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TLP3023

TLP3023

  • 厂商:

    TOSHIBA(东芝)

  • 封装:

  • 描述:

    TLP3023 - OFFICE MACHINE HOUSEHOLD USE EQUIPMENT TRIAC DRIVER SOLID STATE RELAY - Toshiba Semiconduc...

  • 数据手册
  • 价格&库存
TLP3023 数据手册
TLP3021(S),TLP3022(S),TLP3023(S) TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRIAC TLP3021(S),TLP3022(S),TLP3023(S) OFFICE MACHINE HOUSEHOLD USE EQUIPMENT TRIAC DRIVER SOLID STATE RELAY The TOSHIBA TLP3021 (S), TLP3022 (S) and TLP3023 (S) consist of photo-triac optically coupled to a gallium arsenide infrared emitting diode in a six lead plastic DIP. Unit: mm Peak Off-State Voltage Trigger LED Current : 400 V (min) : 15 mA (max) (TLP3021(S)) 10 mA (max) (TLP3022(S)) 5 mA (max) (TLP3023(S)) : 100 mA (max) : 5000Vrms(Min) : UL1577,File No.E67349 : SS EN60065 SS EN60950, File No.9841105 : BS EN60065, File No.8385 BS EN60950, File No.8386 JEDEC EIAJ TOSHIBA Weight : 0.39g ― ― 11-7A9 On-State Current Isolation Voltage UL Recognized SEMKO Approved BSI Approved Option (D4) type VDE approved: DIN EN60747-5-2 Approved No. 40009302 Maximum operating insulation voltage: 890VPK Highest permissible over voltage: 8000VPK (Note):When a EN60747-5-2 approved type is needed, please designate the "Option (D4)" Pin Configuration (top view) 1 2 3 1: Anode 2: Csthode 3: N.C. 4:Terminal 1 6:Terminal 2 6 4 Construction Mechanical Rating 7.62 mm pich Standard Type Creepage Distance Clearance Insulation Thickness 7.0 mm (Min) 7.0 mm (Min) 0.5 mm (Min) 10.16 mm pich TLPxxxxF Type 8.0 mm (Min) 8.0 mm (Min) 0.5 mm (Min) 1 2007-10-01 TLP3021(S),TLP3022(S),TLP3023(S) Absolute Maximum Ratings (Ta=25°C) CHARACTERISTIC Forward Current Forward Current Derating (Ta≥53°C) LED Peak Forward Current (100μs pulse, 100pps) Power Dissipation Power Dissipation Derating (Ta≥25°C) Reverse Voltage Junction Temperature Off-State Output Terminal Voltage On-State RMS Current DETECTOR On-State Current Derating (Ta≥25°C) Peak On-State Current (100μs pulse, 120pps) Peak Nonrepetitive Surge Current Power Dissipation Power Dissipation Derating (Ta≥25°C) Junction Temperature Storage Temperature Range Operating Temperature Range Lead Soldering Temperature (10s) Total Package Power Dissipation Total Package Power Dissipation Derating (Ta≥25°C) Isolation Voltage (AC,1min. , R.H.≤60%) (Note 2) (Pw=10ms,DC=10%) Ta=25°C Ta=70°C ∆IT/°C ITP ITSM PD ∆PD /°C Tj Tstg Topr Tsol PT ∆PT/°C BVS SYMBOL IF ∆IF /°C IFP PD ∆PD /°C VR Tj VDRM IT(RMS) RATING 50 −0.7 1 100 -1.0 5 125 400 100 50 -1.1 2 1.2 300 -4.0 115 −55~150 −40~100 260 330 -4.4 5000 mA /°C A A mW mW/°C °C °C °C °C mW mW /°C Vrms UNIT mA mA /°C A mW mW/°C V °C V mA Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (Note 2) Device considered a two terminal device :Pins1,2 and 3 shorted together and pin4 and pin6 shorted together. Recommended Operating Conditions CHARACTERISTIC Supply Voltage Forward Current Peak On-State Current Operating Temperature SYMBOL VAC IF * MIN. TYP. MAX. 120 25 1 85 UNIT Vac mA A °C — 15 — 20 ITP Topr — −25 — — Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. *In The case of TLP3022 2 2007-10-01 TLP3021(S),TLP3022(S),TLP3023(S) Individual Electrical Characteristics (Ta=25°C) CHARACTERISTIC Forward Voltage LED Reverse Current Capacitance DETECTOR Peak Off-State Current Peak On-State Voltage Holding Current Critical Rate of Rise of Off-State Voltage Critical Rate of Rise of SYMBOL VF IR CT IDRM VTM IH dv/dt dv/dt(c) TEST CONDITION IF = 10 mA VR = 5 V V = 0, f=1MHz VDRM=400V ITM=100mA — Vin=120Vrms , Ta=85°C Vin=30Vrms , IT=15mA (Fig.1) (Fig.1) MIN. 1.0 TYP. 1.15 MAX. 1.3 10 — 1000 3.0 UNIT V μA pF nA V mA V/μs V/μs — — — — — 200 — — 10 10 1.7 0.6 500 0.2 — — — Commutating Voltage Coupled Electrical Characteristics (Ta=25°C) CHARACTERISTIC TLP3021(S) Trigger LED Current TLP3022(S) TLP3023(S) Capacitance (Input to Output) Isolation Resistance CS RS VS=0 , f=1MHz VS=500V(R.H.≤60%) AC , 1minute Isolation Voltage BVS AC , 1second,in oil DC , 1minute,in oil IFT VT=3V SYMBOL TEST CONDITION MIN. TYP. — 5 — 0.8 10 MAX. 15 10 5 UNIT — — — — 5×10 mA — — — — — pF Ω Vrms Vdc 10 14 5000 — 10000 10000 — — Fig. 1 dv / dt test circuit + VCC − Rin 120Ω Vin RL 2k Ω ~ dv / dt(c) +5V,VCC 0V dv / dt 1 2 3 6 4 3 2007-10-01 TLP3021(S),TLP3022(S),TLP3023(S) 4 2007-10-01 TLP3021(S),TLP3022(S),TLP3023(S) 5 2007-10-01 TLP3021(S),TLP3022(S),TLP3023(S) RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 20070701-EN • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2007-10-01
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