TLP250H,TLP250HF
Photocouplers
GaAℓAs Infrared LED & Photo IC
TLP250H,TLP250HF
1. Applications
•
Industrial Inverters
•
Air Conditioner Inverters
•
IGBT Gate Drivers
•
MOSFET Gate Drivers
•
Induction Cooktop and Home Appliances
2. General
The TLP250H is a photocoupler in a DIP8 package that consists of a GaAℓAs infrared light-emitting diode (LED)
optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance
and specifications at temperatures up to 125 . The TLP250H has an internal Faraday shield that provides a
guaranteed Common-mode transient immunity of ±40 kV/µs. It has a totem-pole output that can both sink and
source current. The TLP250H is ideal for IGBT and power MOSFET gate drive.
3. Features
(1)
Buffer logic type (totem pole output)
(2)
Output peak current: ±2.5 A (max)
(3)
Operating temperature: -40 to 125
(4)
Supply current: 3 mA (max)
(5)
Supply voltage: 10 to 30 V
(6)
Threshold input current: 5 mA (max)
(7)
Propagation delay time: 500 ns (max)
(8)
Common-mode transient immunity: ±40 kV/µs (min)
(9)
Isolation voltage: 3750 Vrms (min)
(10) Safety standards
UL-approved: UL1577, File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)
Note 1: When a VDE approved type is needed, please designate the Option (D4)
(D4).
Start of commercial production
©2015 Toshiba Corporation
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2012-09
2015-12-24
Rev.4.0
TLP250H,TLP250HF
4. Packaging (Note)
TLP250H
TLP250H(LF1,TP1)
11-10C401S
11-10C4S
TLP250HF
11-10C405S
TLP250HF(LF4,TP4)
11-10C402S
Note:
TLP250H(LF5,TP5)
11-10C404S
Through-hole type: TLP250H, TLP250HF
Lead forming option: (LF1), (LF4), (LF5)
Taping option: (TP1), (TP4), (TP5)
5. Pin Assignment
1: N.C.
2: Anode
3: Cathode
4: N.C.
5: GND
6: VO (Output)
7: N.C.
8: VCC
©2015 Toshiba Corporation
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2015-12-24
Rev.4.0
TLP250H,TLP250HF
6. Internal Circuit (Note)
Note:
A 0.1-µF bypass capacitor must be connected between pin 8 and pin 5.
7. Principle of Operation
7.1. Truth Table
Input
LED
M1
M2
Output
H
ON
ON
OFF
H
L
OFF
OFF
ON
L
7.2. Mechanical Parameters
7.62-mm Pitch
TLP250H
10.16-mm Pitch
TLP250HF
Unit
Creepage distances
7.0 (min)
8.0 (min)
mm
Clearance distances
7.0 (min)
8.0 (min)
Internal isolation thickness
0.4 (min)
0.4 (min)
Characteristics
©2015 Toshiba Corporation
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Rev.4.0
TLP250H,TLP250HF
8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
LED
Symbol
Input forward current
Input forward current derating
IF
20
mA
-0.54
mA/
1
A
(Ta ≥ 110 )
∆IFPT/∆Ta
-25
mA/
VR
6
V
IFPT
Input power dissipation
Detector Peak high-level output current
Peak low-level output current
(Note 1)
PD
40
mW
(Ta ≥ 110 )
∆PD/∆Ta
-1.0
mW/
(Ta = -40 to 125 )
IOPH
(Note 2)
-2.5
A
(Ta = -40 to 125 )
IOPL
(Note 2)
+2.5
Output voltage
VO
35
Supply voltage
VCC
35
Output power dissipation
Output power dissipation derating
(Ta ≥ 110 )
Common Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
Unit
∆IF/∆Ta
Input reverse voltage
Input power dissipation derating
Rating
(Ta ≥ 110 )
Peak transient input forward current
Peak transient input forward current
derating
Note
V
PO
260
mW
∆PO/∆Ta
-2.0
mW/
Topr
-40 to 125
Tstg
-55 to 150
(10 s)
Tsol
(Note 3)
260
AC, 60 s, R.H. ≤ 60 %
BVS
(Note 4)
3750
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 1 µs, 300 pps
Note 2: Exponential waveform. Pulse width ≤ 0.2 µs, f ≤ 15 kHz, VCC = 20 V, Ta = -40 to 125
Exponential waveform. Pulse width ≤ 0.08 µs, f ≤ 25 kHz, VCC = 15V, Ta = -40 to 125
Note 3: ≥ 2 mm below seating plane.
Note 4: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
©2015 Toshiba Corporation
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2015-12-24
Rev.4.0
TLP250H,TLP250HF
9. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Input on-state current
IF(ON)
(Note 1)
6.5
Input off-state voltage
VF(OFF)
0
10
30
-2.0
+2.0
250
Supply voltage
VCC
Peak high-level output current
IOPH
Peak low-level output current
IOPL
Operating frequency
f
(Note 2)
(Note 3)
Max
Unit
10
mA
0.8
V
A
kHz
Note:
The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 8 and pin 5 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note : If the rising slope of the supply voltage (VCC) for the detector is steep, stable operation of the internal circuits
cannot be guaranteed.
Be sure to set 3.0 V/µs or less for a rising slope of the VCC.
Note 1: The rise and fall times of the input on-current should be less than 0.5 µs.
Note 2: Denotes the operating range, not the recommended operating condition.
Note 3: Exponential waveform. IOPH ≥ -0.65 A (≤ 80 ns), IOPL ≤ 0.65 A (≤ 80 ns), Ta = 125 , VCC = 20 V
©2015 Toshiba Corporation
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TLP250H,TLP250HF
10. Electrical Characteristics (Note)(Unless otherwise specified, Ta = -40 to 125 )
Characteristics
Symbol
Input forward voltage
Input forward voltage
temperature coefficient
VF
IR
Input capacitance
Peak low-level output current
Test
Circuit
∆VF/∆Ta
Input reverse current
Peak high-level output current
Note
Ct
IOPH
(Note 1)
IOPL
(Note 1)
Fig.
12.1.1
Fig.
12.1.2
Test Condition
Min
Typ.
Max
IF = 10 mA, Ta = 25
1.4
1.57
1.8
V
IF = 10 mA
-1.8
mV/
VR = 5 V, Ta = 25
10
µA
V = 0 V, f = 1 MHz, Ta = 25
45
pF
IF = 5 mA, VCC = 30 V,
V8-6 = -3.5 V
-2.2
-1.0
A
IF = 5 mA, VCC = 15 V,
V8-6 = -7.0 V
-3.4
-2.0
IF = 0 mA, VCC = 30 V,
V6-5 = 2.5 V
1.0
2.4
IF = 0 mA, VCC = 15 V,
V6-5 = 7.0 V
2.0
3.5
High-level output voltage
VOH
Fig.
12.1.3
IF = 5 mA, RL = 200 Ω,
VCC1 = +15 V, VEE1 = -15 V
11.0
13.7
Low-level output voltage
VOL
Fig.
12.1.4
VF = 0.8 V, RL = 200 Ω,
VCC1 = +15 V, VEE1 = -15 V
-14.9
-12.5
High-level supply current
ICCH
Fig.
12.1.5
IF = 10 mA, VCC = 30 V,
VO = Open
1.9
3.0
Low-level supply current
ICCL
Fig.
12.1.6
IF = 0 mA, VCC = 30 V,
VO = Open
1.8
3.0
Threshold input current (L/H)
IFLH
VCC = 15 V, VO > 1 V
1.0
5
Threshold input voltage (H/L)
VFHL
VCC = 15 V, VO < 1 V
0.8
1.47
VCC
Supply voltage
UVLO threshold voltage
UVLO hysteresis
10
30
VUVLO+
IF = 5 mA , VO > 2.5 V
7.5
8.7
9.5
VUVLO-
IF = 5 mA, VO < 2.5 V
7.5
8.4
9.5
0.3
UVLOHYS
Unit
V
mA
V
Note:
Note:
All typical values are at Ta = 25 .
This device is designed for low power consumption, making it more sensitive to ESD than its predecessors.
Extra care should be taken in the design of circuitry and pc board implementation to avoid ESD problems.
Note 1: IO application time ≤ 50 µs, single pulse.
11. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Total capacitance (input to output)
CS
Isolation resistance
Isolation voltage
RS
BVS
Note
Test Condition
Min
Typ.
Max
Unit
0.35
pF
1014
Ω
3750
Vrms
AC, 1 s in oil
10000
DC, 60 s in oil
10000
(Note 1) VS = 0 V, f = 1 MHz
(Note 1) VS = 500 V, R.H. ≤ 60 %
(Note 1) AC, 60 s
1×
1012
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
©2015 Toshiba Corporation
6
2015-12-24
Rev.4.0
TLP250H,TLP250HF
12. Switching Characteristics (Note)(Unless otherwise specified, Ta = -40 to 125 )
Characteristics
Symbol
Note
Propagation delay time
(L/H)
tpLH
(Note 1)
Propagation delay time
(H/L)
tpHL
Test
Circuit
Min
Typ.
Max
Unit
IF = 0 → 10 mA, VCC = 30 V,
Rg = 20 Ω, Cg = 10 nF
100
500
ns
(Note 1)
IF = 10 → 0 mA, VCC = 30 V,
Rg = 20 Ω, Cg = 10 nF
100
500
|tpHL-tpLH|
(Note 1)
IF = 0 ←→ 10 mA, VCC = 30 V,
Rg = 20 Ω, Cg = 10 nF
50
tpsk
(Note 1),
(Note 4)
IF = 0 ←→ 10 mA, VCC = 30 V,
Rg = 20 Ω, Cg = 10 nF
-150
150
Rise time
tr
(Note 1)
IF = 0 → 10 mA, VCC = 30 V,
Rg = 20 Ω, Cg = 10 nF
50
Fall time
tf
(Note 1)
IF = 10 → 0 mA, VCC = 30 V,
Rg = 20 Ω, Cg = 10 nF
50
Common-mode transient
immunity at output high
CMH
(Note 2)
VCM = 1000 Vp-p, IF = 10 mA,
VCC = 30 V, Ta = 25 ,
VO(min) = 26 V
±40
Common-mode transient
immunity at output low
CML
(Note 3)
VCM = 1000 Vp-p, IF = 0 mA,
VCC = 30 V, Ta = 25 ,
VO(max) = 1 V
±40
Pulse width distortion
Propagation delay skew
(device to device)
Fig.
12.1.7
Fig.
12.1.8
Test Condition
kV/µs
Note: All typical values are at Ta = 25 .
Note 1: Input signal (f = 250 kHz, duty = 50 %, tr = tf = 5 ns or less).
CL is approximately 15 pF which includes probe and stray wiring capacitance.
Note 2: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage
in the logic high state (VO > 26 V).
Note 3: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in
the logic low state (VO < 1 V).
Note 4: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH
that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc).
©2015 Toshiba Corporation
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2015-12-24
Rev.4.0
TLP250H,TLP250HF
13. Test Circuits and Characteristics Curves
13.1. Test Circuits
Fig. 13.1.1 IOPH Test Circuit
Fig. 13.1.2 IOPL Test Circuit
Fig. 13.1.3 VOH Test Circuit
Fig. 13.1.4 VOL Test Circuit
Fig. 13.1.5 ICCH Test Circuit
Fig. 13.1.6 ICCL Test Circuit
Fig. 13.1.7 Switching Time Test Circuit and Waveform
Fig. 13.1.8 Common-Mode Transient Immunity Test Circuit and Waveform
©2015 Toshiba Corporation
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2015-12-24
Rev.4.0
TLP250H,TLP250HF
14. Soldering and Storage
14.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 14.1.1 An Example of a Temperature Profile Fig. 14.1.2 An Example of a Temperature Profile
When Sn-Pb Eutectic Solder Is Used
When Lead(Pb)-Free Solder Is Used
•
When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
•
When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
14.2. Precautions for General Storage
•
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
•
Follow the precautions printed on the packing label of the device for transportation and storage.
•
Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
•
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
When restoring devices after removal from their packing, use anti-static containers.
•
Do not allow loads to be applied directly to devices while they are in storage.
•
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
©2015 Toshiba Corporation
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2015-12-24
Rev.4.0
TLP250H,TLP250HF
15. Land Pattern Dimensions (for reference only)
Unit: mm
TLP250H
TLP250HF
Fig. 15.1 Lead forming and taping option
(LF1), (TP1), (LF5), (TP5)
Fig. 15.2 Lead forming and taping option
(LF4), (TP4)
16. Marking (Note)
TLP250H
Note:
TLP250HF
A different marking is used for photocouplers that have been qualified according to option (D4) of EN60747.
©2015 Toshiba Corporation
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2015-12-24
Rev.4.0
TLP250H,TLP250HF
Package Dimensions
Unit: mm
TLP250H
Weight: 0.54 g (typ.)
Package Name(s)
TOSHIBA: 11-10C4S
©2015 Toshiba Corporation
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2015-12-24
Rev.4.0
TLP250H,TLP250HF
Package Dimensions
Unit: mm
TLP250H(LF1,TP1)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C401S
©2015 Toshiba Corporation
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Rev.4.0
TLP250H,TLP250HF
Package Dimensions
Unit: mm
TLP250H(LF5,TP5)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C405S
©2015 Toshiba Corporation
13
2015-12-24
Rev.4.0
TLP250H,TLP250HF
Package Dimensions
Unit: mm
TLP250HF
Weight: 0.54 g (typ.)
Package Name(s)
TOSHIBA: 11-10C402S
©2015 Toshiba Corporation
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2015-12-24
Rev.4.0
TLP250H,TLP250HF
Package Dimensions
Unit: mm
TLP250HF(LF4,TP4)
Weight: 0.53 g (typ.)
Package Name(s)
TOSHIBA: 11-10C404S
©2015 Toshiba Corporation
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TLP250H,TLP250HF
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR
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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
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(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
©2015 Toshiba Corporation
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2015-12-24
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