TLP291
TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRANSISTOR
TLP291
Power Supplies
Programmable Controllers
Hybrid ICs
Unit: mm
TLP291 consists of photo transistor, optically coupled to a gallium arsenide
infrared emitting diode. TLP291 is housed in the SO4 package, very small
and thin coupler.
Since TLP291 is guaranteed wide operating temperature (Ta=-55 to 110 ˚C)
and high isolation voltage (3750Vrms), it’s suitable for high-density surface
mounting applications such as small switching power supplies and
programmable controllers.
z Collector-Emitter Voltage
: 80 V (min)
z Current Transfer Ratio
Rank GB
: 50% (min)
: 100% (min)
z Isolation Voltage
: 3750 Vrms (min)
TOSHIBA
11-3C1
Weight: 0.05 g (typ.)
z Operation temperature
: -55 to 110 ˚C
z UL (Under application)
: UL1577
z cUL (Under application)
: CSA Component Acceptance Service No.5A
Pin Configuration
z SEMKO (Under application) : EN 60065: 2002,
EN 60950-1: 2001, EN 60335-1: 2002
z BSI (Under application)
z Option (V4)
VDE (Under application)
: BS EN 60065: 2002,
: BS EN 60950-1: 2006
TLP291
1
4
2
3
: EN60747-5-2
1:ANODE
2:CATHODE
3:EMITTER
4:COLLECTOR
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TLP291
Current Transfer Ratio (CTR) Rank ( Unless otherwise specified, Ta = 25°C)
TYPE
Classification
(Note1)
Current Transfer Ratio (%)
(IC / IF)
IF = 5 mA, VCE = 5 V, Ta = 25°C
Min
Max
Blank
TLP291
50
400
Marking of Classification
Blank, YE, Y+, GR, GB, G, G+,B
Rank Y
50
150
YE
Rank GR
100
300
GR
Rank GB
100
400
GB
Rank YH
75
150
Y+
Rank GRL
100
200
G
Rank GRH
150
300
G+
Rank BLL
200
400
B
Note1: Ex. rank GB: TLP291 (GB,E
Note : Application type name for certification test, please use standard product type name, i.e.
TLP291 (GB,E: TLP291
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TLP291
Absolute Maximum Ratings (Note)( Unless otherwise specified, Ta = 25°C)
CHARACTERISTIC
RATING
UNIT
IF
50
mA
∆IF /ΔTa
−1.5
mA /°C
1
A
SYMBOL
Input forward current
Input forward current derating (Ta≥90°C)
NOTE
IFP
Input reverse voltage
VR
5
V
Input power dissipation
PD
100
mW
ΔPD/ΔTa
-3.0
mW/°C
Tj
125
°C
Collector-emitter voltage
VCEO
80
V
Emitter-collector voltage
VECO
7
V
Collector current
IC
50
mA
Collector power dissipation
PC
150
mW
∆PC /ΔTa
−1.5
mW /°C
Tj
125
°C
Operating temperature range
Topr
−55 to 110
°C
Storage temperature range
Tstg
−55 to 125
°C
Lead soldering temperature
Tsol
260 (10s)
°C
Total package power dissipation
PT
200
mW
∆PT /ΔTa
−2.0
mW /°C
3750
Vrms
LED
Input forward current (pulsed )
Input power dissipation derating
(Ta ≥ 90°C)
DETECTOR
Junction temperature
Collector power dissipation derating(Ta≥25°C)
Junction temperature
Total package power dissipation derating(Ta≥25°C)
Isolation voltage
(Note 2)
BVS
(Note3)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note2: Pulse width ≤ 100μs, frequency 100Hz
Note3: AC, 1 minute, R.H.≤60%, Device considered a two terminal device: LED side pins shorted together and
DETECTOR side pins shorted together.
Electrical Characteristics (Unless otherwise specified, Ta = 25°C)
DETECTOR
LED
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
UNIT
Input forward voltage
VF
IF = 10 mA
1.1
1.25
1.4
V
Input reverse current
IR
VR = 5 V
—
—
5
μA
Input capacitance
CT
V = 0, f = 1 MHz
—
30
—
pF
Collector-emitter breakdown voltage
V(BR) CEO
IC = 0.5 mA
80
—
—
V
Emitter-collector breakdown voltage
V(BR) ECO
IE = 0.1 mA
7
—
—
V
VCE = 48 V
Dark current
Collector-emitter capacitance
ICEO
CCE
—
0.01
0.08
μA
VCE = 48 V, Ta = 85°C
—
2
50
μA
V = 0, f = 1 MHz
—
10
—
pF
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TLP291
Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25°C)
CHARACTERISTIC
Current transfer ratio
Saturated current transfer ratio
Collector-emitter saturation voltage
SYMBOL
IC / IF
IC / IF (sat)
VCE (sat)
TEST CONDITION
MIN
TYP.
MAX
50
—
400
100
—
400
—
60
—
30
—
—
IC = 2.4 mA, IF = 8 mA
—
—
0.3
IC = 0.2 mA, IF = 1 mA
—
0.2
—
—
—
0.3
—
—
10
μA
MIN
TYP.
MAX
UNIT
—
0.8
—
pF
—
Ω
IF = 5 mA, VCE = 5 V
Rank GB
IF = 1 mA, VCE = 0.4 V
Rank GB
Rank GB
OFF-state collector current
IC (off)
VF = 0.7 V, VCE = 48 V
UNIT
%
%
V
Isolation Characteristics (Unless otherwise specified, Ta = 25°C)
CHARACTERISTIC
Total capacitance (input to output)
Isolation resistance
SYMBOL
CS
RS
TEST CONDITION
VS = 0 V, f = 1 MHz
VS = 500 V, R.H.≤60%
1×10
AC , 1 minute
Isolation voltage
BVS
12
10
14
3750
—
—
AC , 1 second, in OIL
—
10000
—
DC , 1 minute, in OIL
—
10000
—
Vdc
MIN
TYP.
MAX
UNIT
—
4
—
—
7
—
—
7
—
—
7
—
—
2
—
—
30
—
—
60
—
Vrms
Switching Characteristics (Unless otherwise specified, Ta = 25°C)
CHARACTERISTIC
SYMBOL
Rise time
tr
Fall time
tf
Turn-on time
ton
Turn-off time
toff
Turn-on time
ton
Storage time
ts
Turn-off time
toff
TEST CONDITION
VCC = 10 V, IC = 2 mA
RL = 100Ω
RL = 1.9 kΩ
VCC = 5 V, IF = 16 mA
(Fig.1)
μs
μs
(Fig.1) Switching Time Test Circuit
ton
4
toff
2012-02-16
TLP291
I F - Ta
P C - Ta
160
Input forward current
(mW)
60
40
(Note) This curve shows
20
the maximum limit to the
input forward current.
0
-20
0
20
40
60
80
Ambient temperature
Ta
100
120
140
PC
80
120
Collector power dissipation
I F (mA)
100
100
80
60
40
(Note) This curve shows the
maximum limit to the collector
20
power dissipation.
0
-20
0
20
(mA)
IF
300
Input forward current
Input forward current (pulsed)
IFP (mA)
500
100
(Note) This curve shows the
maximum limit to the input
forward current (pulsed).
10
Duty cycle ratio
(˚C)
10
110˚C
85˚C
50˚C
25˚C
0˚C
-25˚C
-55˚C
1
100
0.6
DR
0.8
1
1.2
1.4
Input forward voltage
∆ V F / ∆ Ta - I F
1.6
1.8
VF
2
(V)
IFP – VFP
1000
(mA)
-3.2
IFP
-2.8
-2.4
Input forward current (pulsed)
Input forward current derating
ΔVF /ΔTa (mV/°C)
120
0.1
10-1
10-2
10-3
Ta
100
100
Pules width ≤100μs
Ta=25˚C
30
80
IF-VF
1000
50
60
Ambient temperature
(˚C)
IFP-DR
3000
40
-2
-1.6
-1.2
-0.8
-0.4
0.1
1
Input forward current
10
IF
100
100
10
Pulse width ≤10μs
Repeative frequency=100Hz
Ta=25°C
1
0.6
(mA)
1
1.4
1.8
2.2
Input forward voltage (pulsed)
2.6
3
VFP
3.4
(V)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TLP291
IC-VCE
IC-VCE
50
30
Ta=25˚C
Ta=25˚C
(mA)
40
50
30
30
25
50
20
IC
20
15
20
Collector current
Collector current
IC
(mA)
PC (max)
10
10
30
20
15
15
10
10
5
5
I F= 2 m A
IF=5mA
0
0
0
2
4
6
8
Collector-emitter voltage
VCE
0
10
0.2
0.4
0.6
0.8
Collector-emitter voltage
(V)
IC-IF
VCE
1
(V)
I C E O - Ta
10
100
Ta=25˚C
ICEO (μA)
10
Dark current
Collector current
IC
(mA)
1
1
VCE=10V
0.1
VCE=48V
24V
10V
5V
0.01
0.001
VCE=5V
VCE=0.4V
0.0001
0.1
0.1
1
Input forward voltage
10
IF
0
100
(mA)
20
40
60
Ambient temperature
80
Ta
100
120
(°C)
IC/IF -IF
1000
VCE=10V
Current transfer ratio
IC / IF (%)
VCE=5V
VCE=0.4V
100
10
0.1
1
Input forward current
10
IF
100
(mA)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TLP291
V C E ( s a t ) - Ta
I C – Ta
100
25
Collector current IC (mA)
0.24
(V)
0.20
0.16
VCE(sat)
Collector-emitter saturation voltage
0.28
0.12
0.08
IF=8mA, IC=2.4mA
0.04
10
5
10
1
1
IF=0.5mA
IF=1mA, IC=0.2mA
VCE=5V
0.00
-60 -40 -20
0
20
40
Ambient temperature
60
80
Ta
0.1
-60 -40 -20
100 120
(°C)
Switching time - RL
0
20
40
60
Ambient temperature
Ta
80 100 120
(°C)
S w i t c h i n g t i m e – Ta
1000
10000
Ta=25˚C
IF=16mA
VCC=5V
toff
1000
100
toff
(μs)
ts
100
Switching time
Switching time
(μs)
ts
10
10
Ton
1
IF=16mA
VCC=5V
RL=1.9kΩ
ton
0.1
-60 -40 -20
1
1
10
Load resistance
100
RL (kΩ)
0
20
40
60
Ambient temperature
Ta
80
100 120
(°C)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TLP291
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
·Temperature profile example of lead (Pb) solder
(°C)
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
Package surface temperature
240
210
160
140
less than 30s
60 to 120s
Time
(s)
·Temperature profile example of using lead (Pb)-free solder
(°C)
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
Package surface temperature
260
230
190
180
60 to 120s
30 to 50s
Time
(s)
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
· Please preheat it at 150°C between 60 and 120 seconds.
· Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
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TLP291
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP291
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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