TLP2358
Photocouplers
GaAℓAs Infrared LED & Photo IC
TLP2358
1. Applications
•
Intelligent Power Module Signal Isolation
•
Programmable Logic Controllers (PLCs)
•
High-Speed Digital Interfacing for Instrumentation and Control Devices
2. General
The Toshiba TLP2358 consists of a GaAℓAs light-emitting diode coupled with a high-gain, high-speed photo
detector. It is housed in the SO6 package. The detector has a totem-pole output stage with current sourcing and
sinking capabilities. The TLP2358 has an internal Faraday shield that provides a guaranteed common-mode
transient immunity of ±20 kV/µs. The TLP2358 has an inverter output. A buffer output version, the TLP2355,
is also available.
3. Features
(1)
Inverter logic type (totem pole output)
(2)
Package: SO6
(3)
Supply voltage: 3 to 20 V
(4)
Threshold input current, high to low: 1.6 mA (max)
(5)
Propagation delay time: 250 ns (max)
(6)
Pulse width distortion: 70 ns (max)
(7)
Common-mode transient immunity: ±20 kV/µs (min)
(8)
Operating temperature: -40 to 125
(9)
Isolation voltage: 3750 Vrms (min)
(10) Safety standards
UL-approved: UL1577, File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)
CQC-approved: GB4943.1, GB8898 Thailand Factory
Note 1: When a VDE approved type is needed, please designate the Option (V4)
(V4).
Start of commercial production
©2016-2017
Toshiba Electronic Devices & Storage Corporation
1
2011-09
2017-07-11
Rev.5.0
TLP2358
4. Packaging and Pin Assignment
1: Anode
3: Cathode
4: GND
5: VO (output)
6: VCC
11-4L1S
5. Internal Circuit (Note)
Note:
A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4.
6. Principle of Operation
6.1. Truth Table
Input
LED
Output
H
ON
L
L
OFF
H
6.2. Mechanical Parameters
Characteristics
Min
Unit
Creepage distances
5.0
mm
Clearance
5.0
Internal isolation thickness
0.4
©2016-2017
Toshiba Electronic Devices & Storage Corporation
2
2017-07-11
Rev.5.0
TLP2358
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
LED
Symbol
Input forward current
Note
Rating
Unit
20
mA
-0.6
mA/
1
A
∆IFPT/∆Ta
-25
mA/
PD
40
mW
∆PD/∆Ta
-1.0
mW/
VR
5
V
mA
IF
Input forward current derating
(Ta ≥ 116 )
Peak transient input forward
current
∆IF/∆Ta
IFPT
Peak transient input forward
current derating
(Ta ≥ 110 )
Input power dissipation
Input power dissipation
derating
(Ta ≥ 110 )
Input reverse voltage
(Note 1)
Detector Output current
(Ta ≤ 25 )
IO
25/-15
Output current
(Ta = 125 )
IO
5/-5
VO
-0.5 to 20
V
Output voltage
Output power dissipation
(Ta ≤ 25 )
PO
75
mW
Output power dissipation
derating
(Ta ≥ 25 )
∆PO/∆Ta
-0.6
mW/
Supply voltage
Common Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
VCC
-0.5 to 20
V
Topr
-40 to 125
Tstg
-55 to 125
(10 s)
Tsol
(AC, 60 s, R.H. ≤ 60 %)
BVS
260
(Note 2)
3750
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 1 µs, 300 pps
Note 2: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4, 5 and 6 are
shorted together.
8. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Input on-state current
IF(ON)
(Note 1)
2
10
mA
Input off-state voltage
VF(OFF)
0
0.8
V
Supply voltage
VCC
(Note 2)
3
20
Operating temperature
Topr
(Note 2)
-40
125
Note:
The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this data sheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note 1: The rise and fall times of the input on-current should be less than 0.5 µs.
Note 2: Denotes the operating range, not the recommended operating condition.
©2016-2017
Toshiba Electronic Devices & Storage Corporation
3
2017-07-11
Rev.5.0
TLP2358
9. Electrical Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125 , VCC = 3 to 20 V)
Characteristics
Input forward voltage
Input forward voltage
temperature coefficient
Symbol
Note
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
VF
IF = 10 mA, Ta = 25
1.45
1.55
1.70
V
∆VF/∆Ta
IF = 10 mA
-2.0
mV/
Input reverse current
IR
VR = 5 V, Ta = 25
10
µA
Input capacitance
Ct
V = 0 V, f = 1 MHz
60
pF
Low-level output voltage
VOL
Fig.
12.1.1
IO = 3.5 mA, IF = 5 mA
0.2
0.6
V
High-level output voltage
VOH
Fig.
12.1.2
VCC = 3 V, IO = -2.6 mA,
VF = 0.8 V
1.78
2.1
VCC = 20 V, IO = -2.6 mA,
VF = 0.8 V
17.4
19.1
(Note 1)
Low-level supply current
ICCL
Fig.
12.1.3
VCC = 3.6 V, IF = 5 mA
1.4
3.0
VCC = 20 V, IF = 5 mA
1.5
3.0
High-level supply current
ICCH
Fig.
12.1.4
VCC = 3.6 V, VF = 0 V
1.9
3.0
VCC = 20 V, VF = 0 V
2.0
3.0
Fig.
12.1.5
VCC = VO = 3.6 V, IF = 5 mA
15
100
VCC = VO = 20 V, IF = 5 mA
20
140
Fig.
12.1.6
VCC = 3.6 V, VF = 0 V,
VO = GND
-14
-5
VCC = 20 V, VF = 0 V,
VO = GND
-24
-10
Low-level short-circuit output
current
IOSL
High-level short-circuit output
current
IOSH
(Note 2)
(Note 2)
mA
Threshold input current (H/L)
IFHL
IO = 3.5 mA, VO < 0.4 V
0.6
1.6
Threshold input voltage (L/H)
VFLH
IO = -2.6 mA, VO > 2.4 V
0.8
V
Input current hysteresis
IHYS
VCC = 5 V
0.05
mA
Min
Typ.
Max
Unit
0.8
pF
1 × 1012
1014
Ω
Vrms
Note: All typical values are at Ta = 25 .
Note 1: VOH = VCC - VO (V)
Note 2: Duration of output short circuit time should not exceed 10 ms.
10. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Conditions
Total capacitance (input to
output)
CS
(Note 1) VS = 0 V, f = 1 MHz
Isolation resistance
RS
(Note 1) VS = 500 V, R.H. ≤ 60 %
Isolation voltage
BVS
(Note 1) AC, 60 s
3750
AC, 1 s in oil
10000
DC, 60 s in oil
10000
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4, 5 and 6 are
shorted together.
©2016-2017
Toshiba Electronic Devices & Storage Corporation
4
2017-07-11
Rev.5.0
TLP2358
11. Switching Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125 , VCC = 3 to 20 V)
Characteristics
Propagation delay time (L/H)
Propagation delay time (H/L)
Pulse width distortion
Propagation delay skew
(device to device)
Symbol
Note
tpLH
Test Circuit
Fig. 12.1.7
tpHL
|tpHL-tpLH|
Test Condition
Min
Typ.
Max
Unit
IF = 3 → 0 mA
100
250
ns
IF = 0 → 3 mA
100
250
IF = 3 mA
20
70
-130
130
tpsk
Rise time
tr
IF = 3 → 0 mA, VCC = 5 V
15
75
Fall time
tf
IF = 0 → 3 mA, VCC = 5 V
12
75
VCM = 1000 Vp-p, IF = 0 mA,
VCC = 20 V, Ta = 25
±20
±25
VCM = 1000 Vp-p, IF = 5 mA,
VCC = 20 V, Ta = 25
±20
±25
Common-mode transient
immunity at output high
CMH
Common-mode transient
immunity at output low
CML
Note:
Fig. 12.1.8
kV/µs
All typical values are at Ta = 25 .
©2016-2017
Toshiba Electronic Devices & Storage Corporation
5
2017-07-11
Rev.5.0
TLP2358
12. Test Circuits and Characteristics Curves
12.1. Test Circuits
Fig. 12.1.1 VOL Test Circuit
Fig. 12.1.2 VOH Test Circuit
Fig. 12.1.3 ICCL Test Circuit
Fig. 12.1.4 ICCH Test Circuit
Fig. 12.1.5 IOSL Test Circuit
Fig. 12.1.6 IOSH Test Circuit
Fig. 12.1.7 Switching Time Test Circuit and Waveform
©2016-2017
Toshiba Electronic Devices & Storage Corporation
6
2017-07-11
Rev.5.0
TLP2358
Fig. 12.1.8 Common-Mode Transient Immunity Test Circuit and Waveform
©2016-2017
Toshiba Electronic Devices & Storage Corporation
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2017-07-11
Rev.5.0
TLP2358
12.2. Characteristics Curves (Note)
Fig. 12.2.1 IF - VF
Fig. 12.2.2 IF - Ta
Fig. 12.2.3 VOL - Ta
Fig. 12.2.4 VOH - Ta
Fig. 12.2.5 VOH - Ta
Fig. 12.2.6 VOH - Ta
©2016-2017
Toshiba Electronic Devices & Storage Corporation
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2017-07-11
Rev.5.0
TLP2358
Fig. 12.2.7 ICCL - Ta
Fig. 12.2.8 ICCH - Ta
Fig. 12.2.9 IOSL - Ta
Fig. 12.2.10 IOSH - Ta
Fig. 12.2.11 IFHL - Ta
Fig. 12.2.12 VO - IF
©2016-2017
Toshiba Electronic Devices & Storage Corporation
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2017-07-11
Rev.5.0
TLP2358
Fig. 12.2.13 VO - IF
Fig. 12.2.14 tpHL,tpLH,|tpHL-tpLH| - Ta
Fig. 12.2.15 tpHL,tpLH,|tpHL-tpLH| - Ta
Fig. 12.2.16 tpHL,tpLH,|tpHL-tpLH| - Ta
Fig. 12.2.17 tpHL,tpLH,|tpHL-tpLH| - VCC
Fig. 12.2.18 tpHL,tpLH,|tpHL-tpLH| - IF
©2016-2017
Toshiba Electronic Devices & Storage Corporation
10
2017-07-11
Rev.5.0
TLP2358
Fig. 12.2.19 tpHL,tpLH,|tpHL-tpLH| - IF
Note:
The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
©2016-2017
Toshiba Electronic Devices & Storage Corporation
11
2017-07-11
Rev.5.0
TLP2358
13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
•
When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
•
When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2. Precautions for General Storage
•
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
•
Follow the precautions printed on the packing label of the device for transportation and storage.
•
Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
•
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
When restoring devices after removal from their packing, use anti-static containers.
•
Do not allow loads to be applied directly to devices while they are in storage.
•
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
©2016-2017
Toshiba Electronic Devices & Storage Corporation
12
2017-07-11
Rev.5.0
TLP2358
14. Land Pattern Dimensions (for reference only)
Unit: mm
15. Marking
©2016-2017
Toshiba Electronic Devices & Storage Corporation
13
2017-07-11
Rev.5.0
TLP2358
16. EN60747-5-5 Option (V4) Specification
•
Part number: TLP2358 (Note 1)
•
The following part naming conventions are used for the devices that have been qualified according to
option (V4) of EN60747.
Example: TLP2358(V4-TPL,E(T
V4: EN60747 option
TPL: Tape type
E: [[G]]/RoHS COMPATIBLE (Note 2)
T: Domestic ID (Country/Region of origin: Thailand)
Note 1: Use TOSHIBA standard type number for safety standard application.
e.g., TLP2358(V4-TPL,E(T → TLP2358
Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
Fig. 16.1 EN60747 Isolation Characteristics
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Toshiba Electronic Devices & Storage Corporation
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2017-07-11
Rev.5.0
TLP2358
Fig. 16.2 Insulation Related Specifications (Note)
Note:
This photocoupler is suitable for safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig. 16.3 Marking on Packing
Fig. 16.4 Marking Example (Note)
Note:
The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN60747.
©2016-2017
Toshiba Electronic Devices & Storage Corporation
15
2017-07-11
Rev.5.0
TLP2358
Fig. 16.5 Measurement Procedure
©2016-2017
Toshiba Electronic Devices & Storage Corporation
16
2017-07-11
Rev.5.0
TLP2358
17. Specifications for Embossed-Tape Packing
17.1. Applicable Package
Package Name
Product Type
SO6
Mini flat coupler
17.2. Product Naming Conventions
Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification
is as below.
Example) TLP2358(TPL,E(T
Part number: TLP2358
Tape type: TPL
[[G]]/RoHS COMPATIBLE: E (Note 1)
Domestic ID (Country/Region of origin: Thailand): T
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
17.3. Tape Dimensions Specification
Tape Type
Division
Packing Amount
(A unit per reel)
TPL
L direction
3000
TPR
R direction
3000
17.3.1. Orientation of Device in Relation to Direction of Feed
Device orientation in the carrier cavities as shown in the following figure.
Device Orientation
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2017-07-11
Rev.5.0
TLP2358
17.3.2. Empty Cavities
Characteristics
Criterion
Occurrences of 2 or more
successive empty cavities
Remarks
0 device
Single empty cavity
Within any given 40-mm section of tape, not including leader
and trailer
6 devices (max) per reel
Not including leader and trailer
17.3.3. Tape Leader and Trailer
The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and a cover
tape of 30 mm or longer.
17.3.4. Tape Dimensions
Tape material: Plastic (for protection against static electricity)
Table
Tape Dimensions (unit: mm, tolerance: ±0.1)
Symbol
Dimension
Remark
A
4.0
B
7.6
D
5.5
Center line of embossed cavity and sprocket hole
E
1.75
Distance between tape edge and sprocket hole center
F
8.0
Cumulative error +0.1/-0.3 (max) per 10 empty cavities holes
G
4.0
Cumulative error +0.1/-0.3 (max) per 10 sprocket holes
K0
2.6
Internal space
©2016-2017
Toshiba Electronic Devices & Storage Corporation
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2017-07-11
Rev.5.0
TLP2358
17.3.5. Reel Specification
Material: Plastic (for protection against static electricity)
Table
Reel Dimensions (unit: mm)
Symbol
Dimension
A
φ330 ± 2.0
B
φ80 ± 1.0
C
φ13 ± 0.5
E
2.0 ± 0.5
©2016-2017
Toshiba Electronic Devices & Storage Corporation
U
4.0 ± 0.5
W1
13.5 ± 0.5
W2
17.5 ± 1.0
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TLP2358
17.4. Packing (Note)
1 reel/carton (unit: mm)
Note:
Taping reel diameter: φ330 mm
17.5. Label Format
(1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc.
(2) Reel: The label provides the part number, the taping name, quantity, lot number, etc.
17.6. Ordering Information
When placing an order, please specify the part number, tape type and quantity as shown in the following example.
Example) TLP2358(TPL,E(T 3000 pcs
Part number: TLP2358
Tape type: TPL (12-mm pitch)
[[G]]/RoHS COMPATIBLE: E (Note 1)
Domestic ID (Country/Region of origin: Thailand): T
Quantity (must be a multiple of 3000): 3000 pcs
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
©2016-2017
Toshiba Electronic Devices & Storage Corporation
20
2017-07-11
Rev.5.0
TLP2358
Package Dimensions
Unit: mm
Weight: 0.08 g (typ.)
Package Name(s)
TOSHIBA: 11-4L1S
©2016-2017
Toshiba Electronic Devices & Storage Corporation
21
2017-07-11
Rev.5.0
TLP2358
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA".
Hardware, software and systems described in this document are collectively referred to as "Product".
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales
representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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