TLP291(SE
TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRANSISTOR
TLP291(SE
Power Supplies
Programmable Controllers
Hybrid ICs
Unit: mm
TLP291(SE consists of photo transistor optically coupled to a gallium
arsenide infrared emitting diode.
TLP291(SE is housed in the SO4 package, very small and thin coupler.
Since TLP291(SE is guaranteed wide operating temperature (Ta=-55 to
110 ˚C) and high isolation voltage (3750Vrms), it’s suitable for high-density
surface mounting applications such as small switching power supplies and
programmable controllers.
Collector-Emitter Voltage
: 80 V (min)
Current Transfer Ratio
Rank GB
: 50% (min)
: 100% (min)
Isolation Voltage
: 3750 Vrms (min)
TOSHIBA
11-3C1
Weight: 0.05 g (typ.)
Operation temperature: -55 to 110 ˚C
Pin Configuration
UL recognized
: UL1577, File No. E67349
cUL approved
: CSA Component Acceptance Service No.5A,
File No. E67349
SEMKO conformity
: EN 60065: 2002,
TLP291
EN 60950-1: 2001, EN 60335-1: 2002,
BSI conformity
: BS EN 60065: 2002,
BS EN 60950-1: 2006
VDE conformity: EN 60747-5-5
1
4
2
3
1:ANODE
2:CATHODE
3:EMITTER
4:COLLECTOR
Construction Mechanical Rating
Creepage distance: 5.0mm(min)
Clearance: 5.0mm(min)
Insulation thickness: 0.4mm(min)
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TLP291(SE
Current Transfer Ratio (CTR) Rank ( Unless otherwise specified, Ta = 25°C)
TYPE
Classification
(Note1)
Current Transfer Ratio (%)
(I C / I F )
I F = 5 mA, V CE = 5 V, Ta = 25°C
Min
Max
Blank
TLP291
50
600
Marking of Classification
Blank, YE, GR, GB, BL, Y+, G, G+,B
Rank Y
50
150
YE
Rank GR
100
300
GR
Rank GB
100
600
GB
Rank BL
200
600
BL
Rank YH
75
150
Y+
Rank GRL
100
200
G
Rank GRH
150
300
G+
Rank BLL
200
400
B
Note1: Specify both the part number and a rank in this format when ordering
(e.g.) rank GB: TLP291 (GB,SE
For safety standard certification, however, specify the part number alone.
(e.g.)TLP291 (GB,SE: TLP291
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TLP291(SE
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25°C)
CHARACTERISTIC
RATING
UNIT
IF
50
mA
∆I F /∆Ta
-1.5
mA /°C
1
A
SYMBOL
Input forward current
Input forward current derating (Ta≥90°C)
NOTE
I FP
Input reverse voltage
VR
5
V
Input power dissipation
PD
100
mW
∆P D /∆Ta
-3.0
mW/°C
Tj
125
°C
Collector-emitter voltage
V CEO
80
V
Emitter-collector voltage
V ECO
7
V
Collector current
IC
50
mA
Collector power dissipation
PC
150
mW
∆P C /∆Ta
-1.5
mW /°C
Tj
125
°C
Operating temperature range
T opr
-55 to 110
°C
Storage temperature range
T stg
-55 to 125
°C
Lead soldering temperature
T sol
260 (10s)
°C
Total package power dissipation
PT
200
mW
∆P T /∆Ta
-2.0
mW /°C
3750
Vrms
LED
Input forward current (pulsed )
Input power dissipation derating
(Ta ≥ 90°C)
DETECTOR
Junction temperature
Collector power dissipation derating(Ta≥25°C)
Junction temperature
Total package power dissipation derating(Ta≥25°C)
Isolation voltage
(Note 2)
BV S
(Note3)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note2: Pulse width ≤ 100μs, frequency 100Hz
Note3: AC, 1 minute, R.H.≤60%, Device considered a two terminal device: LED side pins shorted together and
DETECTOR side pins shorted together.
Electrical Characteristics (Unless otherwise specified, Ta = 25°C)
DETECTOR
LED
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
UNIT
1.1
1.25
1.4
V
Input forward voltage
VF
I F = 10 mA
Input reverse current
IR
VR = 5 V
-
-
5
μA
Input capacitance
CT
V = 0 V, f = 1 MHz
-
30
-
pF
Collector-emitter breakdown voltage
V (BR) CEO
I C = 0.5 mA
80
-
-
V
Emitter-collector breakdown voltage
V (BR) ECO
I E = 0.1 mA
7
-
-
V
V CE = 48 V
Dark current
Collector-emitter capacitance
I DARK
C CE
-
0.01
0.08
μA
V CE = 48 V, Ta = 85°C
-
2
50
μA
V = 0 V, f = 1 MHz
-
10
-
pF
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TLP291(SE
Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25°C)
CHARACTERISTIC
Current transfer ratio
Saturated current transfer ratio
Collector-emitter saturation voltage
SYMBOL
IC / IF
I C / I F (sat)
V CE (sat)
TEST CONDITION
MIN
TYP.
MAX
50
-
600
100
-
600
-
60
-
30
-
-
I C = 2.4 mA, I F = 8 mA
-
-
0.3
I C = 0.2 mA, I F = 1 mA
-
0.2
-
-
-
0.3
-
-
10
μA
MIN
TYP.
MAX
UNIT
-
0.8
-
pF
-
Ω
I F = 5 mA, V CE = 5 V
Rank GB
I F = 1 mA, V CE = 0.4 V
Rank GB
Rank GB
OFF-state collector current
I C (off)
V F = 0.7 V, V CE = 48 V
UNIT
%
%
V
Isolation Characteristics (Unless otherwise specified, Ta = 25°C)
CHARACTERISTIC
Total capacitance (input to output)
Isolation resistance
SYMBOL
CS
RS
TEST CONDITION
V S = 0 V, f = 1 MHz
V S = 500 V, R.H.≤60%
1×10
AC , 1 minute
Isolation voltage
BV S
12
10
14
3750
-
-
AC , 1 second, in OIL
-
10000
-
DC , 1 minute, in OIL
-
10000
-
Vdc
MIN
TYP.
MAX
UNIT
-
2
-
-
3
-
-
3
-
-
3
-
-
0.5
-
-
25
-
-
40
-
Vrms
Switching Characteristics (Unless otherwise specified, Ta = 25°C)
CHARACTERISTIC
SYMBOL
Rise time
tr
Fall time
tf
Turn-on time
t on
Turn-off time
t off
Turn-on time
t on
Storage time
ts
Turn-off time
t off
TEST CONDITION
V CC = 10 V, I C = 2 mA
R L = 100Ω
R L = 1.9 kΩ
V CC = 5 V, I F = 16 mA
(Fig.1)
μs
μs
(Fig.1) Switching Time Test Circuit
t on
4
t off
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TLP291(SE
P C - Ta
Collector power dissipation
Input forward current
PC
I F (mA)
(mW)
I F - Ta
This curve shows the
maximum limit to the input
forward current.
Ambient temperature
Ta
(˚C)
This curve shows the maximum
limit to the collector power
dissipation.
Ambient temperature
IFP-DR
Ta
(˚C)
IF-VF
10000
(mA)
IF
Ta=25˚C
1000
Input forward current
Input forward current (pulsed)
I FP (mA)
Pules width ≤100μs
100
This curve shows the
maximum limit to the input
forward current (pulsed).
10
10-3
10-2
100
10-1
Duty cycle ratio
110˚C
85˚C
50˚C
25˚C
0˚C
-25˚C
-55˚C
DR
Input forward voltage
∆ V F / ∆ Ta - I F
VF
(V)
Input forward current (pulsed)
I FP
(mA)
Input forward current temperature coefficient
ΔV F /ΔTa (mV/°C)
IFP – VFP
Input forward current
IF
(mA)
Pulse width ≤10μs
Repetitive frequency=100Hz
Ta=25°C
Input forward voltage (pulsed)
V FP
(V)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted
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TLP291(SE
IC-VCE
IC-VCE
Ta=25˚C
Ta=25˚C
(mA)
(mA)
P C (max)
50 mA
IC
IC
50 mA
30 mA
20 mA
10 mA
I F = 5mA
Collector-emitter voltage
V CE
30 mA
20 mA
Collector current
Collector current
15 mA
10 mA
5 mA
IF = 2
mA
Collector-emitter voltage
(V)
15 mA
V CE
(V)
IC/IF -IF
IC-IF
V CE =10V
V CE =5V
V CE =0.4V
Current transfer ratio
Collector current
IC
IC / IF
(mA)
(%)
Ta=25˚C
V CE =10V
V CE =5V
V CE =0.4V
Input forward voltage
IF
(mA)
Input forward current
(mA)
V C E ( s a t ) - Ta
V CE =48
24V
10V
5V
(V)
V CE(sat)
I CEO (μA)
Collector-emitter saturation voltage
I C E O - Ta
Dark current
IF
I F =8mA,
I C =2.4mA
Ambient temperature
Ta
(°C)
Ambient temperature
Ta
(°C)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted
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TLP291(SE
I C - Ta
Collector current I C (mA)
25 mA
10 mA
5 mA
1 mA
I F =0.5mA
V CE =5V
Ambient temperature
Ta
(°C)
Switching time - RL
S w i t c h i n g t i m e - Ta
Ta=25˚C
I F =16mA
I F =16mA
V CC =5V
R L =1.9kΩ
V CC =5V
toff
(μs)
(μs)
toff
ts
Switching time
Switching time
ts
ton
ton
Load resistance
Ambient temperature
R L (kΩ)
Ta
(°C)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TLP291(SE
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
·Temperature profile example of lead (Pb) solder
(°C)
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
Package surface temperature
240
210
160
140
less than 30s
60 to 120s
Time
(s)
·Temperature profile example of using lead (Pb)-free solder
(°C)
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
Package surface temperature
260
230
190
180
60 to 120s
30 to 50s
Time
(s)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
· Please preheat it at 150°C between 60 and 120 seconds.
· Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
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TLP291(SE
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP291(SE
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
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Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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