TLP2095(F)

TLP2095 TOSHIBA PHOTOCOUPLER IRED & PHOTO-IC TLP2095 Unit: mm Programmable controllers Microprocessor system interfaces The Toshiba TLP2095 consists of two infrared emitting diodes optically coupled to a high-gain, high-speed photodetector. The TLP2095 is housed in a 6-pin MFSOP. With a totem-pole output, the TLP2095 is capable of both sinking and sourcing current. The TLP2095 has an internal Faraday shield, which provides a guaranteed common-mode transient immunity of ±10 kV/μs. The TLP2095 has a noninverting output. An inverting-output version, the TLP2098, is also available.  Buffer logic type (totem-pole output)  Guaranteed Performance Over Temperature: -40 to 100°C  Power Supply Voltage: 3.0 to 20 V  Input Threshold Current: IFLH =±3 mA (max)  Switching Time (tpLH/tpHL): 250 ns (max)  Common mode transient immunity: ±15 kV/µs  Isolation Voltage: 3750 Vrms  UL-recognized: UL 1577, File No.E67349  cUL-recognized: CSA Component Acceptance Service No.5A JEDEC ― JEITA ― TOSHIBA 11-4C2 Weight: 0.09 g (typ.) Pin Configuration (top view) File No.E67349  VDE-approved : EN 60747-5-5 (Note 1) VCC 1 6 Note 1: When a VDE approved type is needed, 5 please designate the Option(V4). 3 Truth Table Input H L LED ON OFF Tr1 ON OFF Tr2 OFF ON 4 Output H L Schematic ICC 6 VCC 0.1 µF bypass capacitor must be connected between pin 6 and 4 IF1 Tr1 1＋ GND SHIELD 1 : Anode Cathode 3 : Cathode Anode 4 : GND 5 : Output 6 : VCC IO VF 3－ Tr2 5 VO IF2 GND SHIELD © 2019 Toshiba Electronic Devices & Storage Corporation Start of commercial production 4 2009-05 1 2019-06-03 TLP2095 Recommended Operating Conditions CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT Input Current, ON IF(ON) 5 ― 15 mA Input Voltage, OFF VF(OFF) 0 ― 0.8 V Supply Voltage* VCC 3.0 ― 20 V Operating Temperature Topr -40 ― 100 °C * This item denotes operating range, not meaning of recommended operating conditions. Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Absolute Maximum Ratings (Ta = 25°C) CHARACTERISTIC SYMBOL RATING UNIT IF ±20 mA ∆IF/ΔTa -0.48 mA/˚C IFPT ±1 A PD 40 mW ΔPD/ΔTa -0.96 mW/°C Output Current 1 (Ta ≤ 25 °C) IO1 25/-15 mA Output Current 2 (Ta ≤ 100 °C) IO2 5/-5 mA Output Voltage VO -0.5 to 20 V Supply Voltage VCC -0.5 to 20 V PO 75 mW Forward Current LED Forward Current Derating (Ta ≥ 83 °C) Peak Transient Forward Current (Note 1) Input Power Dissipation DETECTOR Input power dissipation derating (Ta ≥ 83 °C) Output Power Dissipation ΔPO /ΔTa -0.75 mW/°C Operating Temperature Range Output Power Dissipation Derating (Ta ≥ 25°C) Topr -40 to 100 °C Storage Temperature Range Tstg -55 to 125 °C Lead Solder Temperature (10 s) Tsol 260 °C BVs 3750 Vrms Isolation Voltage (AC, 60 s, R.H.≤ 60 %) (Note 2) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc.). Note 1: Pulse width ≤ 1 µs, 300 pps. Note 2: Device considered a two terminal device: pins 1 and 3 shorted together and pins 4, 5 and 6 shorted together. © 2019 Toshiba Electronic Devices & Storage Corporation 2 2019-06-03 TLP2095 Electrical Characteristics (Unless otherwise specified, Ta = -40 to 100°C, VCC = 3.0 to 20 V) TEST CHARACTERISTIC SYMBOL CONDITION CIRCUIT MIN TYP. MAX UNIT 1.45 1.57 1.75 V VF ― IF = 10 mA , Ta = 25 °C ΔVF/ΔTa ― IF = 10 mA ― -2.0 ― mV/°C CT ― V = 0 V, f = 1 MHz , Ta = 25 °C ― 190 - pF Logic Low Output Voltage VOL 1 IOL = 0.02 mA, VF = 0.8 V ― 0.2 0.6 V 2.5 ― VOH 2 IOH = -0.02 mA VCC = 3.0 V 2.0 Logic High Output Voltage IF = 5 mA 17.4 19.5 ― Input Forward Voltage Temperature Coefficient of Forward Voltage Input Capacitance VCC = 20 V V Logic Low Supply Current ICCL 3 VF = 0 V ― ― 3.0 mA Logic High Supply Current ICCH 4 IF = 5 mA ― ― 3.0 mA 80 ― 5 VF = 0 V VCC = VO = 4.5 V 15 IOSL VCC = VO = 20 V 20 90 ― VCC = 4.5 V -12 ― 6 IF = 5 mA -5 IOSH VO = GND VCC = 20 V -10 -20 ― IFLH ― IO = -0.02 mA, VO> 2.4 V ― 1.0 3.0 mA VFHL ― IO = 0.02 mA, VO< 0.6 V 0.8 ― ― V IHYS ― VCC = 5 V ― 0.05 ― mA Logic Low Short Circuit Output Current (Note 3) Logic High Short Circuit Output Current (Note 3) Input Current Logic High Output Input Voltage Logic Low Output Input Current Hysteresis mA mA *All typical values are at VCC = 5 V, Ta = 25 °C Note 3: Duration of output short circuit time should not exceed 10 ms. Isolation Characteristics (Ta = 25°C) Characteristic Symbol Capacitance input to output CS Isolation resistance RS Isolation voltage BVS © 2019 Toshiba Electronic Devices & Storage Corporation Test Condition VS = 0 V, f = 1 MHz (Note 2) R.H. ≤ 60 %,VS = 500 V (Note 2) AC, 60 s 3 (Note 2) MIN TYP. MAX Unit ― 0.8 ― pF 1×1012 1014 ― Ω 3750 ― ― Vrms 2019-06-03 TLP2095 Switching Characteristics (Unless otherwise specified, Ta = -40 to 100°C, VCC = 3.0 to 20 V) CHARACTERISTIC TEST CIRCUIT SYMBOL Propagation Delay Time tpLH to Logic High output Propagation Delay Time tpHL to Logic Low output 7, 8 Switching Time Dispersion Rise Time (10 – 90 %) tr Fall Time (90 – 10 %) tf Common Mode transient UNIT IF = 0→5 mA 30 150 250 ns IF = 5→0 mA 30 150 250 ns ― ― 220 ns IF = 0→5 mA, VCC = 5 V ― 30 75 ns IF = 5→0 mA, VCC = 5 V ― 30 75 ns -15 ― ― kV/µs 15 ― ― kV/µs ― VCM = 1000 Vp-p, IF = 0 mA, CML Immunity at Low Level Output MAX VCC = 20 V, Ta = 25 °C 9 Common Mode transient TYP. VCM = 1000 Vp-p, IF = 5 mA, CMH Immunity at High Level Output MIN (Note 4) |tpHL−tpLH| between ON and OFF CONDITION VCC = 20 V, Ta = 25 °C *All typical values are at Ta = 25 °C Note 4: VCC = 4.5 to 20 V at test circuit 7. TEST CIRCUIT 1: VOL TEST CIRCUIT 2: VOH 6 1 IF 1 → VCC 0.1µF 5 3 GND SHIELD 6 VCC VOL IOL 4 5 ↑ VCC 3 ↑ V GND 4 SHIELD V VO ↑ IOH VCC 0.1µF 0.1µF *VOH= VCC-VO TEST CIRCUIT 3: ICCL 6 1 TEST CIRCUIT 4: ICCH ICCL IF 1 → A VCC 5 3 GND SHIELD 4 VCC 3 3 A GND 4 SHIELD VCC 0.1µF TEST CIRCUIT 6: IOSH 6 GND 4 SHIELD ICCH 5 0.1µF IF → VCC 5 VCC ↑ TEST CIRCUIT 5: IOSL 1 6 1 0.1µF A 5 ↑ IOSL 6 VCC A VCC 3 VO © 2019 Toshiba Electronic Devices & Storage Corporation 4 0.1µF GND 4 SHIELD IOSH VO VCC 2019-06-03 TLP2095 TEST CIRCUIT 7: Switching Time Test Circuit IF=5 mA (P.G) (f=50 kHz, duty=50%, VCC less than tr=tf=5 ns) IF 5V 50% 6 1 IF VO VCC 3 tpHL VOH 90% VO 4 GND tpLH 620 Ω 0.1µF 5 5 kΩ CL SHIELD 1.3V 10% VOL tr tf CL is approximately 15 pF which includes probe and stray capacitance. P.G.: Pulse generator TEST CIRCUIT 8: Switching Time Test Circuit IF=5 mA (P.G) (f=50 kHz, duty=50%, less than tr=tf=5 ns) IF 6 1 IF VCC 5 50% 0.1µF VO 3 GND tpLH VCC 4 CL SHIELD tpHL VOH 90% VO 1.3V 10% VOL tr tf CL is approximately 15 pF which includes probe and stray capacitance. P.G.: Pulse generator TEST CIRCUIT 9: Common Mode Transient Immunity Test Circuit IF → SW A 6 1 90% 1000Ｖ VCC B 5 10% 0.1µF 3 tr VCM VO tf VCC GND 4 SHIELD CMH ・SW A : IF=5mA VCM 17V VO 0.6V ・SW B : IF=0mA CM © 2019 Toshiba Electronic Devices & Storage Corporation 5 H = 800(V ) t f ( µs ) CML CM L = 800(V ) t r ( µs ) 2019-06-03 TLP2095 Soldering and Storage 1. Soldering 1.1 Soldering When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) Using solder reflow ∙Temperature profile example of lead (Pb) solder (°C) Package surface temperature 240 This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. 210 160 140 less than 30s 60 to 120s Time (s) ∙Temperature profile example of using lead (Pb)-free solder (°C) Package surface temperature 260 This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. 230 190 180 60 to 120s 30 to 50s Time (s) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder) ・Please preheat it at 150°C between 60 and 120 seconds. ・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once. 3) Using a soldering iron Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may be heated at most once. © 2019 Toshiba Electronic Devices & Storage Corporation 6 2019-06-03 TLP2095 2. Storage 1) Avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) Follow the precautions printed on the packing label of the device for transportation and storage. 3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75% respectively. 4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. 5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) When restoring devices after removal from their packing, use anti-static containers. 7) Do not allow loads to be applied directly to devices while they are in storage. 8) If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. © 2019 Toshiba Electronic Devices & Storage Corporation 7 2019-06-03 TLP2095 Specification for Embossed–Tape Packing (TPL)(TPR) for Mini-flat Coupler 1. Applicable Package Package Product Type MFSOP Mini-flat coupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP2095 (TPL, F) [[G]]/RoHS COMPATIBLE Tape type Device name (Note 5) 3. Tape Dimensions 3.1 Specification Classification are as shown in Table 1 Table 1 Tape Type Classification Tape type Classification Quantity (pcs / reel) TPL L direction 3000 TPR R direction 3000 3.2 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Direction of Tape L direction R direction Figure 1 © 2019 Toshiba Electronic Devices & Storage Corporation Device Orientation 8 2019-06-03 TLP2095 3.3 Empty Device Recesses are as shown in Table 2. Table 2 Empty Device Recesses Occurrences of 2 or more successive empty device recesses Single empty recesses device Standard Remarks 0 device Within any given 40-mm section of tape, not including leader and trailer 6 devices (max) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape. 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3. Unit: mm +0.1 φ1.5 −0 G A K0 12.0 ± 0.3 B D E 0.3 ± 0.05 F φ1.6 ± 0.1 3.15 ± 0.2 Figure 2 Tape Forms Table 3 Tape Dimensions Unit: mm Unless otherwise specified: ±0.1 Symbol Dimension Remark A 4.2 ― B 7.6 ― D 5.5 Centre line of indented square hole and sprocket hole E 1.75 Distance between tape edge and hole center +0.1 Cumulative error -0.3 (max) per 10 feed holes Cumulative error +0.1 (max) per 10 feed holes -0.3 Internal space F 8.0 G 4.0 K0 2.8 © 2019 Toshiba Electronic Devices & Storage Corporation 9 2019-06-03 TLP2095 3.6 Reel (1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4. Table 4 Reel Dimensions E A C U B Unit: mm Symbol Dimension A Φ330±2 B Φ80±1 C Φ13±0.5 E 2.0±0.5 U 4.0±0.5 W1 13.5±0.5 W2 17.5±1.0 W1 Figure 3 W2 Reel Form 4. Packing Packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example) (Example) TLP2095 (TPL, F) 3000 pcs Quantity (must be a multiple of 3000) [[G]]/RoHS COMPATIBLE (Note 5) Tape type Device name Note 5 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. © 2019 Toshiba Electronic Devices & Storage Corporation 10 2019-06-03 TLP2095 RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”. Hardware, software and systems described in this document are collectively referred to as “Product”. • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative or contact us via our website. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. https://toshiba.semicon-storage.com/ © 2019 Toshiba Electronic Devices & Storage Corporation 11 2019-06-03