TLP2166A(F)

TLP2166A TOSHIBA PHOTOCOUPLER IRED & PHOTO-IC TLP2166A Plasma Display Panels (PDPs) Unit: mm High-Speed Interfaces 3.3-V Voltage Source The Toshiba TLP2166A consists of an infrared emitting diode and an integrated high-gain, high-speed photodetector. The TLP2166A is housed in the 8-pin SO package. Since the TLP2166A contains two photocouplers, it saves board space. The TLP2166A operates with a 3.3-V supply voltage.  Inverting logic output (totem-pole output)  SO8 package  Guaranteed performance over -40 to 100°C  Power supply voltage: 3.0 to 3.6 V  Input threshold current: IFHL = 3 mA (max) Switching time (tpHL / tpLH): 75 ns (max)   Switching speed: 15 MBd (typ.)(NRZ)  Common-mode transient immunity: ±15 kV/μs    Isolation voltage: 2500 Vrms UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349  VDE-approved: EN 60747-5-5 JEDEC ― JEITA ― TOSHIBA 11−5K1S Weight: 0.11 g (typ.) (Note 1) Note 1 : When a VDE approved type is needed, please designate the Option(V4). Truth Table Input H L LED1(2) ON OFF M1(3) OFF ON M2(4) ON OFF Output 1(2) L H 1 Schematic ICC IF1 1＋ LED1 M2 SHIELD 3－ LED2 3 7 4 VO1 GND SHIELD 8 1: ANODE 1 2: CATHODE 1 3: CATHODE 2 7 4: ANODE 2 5: GND 6 6: VO2 (Output2) 7: VO1 (Output1) 5 8: VCC A bypass capacitor of 0.1μF must be connected between pins 8 and 5. M3 IO2 VF2 4＋ 2 M1 IO1 VCC 8 VCC VF1 2－ Pin Configuration (Top View) M4 IF2 SHIELD © 2019 Toshiba Electronic Devices & Storage Corporation 6 VO2 5 Start of commercial production 2008-07 GND 1 2019-06-03 TLP2166A Absolute Maximum Ratings (Ta=25°C) DETECTOR LED CHARACTERISTIC SYMBOL RATING UNIT Forward Current (Note 1) IF 15 mA Forward Current Derating (Ta ≥ 95°C) (Note 1) ⊿IF/⊿Ta -0.5 mA/°C Peak Transient Forward Current (Note 1, 2) IFP 1 A Reverse Voltage (Note 1) VR 5 V Input Power Dissipation (Note 1) PD 40 mW Input Power Dissipation Derating (Ta ≥ 95°C) (Note 1) ⊿PD/°C -1.3 mW/°C Output Current (Note 1) IO 10 mA Output Voltage (Note 1) VO 6 V Supply Voltage VCC 6 V Output Power Dissipation PO 40 mW Output Power Dissipation Derating (Ta ≥ 25°C) ⊿PO/°C -0.4 mW/°C Operating Temperature Range Topr -40 to 100 °C Storage Temperature Range Tstg -55 to 125 °C Lead Soldering Temperature Isolation Voltage (AC, 60 s, R.H.≤ 60 %) (10 s) Tsol 260 °C (Note 3) BVS 2500 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Each Channel. Note 2: Pulse width ≤ 1 μs, 300 pps. Note 3: This device is regarded as a two terminal device: pins 1, 2, 3 and 4 are shorted together, as are pins 5, 6, 7 and 8. Recommended Operating Conditions CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT Input Current, ON (Note 1) IF(ON) 5 ― 10 mA Input Voltage, OFF (Note 1) VF(OFF) 0 ― 0.8 V Supply Voltage* (Note 4) VCC 3.0 3.3 3.6 V Topr -40 ― 100 °C Operating Temperature * This item denotes operating range, not meaning of recommended operating conditions. Note 4: The detector of this product requires a power supply voltage (VCC) of 3.0 V or higher for stable operation. If the VCC is lower than this value, an ICCH may increase, or an output may be unstable. Be sure to use the product after checking the supply current, and the operation of a power-on/-off Note: A ceramic capacitor (0.1 μF) should be connected from pin 8 (VCC) to pin 5 (GND) to stabilize the operation of the high gain linear amplifier. Failure to provide the bypass may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm. © 2019 Toshiba Electronic Devices & Storage Corporation 2 2019-06-03 TLP2166A Electrical Characteristics (Unless otherwise specified, Ta = -40 to 100 °C, VCC = 3.0 to 3.6 V) Symbol Test Circuit VF ― (Note 1) ΔVF/ΔTa Input Reverse Current (Note 1) Input Capacitance (Note 1) Characteristic Input Forward Voltage Temperature Coefficient of Forward Voltage (Note 1) Condition Min Typ. Max Unit IF = 10 mA, Ta = 25 °C 1.3 1.65 1.75 V ― IF = 10 mA ― -2.0 ― mV/°C IR ― VR = 5 V, Ta = 25 °C ― ― 10 μA CT ― V = 0 V, f = 1 MHz, Ta = 25 °C ― 45 ― pF ― 0.3 0.6 V 2.0 2.6 ― V ― 7.0 10.0 mA ― 4.0 10.0 mA 3.0 ― 3.6 V IOL =1.6 mA, IF = 10 mA, Logic Low Output Voltage (Note 1) VOL 1 Logic High Output Voltage (Note 1) VOH 2 Logic Low Supply Current ICCL 3 IF = 10 mA Logic High Supply Current ICCH 4 VF = 0 V Operating Supply Voltage VCC ― (Note 1) IFHL ― IO = 1.6 mA, VO < 0.6 V ― ― 3 mA (Note 1) VFLH ― IO = -0.02 mA, VO > 2.0 V 0.8 ― ― V Input Current Logic Low Output Input Voltage Logic High Output VCC = 3.3 V IOH = -0.02 mA, VF = 1.05 V VCC = 3.3 V (Note 4) ― *All typical values are at Ta=25°C. Isolation Characteristics (Ta = 25°C) Characteristic Symbol Capacitance input to output CS Test Condition VS = 0 V, f = 1 MHz Isolation resistance RS R.H. ≤ 60 %, VS = 500 V Isolation voltage BVS AC, 60 s © 2019 Toshiba Electronic Devices & Storage Corporation 3 Min Typ. Max Unit (Note 3) ― 0.8 ― pF (Note 3) 1×1012 1014 ― Ω 2500 ― ― Vrms (Note 3) 2019-06-03 TLP2166A Switching Characteristics (Unless otherwise specified, Ta=-40 to 100°C､VCC=3.0 to 3.6 V)(Each Channel) Characteristic Test Circuit Symbol Propagation Delay Time tpHL to Logic Low output Propagation Delay Time IF = 0→7.5 mA tpLH to Logic High output Switching Time Dispersion IF = 7.5→0 mA 5 |tpHL-tpLH| between ON and OFF Condition CL = 15 pF (Note 6) tf IF = 0→7.5 mA Rise Time (10 – 90 %) tr IF = 7.5→0 mA VO(min) = 2 V, Ta = 25 °C 6 Common Mode transient VCM = 1000 Vp-p, IF = 7.5 mA, CML Immunity at Low Level Output RIN = 100 Ω CL = 15 pF (Note 6) VCM = 1000 Vp-p, IF = 0 mA, CMH Immunity at High Level Output CL = 15 pF (Note 6) IF = 7.5 mA, RIN = 100 Ω, Fall Time (90 – 10 %) Common Mode transient RIN = 100 Ω VO(max) = 0.6 V, Ta = 25 °C Min Typ. Max Unit ― ― 75 ns ― ― 75 ns ― ― 45 ns ― 5 ― ns ― 5 ― ns 15000 ― ― V/μs -15000 ― ― V/μs *All typical values are at Ta = 25 °C, VCC = 3.3 V. Note 6: CL is approximately 15 pF which includes probe and jig/stray wiring capacitance. TEST CIRCUIT 1: VOL Test Circuit 1 8 IF 2 VCC 3 4 F 2 7 6 GND SHIELD TEST CIRCUIT 2: VOH Test Circuit 8 1 V 5 IO 0.1 μF V VOL VCC F1 2 VCC 4 IF2 A GND SHIELD 2 0.1 μF 5 © 2019 Toshiba Electronic Devices & Storage Corporation IO V GND SHIELD 5 VO VCC 0.1 μF TEST CIRCUIT 4: ICCH Test Circuit ICCH 1 8 7 6 3 7 6 3 4 TEST CIRCUIT 3: ICCL Test Circuit ICCL 1 8 I VCC VCC 3 VCC 4 4 7 6 GND SHIELD 5 A 0.1 μF VCC 2019-06-03 TLP2166A TEST CIRCUIT 5: Switching Time Test Circuit IF=7.5 mA(P.G) (f=5 MHz, duty=50%) 1 IF monitor VCC 8 IF 7 2 3 6 4 GND VO tpHL 0.1 μF VCC 5 VOH tpLH 90% CL SHIELD CL=15 pF 50% VOL RIN=100 Ω 1.5 V 10% tr tf CL includes probe and stray capacitance. P.G.: Pulse generator TEST CIRCUIT 6: Common-Mode Transient Immunity Test Circuit IF SW A → B 1 VCC 8 7 2 4 GND VCM 0.1 μF VO 6 3 1000 V 90% 5 10% VCC tr CMH ・SW B: IF=0 mA 2V VO SHIELD tf 0.6 V CML ・SW A: IF=7.5 mA ＋ VCM － © 2019 Toshiba Electronic Devices & Storage Corporation CM H = 5 800(V ) 800(V ) CM L = tf ( µs ) tr ( µs ) 2019-06-03 TLP2166A Specification for Embossed–Tape Packing (TP) for SO8 Coupler 1. Applicable Package Package Product Type SO8 Photocoupler 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP2166A (TP) Tape type Device name 3. Tape Dimensions 3.1 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Figure 1 Device Orientation 3.2 Tape Packing Quantity:2500 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table 1 Empty Device Recesses Standard Occurrences of 2 or more successive empty device recesses Single empty device recesses Remarks Within any given 40-mm section of tape, not including leader and trailer 0 device 6 devices (max) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape. © 2019 Toshiba Electronic Devices & Storage Corporation 6 2019-06-03 TLP2166A 3.5 Tape Specification (1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2. F Unit: mm B D E G φ1.6 ± 0.1 K0 12.0 ± 0.3 +0.1 0.3 ± 0.05 φ1.5 −0 A 3.3 ± 0.1 Figure 2 Tape Forms Table 2 Tape Dimensions Unit: mm Unless otherwise specified: ±0.1 Symbol Dimension Remark A 6.5 ― B 5.6 ― D 5.5 Center line of indented square hole and sprocket hole E 1.75 F 8.0 G 4.0 K0 3.1 Distance between tape edge and hole center Cumulative error +0.1 -0.3 (max) per 10 feed holes Cumulative error +0.1 (max) per 10 feed holes -0.3 Internal space © 2019 Toshiba Electronic Devices & Storage Corporation 7 2019-06-03 TLP2166A 3.6 Reel A C U B (1) Material: Plastic (protection against electrostatics) (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3. W2 Figure 3 Table 3 Reel Form Reel Dimensions Unit: mm Symbol Dimension A Φ330 ±2 B Φ80 ±1 C Φ13 ±0.5 E 2.0 ±0.5 U 4.0 ±0.5 W1 13.5 ±0.5 W2 17.5 ±1.0 4. Packing Packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example) TLP2166A (TP) 2500 pcs Quantity (must be a multiple of 2500) Tape type 1 Device name © 2019 Toshiba Electronic Devices & Storage Corporation 8 2019-06-03 TLP2166A Precautions of Surface Mounting Type Photocoupler Soldering & General Storage (1) Precautions for Soldering 1) When Using Soldering Reflow  An example of a temperature profile when Sn-Pb eutectic solder is used:  An example of a temperature profile when lead(Pb)-free solder is used:  Reflow soldering must be performed once or twice.  The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)  Apply preheating of 150 °C for 60 to 120 seconds.  Mounting condition of 260 °C or less within 10 seconds is recommended.  Flow soldering must be performed once 3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)  Complete soldering within 10 seconds for lead temperature not exceeding °C or within 3 seconds not exceeding 350 °C.  Heating by soldering iron must be only once per 1 lead © 2019 Toshiba Electronic Devices & Storage Corporation 9 2019-06-03 TLP2166A (2) Precautions for General Storage 1) Do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) When transportation or storage of devices, follow the cautions indicated on the carton box. 3) The storage area temperature should be kept within a temperature range of 5 °C to 35 °C, and relative humidity should be maintained at between 45% and 75%. 4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions. 5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) When repacking devices, use anti-static containers. 7) Do not apply any external force or load directly to devices while they are in storage. 8) If devices have been stored for more than two years, even though the above conditions have been followed, it is recommended that solderability of them should be tested before they are used. © 2019 Toshiba Electronic Devices & Storage Corporation 10 2019-06-03 TLP2166A RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”. Hardware, software and systems described in this document are collectively referred to as “Product”. • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative or contact us via our website. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. https://toshiba.semicon-storage.com/ © 2019 Toshiba Electronic Devices & Storage Corporation 11 2019-06-03