TLP2710(TP,E

TLP2710 Photocouplers GaAℓAs Infrared LED & Photo IC TLP2710 1. Applications • Programmable Logic Controllers (PLCs) • Battery Management System (BMS) • Industrial Inverters 2. General The TLP2710 is a 5-Mbps low-power photocoupler in the small SO6L package. It is housed in a thin SO6L package of 2.3 mm (max). The TLP2710 has guaranteed the isolation voltage 5 kVrms and compliant with international safety standards for reinforced insulation. The TLP2710 consumes supply current (IDDL/IDDH) of only 0.3 mA maximum over the entire operating temperature range of -40 to 125  and operates at a supply voltage as low as 2.7 V, contributing to a reduction in power consumption of various systems. The input forward current can be less than 1 mA maximum, allowing direct drive by a microcontroller. The detector has a totem-pole output stage with current sourcing and sinking capabilities. The TLP2710 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of ±25 kV/µs. 3. Features (1) Package: SO6L (2) Data transfer rate: 5 MBd (typ.) (NRZ) (3) Supply current: 0.3 mA (max) (4) Threshold input current: 1.0 mA (max) (5) Supply voltage: 2.7 V to 5.5 V (6) Operating temperature: -40 to 125  (7) Propagation delay time: 250 ns (max) (8) Pulse width distortion: 30 ns (max) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5, EN60065, EN60950-1, EN 62368-1 (Note 1) Note 1: When a VDE approved type is needed, please designate the Option (D4) (D4). Start of commercial production ©2015-2018 Toshiba Electronic Devices & Storage Corporation 1 2015-05 2018-03-09 Rev.6.0 TLP2710 4. Packaging (Note) TLP2710 TLP2710(LF4) 11-4N1A Note: 11-4N101A Lead-formed product: (LF4) 5. Pin Assignment 1: Anode 2: N.C. 3: Cathode 4: GND 5: VO (Output) 6: VDD 6. Internal Circuit (Note) Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4. ©2015-2018 Toshiba Electronic Devices & Storage Corporation 2 2018-03-09 Rev.6.0 TLP2710 7. Principle of Operation 7.1. Truth Table Input LED Output H ON H L OFF L 7.2. Mechanical Parameters Characteristics Dimension (min) Unit Creepage distances 8.0 mm Clearance distances 8.0 Internal isolation thickness 0.4 8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Note Rating Unit mA Input forward current IF 8 Input forward current (pulsed) IFP 40 ∆IFP/∆Ta -1 mA/ 1 A -25 mA/ Input forward current derating (pulsed) (Ta ≥ 110 ) Peak transient input forward current IFPT Peak transient input forward current derating (Ta ≥ 110 ) ∆IFPT/∆Ta PD 20 mW (Ta ≥ 110 ) ∆PD/∆Ta -0.5 mW/ Input power dissipation Input power dissipation derating (Note 1) Input reverse voltage VR 5 V IO 10 mA Output voltage VO 6 V Supply voltage VDD 6 Detector Output current Output power dissipation Output power dissipation derating (Ta ≥ 110 ) Common Operating temperature Storage temperature 20 mW -0.5 mW/ Topr -40 to 125  Tstg -55 to 125 (10 s) Tsol 260 (AC, 60 s, R.H. ≤ 60 %) BVS Lead soldering temperature Isolation voltage PO ∆PO/∆Ta (Note 2) 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) ≤ 1 µs, 300 pps Note 2: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. ©2015-2018 Toshiba Electronic Devices & Storage Corporation 3 2018-03-09 Rev.6.0 TLP2710 9. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Max Unit Input on-state current IF(ON) (Note 1) 2 Input off-state voltage VF(OFF) (Note 1) 0  6 mA  0.8 V Supply voltage VDD (Note 2) 2.7 3.3 / 5 5.5 V Operating temperature Topr (Note 2) -40  125  Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1: The rise and fall times of the input on-current should be less than 0.5 µs. Note 2: Denotes the operating range, not the recommended operating condition. 10. Electrical Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 , VDD = 2.7 to 5.5 V) Characteristics Input forward voltage Input forward voltage temperature coefficient Input reverse current Input capacitance Symbol Test Circuit VF ∆VF/∆Ta IR Min Typ. Max Unit IF = 2 mA 1.2  1.9 V IF = 2 mA, Ta = 25  1.4 1.53 1.7 IF = 2 mA  -1.58  mV/ VR = 5 V, Ta = 25    10 µA V = 0 V, f = 1 MHz, Ta = 25   20  pF Low-level output voltage VOL Fig. 13.1.1 IO = 20 µA, VF = 0.8 V   0.1 V IO = 3.2 mA, VF = 0.8 V   0.4 High-level output voltage VOH Fig. 13.1.2 IO = -20 µA, IF = 2 mA VDD - 0.1 VDD - 0.01  IO = -3.2 mA, IF = 2 mA VDD - 1.0 VDD - 0.25  Low-level supply current IDDL Fig. 13.1.3 IF = 0 mA   0.3 High-level supply current IDDH Fig. 13.1.4 IF = 2 mA   0.3 Threshold input current (L/H) IFLH IO = -3.2 mA, VO > VDD - 1 V   1.0 Note: Ct Test Condition mA All typical values are at VDD = 5 V, Ta = 25 , unless otherwise noted. 11. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Note Test Condition Total capacitance (input to output) CS (Note 1) VS = 0 V, f = 1 MHz Isolation resistance RS (Note 1) VS = 500 V, R.H. ≤ 60 % Isolation voltage BVS (Note 1) AC, 60 s Min Typ. Max Unit  0.8  pF 1 × 1012 1014  Ω 5000   Vrms Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. ©2015-2018 Toshiba Electronic Devices & Storage Corporation 4 2018-03-09 Rev.6.0 TLP2710 12. Switching Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 , VDD = 2.7 to 5.5 V) Characteristics Symbol Note Propagation delay time (L/H) tpLH (Note 1) Propagation delay time (H/L) tpHL Pulse width distortion tpsk (Note 1), (Note 2) Propagation delay time (L/H) tpLH (Note 1) Propagation delay time (H/L) tpHL Typ. Max Unit VIN = 3.3 V, RT = 820 Ω 80  250 ns 60  250 VIN = 5 V, RT = 1.6 kΩ   50 -65  65 80  250 60  250   50 -65  65 80  250 tpHL 60  250 |tpHL-tpLH|   30 -65  65 VIN = 0 → 3.3 V, RT = 820 Ω, VDD = 5 V  11  VIN = 3.3 → 0 V, RT = 820 Ω, VDD = 5 V  13  VIN = 3.3 V / 5 V, VDD = 3.3 V / 5 V, VCM = 1000 Vp-p, Ta = 25  ±25 ±40  tpsk (Note 1), (Note 2) Propagation delay time (L/H) tpLH (Note 1) Propagation delay time (H/L) Propagation delay skew (device to device) Min |tpHL-tpLH| Propagation delay skew (device to device) Pulse width distortion Fig. 13.1.5 Test Condition |tpHL-tpLH| Propagation delay skew (device to device) Pulse width distortion Test Circuit tpsk (Note 1), (Note 2) Rise time tr (Note 1) Fall time tf Common-mode transient immunity at output high CMH Common-mode transient immunity at output low CML Fig. 13.1.6 Fig. 13.1.5 Fig. 13.1.7 IF = 2 mA, R = 100 Ω kV/µs Note: Note: All typical values are at VDD = 5 V, Ta = 25 , unless otherwise noted. Recommendation input resistance conditions VIN = 3.3 V : R1 = R2 = 430 Ω VIN = 5 V : R1 = R2 = 820 Ω Note 1: f = 250 kHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray wiring capacitance. Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc). ©2015-2018 Toshiba Electronic Devices & Storage Corporation 5 2018-03-09 Rev.6.0 TLP2710 13. Test Circuits and Characteristics Curves 13.1. Test Circuits Fig. 13.1.1 VOL Test Circuit Fig. 13.1.2 VOH Test Circuit Fig. 13.1.3 IDDL Test Circuit Fig. 13.1.4 IDDH Test Circuit Fig. 13.1.5 Switching Time Test Circuit and Waveform Fig. 13.1.6 Switching Time Test Circuit and Waveform ©2015-2018 Toshiba Electronic Devices & Storage Corporation 6 2018-03-09 Rev.6.0 TLP2710 Fig. 13.1.7 Common-Mode Transient Immunity Test Circuit and Waveform ©2015-2018 Toshiba Electronic Devices & Storage Corporation 7 2018-03-09 Rev.6.0 TLP2710 13.2. Characteristics Curves (Note) Fig. 13.2.1 IF - VF Fig. 13.2.2 IF - Ta Fig. 13.2.3 VOL - Ta Fig. 13.2.4 VOL - Ta Fig. 13.2.5 VOH - Ta Fig. 13.2.6 VOH - Ta ©2015-2018 Toshiba Electronic Devices & Storage Corporation 8 2018-03-09 Rev.6.0 TLP2710 Fig. 13.2.7 IDDL - Ta Fig. 13.2.8 IDDH - Ta Fig. 13.2.9 IFLH - Ta Fig. 13.2.10 VO - IF Fig. 13.2.11 tpLH, tpHL, |tpHL - tpLH| - Ta Fig. 13.2.12 tpLH, tpHL, |tpHL - tpLH| - Ta ©2015-2018 Toshiba Electronic Devices & Storage Corporation 9 2018-03-09 Rev.6.0 TLP2710 Fig. 13.2.13 tpLH, tpHL, |tpHL - tpLH| - VDD Note: Fig. 13.2.14 tpLH, tpHL, |tpHL - tpLH| - IF The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. ©2015-2018 Toshiba Electronic Devices & Storage Corporation 10 2018-03-09 Rev.6.0 TLP2710 14. Soldering and Storage 14.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. • When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. An Example of a Temperature Profile When Lead(Pb)-free Solder Is Used • When using soldering flow Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds. Mounting condition of 260  within 10 seconds is recommended. Flow soldering must be performed once. • When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not exceeding 350  Heating by soldering iron must be done only once per lead. 14.2. Precautions for General Storage • Avoid storage locations where devices may be exposed to moisture or direct sunlight. • Follow the precautions printed on the packing label of the device for transportation and storage. • Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %, respectively. • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. • Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. • When restoring devices after removal from their packing, use anti-static containers. • Do not allow loads to be applied directly to devices while they are in storage. • If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. ©2015-2018 Toshiba Electronic Devices & Storage Corporation 11 2018-03-09 Rev.6.0 TLP2710 15. Land Pattern Dimensions (for reference only) Unit: mm TLP2710 TLP2710(LF4) Lead Forming Option (standard) Fig. 15.1 Lead Forming Option (LF4) 16. Marking ©2015-2018 Toshiba Electronic Devices & Storage Corporation 12 2018-03-09 Rev.6.0 TLP2710 17. EN60747-5-5 Option (D4) Specification • Part number: TLP2710 (Note 1) • The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN60747. Example: TLP2710(D4-TP,E D4: EN60747 option TP: Tape type E: [[G]]/RoHS COMPATIBLE (Note 2) Note 1: Use TOSHIBA standard type number for safety standard application. e.g., TLP2710(D4-TP,E → TLP2710 Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Fig. 17.1 EN60747 Isolation Characteristics ©2015-2018 Toshiba Electronic Devices & Storage Corporation 13 2018-03-09 Rev.6.0 TLP2710 Fig. 17.2 Insulation Related Specifications (Note) Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 17.3 Marking on Packing Fig. 17.4 Marking Example (Note) Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747. ©2015-2018 Toshiba Electronic Devices & Storage Corporation 14 2018-03-09 Rev.6.0 TLP2710 Fig. 17.5 Measurement Procedure ©2015-2018 Toshiba Electronic Devices & Storage Corporation 15 2018-03-09 Rev.6.0 TLP2710 18. Specifications for Embossed-Tape Packing 18.1. Applicable Package Package Name Product Type SO6L / SO6L(LF4) Long creepage mini flat coupler 18.2. Product Naming Conventions Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification is as below. Example) TLP2710(TP,E Part number: TLP2710 Tape type: TP [[G]]/RoHS COMPATIBLE: E (Note 1) Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 18.3. Tape Dimensions Specification Tape Type Division Packing Amount (A unit per reel) TP / TP4  1500 18.3.1. Orientation of Device in Relation to Direction of Feed Device orientation in the carrier cavities as shown in the following figure. Orientation of Device in Relation to Direction of Tape Movement 18.3.2. Empty Device Recesses Characteristics Standard Occurrences of 2 more successive empty cavities Single empty cavity Remarks 0 device Within any given 40-mm section of tape, not including leader and trailer 6 devices (max) per reel Not including leader and trailer 18.3.3. Tape Leader and Trailer The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and a cover tape of 30 mm or longer. ©2015-2018 Toshiba Electronic Devices & Storage Corporation 16 2018-03-09 Rev.6.0 TLP2710 18.3.4. Tape Dimensions Tape material: Plastic (for protection against static electricity) Table Symbol Tape Dimensions (unit: mm, tolerance: ±0.1) Dimension Dimension (standard) (LF4) Remark A 10.4 11.55  B 4.24 4.24  D 7.5 7.5 Center line of embossed cavity and sprocket hole E 1.75 1.75 Distance between tape edge and sprocket hole center F 12.0 16.0 Cumulative error +0.1/-0.3 per 10 empty cavities holes G 4.0 4.0 Cumulative error +0.1/-0.3 per 10 sprocket holes K 2.7 K0 2.8 2.4  2.4 ©2015-2018 Toshiba Electronic Devices & Storage Corporation Internal space 17 2018-03-09 Rev.6.0 TLP2710 18.3.5. Reel Specification Material: Plastic (for protection against static electricity) Table Reel Dimensions (unit: mm) Symbol Dimension A φ330 ± 2.0 B φ100 ± 1.0 C φ13 ± 0.5 E 2.0 ± 0.5 U 4.0 ± 0.5 W1 17.4 ± 1.0 W2 21.4 ± 1.0 ©2015-2018 Toshiba Electronic Devices & Storage Corporation 18 2018-03-09 Rev.6.0 TLP2710 18.4. Packing (Note) 1 reel/carton (unit: mm) Note: Taping reel diameter: φ330 mm 18.5. Label Format (1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc. (2) Reel: The label provides the part number, the taping name, quantity, lot number, etc. 19. Ordering Information (Example of Item Name) Item Name Packaging VDE Option Packing (MOQ) TLP2710(E Magazine (125 pcs) TLP2710(TP,E Tape and reel (1500 pcs) TLP2710(D4,E EN60747-5-5 Magazine (125 pcs) TLP2710(D4-TP,E EN60747-5-5 Tape and reel (1500 pcs) TLP2710(LF4,E LF4, Wide forming Magazine (125 pcs) TLP2710(TP4,E LF4, Wide forming Tape and reel (1500 pcs) TLP2710(D4-LF4,E LF4, Wide forming EN60747-5-5 Magazine (125 pcs) TLP2710(D4-TP4,E LF4, Wide forming EN60747-5-5 Tape and reel (1500 pcs) ©2015-2018 Toshiba Electronic Devices & Storage Corporation 19 2018-03-09 Rev.6.0 TLP2710 Package Dimensions Unit: mm TLP2710 Weight: 0.126 g (typ.) Package Name(s) TOSHIBA: 11-4N1A ©2015-2018 Toshiba Electronic Devices & Storage Corporation 20 2018-03-09 Rev.6.0 TLP2710 Package Dimensions Unit: mm TLP2710(LF4) Weight: 0.126 g (typ.) Package Name(s) TOSHIBA: 11-4N101A ©2015-2018 Toshiba Electronic Devices & Storage Corporation 21 2018-03-09 Rev.6.0 TLP2710 RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. ©2015-2018 Toshiba Electronic Devices & Storage Corporation 22 2018-03-09 Rev.6.0