TLP176G
TOSHIBA Photocoupler IRED & Photo-MOS FET
TLP176G
Modem-Fax Cards
PBX
STB
Measurement Equipment
Unit mm
The TOSHIBA TLP176G consists of an infrared emitting diode optically
coupled to a photo-MOS FET in a SOP, which is suitable for surface mount
assembly.
Because of the high-voltage MOSFET used to output terminals,
TLP176G is suitable for a hook relay of a modem, a facsimile, and dial pulls
relay.
•
4-pin SOP(2.54SOP4)
•
Peak off-state voltage: 350 V (min)
On-state current:120 mA (max)
•
Trigger LED current: 3 mA (max)
•
On-state resistance: 35 Ω (max)
•
Isolation voltage: 1500 Vrms (min)
•
UL-recognized: UL 1577, File No.E67349
•
cUL-recognized: CSA Component Acceptance Service No.5A
File No.E67349
―
JEITA
―
TOSHIBA
VDE-approved: EN 60747-5-5 (Note 1)
•
JEDEC
11-5H1
Weight: 0.1 g (typ.)
Note 1: When a VDE approved type is needed,
please designate the Option(V4).
Pin Configuration (top view)
4
1
Schematic
1-Form-A
4
3
1
2
1
4
2
3
3
2
1.
2.
3.
4.
: Anode
: Cathode
: Drain
: Drain
Start of commercial production
1997-10
© 2019
Toshiba Electronic Devices & Storage Corporation
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2019-06-17
TLP176G
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
IF
50
mA
ΔIF / °C
-0.5
mA / °C
Pulse forward current (100μs pulse,100pps)
IFP
1
A
Reverse voltage
VR
5
V
Diode power dissipation
PD
50
mW
ΔPD /°C
-0.5
mW/°C
Tj
125
°C
VOFF
350
V
ION
120
mA
ΔlON / °C
-1.2
mA / °C
PO
300
mW
ΔPO / °C
-3.0
mW / °C
Tj
125
°C
PT
350
mW
ΔPT / °C
-3.5
mW / °C
Storage temperature range
Tstg
-55 to 125
°C
Operating temperature range
Topr
-40 to 85
°C
Lead soldering temperature(10 s)
Tsol
260
°C
Isolation voltage (AC, 60 s, R.H.≤ 60 %) (Note 1)
BVS
1500
Vrms
Forward current
LED
Forward current derating (Ta ≥ 25°C)
Diode power dissipation derating (Ta ≥ 25°C)
Junction temperature
Off-state output terminal voltage
Detector
On-state current
On-state current derating (Ta ≥ 25°C)
Output power dissipation
Output power dissipation derating (Ta ≥ 25°C)
Junction temperature
Total power dissipation
Total power dissipation derating(Ta ≥ 25°C)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two-terminal device: Pin 1 and 2 shorted together and pin 3 and 4 shorted together.
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ.
Max
Unit
Supply voltage
VDD
―
―
280
V
Forward current
IF
5
7.5
25
mA
On-state current
ION
―
―
100
mA
Operating temperature
Topr
-20
―
65
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
© 2019
Toshiba Electronic Devices & Storage Corporation
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2019-06-17
TLP176G
Electrical Characteristics (Ta = 25°C)
Detector
LED
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Forward voltage
VF
IF = 10mA
1.0
1.15
1.3
V
Reverse current
IR
VR = 5V
―
―
10
μA
Capacitance
CT
VF = 0 V, f = 1 MHz
―
30
―
pF
Off-state current
IOFF
VOFF = 350 V
―
―
1
μA
Capacitance between terminals
COFF
V = 0 V, f = 1 MHz
―
40
―
pF
Min
Typ.
Max
Unit
ION = 120 mA
―
1
3
mA
Coupled Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Trigger LED current
IFT
On-state resistance
RON
ION = 120 mA, IF = 5 mA
―
22
35
Ω
Return LED current
IFC
IOFF = 100 μA
0.1
mA
Min
Typ.
Max
Unit
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Capacitance input to output
CS
VS = 0 V, f = 1 MHz
Isolation resistance
RS
VS = 500 V, R.H ≤ 60 %
Isolation voltage
BVS
AC, 60 s
―
0.8
―
pF
5×1010
1014
―
Ω
1500
―
―
Vrms
Min
Typ.
Max
Unit
―
0.3
1
―
0.1
1
Switching Characteristics (Ta = 25°C)
Characteristic
Symbol
Turn-on time
tON
Turn-off time
tOFF
Test Condition
RL = 200 Ω
VDD = 20 V, IF = 5 mA
(Note 2)
ms
Note 2: Switching time test circuit
IF
TLP176G
1
4
2
3
RL
VDD
IF
VOUT
VOUT
tON
© 2019
Toshiba Electronic Devices & Storage Corporation
3
90%
10%
tOFF
2019-06-17
TLP176G
IF – Ta
ION – Ta
100
140
ION (mA)
60
On-state current
Allowable forward current
IF (mA)
120
80
40
20
100
80
60
40
20
0
-20
0
20
40
60
80
100
0
-20
120
Ambient temperature Ta (°C)
0
20
50
Ta = 25 °C
100
Ta = 25 °C
(mA)
30
1000
500
Forward current IF
Allowable pulse forward current
IFP (mA)
80
I F – VF
100
Pulse width ≤ 100 μs
3000
60
Ambient temperature Ta (°C)
IFP – DR
5000
40
300
100
50
30
10
10
5
3
1
0.5
0.3
10-3
10-2
10-1
0.1
0.6
100
0.8
Duty cycle ratio DR
1.0
1.2
Forward voltage
ΔVF /ΔTa – IF
1.4
1.6
1.8
2.6
3.0
VF (V)
IFP – VFP
1000
-2.0
-1.6
-1.2
-0.8
(mA)
-2.4
300
IFP
500
100
Pulse forward current
Forward voltage temperature
coefficient ΔVF /ΔTa (mV/°C)
-2.8
50
30
10
Pulse width ≤ 10 μs
5
Repetitive
3
Frequency = 100 Hz
Ta = 25 °C
-0.4
0.1
0.3 0.5
1
3
5
Forward current IF
10
(mA)
30
50
1
0.6
1.0
1.4
1.8
2.2
Pulse forward voltage VFP
(V)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
© 2019
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Toshiba Electronic Devices & Storage Corporation
TLP176G
IFT – Ta
ION – VON
150
ION = 120 mA
ION
(mA)
4
3
On-sate current
Trigger LED current
IFT
(mA)
5
2
1
0
-40
-20
0
20
40
60
80
Ta = 25 °C
IF = 5 mA
100
50
0
-50
-100
-150
-2.5
100
-1.5
-0.5
RON – Ta
IF = 5 mA
IOFF (nA)
(Ω)
Off-state current
On-state resistance RON
20
10
VOFF = 350 V
-20
0
20
40
60
80
300
100
50
30
10
5
3
1
-20
100
0
Ambient temperature Ta (°C)
20
40
60
VDD = 20 V
RL = 200 Ω
(μs)
I = 5 mA
800 F
Turn - off time tOFF
(μs)
RL = 200 Ω
Turn - on time tON
100
tOFF – Ta
400
VDD = 20 V
600
400
200
-20
80
Ambient temperature Ta (°C)
tON – Ta
0
-40
(V)
500
30
1000
2.5
IOFF – Ta
1000
ION = 120 mA
0
-40
1.5
On-state voltage VON
Ambient temperature Ta (°C)
40
0.5
0
20
40
60
Ambient temperature Ta (°C)
80
100
IF = 5 mA
300
200
100
0
-40
-20
0
20
40
60
80
100
Ambient temperature Ta (°C)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
© 2019
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2019-06-17
Toshiba Electronic Devices & Storage Corporation
TLP176G
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical
equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to
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infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
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WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
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except in compliance with all applicable export laws and regulations.
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substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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Toshiba Electronic Devices & Storage Corporation
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2019-06-17