TLP240GA(TP1,F

TLP240GA,TLP240GAF Photocouplers Photorelay TLP240GA,TLP240GAF 1. Applications • Mechanical relay replacements • Security Systems • Measuring Instruments • Factory Automation (FA) • Amusement Equipment • Smart Meters • Electricity Meters 2. General The TLP240GA and TLP240GAF photorelay consist of a photo MOSFET optically coupled to an infrared LED. They are housed in a 4-pin DIP package. They provide an isolation voltage of 5000 Vrms, making them suitable for applications that require reinforced insulation. 3. Features (1) Halogen-free For details, see "Devices in Halogen-Free Resin Packages" at the end of this datasheet. (2) Normally opened (1-Form-A) (3) OFF-state output terminal voltage: 400 V (min) (4) Trigger LED current: 3 mA (max) (5) ON-state current: 120 mA (max) (6) ON-state resistance: 28 Ω (max, t < 1 s), 35 Ω (max, Continuous) (7) Isolation voltage: 5000 Vrms (min) (8) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 UL-recognized: UL 508, File No.E499232 (Note 1) CQC-approved: GB4943.1, GB8898 Japan Factory VDE-approved: EN 60747-5-5, EN 62368-1 (Note 2) Note 1: Please refer Absolute Maximum Ratings (UL-recognized UL 508) for UL 508 products. Note 2: When a VDE approved type is needed, please designate the Option (D4) (D4). 4. Mechanical Parameters 7.62-mm Pitch TLP240GA 10.16-mm Pitch TLP240GAF Unit Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) Characteristics Start of commercial production ©2016-2020 Toshiba Electronic Devices & Storage Corporation 1 2013-02 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF 5. Packaging (Note) TLP240GA TLP240GA(LF1,TP1) TLP240GA(LF5,TP5) 11-5B205S 11-5B201S 11-5B2S TLP240GAF TLP240GAF(LF4,TP4) 11-5B204S 11-5B202S Note: Through-hole type: TLP240GA, TLP240GAF Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 6. Pin Assignment 1: Anode 2: Cathode 3: Drain 4: Drain 7. Internal Circuit ©2016-2020 Toshiba Electronic Devices & Storage Corporation 2 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF 8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward current Note Rating Unit IF 30 mA Input forward current derating (Ta ≥ 25 ) ∆IF/∆Ta -0.3 mA/ Input forward current (pulsed) (100 µs pulse, 100 pps) IFP 1 A VR 5 V Input reverse voltage Input power dissipation Input power dissipation derating (Ta ≥ 25 ) PD 50 mW ∆PD/∆Ta -0.5 mW/ Tj 125  VOFF 400 V Junction temperature Detector OFF-state output terminal voltage ON-state current ION 120 mA ON-state current derating (Ta ≥ 25 ) ∆ION/∆Ta -1.2 mA/ ON-state current (pulsed) (t = 100 ms, Duty = 1/10) IONP 360 mA PO 500 mW ∆PO/∆Ta -5.0 mW/ Tj 125  Tstg -55 to 125 Topr -40 to 85 Output power dissipation Output power dissipation derating (Ta ≥ 25 ) Junction temperature Common Storage temperature Operating temperature Lead soldering temperature Isolation voltage (10 s) Tsol (AC, 60 s, R.H. ≤ 60 %) BVS 260 (Note 1) 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together. 9. Recommended Operating Conditions (Note) Characteristics Symbol Supply voltage Input forward current Note Min Typ. Max Unit VDD   320 V IF 5 7.5 25 mA ON-state current ION   120 mA Operating temperature Topr -20  65  Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. ©2016-2020 Toshiba Electronic Devices & Storage Corporation 3 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF 10. Absolute Maximum Ratings (UL-recognized: UL 508) (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward current Note Rating Unit IF 30 mA Input forward current derating (Ta ≥ 25 ) ∆IF/∆Ta -0.3 mA/ Input forward current (pulsed) (100 µs pulse, 100 pps) IFP 1 A VR 5 V Input reverse voltage Input power dissipation Input power dissipation derating (Ta ≥ 25 ) PD 50 mW ∆PD/∆Ta -0.5 mW/ Tj 105  VOFF 400 V Junction temperature Detector OFF-state output terminal voltage ON-state current ION 120 mA ON-state current derating (Ta ≥ 25 ) ∆ION/∆Ta -1.2 mA/ ON-state current (pulsed) (t = 100 ms, duty = 1/10) IONP 360 mA PO 500 mW ∆PO/∆Ta -5.0 mW/ Tj 105  Tstg -55 to 125  Tc 105  Output power dissipation Output power dissipation derating (Ta ≥ 25 ) Junction temperature Common Storage temperature Case temperature Operating temperature Topr -40 to 85  (10 s) Tsol 260  (AC, 60 s, R.H. ≤ 60 %) BVS 5000 Vrms Lead soldering temperature Isolation voltage (Note 1) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together. 11. Recommended Operating Conditions (UL-recognized: UL 508) (Note) Characteristics Symbol Supply voltage Note VDD Input forward current Min Typ. Max Unit   320 V IF (Note 1) 5 7.5 19.5 mA ON-state current ION (Note 1)   78 mA Operating temperature Topr -20  65  Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. Note 1: The above recommended operating conditions are at Ta = 60 . However, within the derating range of the characteristic curves of "IF - Ta", "ION - Ta", it can be used up to 85 . ©2016-2020 Toshiba Electronic Devices & Storage Corporation 4 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF 12. Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Note Test Condition Min Typ. Max Unit Input forward voltage VF IF = 10 mA 1.1 1.27 1.4 V Input reverse current IR VR = 5 V   10 µA Ct Input capacitance Detector OFF-state current Output capacitance V = 0 V, f = 1 MHz  50  pF IOFF VOFF = 400 V   1000 nA COFF V = 0 V, f = 1 MHz  80  pF 13. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Trigger LED current Note Test Condition Min Typ. Max Unit 0.6 3 mA IFT ION = 120 mA  Return LED current IFC IOFF = 10 µA 0.1   ON-state resistance RON ION = 120 mA, IF = 5 mA, t < 1 s  17 28  22 35 Min Typ. Max Unit (Note 1) ION = 120 mA, IF = 5 mA, Continuous Ω Note 1: Thermally saturated state. 14. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Note Test Condition Total capacitance (input to output) CS (Note 1) VS = 0 V, f = 1 MHz  0.8  pF Isolation resistance RS (Note 1) VS = 500 V, R.H. ≤ 60 % 1012 1014  Ω (Note 1) AC, 60 s 5000   Vrms Isolation voltage BVS Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together. 15. Switching Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Turn-on time tON Turn-off time tOFF Note Test Condition See Fig. 15.1. RL = 200 Ω, VDD = 20 V, IF = 5 mA Min Typ. Max Unit  0.6 2 ms  0.2 1 Fig. 15.1 Switching Time Test Circuit and Waveform ©2016-2020 Toshiba Electronic Devices & Storage Corporation 5 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF 16. Characteristics Curves (Note) Fig. 16.1 IF - Ta Fig. 16.2 ION - Ta Fig. 16.3 IF - VF Fig. 16.4 ION - VON Fig. 16.5 RON - Ta Fig. 16.6 IFT - Ta ©2016-2020 Toshiba Electronic Devices & Storage Corporation 6 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF Fig. 16.7 tON, tOFF - IF Fig. 16.8 tON, tOFF - Ta Fig. 16.9 IOFF - Ta Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. ©2016-2020 Toshiba Electronic Devices & Storage Corporation 7 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF 17. Soldering and Storage 17.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. • When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 17.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used • When using soldering flow Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds. Mounting condition of 260  within 10 seconds is recommended. Flow soldering must be performed once. • When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not exceeding 350  Heating by soldering iron must be done only once per lead. 17.2. Precautions for General Storage • Avoid storage locations where devices may be exposed to moisture or direct sunlight. • Follow the precautions printed on the packing label of the device for transportation and storage. • Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %, respectively. • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. • Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. • When restoring devices after removal from their packing, use anti-static containers. • Do not allow loads to be applied directly to devices while they are in storage. • If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. ©2016-2020 Toshiba Electronic Devices & Storage Corporation 8 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF 18. Land Pattern Dimensions (for reference only) Unit: mm TLP240GA TLP240GAF Fig. 18.1 Lead forming and taping option (LF1), (TP1), (LF5), (TP5) ©2016-2020 Toshiba Electronic Devices & Storage Corporation Fig. 18.2 Lead forming and taping option (LF4), (TP4) 9 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF 19. EN 60747-5-5 Option (D4) Specification • Part number: TLP240GA (Note 1) • The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN 60747. Example: TLP240GA(D4TP1,F D4: EN 60747 option TP1: Tape type F: [[G]]/RoHS COMPATIBLE (Note 2) Note 1: Use TOSHIBA standard type number for safety standard application. e.g., TLP240GA(D4TP1,F → TLP240GA Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Fig. 19.1 EN 60747 Insulation Characteristics ©2016-2020 Toshiba Electronic Devices & Storage Corporation 10 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF Table Insulation Related Specifications (Note) Insulation Related Parameters Symbol TLP240GA TLP240GAF Minimum creepage distance Cr 7.0 mm 8.0 mm Minimum clearance Cl 7.0 mm 8.0 mm Minimum insulation thickness ti 0.4 mm 0.4 mm CTI 175 175 Comparative tracking index Note: Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall take suitable measures. This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 19.2 Marking on Packing ©2016-2020 Toshiba Electronic Devices & Storage Corporation 11 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF Fig. 19.3 Measurement Procedure ©2016-2020 Toshiba Electronic Devices & Storage Corporation 12 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF 20. Ordering Information (Example of Item Name) Item Name Packaging (Note 1) VDE Option Packing (MOQ) TLP240GA(F TH Magazine (100 pcs) TLP240GA(LF1,F LF1 Magazine (100 pcs) TLP240GA(LF5,F LF5 Magazine (100 pcs) TLP240GA(TP1,F LF1 Tape and reel (1500 pcs) TLP240GA(TP5,F LF5 TLP240GA(D4,F TH EN 60747-5-5 Magazine (100 pcs) TLP240GA(D4LF1,F LF1 EN 60747-5-5 Magazine (100 pcs) TLP240GA(D4LF5,F LF5 EN 60747-5-5 Magazine (100 pcs) TLP240GA(D4TP1,F LF1 EN 60747-5-5 Tape and reel (1500 pcs) TLP240GA(D4TP5,F LF5 EN 60747-5-5 Tape and reel (1500 pcs) TLP240GAF(F TH, Wide forming Magazine (100 pcs) TLP240GAF(LF4,F LF4, Wide forming Magazine (100 pcs) TLP240GAF(TP4,F LF4, Wide forming TLP240GAF(D4,F TH, Wide forming EN 60747-5-5 Magazine (100 pcs) TLP240GAF(D4LF4F LF4, Wide forming EN 60747-5-5 Magazine (100 pcs) TLP240GAF(D4TP4F LF4, Wide forming EN 60747-5-5 Tape and reel (1000 pcs) Tape and reel (1500 pcs) Tape and reel (1000 pcs) Note 1: TH: Through-hole, LF: Lead forming for surface mount 21. Devices in Halogen-Free Resin Packages This product is Halogen-Free Toshiba Electronic Devices & Storage Corporation ("Toshiba") defines a "Halogen-Free resin semiconductor product" as a semiconductor product in which: (1) the encapsulating resins do not contain any of the following elements: bromine (Br), chlorine (Cl) and antimony (Sb), respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the encapsulating resins, and/or (2) the resin portion(s) in printed circuit boards do not contain any of the following elements: bromine, chlorine and antimony, respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the each resin portion(s) in printed circuit boards. For avoidance of doubt, "Halogen-Free resin semiconductor product" does not mean, and Toshiba does not make any warranty of any kind, that said semiconductor product is entirely free of antimony or of any of the following elements of the halogen family: bromine, chlorine, iodine (I), fluorine (F) and astatine (At). In addition, a Halogen-Free resin semiconductor product may contain antimony and/or any of the elements of the halogen family as mentioned in the above paragraph in one or more portion(s) of the semiconductor product other than the encapsulating resins and the resin portion(s) in printed circuit boards. The information provided herein is accurate as of the date that it was provided, to the best of the knowledge and belief of the Toshiba Electronic Devices & Storage Corporation ("Toshiba"), Toshiba bases such knowledge and belief on information provided by third parties, and Toshiba makes no representation or warranty as to the accuracy of such third party information. Toshiba has taken and will continue to take, reasonable steps to provide accurate information to its customers, but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ©2016-2020 Toshiba Electronic Devices & Storage Corporation 13 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF Package Dimensions Unit: mm TLP240GA Weight: 0.26 g (typ.) Package Name(s) TOSHIBA: 11-5B2S ©2016-2020 Toshiba Electronic Devices & Storage Corporation 14 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF Package Dimensions Unit: mm TLP240GA(LF1,TP1) Weight: 0.25 g (typ.) Package Name(s) TOSHIBA: 11-5B201S ©2016-2020 Toshiba Electronic Devices & Storage Corporation 15 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF Package Dimensions Unit: mm TLP240GA(LF5,TP5) Weight: 0.25 g (typ.) Package Name(s) TOSHIBA: 11-5B205S ©2016-2020 Toshiba Electronic Devices & Storage Corporation 16 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF Package Dimensions Unit: mm TLP240GAF Weight: 0.26 g (typ.) Package Name(s) TOSHIBA: 11-5B202S ©2016-2020 Toshiba Electronic Devices & Storage Corporation 17 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF Package Dimensions Unit: mm TLP240GAF(LF4,TP4) Weight: 0.25 g (typ.) Package Name(s) TOSHIBA: 11-5B204S ©2016-2020 Toshiba Electronic Devices & Storage Corporation 18 2020-02-04 Rev.8.0 TLP240GA,TLP240GAF RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. https://toshiba.semicon-storage.com/ ©2016-2020 Toshiba Electronic Devices & Storage Corporation 19 2020-02-04 Rev.8.0