TLP2735(D4,E

TLP2735 Photocouplers GaAℓAs Infrared LED & Photo IC TLP2735 1. Applications • Intelligent Power Module Signal Isolation • Switching Power Supplies • High-Speed Digital Interfacing for Instrumentation and Control Devices 2. General The Toshiba TLP2735 consists of high-output GaAℓAs light-emitting diode coupled with a high-gain, high-speed photo detector. It is housed in a thin SO6L package of 2.3 mm (max). The TLP2735 has guaranteed the isolation voltage 5 kVrms and compliant with international safety standards for reinforced insulation. This product can operate in power supply voltage 9 V to 15 V with the maximum operating temperature of 125 . Since TLP2735 has UVLO function, it can prevent false operation during VDD starting up or under low voltage condition. The detector has a totem-pole output stage with current sourcing and sinking capabilities. The TLP2735 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of ±25 kV/µs. 3. Features (1) Buffer logic type (totem pole output) (2) Package: SO6L (3) Operating temperature: -40 to 125  (4) Supply voltage: 9 to 15 V (5) Threshold input current: 3.0 mA (max) (6) Supply current: 4.5 mA (max) (7) Propagation delay time: 100 ns (max) (8) Pulse width distortion: 40 ns (max) (9) Common-mode transient immunity: ±25 kV/µs (min) (10) Isolation voltage: 5000 Vrms (min) (11) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5, EN60065, EN60950-1, EN 62368-1 (Note 1) Note 1: When a VDE approved type is needed, please designate the Option (D4) (D4). Start of commercial production ©2017-2018 Toshiba Electronic Devices & Storage Corporation 1 2017-08 2018-01-19 Rev.2.0 TLP2735 4. Packaging and Pin Assignment 1: Anode 2: N.C. 3: Cathode 4: GND 5: VO (Output) 6: VDD 11-4N1A 5. Internal Circuit (Note) Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4. 6. Principle of Operation 6.1. Truth Table Input LED Output H ON H L OFF L 6.2. Mechanical Parameters Characteristics Min Unit Creepage distances 8.0 mm Clearance distances 8.0 Internal isolation thickness 0.4 ©2017-2018 Toshiba Electronic Devices & Storage Corporation 2 2018-01-19 Rev.2.0 TLP2735 7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward current Input forward current derating (Ta ≥ 110 ) Note Rating Unit IF 15 mA ∆IF/∆Ta -0.6 mA/ Peak transient input forward current IFPT 1 A Input power dissipation PD 40 mW ∆PD/∆Ta -1.6 mW/ VR 6 V Input power dissipation derating (Ta ≥ 110 ) Input reverse voltage (Note 1) Detector Output current IO 20 / -20 mA Output voltage VO -0.5 to 20 V Supply voltage VDD -0.5 to 20 V Output power dissipation PO 100 mW ∆PO/∆Ta -4 mW/ Topr -40 to 125  Output power dissipation derating (Ta ≥ 110 ) Common Operating temperature Storage temperature Lead soldering temperature Isolation voltage Tstg -55 to 125  (10 s) Tsol 260  (AC, 60 s, R.H. ≤ 60 %) BVS 5000 Vrms (Note 2) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) ≤ 1 µs, 300 pps Note 2: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. 8. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Max Unit Input on-state current IF(ON) (Note 1) 5  10 mA Input off-state voltage VF(OFF) V 0  0.8 Supply voltage VDD (Note 2) 9  15 Operating temperature Topr (Note 2) -40  125  Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1: The rise and fall times of the input on-current should be less than 0.5 µs. Note 2: Denotes the operating range, not the recommended operating condition. ©2017-2018 Toshiba Electronic Devices & Storage Corporation 3 2018-01-19 Rev.2.0 TLP2735 9. Electrical Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 , VDD = 9 to 15 V) Characteristics Symbol Input forward voltage Input forward voltage temperature coefficient Note Test Circuit Test Condition Min Typ. Max Unit VF  IF = 5 mA, Ta = 25  1.35 1.61 1.9 V ∆VF/∆Ta  IF = 5 mA  -2.0  mV/ IR  VR = 5 V, Ta = 25    10 µA Ct  V = 0 V, f = 1 MHz, Ta = 25   20  pF VOL Fig. 12.1.1 VF = 0.8 V, IO = 3.5 mA, VDD = 15 V  0.02 0.2 V VF = 0.8 V, IO = 15 mA, VDD = 15 V  0.09 0.8 IF = 5 mA, IO = -3.5 mA, VDD = 15 V 11.8 14.98  IF = 5 mA, IO = -15 mA, VDD = 15 V 11.2 14.91  Input reverse current Input capacitance Low-level output voltage High-level output voltage VOH Low-level supply current Fig. 12.1.2 IDDL High-level supply current IDDH Low-level short-circuit output current IOSL High-level short-circuit output current IOSH Threshold input current (L/H) Fig. 12.1.3 IF = 0 mA, VDD = 9 V  3.1 4.5 IF = 0 mA, VDD = 15 V  3.2 4.5 Fig. 12.1.4 IF = 5 mA, VDD = 9 V  3.1 4.5 IF = 5 mA, VDD = 15 V  3.2 4.5 Fig. 12.1.5 VDD = VO = 9 V, t = 1 ms 160 340  VDD = VO = 15 V, t = 1 ms 160 330  Fig. 12.1.6 IF = 5 mA, VDD = 9 V, VO = GND, t = 1 ms  -320 -150 IF = 5 mA, VDD = 15 V, VO = GND, t = 1 ms  -310 -150  0.38 3.0 mA IFLH  IO = -15 mA, VO > 14 V, VDD = 15 V Input current hysteresis IHYS  IO = -15 mA  0.13  Threshold input voltage (H/L) VFHL  IO = 15 mA, VO < 1 V 0.8   V VUVLO+  IF = 5 mA, VO > 2.5 V 7.6 8.1 8.6 V VUVLO-  IF = 5 mA, VO < 2.5 V 7.0 7.5 8.0 UVLOHYS   0.6  V Min Typ. Max Unit  0.8  pF 1×1012 1×1014  Ω Vrms UVLO threshold voltage UVLO hysteresis Note:  All typical values are at VDD = 9 V, Ta = 25 , unless otherwise noted. 10. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Total capacitance (input to output) CS (Note 1) VS = 0 V, f = 1 MHz Isolation resistance RS (Note 1) VS = 500 V, R.H. ≤ 60 % Isolation voltage BVS Note Test Condition (Note 1) AC, 60 s 5000   AC, 1 s in oil  10000  DC, 60 s in oil  10000  Vdc Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. ©2017-2018 Toshiba Electronic Devices & Storage Corporation 4 2018-01-19 Rev.2.0 TLP2735 11. Switching Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 , VDD = 9 to 15 V) Characteristics Symbol Note Propagation delay time (L/H) tpLH (Note 1) Propagation delay time (H/L) tpHL Pulse width distortion Propagation delay skew (device to device) Rise time Fall time Test Circuit Test Condition Fig. VIN = 3.3 V, RIN = 330 Ω 12.1.7 VIN = 5.0 V, RIN = 680 Ω |tpHL-tpLH| Min Typ. Max Unit 30 52 100 ns 30 57 100  4 40 tpsk (Note 1), (Note 2) -60  60 tr (Note 1)  4 30 tf Common-mode transient immunity at output high CMH Common-mode transient immunity at output low CML Fig. IF = 5 mA, VDD = 9 V, 15V 12.1.8 VCM = 1000 VP-P, VO > 7 V (VDD = 9 V), VO > 12 V (VDD = 15 V) IF = 0 mA, VDD = 9 V, 15 V VCM = 1000 VP-P, VO < 1 V  4 30 ±25 ±50  ±25 ±50  kV/µs Note: All typical values are at VDD = 9 V, Ta = 25 , unless otherwise noted. Note 1: f = 50 kHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray wiring capacitance. Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc). ©2017-2018 Toshiba Electronic Devices & Storage Corporation 5 2018-01-19 Rev.2.0 TLP2735 12. Test Circuits and Characteristics Curves 12.1. Test Circuits Fig. 12.1.1 VOL Test Circuit Fig. 12.1.2 VOH Test Circuit Fig. 12.1.3 ICCL Test Circuit Fig. 12.1.4 ICCH Test Circuit Fig. 12.1.5 IOSL Test Circuit Fig. 12.1.6 IOSH Test Circuit Fig. 12.1.7 Switching Time Test Circuit and Waveform Fig. 12.1.8 Common-Mode Transient Immunity Test Circuit and Waveform ©2017-2018 Toshiba Electronic Devices & Storage Corporation 6 2018-01-19 Rev.2.0 TLP2735 12.2. Characteristics Curves (Note) Fig. 12.2.1 IF - VF Fig. 12.2.2 IFLH - Ta Fig. 12.2.3 VO - IF(IHYS) Fig. 12.2.4 VO - IF(IHYS) Fig. 12.2.5 VOL - Ta Fig. 12.2.6 (VDD-VOH) - Ta ©2017-2018 Toshiba Electronic Devices & Storage Corporation 7 2018-01-19 Rev.2.0 TLP2735 Fig. 12.2.7 IDDL - Ta Fig. 12.2.8 IDDH - Ta Fig. 12.2.9 IOSL - Ta Fig. 12.2.10 IOSH - Ta Fig. 12.2.11 VO - VDD Fig. 12.2.12 tpLH, tpHL, |tpHL-tpLH| - Ta ©2017-2018 Toshiba Electronic Devices & Storage Corporation 8 2018-01-19 Rev.2.0 TLP2735 Fig. 12.2.13 tpLH, tpHL, |tpHL-tpLH| - Ta Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. ©2017-2018 Toshiba Electronic Devices & Storage Corporation 9 2018-01-19 Rev.2.0 TLP2735 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. • When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. An Example of a Temperature Profile When Lead(Pb)-free Solder Is Used • When using soldering flow Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds. Mounting condition of 260  within 10 seconds is recommended. Flow soldering must be performed once. • When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not exceeding 350  Heating by soldering iron must be done only once per lead. 13.2. Precautions for General Storage • Avoid storage locations where devices may be exposed to moisture or direct sunlight. • Follow the precautions printed on the packing label of the device for transportation and storage. • Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %, respectively. • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. • Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. • When restoring devices after removal from their packing, use anti-static containers. • Do not allow loads to be applied directly to devices while they are in storage. • If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. ©2017-2018 Toshiba Electronic Devices & Storage Corporation 10 2018-01-19 Rev.2.0 TLP2735 14. Land Pattern Dimensions (for reference only) Unit: mm 15. Marking ©2017-2018 Toshiba Electronic Devices & Storage Corporation 11 2018-01-19 Rev.2.0 TLP2735 16. EN60747-5-5 Option (D4) Specification • Part number: TLP2735 (Note 1) • The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN60747. Example: TLP2735(D4-TP,E(O D4: EN60747 option TP: Tape type E: [[G]]/RoHS COMPATIBLE (Note 2) O: Domestic ID (Country/Region of origin: Japan) Note 1: Use TOSHIBA standard type number for safety standard application. e.g., TLP2735(D4-TP,E(O → TLP2735 Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Fig. 16.1 EN60747 Isolation Characteristics ©2017-2018 Toshiba Electronic Devices & Storage Corporation 12 2018-01-19 Rev.2.0 TLP2735 Fig. 16.2 Insulation Related Specifications (Note) Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 16.3 Marking on Packing for EN60747 Fig. 16.4 Marking Example (Note) Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747. ©2017-2018 Toshiba Electronic Devices & Storage Corporation 13 2018-01-19 Rev.2.0 TLP2735 Fig. 16.5 Measurement Procedure ©2017-2018 Toshiba Electronic Devices & Storage Corporation 14 2018-01-19 Rev.2.0 TLP2735 17. Specifications for Embossed-Tape Packing 17.1. Applicable Package Package Name Product Type SO6L Long creepage mini flat coupler 17.2. Product Naming Conventions Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification is as below. Example) TLP2735(TP,E(O Part number: TLP2735 Tape type: TP [[G]]/RoHS COMPATIBLE: E (Note 1) Domestic ID (Country/Region of origin: Japan): O Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 17.3. Tape Dimensions Specification Tape Type Division Packing Amount (A unit per reel) TP  1500 17.3.1. Orientation of Device in Relation to Direction of Feed Device orientation in the carrier cavities as shown in the following figure. Orientation of Device in Relation to Direction of Tape Movement 17.3.2. Empty Cavities Characteristics Criterion Occurrences of 2 or more successive empty cavities Single empty cavity Remarks 0 device Within any given 40-mm section of tape, not including leader and trailer 6 devices (max) per reel Not including leader and trailer 17.3.3. Tape Leader and Trailer The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and a cover tape of 30 mm or longer. ©2017-2018 Toshiba Electronic Devices & Storage Corporation 15 2018-01-19 Rev.2.0 TLP2735 17.3.4. Tape Dimensions Tape material: Plastic (for protection against static electricity) Table Tape Dimensions (unit: mm, tolerance: ±0.1) Symbol Dimension Remark A 10.4  B 4.24  D 7.5 Center line of embossed cavity and sprocket hole E 1.75 Distance between tape edge and sprocket hole center F 12.0 Cumulative error +0.1/-0.3 (max) per 10 empty cavities holes G 4.0 Cumulative error +0.1/-0.3 (max) per 10 sprocket holes K0 2.4 Internal space ©2017-2018 Toshiba Electronic Devices & Storage Corporation 16 2018-01-19 Rev.2.0 TLP2735 17.3.5. Reel Specification Material: Plastic (for protection against static electricity) Table Reel Dimensions (unit: mm) Symbol Dimension A φ330 ± 2.0 B φ100 ± 1.0 C φ13 ± 0.5 E 2.0 ± 0.5 U 4.0 ± 0.5 W1 17.4 ± 1.0 W2 21.4 ± 1.0 ©2017-2018 Toshiba Electronic Devices & Storage Corporation 17 2018-01-19 Rev.2.0 TLP2735 17.4. Packing (Note) 1 reel/carton (unit: mm) Note: Taping reel diameter: φ330 mm 17.5. Label Format (1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc. (2) Reel: The label provides the part number, the taping name, quantity, lot number, etc. 17.6. Ordering Information When placing an order, please specify the part number, tape type and quantity as shown in the following example. Example) TLP2735(TP,E(O 1500 pcs Part number: TLP2735 Tape type: TP (12-mm pitch) [[G]]/RoHS COMPATIBLE: E (Note 1) Domestic ID (Country/Region of origin: Japan): O Quantity (must be a multiple of 1500): 1500 pcs Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. ©2017-2018 Toshiba Electronic Devices & Storage Corporation 18 2018-01-19 Rev.2.0 TLP2735 Package Dimensions Unit: mm Weight: 0.126 g (typ.) Package Name(s) TOSHIBA: 11-4N1A ©2017-2018 Toshiba Electronic Devices & Storage Corporation 19 2018-01-19 Rev.2.0 TLP2735 RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. ©2017-2018 Toshiba Electronic Devices & Storage Corporation 20 2018-01-19 Rev.2.0