6 Reel
A
C
U
B
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4.
E
W1
W2
Figure 3
Table 4
Reel Form
Reel Dimensions
Unit: mm
Symbol
Dimension
A
Φ330 ±2
B
Φ80 ±1
C
Φ13 ±0.5
E
2.0 ±0.5
U
4.0 ±0.5
W1
13.5 ±0.5
W2
17.5 ±1.0
4. Packing
Packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard, the
quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the
following example.
(Example)
TLP155E (TPL,E)
3000 pcs
Quantity (must be a multiple of 3000)
[[G]]/RoHS COMPATIBLE (Note)
Tape type
Device name
Note
: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on
the restriction of the use of certain hazardous substances in electrical and electronic equipment.
© 2019
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TLP155E
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical
equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to
control combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative or contact us via our website.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of
Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled
substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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Toshiba Electronic Devices & Storage Corporation
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2019-05-27
