TLP2955(F)

TLP2955 Photocouplers GaAℓAs Infrared LED & Photo IC TLP2955 1. Applications • Intelligent Power Module Signal Isolation • Programmable Logic Controllers (PLCs) • High-Speed Digital Interfacing for Instrumentation and Control Devices 2. General The Toshiba TLP2955 consists of a GaAℓAs light-emitting diode coupled with a high-gain, high-speed photo detector. It is housed in the DIP8 package. The detector has a totem-pole output stage with current sourcing and sinking capabilities. The TLP2955 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of ±20 kV/µs. The TLP2955 has an buffer output. A inverter output version, the TLP2958, is also available. 3. Features (1) Buffer logic type (totem pole output) (2) Package: DIP8 (3) Supply voltage: 3 to 20 V (4) Threshold input current, low to high: IFLH = 1.6 mA (max) (5) Propagation delay time: 250 ns (max) (6) Common-mode transient immunity: ±20 kV/µs (min) (7) Operating temperature: -40 to 125 (8) Isolation voltage: 5000 Vrms (min) (9) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1) Note 1: When a VDE approved type is needed, please designate the Option (D4) (D4). Start of commercial production ©2016 Toshiba Corporation 1 2012-03 2016-02-17 Rev.2.0 TLP2955 4. Packaging and Pin Configuration 1: N.C. 2: Anode 3: Cathode 4: N.C. 5: GND 6: N.C. 7: VO(output) 8: VCC 11-10C4S 5. Internal Circuit (Note) Note: A 0.1-µF bypass capacitor must be connected between pin 8 and pin 5. 6. Principle of Operation 6.1. Truth Table Input LED Output H ON H L OFF L 6.2. Mechanical Parameters Characteristics 7.62 mm Pitch TLP2955 10.16 mm Pitch TLP2955F Unit mm Creepage distances 7.0 (min) 8.0 (min) Clearance 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) ©2016 Toshiba Corporation 2 2016-02-17 Rev.2.0 TLP2955 ) 7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 25 Characteristics LED Symbol Rating Unit 25 mA -0.6 mA/ 1 A ∆IFPT/∆Ta -25 mA/ PD 40 mW ∆PD/∆Ta -1.0 mW/ Input forward current Input forward current derating IF (Ta ≥ 108) ∆IF/∆Ta Peak transient input forward current Peak transient input forward current derating IFPT (Ta ≥ 110) Input power dissipation Input power dissipation derating Note (Ta ≥ 110) Input reverse voltage (Note 1) VR 5 V (Ta ≤ 25) IO 25/-15 mA Output current derating (Ta ≥ 25) ∆IO/∆Ta -0.2/-0.12 mA/ Output current (Ta = 125) IO 5/-3 mA PW ≤ 5 µs, Duty ≤ 0.025% IOP 200/-50 Output voltage VO -0.5 to 20 Supply voltage VCC -0.5 to 20 Output power dissipation PO 100 mW ∆PO/∆Ta -2.5 mW/ Topr -40 to 125  Tstg -55 to 150 Detector Output current Peak output current Output power dissipation derating (Ta ≥ 110) Common Operating temperature Storage temperature Lead soldering temperature Isolation voltage (10 s) Tsol AC, 60 s, R.H. ≤ 60% BVS V 260 (Note 2) 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) ≤ 1 µs, 300 pps Note 2: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 8. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Max Unit Input on-state current IF(ON) (Note 1) 2 Input off-state voltage VF(OFF) 0  10 mA  0.8 V Supply voltage VCC (Note 2) 3  20 Operating temperature Topr (Note 2) -40  125  Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this datasheet should also be considered. Note: A ceramic capacitor (0.1 µF) should be connected between pin 8 and pin 5 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1 :The rise and fall times of the input on-current should be less than 0.5 µs. Note 2: Denotes the operating range, not the recommended operating condition. ©2016 Toshiba Corporation 3 2016-02-17 Rev.2.0 TLP2955 9. Electrical Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 , VCC = 3 to 20 V) 125 Characteristics Input forward voltage Input forward voltage temperature coefficient Symbol Note Test Circuit Test Condition Min Typ. Max Unit VF  IF = 10 mA, Ta = 25 1.45 1.55 1.70 V ∆VF/∆Ta  IF = 10 mA  -2.0  mV/ Input reverse current IR  VR = 5 V, Ta = 25   10 µA Input capacitance Ct  V = 0 V, f = 1 MHz  60  pF Low-level output voltage VOL Fig. 12.1.1 IO = 3.5 mA, VF = 0.8 V  0.2 0.5 V High-level output voltage VOH Fig. 12.1.2 VCC = 3 V, IO = -2.6 mA, IF = 5 mA 1.78 2.1  VCC = 20 V, IO = -2.6 mA, IF = 5 mA 17.4 19  (Note 1) Low-level supply current ICCL Fig. 12.1.3 VCC = 3.6 V, VF = 0 V  1.4 3.0 VCC = 20 V, VF = 0 V  1.5 3.0 High-level supply current ICCH Fig. 12.1.4 VCC = 3.6 V, IF = 5 mA  1.9 3.0 VCC = 20 V, IF = 5 mA  2.0 3.0 Fig. 12.1.5 VCC = VO = 3.6 V, VF = 0 V 25 100  VCC = VO = 20 V, VF = 0 V 40 140  Fig. 12.1.6 VCC = 3.6 V, IF = 5 mA, VO = GND  -13 -5 VCC = 20 V, IF = 5 mA, VO = GND  -22 -10 VCC = 3.3 V, IO = -2.6 mA, VO > 1.78 V  0.4 1.6 VCC = 20 V, IO = -2.6 mA, VO > 17.4 V  0.4 1.6 VCC = 3.3 V, VO < 0.6 V, IO = 6.4 mA 0.8   VCC = 20 V, VO < 0.6 V, IO = 6.4 mA 0.8   VCC = 5 V  0.05  mA Min Typ. Max Unit  0.8  pF 1 × 1012 1014  Ω 5000   Vrms AC, 1 s in oil  10000  DC, 60 s in oil  10000  Low-level short-circuit output current IOSL High-level short-circuit output current IOSH Threshold input current (L/H) Threshold input voltage (H/L) Input current hysteresis (Note 2) (Note 2) IFLH  VFHL  IHYS  mA V Note: All typical values are at Ta = 25. Note 1: VOH = VCC - VO (V) Note 2: Duration of output short circuit time should not exceed 10 ms. ) 25 10. Isolation Characteristics (Unless otherwise specified, Ta = 25 Characteristics Symbol Note Test Conditions Total capacitance (input to output) CS (Note 1) VS = 0 V, f = 1 MHz Isolation resistance RS (Note 1) VS = 500 V, R.H. ≤ 60% Isolation voltage BVS (Note 1) AC, 60 s Vdc Note 1: This device is considered as a two-terminal device: Pins 1 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. ©2016 Toshiba Corporation 4 2016-02-17 Rev.2.0 TLP2955 11. Switching Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 , VCC = 3 to 20 V) 125 Characteristics Propagation delay time (L/H) Propagation delay time (H/L) Pulse width distortion Symbol Note tpLH tpHL Test Circuit Test Condition Fig. 12.1.7, IF = 0 → 3 mA Fig. 12.1.8 IF = 3 → 0 mA |tpHL-tpLH| Min Typ. Max Unit 30 120 250 ns 30 130 250 IF = 3 mA  10 220 Rise time tr IF = 0 → 3 mA, VCC = 5 V  16 75 Fall time tf IF = 3 → 0 mA, VCC = 5 V  14 75 VCM = 1000 Vp-p, IF = 5 mA, VCC = 20 V, Ta = 25 ±20 ±25  VCM = 1000 Vp-p, IF = 0 mA, VCC = 20 V, Ta = 25 ±20 ±25  Common-mode transient immunity at output high CMH Common-mode transient immunity at output low CML Note: Fig. 12.1.9 kV/µs All typical values are at Ta = 25. ©2016 Toshiba Corporation 5 2016-02-17 Rev.2.0 TLP2955 12. Test Circuits and Characteristics Curves 12.1. Test Circuits Fig. 12.1.1 VOL Test Circuit Fig. 12.1.2 VOH Test Circuit Fig. 12.1.3 ICCL Test Circuit Fig. 12.1.4 ICCH Test Circuit Fig. 12.1.5 IOSL Test Circuit Fig. 12.1.6 IOSH Test Circuit Fig. 12.1.7 Switching Time Test Circuit and Waveform ©2016 Toshiba Corporation 6 2016-02-17 Rev.2.0 TLP2955 Fig. 12.1.8 Switching Time Test Circuit and Waveform Fig. 12.1.9 Common-Mode Transient Immunity Test Circuit and Waveform ©2016 Toshiba Corporation 7 2016-02-17 Rev.2.0 TLP2955 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. • When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 13.1.1 An Example of a Temperature Profile Fig. 13.1.2 An Example of a Temperature Profile When Sn-Pb Eutectic Solder Is Used When Lead(Pb)-Free Solder Is Used • When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds. Mounting condition of 260  within 10 seconds is recommended. Flow soldering must be performed once. • When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not exceeding 350  Heating by soldering iron must be done only once per lead. 13.2. Precautions for General Storage • Avoid storage locations where devices may be exposed to moisture or direct sunlight. • Follow the precautions printed on the packing label of the device for transportation and storage. • Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%, respectively. • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. • Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. • When restoring devices after removal from their packing, use anti-static containers. • Do not allow loads to be applied directly to devices while they are in storage. • If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. ©2016 Toshiba Corporation 8 2016-02-17 Rev.2.0 TLP2955 14. Marking ©2016 Toshiba Corporation 9 2016-02-17 Rev.2.0 TLP2955 Package Dimensions Unit: mm Weight: 0.54 g (typ.) Package Name(s) TOSHIBA: 11-10C4S ©2016 Toshiba Corporation 10 2016-02-17 Rev.2.0 TLP2955 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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For details, please contact your TOSHIBA sales representative. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. 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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. ©2016 Toshiba Corporation 11 2016-02-17 Rev.2.0