2011-3
PRODUCT GUIDE
Photocouplers and Photorelays
SEMICONDUCTOR
h t t p : / / w w w . s e m i c o n . t o s h i b a . c o . j p / e n g
Preface
Extensive Line of Products
As a type of isolator favored by manufacturers, photocouplers
now serve as noise protectors in many electronic devices.
Toshiba’s photocouplers consist of either a GaAs or GaA As
infrared LED(s) and a silicon photodetector(s) housed in a mold
package. GaA As LEDs are adopted in high-speed photo-IC
types due to their high-speed and high-light output.
To meet customers’ various needs, we offer an extensive
product portfolio shown below as well as generalpurpose photocouplers.
1. Photo-IC couplers: High speed and advanced functions
(highly integrated detectors)
2. Zero-crossing phototriac couplers: Phototriac-output
devices with zero-crossing detection
3. Photovoltaic couplers: MOSFET gate drive (high voltage
output achieved using a photodiode array)
4. Photorelays (MOSFET-output devices):
AC-DC switches (MOSFET output)
Mechanical relay replacement
White overmold
(epoxy)
Detector
Dome (silicon)
Infrared LED
Lead frame
Safety Standard Approvals
Perspective view
of the TLP521-1
UL approval has been obtained under file number E67349 for
most of our photocouplers. EN60747-5-2-approved
photocouplers are also offered with a wide selection of output
(transistor, thyristor, triac, IC output and photorelay). The
designs of these devices meet other standards including
IEC380/VDE0806, IEC60950/EN60950 and IEC60065/EN60065.
Cross section
of the TLP521-1
Small-Package Products
Toshiba offers a wide variety of photocouplers in a small
package to meet the space-saving requirement of increasingly
smaller and thinner end products. Packaging options include
mini-flat packages (MFSOPs) and half-pitch (1.27 mm) mini-flat
SOP packages.
Overseas Manufactured Photocouplers
Part of the general-purpose photocouplers with transistor and
triac outputs are manufactured by Toshiba Semiconductor
Thailand Co., Ltd. This will help customers procure components
locally for overseas assembly of end products.
CONTENTS
1. Product Index ............................................................... 3
2. New Products .............................................................. 5
6. Package Information .................................................. 42
3. Photocoupler Product Tree .......................................... 9
4. Selection Guide ......................................................... 10
2. Package Dimensions ................................................. 43
3. Rank Marking ......................................................... 49
1. Transistor-Output and Darlington-TransistorOutput Photocouplers ............................................... 10
2. Photocouplers for Logic Signal Transmission.......... 17
1. Lead Form Options for DIP Packages ..................... 42
7. Packing Information ................................................... 50
1. Photocoupler Magazine Packing
Specifications ............................................................. 51
3. Photocouplers for IGBT/MOSFET Gate Drive ........ 23
2. Tape-and-Reel Specifications ................................... 53
4. Photorelays (1-Form-A and 2-Form-A) .................... 26
8. Board Assembly......................................................... 56
1. Example Land Patterns .......................................... 56
5. Photorelays
(1-Form-B, 2-Form-B and 1-Form-A/1-Form-B) ...... 32
6. Triac-Output Photocouplers ...................................... 34
7. Thyristor-Output Photocouplers................................ 37
8. Photovoltaic-Output photocouplers .......................... 38
2. Board Assembly Considerations .............................. 57
9. Device Degradation ................................................... 58
1. Projected Operating Life Based on LED Light
9. Products Manufactured by Toshiba Semiconductor
Output Degradation ................................................... 58
10. Safety Standard Approvals ...................................... 65
(Thailand) Co., Ltd. (TST) ......................................... 38
5. Part Naming Conventions .......................................... 41
11. Photocoupler Application Circuit Examples ............. 67
12. Competitor Cross Reference ................................... 79
2
1
Product Index
Part Number
TLP104
TLP105
TLP108
TLP109
TLP109 (IGM)
TLP116A
TLP117
TLP118
TLP124
TLP126
TLP127
TLP130
TLP131
TLP137
TLP148G
TLP151
TLP151A
TLP155E
TLP160G
TLP160J
TLP161G
TLP161J
TLP163J
TLP165J
TLP166J
TLP168J
TLP170A
TLP170D
TLP170G
TLP170J
TLP172A
TLP172G
TLP173A
TLP174G
TLP174GA
TLP175A
TLP176A
TLP176D
TLP176G
TLP176GA
TLP179D
TLP180
TLP181
TLP184
TLP185
TLP190B
TLP191B
TLP192A
TLP192G
TLP197A
TLP197D
TLP197G
TLP197GA
TLP199D
TLP200D
TLP202A
TLP202G
TLP2066
TLP206A
TLP206G
TLP206GA
TLP2095
TLP2098
TLP209D
TLP2105
TLP2108
TLP2116
TLP2118E
TLP2160
TLP2166A
TLP2167
TLP2168
TLP2200
TLP220A
TLP220D
TLP220G
TLP220GA
TLP220J
TLP221A
Package
SO6
MFSOP6
MFSOP6
SO6
SO6
SO6
MFSOP6
SO6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
SO6
SO6
SO6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
MFSOP6
2.54SOP4
2.54SOP4
SO6
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
MFSOP6
MFSOP6
SO6
SO6
MFSOP6
MFSOP6
2.54SOP6
2.54SOP6
2.54SOP6
2.54SOP6
2.54SOP6
2.54SOP6
2.54SOP6
2.54SOP8
2.54SOP8
2.54SOP8
MFSOP6
2.54SOP8
2.54SOP8
2.54SOP8
MFSOP6
MFSOP6
2.54SOP8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
DIP8
DIP4
DIP4
DIP4
DIP4
DIP4
DIP4
Output
IC
IC
IC
IC
IC
IC
IC
IC
Transistor
Transistor
Darlington transistor
Transistor
Transistor
Transistor
Thyristor
IC
IC
IC
Triac
Triac
Triac
Triac
Triac
Triac
Triac
Triac
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET(Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
Transistor
Transistor
Transistor
Transistor
Photovoltaic
Photovoltaic
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
IC
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
IC
IC
MOSFET (Photorelay)
IC
IC
IC
IC
IC
IC
IC
IC
IC
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
Page
22
20
18
21
22
18
17
18
11
14
16
14
11
11
37
24
24
24
34
34
34
34
34
34
34
34
28
28
28
28
28
28
28
28
28
27
28
28
28
28
28
14,38
11,38
39
39
36
36
29
29
29
29
29
29
29
30
30
30
18
30
30
30
20
20
30
21
21
18
18
19
19
17
19
21
30
30
30
30
30
30
Part Number
TLP222A
TLP222A-2
TLP222G
TLP222G-2
TLP224G
TLP224G-2
TLP224GA
TLP224GA-2
TLP225A
TLP227A
TLP227A-2
TLP227G
TLP227G-2
TLP227GA
TLP227GA-2
TLP2366
TLP2367
TLP2368
TLP2403
TLP2404
TLP2405
TLP2408
TLP2409
TLP2409 (IGM)
TLP2418
TLP2451
TLP2451A
TLP2466
TLP2467
TLP2468
TLP2530
TLP2531
TLP2601
TLP260J
TLP261J
TLP2630
TLP2631
TLP2766
TLP2767
TLP2768
TLP280
TLP280-4
TLP281
TLP281-4
TLP284
TLP284-4
TLP285
TLP285-4
TLP290-4
TLP291-4
TLP3022 (S)
TLP3023 (S)
TLP3042 (S)
TLP3043 (S)
TLP3052 (S)
TLP3062 (S)
TLP3063 (S)
TLP3064 (S)
TLP3082 (S)
TLP3100
TLP3110
TLP3111
TLP3113
TLP3114
TLP3115
TLP3116
TLP3118
TLP3119
TLP3120
TLP3121
TLP3122
TLP3123
TLP3125
TLP3130
TLP3131
TLP320
TLP320-2
TLP3203
TLP320-4
3
Package
DIP4
DIP8
DIP4
DIP8
DIP4
DIP8
DIP4
DIP8
DIP4
DIP4
DIP8
DIP4
DIP8
DIP4
DIP8
SO6
SO6
SO6
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
DIP8
DIP8
DIP8
MFSOP6
MFSOP6
DIP8
DIP8
SDIP6
SDIP6
SDIP6
SOP4
SOP16
SOP4
SOP16
SOP4
SOP16
SOP4
SOP16
SO16
SO16
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
2.54SOP6
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP6
2.54SOP4
2.54SOP6
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP8
2.54SOP4
2.54SOP4
DIP4
DIP8
SSOP4
DIP16
Output
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay
MOSFET (Photorelay)
MOSFET (Photorelay)
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
Triac
Triac
IC
IC
IC
IC
IC
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Triac
Triac
Triac
Triac
Triac
Triac
Triac
Triac
Triac
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
Transistor
Transistor
MOSFET (Photorelay)
Transistor
Page
30
31
31
31
30
31
30
31
30
30
31
30
32
30
32
19
17
19
21
22
20
20
21
22
18
24
24
19
18
19
22
22
19
35
35
20
20
19
18
19
14,39
14
11,39
12
11,39
11
11,39
11
39
39
36,40
36,40
36,40
36,40
36,40
37,40
37,40
37,40
37,40
29
28
28
28
28
28
28
28
28
29
29
29
29
29
29
29
15
15
27
15
1
Product Index
Part Number
TLP3212
TLP3213
TLP3214
TLP3215
TLP3216
TLP3217
TLP3218
TLP3219
TLP3220
TLP3230
TLP3231
TLP3240
TLP3241
TLP3250
TLP3275
TLP330
TLP331
TLP3312
TLP332
TLP3375
TLP350
TLP350H
TLP351
TLP351A
TLP351H
TLP352
TLP3542
TLP3543
TLP3544
TLP3545
TLP3546
TLP360J
TLP361J
TLP363J
TLP371
TLP372
TLP373
TLP3762 (S)
TLP3782 (S)
TLP3783 (S)
TLP3902
TLP3904
TLP3914
TLP3924
TLP4006G
TLP4007G
TLP4026G
TLP4027G
TLP4172G
TLP4176G
TLP4192G
TLP4197G
TLP4202G
TLP4206G
TLP4222G
TLP4222G-2
TLP4227G
TLP4227G-2
TLP4592G
TLP4597G
TLP504A
TLP512
TLP513
TLP523
TLP523-2
TLP523-4
TLP525G
TLP525G-2
TLP525G-4
TLP531
TLP532
TLP548J
TLP549J
TLP550
TLP551
TLP552
TLP553
TLP554
Package
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
DIP6
DIP6
USOP4
DIP6
USOP4
DIP8
DIP8
DIP8
DIP8
DIP8
DIP8
DIP6
DIP6
DIP6
DIP6
DIP6
DIP4
DIP4
DIP4
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
MFSOP6
SSOP4
SSOP4
SSOP4
DIP8
DIP8
2.54SOP8
2.54SOP8
2.54SOP4
2.54SOP4
2.54SOP6
2.54SOP6
2.54SOP8
2.54SOP8
DIP4
DIP8
DIP4
DIP8
DIP6
DIP6
DIP8
DIP6
DIP6
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP6
DIP6
DIP6
DIP8
DIP8
DIP8
DIP8
DIP8
DIP8
Output
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
Transistor
Transistor
MOSFET (Photorelay)
Transistor
MOSFET (Photorelay)
IC
IC
IC
IC
IC
IC
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
Triac
Triac
Triac
Darlington transistor
Darlington transistor
Darlington transistor
Triac
Triac
Triac
Photovoltaic
Photovoltaic
Photovoltaic
Photovoltaic
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
Transistor
IC
IC
Darlington transistor
Darlington transistor
Darlington transistor
Triac
Triac
Triac
Transistor
Transistor
Thyristor
Thyristor
IC
IC
IC
IC
IC
Page
27
27
27
27
27
27
27
27
27
27
27
27
27
27
27
15
12
27
12
27
24
24
24
24
24
24
31
31
31
31
31
35
35
35
16
16
16
37
37,40
37,40
38
38
38
38
33
33
33
33
32
32
32
32
33
32
32
33
33
33
32
33
12
21
19
16
16
16
35
35
35
12
12
37
37
21
21
19
21
19
Part Number
TLP555
TLP557
TLP558
TLP559
TLP559 (IGM)
TLP560G
TLP560J
TLP561G
TLP561J
TLP570
TLP571
TLP572
TLP590B
TLP591B
TLP592A
TLP592G
TLP597A
TLP597G
TLP597GA
TLP598AA
TLP598GA
TLP620
TLP620-2
TLP620-4
TLP624
TLP624-2
TLP624-4
TLP626
TLP626-2
TLP626-4
TLP627
TLP627-2
TLP627-4
TLP628
TLP628-2
TLP628-4
TLP629
TLP629-2
TLP629-4
TLP630
TLP631
TLP632
TLP651
TLP700
TLP700H
TLP701
TLP701A
TLP701H
TLP705
TLP705A
TLP708
TLP714
TLP715
TLP716
TLP718
TLP719
TLP731
TLP732
TLP733
TLP734
TLP748J
TLP750
TLP751
TLP754
TLP759
TLP759 (IGM)
TLP762J
TLP763J
TLP781
TLP785
TLP797GA
TLP797J
TLP798GA
6N135
6N136
6N137
6N138
6N139
4
Package
DIP8
DIP8
DIP8
DIP8
DIP8
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP6
DIP6
DIP6
DIP8
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP8
DIP8
DIP8
DIP8
DIP8
DIP6
DIP6
DIP4
DIP4
DIP6
DIP6
DIP6
DIP8
DIP8
DIP8
DIP8
DIP8
Output
IC
IC
IC
IC
IC
Triac
Triac
Triac
Triac
Darlington transistor
Darlington transistor
Darlington transistor
Photovoltaic
Photovoltaic
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay
MOSFET (Photorelay)
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Darlington transistor
Darlington transistor
Darlington transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
Transistor
Transistor
Transistor
Transistor
Thyristor
IC
IC
IC
IC
IC
Triac
Triac
Transistor
Transistor
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
IC
IC
IC
IC
IC
Page
20
25
20
21
23
35
36
36
36
16
16
16
38
38
31
31
31
31
31
31
31
15,39
15,39
15
12
12
12
15
15
15
16,39
16,39
16
12
13
13
13
13
13
15
13
13
21
25
25
25
25
25
25
25
18
22
20
18
20
21
13
13
13
14
37
22
22
22
22
23
36
36
14
14
31
31
31
23
23
23
23
23
2
New Products
Small Surface-Mount IC-Output Photocouplers in the SO8 Package
Toshiba is expanding its portfolio of IC-output photocouplers in the small and thin SO8 package.
To meet customer needs, Toshiba has released photocouplers featuring various data rates,
dual-channel configurations and power device drivers.
Data rate
(typ.)
Part Number
# of Circuits
Output
TLP2403
TLP2404
TLP2409
TLP2405
TLP2408
TLP2105
TLP2108
TLP2466*
TLP2160*
TLP2418
TLP2118E
TLP2468*
TLP2168*
TLP2116
TLP2166A
TLP2467*
TLP2167*
1-ch
Darlington
Driver Propagation
Delay: 0.7 μs
(max)
TLP2451
Driver Propagation
Delay: 0.5 μs
(max)
TLP2451A*
0.1 Mbit/s
1 Mbit/s
5 Mbit/s
15 Mbit/s
to
20 Mbit/s
50 Mbit/s
1-ch
1-ch
Supply Voltage
Open-collector
Up to 18 V
4.5 V to 30 V
Up to 30 V
1-ch
1-ch
2-ch
Totem-pole
4.5 V to 20 V
SO8
2-ch
1-ch
2-ch
1-ch
2-ch
1-ch
2-ch
2-ch
2-ch
1-ch
Totem-pole
3.3 V/5 V
Open-collector
5V
Open-collector
3.3 V/5 V
5
2.6
5V
Totem-pole
3.3 V
6.0
1.
Totem-pole
3.3 V/5 V
1-ch
±0.6-A peak current
10 V to 30 V
1-ch
±0.6-A peak current
10 V to 30 V
2-ch
5.1
3.9
27
SO8
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
IGBT/MOSFET Gate-Drive IC-Output Photocouplers with an Extended Operating Temperature Range
Printed circuit boards are becoming smaller and denser as a result of product miniaturization.
This is driving the need for electronic components with an extended operating temperature
range.
To meet this need, Toshiba has been expanding its portfolio of IC-output photocouplers that
are guaranteed up to 125°C instead of the conventional 100°C limit.
●
●
●
TLP351H
Wide packaging options: SO6, SO8, SDIP6, DIP8
Key specifications are guaranteed over –40°C to 125°C (–40°C to 110°C for the TLP151)
Low current consumption: ICC = 2 mA (max)
Peak
Output
Current
±0.6 A
±2.0 A
±2.5 A
Part Number
TLP351H*
TLP701H*
TLP2451
TLP2451A*
TLP151*
TLP151A*
TLP700H*
TLP350H*
Package
Supply
Voltage
(VCC)
Supply
Current
(ICC)
Input
Threshold
Current
Propagation
Delay
(max)
SO8
700 ns
2 mA
(max)
5 mA
(max)
500 ns
−
700 ns
−
500 ns
Yes
VCC
8
2+
(M2)
3–
VO
6
−
SO6
DIP8
(M1)
−
−
10 V to 30 V
SO6
SDIP6
Functional Schematic (TLP2451)
−
DIP8
SDIP6
SO8
UVLO
TLP701H
15 V to 30 V
GND
SHIELD
5
Yes
1: N.C.
2: Anode
3: Cathode
4: N.C.
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
5
5: GND
6: VO (Output)
7: N.C.
8: VCC
2
New Products
General-Purpose 5-Mbit/s IC-Output Photocouplers
IC-output photocouplers with a date rate of 5 Mbits/s are beneficial for applications where the
user needs a data rate that is not achievable with transistor-output photocouplers. In
conjunction with various packaging options, the fast IC-output photocouplers simplify system
design and provide extra performance for future upgrades.
●
●
●
●
●
●
●
●
Pin Configuration
MFSOP6
SDIP6
SO8
Part Number
# of Channels
Logic Polarity
TLP105
TLP108
TLP715
TLP718
TLP2405
TLP2408
TLP2105
TLP2108
1-ch
Positive
1-ch
Negative
1-ch
Positive
1-ch
Negative
1-ch
Positive
1-ch
Negative
2-ch
Positive
2-ch
Negative
4.4
VCC
3
GND
1: Anode
3: Cathode
4: GND
5: VO (Output)
6: VCC
6
5
Packaging options: MFSOP6, SDIP6, SO8
Available in positive and negative polarity versions.
Key specifications guaranteed over –40°C to 100°C
Low input current: 1.6 mA max (3 mA for the TLP715 and TLP718)
Totem-pole output: Eliminates the need for an external load resistor.
Wide supply voltage range: 4.5 V to 20 V
Available in dual-channel versions (TLP2105/TLP2108)
EN60747-5-2-certified
Package
1
SHIELD
4
TLP105
1
VCC
2
7
6
3
4
1: Anode 1
2: Cathode 1
3: Cathode 2
4: Anode 2
5: GND
6: Output 2
7: Output 1
8: VCC
8
GND
SHIELD
5
TLP2105
3.6
2.6
6.8
4.5
8
7.0
7
9.7
1.
27
MFSOP6
5.1
2.6
4.0
1.2
5
3.9
1.
6.0
27
SDIP6
SO8
IC-Output Photocouplers for IPM Drive Applications
Toshiba offers IC-output photocouplers ideal for IPM drive applications. Compared to the
conventional TLP114A (IGM), these IC-output photocouplers provide shorter propagation delay
times, a wider operating temperature range and digital output. Thus, they help to simplify
system design and improve system performance. The TLP104 and TLP2404 in a small
surface-mount package are now available in mass-production quantities, while those in the
SDIP6 and DIP8 packages will shortly be available.
●
●
●
●
●
●
Wide packaging options: SO6, SO8, SDIP6, DIP8
Key specifications are guaranteed over –40°C to 125°C.
Low current consumption: 5 mA (max)
Wide supply voltage range: 4.5 to 30 V
Propagation delay times: tpHL = 400 ns (max), tpLH = 550 ns (max)
Propagation delay skew: |tpHL – tpLH| = 400 ns (max)
SO6
Functional Schematic (TLP104)
VCC
6
1+
Part Number
Package
TLP104
TLP2404
TLP714*
TLP754*
SO6
Small surface-mount package with a 2.3-mm PCB mounted height (max)
SO8
Standard 8-pin small surface-mount package
SDIP6
DIP8
Feature
5
VO
3–
GND
Small surface-mount SDIP6 package
SHIELD
Standard DIP8 package
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
1: Anode
3: Cathode
6
4
4: GND
5: VO (Output)
6: VCC
Photorelays in the Ultra-Small USOP4 Package: TLP33xx Series
There is a strong market need for smaller photorelays.
To meet this need, Toshiba has developed photorelays
in the ultra-small USOP4 package, which are suitable
for high-density board assembly. These photorelays
help to reduce system size and cost. They are ideal
for use in small measuring instruments such as
semiconductor testers that require numerous relays.
The TLP3312 and TLP3375 provide well-balanced
off-state voltage and on-state current, making them
suitable not only for tester applications but also for
various applications requiring high-density board
assembly such as battery-controlled devices.
Part Number
5
2.8
2.2
SSOP4
1.65
5
1.
27
3.2
USOP4
USOP4
Pin Configuration
Off-State Voltage
(max)
On-State Current
(max)
60 V
0.4 A
1.5 Ω
20 pF
3 mA
50 V
0.3 A
1.5 Ω
12 pF
3 mA
TLP3312
TLP3375
On-State
Total Capacitance
Resistance (max)
(typ.)
LED Trigger
Current (max)
1
4
2
3
1. Anode
2. Cathode
3. Drain
4. Drain
High-ION Photorelays: TLP354x Series (Under Development)
Toshiba is now developing the TLP354x Series in the DIP6 package targeting applications that deal with relatively large current.
Housed in the DIP6 package, the TLP354x photorelays allow B and C connections, enabling the switching of 8-A, 7-A, 6-A and 4-A dc
current respectively. They are suitable for various applications such as factory equipment, power supplies and security systems.
Scheduled for mass production in April
Characteristic
Available
Under Development
Symbol
Unit
−
−
VOFF
V
40
20
On-State Current
(max)
ION
A
2.5
On-State Resistance
(max)
RON
mΩ
Isolation Voltage
(min)
BVS
Vrms
Package
Peak Off-State Voltage
(min)
TLP3542
TLP3543
TLP3544
TLP3545
TLP3546
40
60
100
4
3.5
3
2
100
50
60
70
200
2500
2500
2500
2500
2500
DIP6
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
7
2 New Products
General-Purpose Photorelays Certified for Reinforced Insulation:
TLP220 Series and TLP221A (Under Development)
Toshiba is now developing the TLP220 Series and the TLP221 targeting factory equipment applications, and wattmeter and smart meter
applications for the monitoring of electrical energy consumption. These photorelays meet the requirements for high isolation voltage
between input and output, as well as for international safety standards certification. Housed in the DIP4 package, the new photorelays
save board space and provide an isolation voltage of 5 kV. The TLP220 Series is available in versions with 60-V, 200-V, 350-V, 400-V
and 600-V peak off-state voltages. The TLP221A provides a 60-V peak off-state voltage and a 1.5-A on-state current.
Scheduled for mass production in June to August
Characteristic
Existing Photorelay Examples
Under Development
Symbol
Unit
−
−
VOFF
V
60
350
60
200
On-State Current
(max)
ION
A
0.5
0.12
0.5
On-State Resistance
(max)
RON
Ω
2
50
Isolation Voltage
(min)
BVS
Vrms
5000
5000
Package
Peak Off-State Voltage
(min)
TLP222A
TLP222G
TLP220A
TLP220D
TLP220G
TLP220GA
TLP220J
TLP221A
350
400
600
60
0.25
0.1
0.12
0.09
1.5
2
8
50
35
60
0.2
5000
5000
5000
5000
5000
5000
DIP4
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
IC-Output Photocouplers in the SO6 Package Certified for Reinforced Insulation
Despite the same footprint size as the MFSOP6 package, the new SO6 package provides
reinforced insulation, offering clearance and creepage distances of ≥ 5 mm; an internal
isolation thickness of ≥ 0.4 mm; and an isolation voltage of 3750 Vrms.
Additionally, the SO6 features the maximum PCB mounted height of 2.3 mm, approximately
20% lower than the MFSOP6. This makes the photocouplers in SO6 ideal for low-profile
applications.
●
●
●
●
Clearance/creepage: ≥ 5 mm
Thin package: ≤ 2.3 mm
Internal Faraday shield: ≥ 0.4 mm
Thin package: ≤ 2.3 mm
Part Number
TLP104
TLP109
TLP116A
TLP2366*
TLP118
TLP2368*
TLP2367*
Data rate
(typ.)
SO6
Output
Supply voltage
Input Threshold
Current (max)
1 Mbit/s
Open-collector, optimized for IPM drive
4.5 V to 30 V
5 mA
1 Mbit/s
Open-collector
4.5 V to 30 V
−
20 Mbit/s
Totem-pole inverting logic
20 Mbit/s
Open-collector inverting logic
50 Mbit/s
Totem-pole inverting logic
5V
5 mA
3.3 V/5 V
5 mA
5V
5 mA
3.3 V/5 V
5 mA
3.3 V/5 V
5 mA
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
8
5
4.5
3.7
2.3
1.
27
7.0
SO6
3 Photocoupler Product Tree
Photocoupler Product Tree
Package
DIP4
DIP4
DIP6
DIP8
DIP16
●
General-purpose packages
Lead-forming options for surface mounting
DIP6
●
SDIP6
●
●
SO6
SDIP6
DIP8
●
●
DIP16
SO8
SO6
●
●
SO16
SO8
SO16
SOP4
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SOP16
●
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
MFSOP6
●
SMD package (1.27-mm lead pitch)
●
SOP4
SOP16
MFSOP6
2.54SOP4
2.54SOP4
2.54SOP6
2.54SOP6
2.54SOP8
●
SMD package (2.54-mm lead pitch)
SSOP4
SSOP4
●
Ultra-small; SMD package (1.27-mm lead pitch)
USOP4
USOP4
●
Ultra-small; SMD package (1.27-mm lead pitch)
2.54SOP8
Transistor-Output
Darlington-Transistor Output
Transistor-Output
IC-Output
Logic Output
Vcc
Photorelays
GND
Photorelays
VCC
Output Choices
GND
Gate Drive
Thyristor- and Triac-Output
Triac Output
Photovoltaic-Output
Thyristor Output
Photovoltaic-Output
ZC
9
4
Selection Guide
1 Transistor-Output and Darlington-Transistor-Output Photocouplers
Package
Features
Isolation Voltage
Channel
2500 Vrms
3750 Vrms
SOP4
SOP16
SO6
SO16
MFSOP6
DIP6
DIP4
DIP8
DIP16
Single
Quad
Single
Quad
Single
Single
Single
Dual
Quad
TLP281
TLP281-4
TLP531
TLP291-4*
TLP504A
TLP532
TLP285
TLP131
TLP285-4 TLP185*
TLP181
TLP731
General-purpose
TLP732
4000 Vrms
TLP733
TLP734
5000 Vrms
TLP631
TLP781
TLP632
TLP785
TLP331
TLP624
TLP624-2 TLP624-4
TLP124
3750 Vrms
TLP137
Low IF
5000 Vrms
TLP332
High VCEO
5000 Vrms
TLP628
TLP628-2 TLP628-4
High IF
5000 Vrms
TLP629
TLP629-2 TLP629-4
TLP620
TLP620-2 TLP620-4
TLP626
TLP626-2 TLP626-4
TLP330
TLP320
TLP320-2 TLP320-4
TLP570
TLP523
TLP523-2 TLP523-4
TLP627
TLP627-2 TLP627-4
2500 Vrms
AC input
TLP290-4*
TLP280
TLP280-4
TLP284
TLP284-4 TLP184*
3750 Vrms
TLP130
TLP180
5000 Vrms
TLP630
3750 Vrms
TLP126
Low IF
5000 Vrms
High IF
5000 Vrms
Darlington
2500 Vrms
TLP571
TLP572
2500 Vrms
TLP127
TLP371
High VCEO
TLP372
5000 Vrms
TLP373
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
10
New Products with Reinforced Insulation in a Small, Surface-Mount SOP Package
(≥ 5-mm Clearance/Creepage and ≥ 0.4-mm Internal Isolation Thickness)
Part Number
Pin Configuration
Features
3
4
SOP4
Lead pitch = 1.27 mm
AC Input
SEMKO-approved
TST part recm’ed
TLP284(4)
1
2
16 15 14 13 12 11 10
9
TLP284-4
1
2
3
4
5
4
6
7
8
3
SOP4
Lead pitch = 1.27 mm
SEMKO-approved
TST part recm’ed
TLP285
(4)
1
2
16 15 14 13 12 11 10
9
TLP285-4
1
2
3
SOP16
4-channel version of
the TLP284
Lead pitch = 1.27 mm
AC Input
SEMKO-approved
4
5
6
7
SOP16
4-channel version of
the TLP285
Lead pitch = 1.27 mm
SEMKO-approved
8
Rank
–
Y
GR
BL
GB
–
CTR (%)(3)
Min
Max
50
600
50
150
100
300
200
600
100
600
50
600
GB
100
600
–
Y
GR
BL
GB
YH
GRL
GRH
BLL
50
50
100
200
100
75
100
150
200
600
150
300
600
600
150
200
300
400
–
50
600
GB
100
Safety Standards(2)
VDE
BSI
TÜV
VCEO
BVs
±5 mA,
5V
80 V
3750
Vrms
/
(1)
±5 mA,
5V
80 V
3750
Vrms
/
(1)
5 mA,
5V
80 V
3750
Vrms
/
5 mA,
5V
80 V
3750
Vrms
/
VCEO
BVs
1 mA,
0.5 V
80 V
3750
Vrms
/
5 mA,
5V
80 V
3750
Vrms
/
1 mA,
0.5 V
80 V
3750
Vrms
/
5 mA,
5V
80 V
3750
Vrms
/
5 mA,
5V
80 V
2500
Vrms
/
@IF, VCE
UL/CUL
(1)
IEC
(1)
(1)
600
General-Purpose, Transistor-Output Photocouplers
Part Number
Pin Configuration
6
Features
Mini-flat
MFSOP6
Low input drive current
1
4
Mini-flat
MFSOP6
Internal base
connection
TLP131
3
4
5
TLP137
1
3
6
4
TLP181(4)
1
3
4
3
TLP281
(4)
1
@IF, VCE
UL/CUL
Safety Standards(2)
VDE
BSI
TÜV
IEC
–
100
1200
BV
200
1200
–
Y
GR
BL
GB
50
50
100
200
100
600
150
300
600
600
–
100
1200
3
5
1
6
CTR (%)(3)
Min
Max
4
TLP124
6
Rank
2
Mini-flat
MFSOP6
Low input drive current
Internal base
connection
Mini-flat
MFSOP6
SEMKO-approved
TST part recm’ed
SOP4
Lead pitch = 1.27 mm
SEMKO-approved
TST part recm’ed
BV
200
1200
–
Y
GR
BL
GB
YH
GRL
GRH
BLL
–
Y
GR
BL
GB
YH
GRL
GRH
BLL
50
50
100
200
100
75
100
150
200
50
50
100
200
100
75
100
150
200
600
150
300
600
600
150
200
300
400
600
150
300
600
600
150
200
300
400
(1)
(1)
(1)
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.
11
4
Selection Guide
General-Purpose, Transistor-Output Photocouplers (Continued)
Part Number
Pin Configuration
16 15 14 13 12 11 10
Features
9
TLP281-4
1
2
3
4
6
5
6
5
7
8
4
DIP6
Low input drive current
Internal base
connection
TLP331
1
2
3
6
5
4
SOP16
4-channel version
of the TLP281
Lead pitch = 1.27 mm
SEMKO-approved
Rank
–
CTR (%)(3)
Min
Max
50
1
2
8
3
7
6
5
TLP504A
GB
100
600
–
100
1200
BV
200
1200
–
100
1200
BV
200
1200
–
50
600
DIP8
2
1
3
6
4
5
DIP6
Internal base
connection
2
6
DIP6
High EMI immunity
2
GB
100
600
600
–
50
Y
50
150
GR
100
300
BL
200
600
GB
100
600
–
50
600
Y
50
150
GR
100
300
BL
200
600
TLP624
1
2
7
6
5
DIP8
Dual-channel version
of the TLP624
TLP624-2
2
3
4
16 15 14 13 12 11 10
9
DIP16
4-channel version of
the TLP624
TLP624-4
2
3
4
4
5
6
7
8
3
GB
100
600
–
100
1200
BV
200
1200
–
100
1200
BV
200
1200
–
100
1200
BV
200
1200
–
50
600
DIP4
High VCEO
TLP628
1
1 mA,
0.5 V
55 V
5000
Vrms
/
1 mA,
0.5 V
55 V
5000
Vrms
/
5 mA,
5V
55 V
2500
Vrms
/–
5 mA,
5V
55 V
2500
Vrms
/
5 mA,
5V
55 V
2500
Vrms
/
1 mA,
5V
55 V
5000
Vrms
/−
1 mA,
5V
55 V
5000
Vrms
/–
1 mA,
5V
55 V
5000
Vrms
/–
5 mA,
5V
350 V
5000
Vrms
/–
(1)
3
DIP4
Low input drive current
1
/
3
4
1
2500
Vrms
IEC
4
TLP532
8
80 V
Safety Standards(2)
VDE
BSI
TÜV
3
5
1
5 mA,
5V
UL/CUL
4
TLP531
1
BVs
600
DIP6
Low input drive current
TLP332
VCEO
@IF, VCE
2
GB
100
600
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
12
General-Purpose, Transistor-Output Photocouplers (Continued)
Part Number
Pin Configuration
8
7
6
Features
5
DIP8
Dual-channel version
of the TLP628
TLP628-2
2
1
3
4
16 15 14 13 12 11 10
DIP16
4-channel version of
the TLP628
2
3
4
5
4
6
7
1
2
7
6
2
3
3
6
5000
Vrms
/–
5 mA,
5V
350 V
5000
Vrms
/–
IEC
600
GB
100
600
–
50
600
100
600
DIP4
High input current
I F = 150 mA
–
20
80
100 mA,
1V
55 V
5000
Vrms
/–
DIP8
Dual-channel version
of the TLP629
–
20
80
100 mA,
1V
55 V
5000
Vrms
/–
DIP16
4-channel version of
the TLP629
–
20
80
100 mA,
1V
55 V
5000
Vrms
/–
–
50
600
GB
100
600
5 mA,
5V
55 V
5000
Vrms
/
GR
100
300
–
50
600
GB
100
600
5 mA,
5V
55 V
5000
Vrms
/
GR
100
300
–
50
600
GB
100
600
5 mA,
5V
55 V
4000
Vrms
/
5 mA,
5V
55 V
4000
Vrms
/
5 mA,
5V
55 V
4000
Vrms
/–
9
4
5
5
6
7
8
4
DIP6
Internal base
connection
TLP631
1
2
3
6
5
4
DIP6
High EMI immunity
TLP632
1
2
3
6
5
4
DIP6
SEMKO-approved
Internal base
connection
TLP731
1
2
3
GR
100
300
6
5
4
–
50
600
GB
100
600
GR
100
300
–
50
600
GB
100
600
GR
100
300
DIP6
SEMKO-approved
TLP732
1
2
3
6
5
4
TLP733
TLP733F
1
350 V
Safety Standards(2)
VDE
BSI
TÜV
4
TLP629-4
2
5 mA,
5V
UL/CUL
5
16 15 14 13 12 11 10
1
BVs
3
TLP629-2
1
50
VCEO
@IF, VCE
GB
8
TLP629
8
–
CTR (%)(3)
Min
Max
9
TLP628-4
1
Rank
2
3
DIP6
SEMKO-approved
Internal base
connection
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
13
4
Selection Guide
General-Purpose, Transistor-Output Photocouplers (Continued)
Part Number
Pin Configuration
6
5
Features
4
DIP6
SEMKO-approved
TLP734
TLP734F
2
1
3
4
3
DIP 4
High isolation voltage
UL-approved (double
protection)
TLP781(6)
TLP781F(6)
2
1
4
3
DIP 4
High isolation voltage
UL-approved (double
protection)
TLP785*(6)
TLP785F*(6)
1
2
Rank
CTR (%)(3)
Min
Max @IF, VCE
–
50
600
GB
100
600
GR
100
300
–
50
600
Y
50
150
GR
100
300
BL
200
600
GB
100
600
YH
75
150
200
GRL
100
GRH
150
300
BLL
200
400
–
50
600
Y
50
150
GR
100
300
BL
200
600
GB
100
600
YH
75
150
200
GRL
100
GRH
150
300
BLL
200
400
Rank
CTR (%)(3)
Min
Max
Safety Standards(2)
VDE
BSI
TÜV
IEC
Safety Standards(2)
VDE
BSI
TÜV
IEC
VCEO
BVs
5 mA,
5V
55 V
4000
Vrms
5 mA,
5V
80 V
5000
Vrms
5 mA,
5V
80 V
5000
Vrms
VCEO
BVs
±1 mA,
0.5 V
80 V
3750
Vrms
/
±5 mA,
5V
80 V
3750
Vrms
/
±5 mA,
5V
80 V
3750
Vrms
/
(1)
(1)
±5 mA,
5V
80 V
2500
Vrms
/
(1)
(1)
±5 mA,
5V
80 V
2500
Vrms
/
UL/CUL
/–
(5)
/
(5)
/
AC-Input, Transistor-Output Photocouplers
Part Number
Pin Configuration
6
Features
4
Mini-flat
MFSOP6
AC input
Low input drive current
TLP126
1
5
4
Mini-flat
MFSOP6
AC input
Internal base
connection
TLP130
1
3
6
4
Mini-flat
MFSOP6
AC input
SEMKO-approved
TST part recm’ed
TLP180(4)
1
3
4
3
SOP4
Lead pitch = 1.27 mm
AC input
SEMKO-approved
TST part recm’ed
TLP280(4)
1
2
16 15 14 13 12 11 10
9
TLP280-4
2
3
100
1200
–
50
600
UL/CUL
3
6
1
–
@IF, VCE
4
5
6
7
8
SOP16
4-channel version
of the TLP280
Lead pitch = 1.27 mm
AC input
SEMKO-approved
GB
100
600
–
50
600
Y
50
150
GR
100
300
BL
200
600
GB
100
600
–
50
600
Y
50
150
GR
100
300
BL
GB
200
100
600
600
–
50
600
GB
100
(1)
600
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.
Note 5: For safety standard compliance criteria including the operating temperature conditions, please contact your nearest Toshiba representative.
Note 6: About the package dimensions and lead form options, see each datasheet.
14
AC-Input, Transistor-Output Photocouplers (Continued)
Part Number
Pin Configuration
4
Features
CTR (%)(3)
Max
Min
@IF, VCE
VCEO
BVs
UL/CUL
Safety Standards(2)
TÜV
VDE
BSI
IEC
3
TLP320
8
Rank
1
2
7
6
DIP4
High input current
AC input
I F = 150 mA
–
20
80
±100 mA,
55 V
1V
5000
Vrms
/
DIP8
Dual-channel version
of the TLP320
–
20
80
±100 mA,
1V
55 V
5000
Vrms
/
DIP16
4-channel version of
the TLP320
–
20
80
±100 mA,
1V
55 V
5000
Vrms
/
DIP6
High input current
AC input
I F = 150 mA
Internal base
connection
–
20
80
±100 mA,
1V
55 V
5000
Vrms
/
±5 mA,
5V
55 V
5000
Vrms
/
±5 mA,
5V
55 V
5000
Vrms
/
±5 mA,
5V
55 V
5000
Vrms
/
1200
±1 mA,
0.5 V
55 V
5000
Vrms
/−
1200
±1 mA,
0.5 V
55 V
5000
Vrms
/–
1200
±1 mA,
0.5 V
55 V
5000
Vrms
/–
600
±5 mA,
5V
55 V
5000
Vrms
/
5
TLP320-2
1
2
3
4
16 15 14 13 12 11 10 9
TLP320-4
1
2
3
4
6
5
6
5
8
7
4
TLP330
2
1
3
4
3
DIP4
AC input
SEMKO-approved
TST part recm’ed
TLP620(4)
TLP620F(4)
8
1
2
7
6
5
DIP8
Dual-channel version
of the TLP620
SEMKO-approved
TST part recm’ed
TLP620-2(4)
TLP620F-2(4)
1
2
3
4
16 15 14 13 12 11 10
TLP620-4
2
3
4
5
4
6
7
1
2
7
6
5
DIP8
Dual-channel version
of the TLP626
TLP626-2
2
3
4
16 15 14 13 12 11 10
9
DIP16
4-channel version of
the TLP626
TLP626-4
1
2
3
6
4
5
5
6
7
4
TLP630
1
150
GR
100
300
BL
200
600
GB
100
600
–
50
600
GB
100
600
–
50
600
GB
100
–
100
600
3
DIP4
Low input drive current
AC input
1
600
50
8
TLP626
8
50
9
DIP16
4-channel version of
the TLP620
1
–
Y
2
3
BV
200
–
100
BV
200
–
100
BV
200
–
50
8
DIP6
AC input
High isolation voltage
Internal base
connection
GB
100
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.
15
4
Selection Guide
Darlington-Transistor-Output Photocouplers
Part Number
Pin Configuration
6
Features
VCE (sat)
CTR (%)(3)
Min @IF, VCE Max
@IC, IF
BVs
UL/CUL
Safety Standards(2)
VDE
BSI
TÜV
IEC
4
Mini-flat
1000
1 mA,
1V
1.2 V
100 mA,
10 mA
300 V
2500
Vrms
/
DIP6
High VCEO
SEMKO-approved
Internal base
connection
1000
1 mA,
1V
1.2 V
100 mA,
10 mA
300 V
5000
Vrms
/
DIP6
High VCEO
SEMKO-approved
1000
1 mA,
1V
1.2 V
100 mA,
10 mA
300 V
5000
Vrms
/
DIP6
High VCEO
Long emitter-collector
distance
SEMKO-approved
1000
1 mA,
1V
1.2 V
100 mA,
10 mA
300 V
5000
Vrms
/
DIP4
500
1 mA,
1V
1V
50 mA,
10 mA
55 V
2500
Vrms
/
DIP8
Dual-channel version
of the TLP523
500
1 mA,
1V
1V
50 mA,
10 mA
55 V
2500
Vrms
/
DIP16
4-channel version of
the TLP523
500
1 mA,
1V
1V
50 mA,
10 mA
55 V
2500
Vrms
/
DIP6
High EMI immunity
1000
1 mA,
1V
1.2 V
100 mA,
10 mA
35 V
2500
Vrms
/
DIP6
Internal base
connection
1000
1 mA,
1V
1.2 V
100 mA,
10 mA
35 V
2500
Vrms
/–
DIP6
Built-in RBE
1000
1 mA,
1.2 V
1.2 V
100 mA,
10 mA
55V
2500
Vrms
/–
DIP4
High VCEO
SEMKO-approved
TST part recm’ed
1000
1 mA,
1V
1.2 V
100 mA,
10 mA
300 V
5000
Vrms
/
DIP8
Dual-channel version
of the TLP627
SEMKO-approved
TST part recm’ed
1000
1 mA,
1V
1.2 V
100 mA,
10 mA
300 V
5000
Vrms
/
DIP16
4-channel version of
the TLP627
1000
1 mA,
1V
1.2 V
100 mA,
10 mA
300 V
5000
Vrms
/
MFSOP6
High VCEO
TLP127
(1)
3
1
6
5
4
TLP371
2
5
1
6
3
4
TLP372
1
6
2
3
4
TLP373
1
2
3
4
3
TLP523
2
6
1
7
8
VCEO
5
TLP523-2
1
2
3
4
16 15 14 13 12 11 10 9
TLP523-4
1
2
3
4
6
5
6
5
7
8
4
TLP570
1
2
3
6
5
4
TLP571
2
5
1
6
3
4
TLP572
1
2
3
4
3
TLP627(4)
1
7
8
2
6
5
TLP627-2(4)
1
2
3
4
16 15 14 13 12 11 10 9
TLP627-4
1
2
3
4
5
6
7
8
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.
16
2 Photocouplers for Logic Signal Transmission
Package
Features
Data Rate
(Typ.)
Output
0.3 Mbit/s
Open-collector
(Darlington)
MFSOP6
(TLP112)*2
(TLP112A)*2
(TLP114A)*2
1 Mbit/s
SO6
TLP109
SO8
1ch
TLP2403
2ch
TLP2409
SDIP6
TLP719
DIP8
1ch
TLP553
DIP6
TLP512
Open-collector
(TLP114A(IGM))*3 TLP109(IGM) TLP2409(IGM)
TLP2404
TLP104
IPM
drive
Dual
polarity
input
5 Mbit/s
TLP2405
TLP2408
TLP105
TLP108
TLP2095
TLP2098
Totem-pole
TLP714*1
TLP2105
TLP2108
TLP550
TLP551
TLP559
TLP651
TLP750
TLP751
TLP759
TLP559(IGM)
TLP759(IGM)
TLP754*1
15 to 20
Mbit/s
50 Mbit/s
(TLP113)*4
(TLP115)*4
(TLP115A)*4
5 V (TLP116)*5 TLP116A
Totem3.3 V TLP2066
pole
TLP2366*1 TLP2466*1
3.3 V/5 V
TLP118
5V
TLP2418
Opencollector 3.3 V/5 V
TLP2368*1 TLP2468*1
TLP117
5V
Totempole
TLP2367*1 TLP2467*1
3.3 V/5 V
TLP2530
TLP2531
6N138
6N139
6N135
6N136
TLP715
TLP718
TLP555
TLP558
TLP2200
TLP552
TLP554
TLP2601
3-state
10 Mbit/s
JEDEC
2ch
TLP513
Open-collector
TLP2630
TLP2631
6N137
TLP2116
TLP716
TLP2166A
TLP2160*1 TLP2766*1
TLP708
TLP2118
TLP2168*1 TLP2768*1
TLP2167*1 TLP2767*1
*1: Under development as of January 2011. For the latest information, please contact your nearest Toshiba sales representative.
*2: TLP109 recommended
*3: TLP109(IGM) recommended
*4: TLP118 recommended
*5: TLP116A recommended
Photocouplers for Logic Signal Transmission at 40 to 50 Mbit/s (Typ.)
Data Rate
(NRZ) (Typ.)
Output Form
50 Mbit/s
SO8
VCC = 3.3 or 5 V
Topr (max) 125˚C
SO6 (reinforced insulation)
VCC = 3.3 or 5 V
Topr (max) 125˚C
Pin Configuration
5
4
Vcc
GND
SHIELD
6
TLP117
1
3
7
6
VCC
TLP2167*
1
2
Vcc
6
TLP2367*
1
3
5
Features
Safety Standards(2)
IFHL
(Max)
BVs
Totem pole
output
(Inverter logic)
5 mA
3750
Vrms
/
40 Mbit/s
Totem pole
output
(Inverter logic)
5 mA
2500
Vrms
/
(1)
40 Mbit/s
Totem pole
output
(Inverter logic)
5 mA
3750
Vrms
/
(2)
UL/cUL TÜV
VDE
(1)
(1)
BSI
IEC
Mini-flat
MFSOP6
Propagation delay time:
30 ns (max)
VCC = 5 V
5
GND
SHIELD
8
4
4
GND
SHIELD
Part Number
3
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
17
4
Selection Guide
Photocouplers for Logic Signal Transmission at 40 to 50 Mbit/s (Typ.) (Continued)
Part Number
Data Rate
(NRZ) (Typ.)
Output Form
SO8
VCC = 3.3 or 5 V
Topr (max) 125˚C
40 Mbit/s
SDIP6 (reinforced insulation)
VCC = 3.3 or 5 V
Topr (max) 125˚C
40 Mbit/s
Pin Configuration
7
6
VCC
TLP2467*
2
1
3
Totem pole
output
(Inverter logic)
5 mA
3750
Vrms
/
Totem pole
output
(Inverter logic)
5 mA
5000
Vrms
/
IFHL
(Max)
BVs
UL/cUL TÜV
VDE
BSI
IEC
(1)
4
Vcc
TLP2767*
1
BVs
4
5
GND
SHIELD
6
Safety Standards(2)
IFHL
(Max)
5
GND
SHIELD
8
Features
3
2
Photocouplers for Logic Signal Transmission at 15 to 20 Mbit/s (Typ.)
Part Number
5
Output Form
SO6 (reinforced insulation)
High speed: 20 Mbit/s
VCC = 5 V
60 ns
Totem pole
output
(Inverter logic)
5 mA
3750
Vrms
/
(1)
(1)
Vcc
TLP116A
SO8
High speed: 15 Mbit/s
VCC = 5 V
Dual-channel version
75 ns
Totem pole
output
(Inverter logic)
5 mA
2500
Vrms
/
(1)
(1)
6
5
VCC
GND
SHIELD
7
TLP2116
2
3
SDIP6
High speed: 15 Mbit/s
VCC = 5 V
High isolation voltage
75 ns
Totem pole
6.5 mA
output
(Inverter logic)
5000
Vrms
/
SO6 (reinforced insulation)
High speed: 20 Mbit/s
VCC = 5 V
Topr = 125°C (max)
60 ns
Open-collector
(Inverter logic)
5 mA
3750
Vrms
/
(1)
1
SO8
High speed: 15 Mbit/s
VCC = 5 V
75 ns
Open-collector
(Inverter logic)
5 mA
3750
Vrms
/
(1)
SO8
High speed: 15 Mbit/s
VCC = 5 V
75 ns
Open-collector
(Inverter logic)
5 mA
2500
Vrms
/
(1)
4
VCC
GND
5
TLP118
1
3
6
VCC
TLP2418*
2
3
4
8
7
6
5
VCC
GND
SHIELD
1
TLP2118E*
2
3
SDIP6
High speed: 15 Mbit/s
VCC = 5 V
High isolation voltage
75 ns
Open-collector
(Inverter logic)
5 mA
5000
Vrms
/
1
Vcc
TLP2066
1
2
5
SHIELD
GND
4
3
60 ns
Totem pole
output
(Inverter logic)
5 mA
3750
Vrms
/
4
GND
SHIELD
TLP708*
6
4
5
VCC
6
IEC
5
GND
SHIELD
7
1
BSI
3
2
6
8
VDE
4
Vcc
TLP716
TLP716F
4
5
GND
SHIELD
6
SHIELD
1
UL/cUL TÜV
3
1
8
Features
4
GND
SHIELD
6
Safety Standards(2)
Propagation
Delay Time
(Max)
Pin Configuration
Mini-flat
MFSOP6
High speed: 20 Mbit/s
VCC = 3.3 V
(1)
(1)
3
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
18
Photocouplers for Logic Signal Transmission at 15 to 20 Mbit/s (Typ.) (Continued)
Part Number
Pin Configuration
7
6
5
VCC
GND
SHIELD
8
TLP2160*
2
3
4
8
7
6
5
VCC
GND
SHIELD
1
TLP2168*
2
3
4
5
Vcc
TLP2366*
5
VCC
TLP2368*
1
UL/cUL TÜV
VDE
SO8
VCC = 3.3 or 5 V
Topr = 125˚C (max)
Dual-channel version
20 Mbit/s
Totem pole
output
3.5 mA
(Inverter logic)
2500
Vrms
/
(1)
SO8
VCC = 3.3 or 5 V
Topr = 125˚C (max)
Dual-channel version
20 Mbit/s
Open-collector
(Inverter logic)
3750
Vrms
/
(1)
SO6 (reinforced insulation)
VCC = 3.3 or 5 V
Topr = 125˚C (max)
20 Mbit/s
Totem pole
output
3.5 mA
(Inverter logic)
3750
Vrms
/
(1)
SO6 (reinforced insulation)
VCC = 3.3 or 5 V
Topr = 125˚C (max)
20 Mbit/s
Open-collector
(Inverter logic)
3750
Vrms
/
(1)
SO8
VCC = 3.3 or 5 V
Topr = 125˚C (max)
20 Mbit/s
Totem pole
output
3.5 mA
(Inverter logic)
3750
Vrms
/
(1)
SO8
VCC = 3.3 or 5 V
Topr = 125˚C (max)
20 Mbit/s
Open-collector
(Inverter logic)
3750
Vrms
/
(1)
SDIP6
VCC = 3.3 or 5 V
Topr = 125˚C (max)
20 Mbit/s
Totem pole
output
3.5 mA
(Inverter logic)
5000
Vrms
/
SDIP6
VCC = 3.3 or 5 V
Topr = 125˚C (max)
20 Mbit/s
Open-collector
(Inverter logic)
5 mA
5000
Vrms
/
SO8
Propagation delay time: 75 ns
VCC = 3.3 V
Dual-channel version
15 Mbit/s
Totem pole
output
(Inverter logic)
3 mA
2500
Vrms
/
IFHL,
IFLH
(Max)
BVs
5 mA
BSI
IEC
5 mA
5
VCC
GND
SHIELD
6
TLP2466*
2
3
4
7
6
5
VCC
GND
SHIELD
1
8
TLP2468
2
3
4
Vcc
TLP2766*
2
3
6
5
4
TLP2768*
2
3
6
5
VCC
GND
SHIELD
7
SHIELD
VCC
GND
1
1
TLP2166A
2
5 mA
4
5
GND
SHIELD
6
1
Safety Standards(2)
BVs
3
7
8
IFHL
(Max)
4
GND
6
1
Output Form
3
1
8
Data Rate
(NRZ) (Typ.)
4
GND
SHIELD
6
SHIELD
1
Features
3
4
(1)
Photocouplers for Logic Signal Transmission at 10 Mbit/s (Typ.)
Part Number
Pin Configuration
5
VCC
TLP513
1
3
2
6
TLP552
2
3
5
VCC
TLP554
3
4
7
6
5
VCC
GND
2
8
TLP2601
2
3
SHIELD
1
1
Safety Standards(2)
UL/cUL TÜV
VDE
BSI
IEC
DIP6
6-pin package version of
the TLP552
VCC = 5 V
120 ns
Open-collector
(Topr = 25˚C)
5 mA
2500
Vrms
/–
DIP8
Logic output
VCC = 5 V
120 ns
Open-collector
(Topr = 25˚C)
5 mA
2500
Vrms
/–
DIP8
High CMR version of
the TLP552
VCC = 5 V
120 ns
Open-collector
(Topr = 25˚C)
5 mA
2500
Vrms
/
DIP8
High CMR
VCC = 5 V
75 ns
Open-collector
(Topr = 25˚C)
5 mA
2500
Vrms
/
4
6
GND
7
SHIELD
1
8
Output Form
5
GND
7
VCC
8
Propagation
Delay Time
(Max)
4
GND
6
Features
4
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
19
4
Selection Guide
Photocouplers for Logic Signal Transmission at 10 Mbit/s (Typ.) (Continued)
Part Number
IFHL,
IFLH
(Max)
BVs
DIP8
75 ns
Dual-channel version of
Open-collector
the 6N137 and the TLP552 (Topr = 25˚C)
VCC = 5 V
5 mA
2500
Vrms
/
DIP8
High CMR
Dual-channel version of
the TLP554
VCC = 5 V
5 mA
2500
Vrms
/
IFHL,
IFLH
(Max)
BVs
1.6 mA
3750
Vrms
/
(1)
(1)
Totem pole
output
1.6 mA
(Inverter logic)
3750
Vrms
/
(1)
(1)
1.6 mA
3750
Vrms
/
(1)
Totem pole
output
1.6 mA
(Inverter logic)
3750
Vrms
/
(1)
3-state
(Buffer logic)
Pin Configuration
7
6
5
VCC
GND
8
TLP2630
2
3
4
7
6
5
VCC
GND
SHIELD
1
8
TLP2631
2
1
3
4
Features
Propagation
Delay Time
(Max)
Output Form
75 ns
Open-collector
(Topr = 25˚C)
Safety Standards(2)
UL/cUL TÜV
VDE
BSI
IEC
Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.)
Pin Configuration
5
4
Vcc
TLP105
1
6
6
5
VCC
GND
SHIELD
7
TLP2405
2
3
4
8
7
6
5
VCC
GND
SHIELD
1
TLP2408
2
3
4
7
6
5
2
3
4
8
7
6
5
2
3
Vcc
1
6
TLP2098
1
GND
SHIELD
GND
SHIELD
GND
3
4
Totem pole
output
(Buffer logic)
UL/cUL TÜV
VDE
BSI
IEC
250 ns
SO8
VCC = 4.5 to 20 V
Low input operation
IPM drive
250 ns
SO8
VCC = 4.5 to 20 V
Low input operation
IPM drive
250 ns
Totem pole
output
(Buffer logic)
DIP8
Low input current
VCC = 4.5 to 20 V
400 ns
(Topr = 25˚C)
1.6 mA
2500
Vrms
/
DIP8
Inverting logic version of
the TLP555
VCC = 4.5 to 20 V
400 ns
3-state
1.6 mA
(Topr = 25˚C) (Inverter logic)
2500
Vrms
/
SDIP6
IPM drive
High CMR
VCC = 4.5 to 20 V
250 ns
Totem pole
output
(Buffer logic)
3 mA
5000
Vrms
/
SDIP6
IPM drive
High CMR
VCC = 4.5 to 20 V
250 ns
Totem pole
output
(Inverter logic)
3 mA
5000
Vrms
/
250 ns
Totem pole
output
(Buffer logic)
3 mA
3750
Vrms
/
(1)
250 ns
Totem pole
output
(Inverter logic)
3 mA
3750
Vrms
/
(1)
Mini-flat
SHIELD
TLP2095
250 ns
Safety Standards(2)
3
4
2
5
Vcc
1
6
Output Form
4
2
5
Vcc
1
6
4
5
Vcc
6
3
4
5
GND
1
SHIELD
VCC
GND
1
TLP558
TLP718
TLP718F
SHIELD
VCC
GND
1
8
TLP555
TLP715
TLP715F
MFSOP6
VCC = 4.5 to 20 V
Low input operation
IPM drive
3
1
Propagation
Delay Time
(Max)
Mini-flat
GND
SHIELD
Vcc
TLP108
8
MFSOP6
VCC = 4.5 to 20 V
Low input operation
IPM drive
3
4
5
Features
Mini-flat
GND
SHIELD
6
3
MFSOP6
Dual polarity input version
of the TLP105
VCC = 3 to 20 V
Mini-flat
SHIELD
Part Number
MFSOP6
Dual polarity input version
of the TLP108
VCC = 3 to 20 V
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
20
Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.) (Continued)
Pin Configuration
7
6
5
VCC
GND
SHIELD
8
TLP2105
2
3
4
8
7
6
5
VCC
GND
SHIELD
1
TLP2108
2
3
4
7
6
5
VCC
GND
1
8
TLP2200
1
2
3
SHIELD
Part Number
Propagation
Delay Time
(Max)
Output Form
SO8
Dual-channel version for
the TLP105
VCC = 4.5 to 20 V
250 ns
Totem pole
output
(Buffer logic)
SO8
Dual-channel version for
the TLP108
VCC = 4.5 to 20 V
250 ns
DIP8
Low input current
VCC = 4.5 to 20 V
400 ns
Features
IFHL,
IFLH
(Max)
BVs
1.6 mA
3750
Vrms
/
(1)
(1)
Totem pole
output
1.6 mA
(Inverter logic)
3750
Vrms
/
(1)
(1)
2500
Vrms
/
3-state
(Buffer logic)
1.6 mA
Safety Standards(2)
UL/cUL TÜV
VDE
BSI
IEC
Safety Standards(2)
UL/cUL TÜV
VDE
BSI
IEC
4
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.)
Part Number
Pin Configuration
5
TLP109
1
8
SHIELD
2
6
3
5
2
1
7
16 mA
3750
Vrms
/
(1)
SO8
Topr = 125˚C(max)
SO8 version of the TLP109
1 Mbit/s
20% (min)
16 mA
3750
Vrms
/
(1)
DIP6
6-pin package version
of the TLP550
1 Mbit/s
20% (min)
16 mA
2500
Vrms
/–
DIP8
High CMR
1 Mbit/s
16 mA
2500
Vrms
/
DIP8
Internal base connection
1 Mbit/s
16 mA
2500
Vrms
/
3
6
5
1
2
3
4
8
7
6
5
TLP551
1
2
3
4
8
7
6
5
TLP2403
1
2
3
4
8
7
6
5
TLP553
2
3
4
7
6
5
SHIELD
1
8
TLP559
1
2
3
4
8
7
6
5
TLP651
2
3
5
10% (min)
(19% min for rank 0)
SO8
Low input current
SO8 version of the TLP553
300 kbit/s
400% (min)
0.5 mA
3750
Vrms
/
DIP8
Low input drive current
300 kbit/s
400% (min)
0.5 mA
2500
Vrms
/–
1 Mbit/s
20% (min)
16 mA
2500
Vrms
/
16 mA
5000
Vrms
/
16 mA
5000
Vrms
/
DIP8
High CMR version
of the TLP550
DIP8
Internal base connection
1 Mbit/s
SDIP6
High CMR
1 Mbit/s
10% (min)
(19% min for rank 0)
(1)
4
SHIELD
2
10% (min)
(19% min for rank 0)
4
TLP719
TLP719F
1
20% (min)
4
TLP550
6
1 Mbit/s
BVs
4
TLP512
1
SO6 (reinforced insulation)
@IF
5
TLP2409
8
CTR
3
6
7
1
Data Rate
(NRZ) (Typ.)
4
SHIELD
6
Features
20% (min)
3
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
21
4
Selection Guide
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.) (Continued)
Part Number
Pin Configuration
8
7
6
1
2
3
4
8
7
6
5
TLP751
TLP751F
2
1
3
7
7
3
4
6
5
TLP2530
1
2
3
4
8
7
6
5
TLP2531
2
1
@IF
BVs
Safety Standards(2)
UL/cUL TÜV
VDE
BSI
IEC
DIP8
High CMR
SEMKO-approved
1 Mbit/s
DIP8
Internal base connection
SEMKO-approved
1 Mbit/s
DIP8
IEC60950-compliant
version of the TLP559
SEMKO-approved
16 mA
5000
Vrms
/
10% (min)
16 mA
5000
Vrms
/
1 Mbit/s
20% (min)
16 mA
5000
Vrms
/
DIP8
Dual-channel version of
the 6N135 and the TLP550
1 Mbit/s
7% (min)
16 mA
2500
Vrms
/
DIP8
Dual-channel version of
the 6N136 and the TLP550
1 Mbit/s
19% (min)
16 mA
2500
Vrms
/
IFHL,
Propagation
Delay Time Output Form/CTR IFLH
(Max)
(Max)
BVs
10% (min)
(19% min for rank 0)
5
SHIELD
2
8
CTR
4
6
TLP759
TLP759F
1
Data Rate
(NRZ) (Typ.)
5
TLP750
TLP750F
8
Features
3
4
IPM-Drive Photocouplers
Pin Configuration
5
7
6
3
2
6
SO6 (reinforced insulation)
IPM drive
Topr = 125°C (max)
550 ns
Open-collector
5 mA
3750
Vrms
/
(1)
SO8
IPM drive
Topr = 125°C (max)
SO8 version of the TLP104
550 ns
Open-collector
(Inverter logic)
5 mA
3750
Vrms
/
(1)
SDIP6 (reinforced insulation)
IPM drive
Topr = 125°C (max)
High isolation voltage
550 ns
Open-collector
(Inverter logic)
5 mA
5000
Vrms
/
DIP8
IPM drive
550 ns
Open-collector
5 mA
5000
Vrms
/
SO6 (reinforced insulation)
IPM drive
High CMR
800 ns
25% (min)
10 mA
3750
Vrms
/
(1)
SO8
IPM drive
High CMR
800 ns
20% (min)
10 mA
3750
Vrms
/
(1)
4
5
SHIELD
7
6
3
5
SHIELD
TLP754*
TLP754F*
3
2
TLP109(IGM)
3
1
7
6
5
SHIELD
8
TLP2409(IGM)
1
IEC
4
4
5
SHIELD
1
6
BSI
4
TLP714
TLP714F
1
8
VDE
3
5
TLP2404
1
UL/cUL TÜV
4
TLP104
1
8
Safety Standards(2)
SHIELD
6
Features
SHIELD
Part Number
2
3
4
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
22
IPM-Drive Photocouplers (Continued)
Part Number
Pin Configuration
7
6
TLP559(IGM)
1
8
2
7
3
6
SHIELD
2
3
BVs
Safety Standards(2)
UL/cUL TÜV
VDE
BSI
IEC
Safety Standards(2)
UL/cUL TÜV VDE
BSI
IEC
DIP8
IPM drive
High CMR
800 ns
25% (min)
10 mA
2500
Vrms
/
DIP8
IPM drive
High CMR
SEMKO-approved
800 ns
25% (min)
10 mA
5000
Vrms
/
Data Rate
(NRZ) (Typ.)
CTR
IFHL, IFLH
(Max)
BVs
JEDEC-compliant
1 Mbit/s
7% (min)
16 mA
2500
Vrms
/–
JEDEC-compliant
1 Mbit/s
19% (min)
16 mA
2500
Vrms
/–
JEDEC-compliant
10 Mbit/s
700% (Typ.)
5 mA
2500
Vrms
/–
JEDEC-compliant
High CTR
300 kbit/s
300% (min)
1.6 mA
2500
Vrms
/–
JEDEC-compliant
High CTR
300 kbit/s
400% (min)
0.5 mA
2500
Vrms
/–
4
5
TLP759(IGM)
TLP759F(IGM)
1
Propagation
IFHL,
Delay Time Output Form/CTR IFLH
(Max)
(Max)
5
SHIELD
8
Features
4
JEDEC-Compliant Photocouplers
Part Number
Pin Configuration
8
7
6
5
6N135
1
2
3
4
8
7
6
5
6N136
2
3
4
8
7
6
5
VCC
GND
1
6N137
1
2
3
4
8
7
6
5
6N138
1
2
3
4
8
7
6
5
6N139
1
2
3
Features
4
Note 2: BSI and IEC:
: Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
3 Photocouplers for IGBT/MOSFET Gate Drive
Package
Output Peak
Current
SDIP6
± 0.25 A
± 0.45 A (max)
TLP705 (High speed)
± 0.6 A (max)
TLP701
TLP701A*
TLP701H*
TLP705A*
± 2.0 A (max)
TLP700
TLP700H*
± 2.5 A (max)
DIP8
TLP557
SO6
SO8
TLP351
TLP351A*
TLP351E
TLP351H*
TLP151*
TLP151A*
TLP155E
TLP2451
TLP2451A*
TLP350
TLP350H*
TLP352*
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
23
4
Selection Guide
Photocouplers for IGBT/MOSFET Gate Drive
Part Number
Pin Configuration
6
5
Features
SO6 (reinforced Insulation)
Topr = 110°C (max)
Direct drive of a
small-power
IGBT/MOSFET
TLP151A*
1
I FHL
(Max)
BVs
Safety Standards (2)
UL/cUL TÜV
VDE
BSI
IEC
0.7 μs
Peak output
current (max):
±0.6 A
/
5 mA
(1)
3750
Vrms
0.5 μs
/
(1)
3
6
5
4
SO6 (reinforced Insulation)
Topr = 100°C (max)
Direct drive of a
small-power
IGBT/MOSFET
TLP155E
0.2 μs
Peak output
current (max):
±0.6 A
7.5 mA
3750
Vrms
Peak output
current (max):
±0.6 A
5 mA
3750
Vrms
/
3
1
7
6
5
TLP2451
TLP2451A*
1
2
3
4
8
7
6
5
TLP350
TLP350F
1
2
3
4
8
7
6
5
TLP350H*
TLP350HF*
1
2
3
4
8
7
6
5
TLP351
TLP351F
1
2
3
4
8
7
6
5
TLP351A*
TLP351AF*
1
2
3
4
8
7
6
5
TLP351H*
TLP351HF*
1
2
3
4
8
7
6
5
TLP352*
TLP352F*
1
Output
4
TLP151*
8
Propagation
Delay Time (Max)
2
3
4
SO8
Topr = 125°C (max)
Direct drive of a
small-power
IGBT/MOSFET
High CMR
0.7 μs
/
0.5 μs
/
DIP8
Direct drive of a
medium-power
IGBT/MOSFET
High CMR
Low power dissipation
0.5 μs
Peak output
current (max):
±2.5 A
5 mA
3750
Vrms
/
DIP8
Topr = 125°C (max)
Direct drive of a
medium-power
IGBT/MOSFET
High CMR
0.5 μs
Peak output
current (max):
±2.5 A
5 mA
3750
Vrms
/
DIP8
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
0.7 μs
Peak output
current (max):
±0.6 A
5 mA
3750
Vrms
/
DIP8
Direct drive of a
small-power
IGBT/MOSFET
Low power dissipation
0.7 μs
Peak output
current (max):
±0.6 A
5 mA
3750
Vrms
/
DIP8
Topr = 125°C (max)
Direct drive of a
small-power
IGBT/MOSFET
High CMR
0.7 μs
Peak output
current (max):
±6.0 A
5 mA
3750
Vrms
/
DIP8
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
Topr = 125°C (max)
0.2 μs
Peak output
current (max):
±2.5 A
5 mA
3750
Vrms
/
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
24
Photocouplers for IGBT/MOSFET Gate Drive (Continued)
Part Number
Pin Configuration
8
7
6
2
6
3
5
BVs
Constant current
5 mA
output : 0.25 A
2500
Vrms
/
IEC
DIP8
Direct drive of a power
transistor
5 μs
SDIP6
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
0.5 μs
Peak output
current (max):
±2.0 A
5 mA
5000
Vrms
/
SDIP6
Topr = 125°C (max)
Direct drive of a
medium-power
IGBT/MOSFET
High CMR
0.5 μs
Peak output
current (max):
±2.0 A
5 mA
5000
Vrms
/
SDIP6
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
0.7 μs
Peak output
current (max):
±0.6 A
5 mA
5000
Vrms
/
SDIP6
Direct drive of a
small-power
IGBT/MOSFET
Low power dissipation
0.7 μs
Peak output
current (max):
±0.6 A
5 mA
5000
Vrms
/
SDIP6
Topr = 125°C (max)
Direct drive of a
small-power
IGBT/MOSFET
High CMR
0.7 μs
Peak output
current (max):
±0.6 A
5 mA
5000
Vrms
/
SDIP6
Direct drive of a
small-power
IGBT/MOSFET
High speed (250 kHz)
Low power dissipation
0.2 μs
Peak output
current (max):
±0.45 A
8 mA
5000
Vrms
/
SDIP6
Direct drive of a
small-power
IGBT/MOSFET
High speed
Low power dissipation
0.2 μs
Peak output
current (max):
±0.6 A
7.5 mA
5000
Vrms
/
4
1
2
3
6
5
4
TLP700H*
TLP700HF*
1
2
3
6
5
4
TLP701
TLP701F
1
2
3
6
5
4
TLP701A*
TLP701AF*
1
2
3
6
5
4
TLP701H*
TLP701HF*
1
2
3
6
5
4
TLP705
TLP705F
1
2
3
6
5
4
TLP705A*
TLP705AF*
2
Safety Standards (2)
VDE
BSI
UL/cUL TÜV
I FHL
(Max)
Output
4
TLP700
TLP700F
1
Propagation
Delay Time (Max)
5
TLP557
1
Features
3
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
25
4
Selection Guide
4 Photorelays (1-Form-A and 2-Form-A)
Package
Features
Off-State
Voltage
(max)
(V)
20
40
50
60
80
100
200
On-State On-State
Resistance Current
(max)
(max)
(Ω)
(A)
8
5
1.2
1.2
0.22
0.05
0.05
35
15
14
10
3
1.5
0.13
0.06
0.06
1.5
50
50
0.16
0.2
0.3
0.45
0.9
2.5
4
0.08
0.12
0.12
0.14
0.25
0.3
1
2.5
3.5
0.3
0.07
0.1
2
0.4
2
0.5
1.5
1.2
1.1
1
0.7
0.2
0.1
0.07
0.07
25
20
12
8
1.2
0.15
14
0.2
0.2
50
0.4
0.35
0.5
0.4
1
1.5
2.5
2.3
3
0.04
0.1
0.12
0.2
0.35
1.25
0.08
1.4
2
0.05
8
0.2
8
50
35
0.25
0.1
0.11
35
0.12
35
0.12
12
0.15
35
4
35
60
0.12
0.2
0.1
0.09
350
400
600
USOP4
SSOP4
SO6
2.54SOP4 2.54SOP6 2.54SOP8
DIP4
DIP6
DIP8
TLP3130
TLP3230
TLP3250
TLP3131
TLP3231
TLP3203
TLP3100
TLP3543*
TLP3113
TLP3116
TLP3213
TLP3216
TLP3240
TLP3241
TLP3214
TLP3215
TLP3114
TLP3115
TLP3123
TLP3102
TLP3544*
TLP3375
TLP3275
TLP173A†
TLP175A*
TLP170A
TLP172A
TLP176A
TLP192A
TLP197A
TLP202A◆
TLP206A◆
TLP220A* TLP598AA
TLP222A TLP592A TLP222A-2◆
TLP227A TLP597A TLP227A-2◆
TLP3212
TLP3110
TLP225A
TLP3312
TLP3122
TLP221A*
TLP3542
TLP3103
TLP3545*
TLP3218
TLP3217
TLP3219
TLP3118
TLP3111
TLP3119
TLP3121
TLP3120
TLP3220
TLP3105
TLP3546*
TLP179D
TLP170D
TLP176D
TLP170G
TLP172G
TLP199D
TLP209D◆
TLP197D
TLP200D◆
TLP220D*
TLP220G*
TLP192G TLP202G◆
TLP222G TLP592G
TLP174G
TLP224G
TLP176G TLP197G TLP206G◆ TLP227G TLP597G
TLP176GA TLP197GA TLP206GA◆ TLP227GA TLP597GA
TLP220GA* TLP797GA
TLP598GA
TLP798GA
TLP174GA
TLP224GA
TLP3125
TLP797J
TLP220J*
TLP170J
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
26
◆
TLP222G-2◆
TLP224G-2◆
TLP227G-2◆
TLP227GA-2◆
TLP224GA-2◆
Dual-channel †: MFSOP6
MOSFET-Output Photorelays, 1-Form-A in a USOP4 Package
Part Number
Pin Configuration
4
3
TLP3312*
TLP3375*
1
2
Features
IFT
(Max)
RON (Max)
@IF
ION
(Max)
VOFF
BVs
Safety Standards (2)
UL/cUL TÜV
USOP4
COFF: 20 pF (typ.)
3 mA
1Ω
5 mA
0.4 A
60 V
500
Vrms
USOP4
COFF: 12 pF (typ.)
3 mA
1.5 Ω
5 mA
0.3 A
50 V
500
Vrms
VOFF
BVs
VDE
BSI
IEC
MOSFET-Output Photorelays, 1-Form-A in a SO6 Package
Part Number
Pin Configuration
6
Features
RON (Max)
ION
@IF
(Max)
2 mA
0.1 A
Safety Standards (2)
UL/cUL TÜV
VDE
BSI
IEC
4
SO6
General-purpose
Low trigger current
TLP175A*
1
IFT
(Max)
1 mA
50 Ω
60 V
3750
Vrms
VOFF
BVs
/–
/
3
MOSFET-Output Photorelays, 1-Form-A in a SSOP4 Package
Part Number
Pin Configuration
Features
IFT
(Max)
RON (Max)
@IF
ION
(Max)
Safety Standards (2)
UL/cUL TÜV
TLP3203
SSOP4
COFF: 40 pF (typ.)
3 mA
0.22 Ω
5 mA
0.9 A
20 V
1500
Vrms
TLP3212
SSOP4
COFF: 20 pF (typ.)
5 mA
1.5 Ω
5 mA
0.4 A
60 V
1500
Vrms
/–
TLP3213
SSOP4
COFF: 0.6 pF (typ.)
4 mA
35 Ω
5 mA
0.08 A
40 V
1500
Vrms
/–
TLP3214
SSOP4
COFF: 5 pF (typ.)
4 mA
3Ω
5 mA
0.25 A
40 V
1500
Vrms
/–
TLP3215
SSOP4
COFF: 10 pF (typ.)
4 mA
1.5 Ω
5 mA
0.3 A
40 V
1500
Vrms
/–
TLP3216
SSOP4
COFF: 1 pF (typ.)
4 mA
15 Ω
5 mA
0.12 A
40 V
1500
Vrms
/–
TLP3217
SSOP4
COFF: 5 pF (typ.)
5 mA
12 Ω
10 mA
0.12 A
80 V
1500
Vrms
/–
SSOP4
COFF: 2.5 pF (typ.)
5 mA
25 Ω
5 mA
0.04 A
80 V
1500
Vrms
/–
SSOP4
COFF: 6.5 pF (typ.)
3 mA
8Ω
5 mA
0.2 A
80 V
1500
Vrms
/–
TLP3220
SSOP4
COFF: 6 pF (typ.)
5 mA
14 Ω
10 mA
0.08 A
100 V
1500
Vrms
/–
TLP3230
SSOP4
COFF: 1 pF (typ.)
4 mA
8Ω
5 mA
0.16 A
20 V
1500
Vrms
/–
TLP3231
SSOP4
COFF: 5 pF (typ.)
4 mA
1.2 Ω
5 mA
0.45 A
20 V
1500
Vrms
/–
TLP3240
SSOP4
COFF: 0.45 pF (typ.)
3 mA
14 Ω
5 mA
0.12 A
40 V
1500
Vrms
/–
TLP3241
SSOP4
COFF: 0.7 pF (typ.)
3 mA
10 Ω
5 mA
0.14 A
40 V
1500
Vrms
/–
TLP3250
SSOP4
COFF: 0.8 pF (typ.)
3 mA
5Ω
5 mA
0.2 A
20 V
1500
Vrms
/–
TLP3275
SSOP4
COFF: 12 pF (typ.)
3 mA
1.5 Ω
5 mA
0.3 A
50 V
1500
Vrms
/–
4
3
TLP3218
TLP3219
1
2
VDE
BSI
IEC
IEC
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
IEC
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
27
4
Selection Guide
MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP4 Package
Part Number
Pin Configuration
Features
IFT
(Max)
RON (Max)
@IF
ION
(Max)
BVs
/
UL/cUL TÜV
2.54SOP4
TLP170A
Lead pitch: 2.54 mm
Low trigger LED current
TLP170D
Lead pitch: 2.54 mm
Low trigger LED current
4
3
1 mA
2Ω
2 mA
0.4 A
60 V
1 mA
8Ω
2 mA
0.2 A
200 V
1500
Vrms
/
1 mA
50 Ω
2 mA
0.1 A
350 V
1500
Vrms
/
1
2
1 mA
60 Ω
2 mA
0.09 A
600 V
1500
Vrms
/
3 mA
2Ω
5 mA
0.4 A
60 V
1500
Vrms
/
3 mA
35 Ω
5 mA
0.11 A
350 V
1500
Vrms
/
2 mA
50 Ω
3 mA
0.07 A
60 V
3750
Vrms
/
3 mA
35 Ω
5 mA
0.12 A
350 V
1500
Vrms
/
3 mA
35 Ω
5 mA
0.12 A
400 V
1500
Vrms
/
3 mA
2Ω
5 mA
0.4 A
60 V
1500
Vrms
/
(1)
3 mA
8Ω
5 mA
0.2 A
200 V
1500
Vrms
/
(1)
3 mA
35 Ω
5 mA
0.12 A
350 V
1500
Vrms
/
(1)
3 mA
35 Ω
5 mA
0.12 A
400 V
1500
Vrms
/
3 mA
50 Ω
5 mA
0.05 A
200 V
1500
Vrms
/
4 mA
1.2 Ω
5 mA
0.35 A
60 V
1500
Vrms
/–
4 mA
20 Ω
5 mA
0.1 A
80 V
1500
Vrms
/–
4 mA
35 Ω
5 mA
0.08 A
40 V
1500
Vrms
/–
4 mA
3Ω
5 mA
0.25 A
40 V
1500
Vrms
/–
4 mA
1.5 Ω
5 mA
0.3 A
40 V
1500
Vrms
/–
4 mA
15 Ω
5 mA
0.12 A
40 V
1500
Vrms
/–
3 mA
25 Ω
5 mA
0.04 A
80 V
1500
Vrms
/–
2.54SOP4
Lead pitch: 2.54 mm
Low trigger LED current
2.54SOP4
TLP170J
Lead pitch: 2.54 mm
Low trigger LED current
2.54SOP4
TLP172A
Lead pitch: 2.54 mm
COFF: 130 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
COFF: 30 pF (typ.)
TLP172G
6
BSI
IEC
4
Mini-flat
MFSOP6
TLP173A
Low trigger LED current
1
VDE
1500
Vrms
2.54SOP4
TLP170G
Safety Standards (2)
VOFF
3
2.54SOP4
Lead pitch: 2.54 mm
SEMKO-approved
Current-limiting function
Limit current: 150 to 300 mA
TLP174G
2.54SOP4
TLP174GA
Lead pitch: 2.54 mm
Current-limiting function
Limit current: 150 to 300 mA
TLP176A
Lead pitch: 2.54 mm
COFF: 130 pF (typ.)
TLP176D
Lead pitch: 2.54 mm
COFF: 100 pF (typ.)
2.54SOP4
2.54SOP4
2.54SOP4
Lead pitch: 2.54 mm
SEMKO-approved
COFF: 40 pF (typ.)
TLP176G
2.54SOP4
TLP176GA
4
3
Lead pitch: 2.54 mm
COFF: 70 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
COFF: 15 pF (typ.)
TLP179D
1
2
2.54SOP4
TLP3110
Lead pitch: 2.54 mm
COFF: 100 pF (typ.)
TLP3111
Lead pitch: 2.54 mm
COFF: 11 pF (typ.)
2.54SOP4
2.54SOP4
TLP3113
Lead pitch: 2.54 mm
COFF: 0.6 pF (typ.)
TLP3114
Lead pitch: 2.54 mm
COFF: 5 pF (typ.)
2.54SOP4
2.54SOP4
TLP3115
Lead pitch: 2.54 mm
COFF: 10 pF (typ.)
2.54SOP4
TLP3116
Lead pitch: 2.54 mm
COFF: 1 pF (typ.)
2.54SOP4
TLP3118
Lead pitch: 2.54 mm
COFF: 2.5 pF (typ.)
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
28
MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP4 Package (Continued)
Part Number
Pin Configuration
Features
IFT
(Max)
RON (Max)
ION
@IF
(Max)
VOFF
UL/cUL TÜV
2.54SOP4
TLP3119
Lead pitch: 2.54 mm
COFF: 6.5 pF (typ.)
3 mA
8Ω
5 mA
0.2 A
80 V
1500
Vrms
/–
4 mA
1.2 Ω
5 mA
0.35 A
80 V
1500
Vrms
/
3 mA
0.7 Ω
5 mA
1.0 A
60 V
1500
Vrms
/
3 mA
0.13 Ω
5 mA
1.0 A
40 V
1500
Vrms
/
4 mA
8Ω
5 mA
0.16 A
20 V
1500
Vrms
/–
4 mA
1.2 Ω
5 mA
0.3 A
20 V
1500
Vrms
/–
2.54SOP4
TLP3121
Lead pitch: 2.54 mm
COFF: 30 pF (typ.)
Safety Standards (2)
BVs
VDE
BSI
IEC
2.54SOP4
TLP3122
4
3
TLP3123
1
2
Lead pitch: 2.54 mm
ION: 1 A (max)@Ta: up to 50˚C
COFF: 90 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
ION: 1 A (max)@Ta: up to 50˚C
COFF: 300 pF (typ.)
2.54SOP4
TLP3130
Lead pitch: 2.54 mm
COFF: 1 pF (typ.)
2.54SOP4
TLP3131
Lead pitch: 2.54 mm
COFF: 5 pF (typ.)
MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP6 or 2.54SOP8 Package
Part Number
Pin Configuration
Features
IFT
(Max)
RON (Max)
@IF
ION
(Max)
BVs
/
UL/cUL TÜV
2.54SOP6
Lead pitch: 2.54 mm
COFF: 130 pF (typ.)
TLP192A
3 mA
2Ω
5 mA
0.4 A
60 V
1500
Vrms
3 mA
35 Ω
5 mA
0.11 A
350 V
1500
Vrms
/
3 mA
2Ω
5 mA
0.4 A
60 V
1500
Vrms
/
3 mA
8Ω
5 mA
0.2 A
200 V
1500
Vrms
/
3 mA
35 Ω
5 mA
0.12 A
350 V
1500
Vrms
/
3 mA
35 Ω
5 mA
0.12 A
400 V
1500
Vrms
/–
3 mA
50 Ω
5 mA
0.05 A
200 V
1500
Vrms
/
3 mA
0.05 Ω
5 mA
2.5 A
20 V
1500
Vrms
/
3 mA
0.06 Ω
5 mA
2.5 A
40 V
1500
Vrms
/
3 mA
0.07 Ω
5 mA
2.3 A
60 V
1500
Vrms
/
3 mA
0.2 Ω
5 mA
1.4 A
100 V
1500
Vrms
/
5 mA
0.15 Ω
5 mA
1.25 A
80 V
1500
Vrms
/
3 mA
4Ω
5 mA
0.2 A
400 V
1500
Vrms
/
2.54SOP6
Lead pitch: 2.54 mm
COFF: 30 pF (typ.)
TLP192G
2.54SOP6
Lead pitch: 2.54 mm
COFF: 130 pF (typ.)
TLP197A
2.54SOP6
TLP197D
Lead pitch: 2.54 mm
COFF: 100 pF (typ.)
2.54SOP6
TLP197G
Lead pitch: 2.54 mm
SEMKO-approved
6
5
4
2.54SOP6
Lead pitch: 2.54 mm
COFF: 70 pF (typ.)
TLP197GA
2.54SOP6
TLP199D
2
1
3
Lead pitch: 2.54 mm
COFF: 15 pF (typ.)
2.54SOP6
TLP3100
Lead pitch : 2.54 mm
ION: 2.5 A (max) @Ta: up to 50˚C
TLP3102
2.54SOP6
TLP3103
2.54SOP6
TLP3105
2.54SOP6
ION (DC) = 5 A (max); C-connection
ION (DC) = 4.6 A (max); C-connection
ION (DC) = 2.8 A (max); C-connection
2.54SOP6
TLP3120
Lead pitch : 2.54 mm
ION: 1.25 A (max)
8
7
6
2.54SOP8
Lead pitch: 2.54 mm
COFF: 410 pF (typ.)
2
3
VDE
BSI
IEC
(1)
5
TLP3125
1
Safety Standards (2)
VOFF
4
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
29
4
Selection Guide
MOSFET-Output Photorelays, 2-Form-A in a 2.54SOP8 Package
Part Number
Pin Configuration
Features
IFT
(Max)
RON (Max)
@IF
ION
(Max)
BVs
/–
UL/cUL TÜV
2.54SOP8
TLP200D
Lead pitch: 2.54 mm
Dual-channel version of the TLP176D
3 mA
8Ω
5 mA
0.2 A
200 V
1500
Vrms
3 mA
2Ω
5 mA
0.4 A
60 V
1500
Vrms
/–
3 mA
50 Ω
5 mA
0.11 A
350 V
1500
Vrms
/–
3 mA
2Ω
5 mA
0.4 A
60 V
1500
Vrms
/–
3 mA
35 Ω
5 mA
0.12 A
350 V
1500
Vrms
/–
3 mA
35 Ω
5 mA
0.12 A
400 V
1500
Vrms
/–
3 mA
50 Ω
5 mA
0.05 A
200 V
1500
Vrms
/–
VOFF
BVs
2.54SOP8
TLP202A
Lead pitch: 2.54 mm
Dual-channel version of the TLP172A
2.54SOP8
TLP202G
8
7
6
5
Lead pitch: 2.54 mm
Dual-channel version of the TLP172G
2.54SOP8
TLP206A
Lead pitch: 2.54 mm
Dual-channel version of the TLP176A
1
2
3
4
TLP206G
2.54SOP8
Lead pitch: 2.54 mm
Dual-channel version of the TLP176G
2.54SOP8
TLP206GA
Lead pitch: 2.54 mm
Dual-channel version of the TLP176GA
2.54SOP8
TLP209D
Lead pitch: 2.54 mm
Dual-channel version of the TLP179D
Safety Standards (2)
VOFF
VDE
BSI
IEC
(1)
MOSFET-Output Photorelays, 1-Form-A in a DIP4 Package
Part Number
Pin Configuration
Features
IFT
(Max)
RON (Max)
ION
@IF
(Max)
DIP4
TLP220A*
2 mA
2Ω
5 mA
±0.5 A
60 V
5000
Vrms
/
2 mA
8Ω
5 mA
±0.25 A 200 V
5000
Vrms
/
2 mA
50 Ω
5 mA
±0.1 A
350 V
5000
Vrms
/
2 mA
35 Ω
5 mA
±0.12 A 400 V
5000
Vrms
/
2 mA
60 Ω
5 mA
±0.09 A 600 V
5000
Vrms
/
General-purpose
Reinforced insulation
2 mA
0.2 Ω
5 mA
±1.5 A
60 V
5000
Vrms
/
DIP4
3 mA
2Ω
5 mA
0.5 A
60 V
2500
Vrms
/
3 mA
50 Ω
5 mA
0.12 A
350 V
2500
Vrms
/
3 mA
35 Ω
5 mA
0.12 A
350 V
2500
Vrms
/
Current-limiting function
Limit current: 150 to 300 mA
3 mA
35 Ω
5 mA
0.12 A
400 V
2500
Vrms
/–
DIP4 SEMKO-approved
3 mA
2Ω
5 mA
0.5 A
60 V
2500
Vrms
/
3 mA
35 Ω
5 mA
0.12 A
350 V
2500
Vrms
/
3 mA
35 Ω
5 mA
0.12 A
400 V
2500
Vrms
/–
5 mA
1.1 Ω
10 mA
0.5 A
60 V
2500
Vrms
/
General-purpose
Reinforced insulation
DIP4
TLP220D*
General-purpose
Reinforced insulation
DIP4
TLP220G*
General-purpose
Reinforced insulation
DIP4
General-purpose
Reinforced insulation
TLP220GA*
DIP4
General-purpose
Reinforced insulation
TLP220J*
DIP4
TLP221A*
4
3
TLP222A
COFF: 130 pF (typ.)
1
2
TLP222G
DIP4
COFF: 30 pF (typ.)
DIP4 SEMKO-approved
TLP224G
Current-limiting function
Limit current: 150 to 300 mA
DIP4 For modems
TLP224GA
TLP227A
COFF: 130 pF (typ.)
DIP4
TLP227G
SEMKO-approved
COFF: 40 pF (typ.)
DIP4
TLP227GA
SEMKO-approved
4
VDE
BSI
IEC
3
DIP4
TLP225A
Designed for DC output modules
1
Safety Standards (2)
UL/cUL TÜV
2
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
30
MOSFET-Output Photorelays, 1-Form-A in a DIP6 Package
Part Number
Pin Configuration
Features
DIP6
TLP592A
RON (Max)
ION
@IF
(Max)
VOFF
UL/cUL TÜV
2Ω
5 mA
0.5 A
60 V
2500
Vrms
/–
3 mA
50 Ω
5 mA
0.12 A
350 V
2500
Vrms
/–
3 mA
2Ω
5 mA
0.5 A
60 V
2500
Vrms
/–
3 mA
35 Ω
5 mA
0.12 A
350 V
2500
Vrms
/–
3 mA
35 Ω
5 mA
0.12 A
400 V
2500
Vrms
/–
COFF: 130 pF (typ.)
3 mA
2Ω
5 mA
0.5 A
60 V
2500
Vrms
/–
DIP6
3 mA
12 Ω
5 mA
0.15 A
400 V
2500
Vrms
/–
3 mA
35 Ω
5 mA
0.12 A
400 V
5000
Vrms
/–
5 mA
35 Ω
10 mA
0.1 A
600 V
5000
Vrms
/
5 mA
12 Ω
5 mA
0.15 A
400 V
5000
Vrms
/–
3 mA
0.1 Ω
10 mA
2.5 A
60 V
2500
Vrms
/
3 mA
0.05 Ω
5 mA
4A
20 V
2500
Vrms
/
3 mA
0.06 Ω
5 mA
3.5 A
40 V
2500
Vrms
/
3 mA
0.07 Ω
5 mA
3A
60 V
2500
Vrms
/
3 mA
0.2 Ω
5 mA
2A
100 V
2500
Vrms
/
VOFF
BVs
DIP6
COFF: 30 pF (typ.)
DIP6
TLP597A
SEMKO-approved
COFF: 130 pF (typ.)
DIP6
TLP597G
SEMKO-approved
COFF: 40 pF (typ.)
DIP6
SEMKO-approved
COFF: 70 pF (typ.)
TLP597GA
DIP6
TLP598AA
TLP598GA
6
5
VDE
BSI
IEC
4
DIP6
TLP797GA
TLP797GAF
COFF: 40 pF (typ.)
1
Safety Standards (2)
BVs
3 mA
COFF: 130 pF (typ.)
TLP592G
IFT
(Max)
2
3
TLP797J
TLP797JF
DIP6
TLP798GA
DIP6
COFF: 120 pF (typ.)
DIP6
TLP3542
High output current: 2.5 A (max)
COFF: 400 pF (typ.)
DIP6
TLP3543*
High output current: 4 A (max)
DIP6
TLP3544*
High output current: 3.5 A (max)
DIP6
TLP3545*
High output current: 3 A (max)
DIP6
TLP3546*
High output current: 2 A (max)
MOSFET-Output Photorelays, 2-Form-A in a DIP8 Package
Part Number
Pin Configuration
Features
IFT
(Max)
RON (Max)
ION
@IF
(Max)
Safety Standards (2)
UL/cUL TÜV
TLP222A-2
DIP8
Dual-channel version of the TLP222A
3 mA
2Ω
5 mA
0.5 A
60 V
2500
Vrms
/
TLP222G-2
DIP8
Dual-channel version of the TLP222G
SEMKO-approved
3 mA
50 Ω
5 mA
0.12 A
350 V
2500
Vrms
/
DIP8
Dual-channel version of the TLP224G
SEMKO-approved
3 mA
35 Ω
5 mA
0.12 A
350 V
2500
Vrms
/
TLP224GA-2
DIP8
Current-limiting function
Limit current: 150 to 300 mA
3 mA
35 Ω
5 mA
0.12 A
400 V
2500
Vrms
/–
TLP227A-2
DIP8
Dual-channel version of the TLP227A
SEMKO-approved
3 mA
2Ω
5 mA
0.5 A
60 V
2500
Vrms
/
8
7
6
5
TLP224G-2
1
2
3
4
VDE
BSI
IEC
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
31
4
Selection Guide
MOSFET-Output Photorelays, 2-Form-A in a DIP8 Package (Continued)
Part Number
TLP227G-2
TLP227GA-2
Pin Configuration
8
7
6
5
1
2
3
4
IFT
(Max)
Features
RON (Max)
ION
@IF
(Max)
VOFF
Safety Standards (2)
BVs
UL/cUL TÜV
DIP8
Dual-channel version of the TLP227G
SEMKO-approved
3 mA
35 Ω
5 mA
0.12 A
350 V
2500
Vrms
/
DIP8
Dual-channel version of the TLP227GA
SEMKO-approved
3 mA
35 Ω
5 mA
0.12 A
400 V
2500
Vrms
/–
VDE
BSI
IEC
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
5 Photorelays (1-Form-B, 2-Form-B and 1-Form-A/1-Form-B)
Package
Features
2.54SOP4
2.54SOP6
2.54SOP8
50
0.09
TLP4172G
TLP4192G
TLP4202G*
50
0.10
25
0.12
TLP4176G
TLP4197G
TLP4206G*
25
0.15
50
0.09
50
0.10
25
0.12
1-Form-A/
1-Form-B
1-Form-B,
2-Form-B
Off-State On-State On-State
Voltage Resistance Current
(max)
(max)
(max)
(V)
(A)
(Ω)
350
350
DIP4
DIP6
DIP8
TLP4222G
TLP4592G
TLP4222G-2*
TLP4227G
TLP4597G
TLP4227G-2*
TLP4027G*
TLP4007G*
TLP4006G*
TLP4026G*
* Dual-channel
MOSFET-Output Photorelays, 1-Form-B
Part Number
Pin Configuration
4
Features
IFT
(Max)
RON (Max)
ION
@IF
(Max)
VOFF
UL/cUL TÜV
2.54SOP4
Lead pitch: 2.54 mm
1-Form-B
1
3 mA
50 Ω
0 mA
0.09 A
350 V
1500
Vrms
/–
3 mA
50 Ω
0 mA
0.09 A
350 V
1500
Vrms
/–
3 mA
50 Ω
0 mA
0.1 A
350 V
2500
Vrms
/–
3 mA
50 Ω
0 mA
0.1 A
350 V
2500
Vrms
/–
3 mA
25 Ω
0 mA
0.12 A
350 V
1500
Vrms
/–
3 mA
25 Ω
0 mA
0.12 A
350 V
1500
Vrms
/–
2.54SOP6
Lead pitch: 2.54 mm
1-Form-B
3
2
4
3
DIP4
TLP4222G
1-Form-B
1
2
5
4
DIP6
TLP4592G
1-Form-B
1
3
2
4
3
2.54SOP4
TLP4176G
Lead pitch: 2.54 mm
1-Form-B
2
1
6
5
4
2.54SOP6
TLP4197G
Lead pitch: 2.54 mm
1-Form-B
1
IEC
4
TLP4192G
6
BSI
2
5
1
VDE
3
TLP4172G
6
Safety Standards (2)
BVs
2
3
Note 2: BSI and IEC:
: Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
32
MOSFET-Output Photorelays, 1-Form-B (Continued)
Part Number
Pin Configuration
4
Features
IFT
(Max)
RON (Max)
ION
@IF
(Max)
VOFF
UL/cUL TÜV
DIP4
1-Form-B
SEMKO-approved
1
BSI
IEC
3 mA
25 Ω
0 mA
0.15 A
350 V
2500
Vrms
/–
3 mA
25 Ω
0 mA
0.15 A
350 V
2500
Vrms
/–
VOFF
BVs
2
5
4
DIP6
TLP4597G
1-Form-B
SEMKO-approved
2
1
VDE
3
TLP4227G
6
Safety Standards (2)
BVs
3
MOSFET-Output Photorelays, 2-Form-B
Part Number
Pin Configuration
Features
IFT
(Max)
RON (Max)
ION
@IF
(Max)
Safety Standards (2)
UL/cUL TÜV
VDE
BSI
IEC
2.54SOP8
Lead pitch: 2.54 mm
Dual-channel version of the TLP4172G
2-Form-B
TLP4202G
3 mA
50 Ω
0 mA
0.09 A
350 V
1500
Vrms
/–
3 mA
50 Ω
0 mA
0.1 A
350 V
2500
Vrms
/–
3 mA
25 Ω
0 mA
0.12 A
350 V
1500
Vrms
/–
3 mA
25 Ω
0 mA
0.15 A
350 V
2500
Vrms
/–
VOFF
BVs
DIP8
TLP4222G-2
8
7
6
5
1
2
3
4
Dual-channel version of the TLP4222G
2-Form-B
2.54SOP8
TLP4206G
Lead pitch: 2.54 mm
Dual-channel version of the TLP4176G
2-Form-B
DIP8
Dual-channel version of the TLP4227G
2-Form-B
SEMKO-approved
TLP4227G-2
MOSFET-Output Photorelays, 1-Form-A/1-Form-B
Part Number
Pin Configuration
Features
IFT
(Max)
RON (Max)
@IF
TLP4007G
Lead pitch: 2.54
1a1b (N.C. + N.O.)
DIP8
8
7
6
5
1
2
3
4
1a1b (N.C. + N.O.)
TLP4006G
Lead pitch: 2.54
1a1b (N.C. + N.O.)
DIP8
1a1b (N.C. + N.O.)
UL/cUL TÜV
3 mA
50 Ω
3 mA
50 Ω
(Form-A)
5 mA
(Form-B)
0 mA
3 mA
25 Ω
(Form-A)
5 mA 0.12 A
(Form-B)
0 mA
350 V
1500
Vrms
/–
3 mA
25 Ω
(Form-A)
5 mA 0.12 A
(Form-B)
0 mA
350 V
2500
Vrms
/–
2.54SOP8
TLP4026G
Safety Standards (2)
(Form-A)
5 mA 0.09 A
(Form-B)
0 mA
2.54SOP8
TLP4027G
ION
(Max)
Note 2: BSI and IEC:
0.1 A
350 V
1500
Vrms
/–
350 V
2500
Vrms
/–
VDE
BSI
IEC
: Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
33
4
Selection Guide
6 Triac-Output Photocouplers
Package
Features
MFSOP6
VDRM
DIP6
Isolation
voltage
NZC
ZC
2500 Vrms
TLP160G
TLP161G
TLP160J
TLP165J
TLP161J
TLP163J
TLP166J
TLP260J
TLP261J
TLP168J
400 V
5000 Vrms
2500 Vrms
3000 Vrms
600 V
3750 Vrms
4000 Vrms
NZC
ZC
NZC
TLP560G
TLP561G
TLP3022(S) TLP3042(S)
TLP3023(S) TLP3043(S)
SO6
ZC
NZC
ZC
TLP525G/-2/-4
TLP561J
TLP560J
TLP762J
TLP763J
TLP3052(S)
TLP3762(S)
TLP3062(S)
TLP3063(S)
TLP3064(S)
5000 Vrms
800 V
DIP4/8/16
TLP360J
TLP361J
TLP363J
TLP3082(S)
TLP3782(S)
TLP3783(S)
5000 Vrms
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
NZC: Non-zero cross
ZC: Zero cross
Triac-Output Photocouplers for Solid State Relays (SSRs)
Part Number
Pin Configuration
6
Features
4
Mini-flat
TLP160G
MFSOP6
Non-zero cross
1
3
6
4
Mini-flat
TLP161G
ZC
MFSOP6
Zero cross
1
3
6
4
TLP160J
Mini-flat
TLP165J
Non-zero cross
1
3
6
4
Mini-flat
ZC
TLP168J
−
10 mA
IFT7
7 mA
IFT5
5 mA
−
10 mA
IFT7
7 mA
IFT5
5 mA
−
10 mA
MFSOP6
TLP161J
TLP166J
I FT (Max)
Rank
MFSOP6
Zero cross
3
6
4
VDRM
BVs
UL/c-UL
Safety Standards (2)
TÜV
VDE
BSI
2.8 V
70 mA 400 V
2500
Vrms
/
(1)
2.8 V
70 mA 400 V
2500
Vrms
/
(1)
2.8 V
70 mA 600 V
2500
Vrms
/
(1)
2.8 V
70 mA 600 V
2500
Vrms
/
(1)
IFT7
7 mA
−
10 mA
IFT7
7 mA
−
3 mA
2.8 V
70 mA 600 V
2500
Vrms
/
−
10 mA
2.8 V
100 mA 600 V
2500
Vrms
/
IEC
Mini-flat
MFSOP6
1
VTM (Max)
@ITM
Zero cross
Low trigger current
Mini-flat
MFSOP6
ZC
TLP163J
1
3
Zero cross
High impulse noise
immunity
VN=2000 V (typ.)
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC:
: Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
34
Triac-Output Photocouplers for Solid State Relays (SSRs) (Continued)
Pin Configuration
Part Number
6
Features
I FT (Max)
Rank
VTM (Max)
@ITM
VDRM
BVs
UL/c-UL
Safety Standards (2)
TÜV
VDE
BSI
IEC
4
Mini-flat
TLP260J
MFSOP6
−
10 mA
2.8 V
70 mA 600 V
3000
Vrms
/–
(1)
−
10 mA
2.8 V
70 mA 600 V
3000
Vrms
/–
(1)
Non-zero cross
1
3
6
4
Mini-flat
TLP261J
MFSOP6
ZC
Zero cross
3
1
Triac-Output Photocouplers for Office Equipment
Part Number
Pin Configuration
4
Features
I FT (Max)
Rank
VTM (Max)
@ITM
VDRM
BVs
Safety Standards (2)
UL/c-UL
TÜV
VDE
BSI
IEC
3
TLP360J
TLP360JF
DIP4
−
10 mA
IFT7
7 mA
−
10 mA
Non-zero cross
2.8 V
70 mA 600 V
5000
Vrms
/
2.8 V
70 mA 600 V
5000
Vrms
/
2.8 V
70 mA 600 V
5000
Vrms
/
2
3
1
4
TLP361J
TLP361JF
DIP4
ZC
Zero cross
2
3
1
4
TLP363J
TLP363JF
7 mA
−
10 mA
DIP4
Zero cross
High impulse noise
immunity
VN = 2000 V (typ.)
ZC
2
1
IFT7
Triac-Output Photocouplers for AC 100 to 120 V Lines
Part Number
Pin Configuration
4
Features
VTM (Max)
@ITM
VDRM
BVs
DIP4
1
2
7
6
−
10 mA
3V
100 mA 400 V
2500
Vrms
/
−
10 mA
3V
100 mA 400 V
2500
Vrms
/
−
10 mA
3V
100 mA 400 V
2500
Vrms
/
−
10 mA
IFT7
7 mA
3V
100 mA 400 V
2500
Vrms
/–
IFT5
5 mA
DIP8
Dual-channel version
of the TLP525G
2
3
9
DIP16
TLP525G-4
4-channel version
of the TLP525G
2
3
4
5
6
6
7
8
4
DIP6
TLP560G
General-purpose
Non-zero cross
1
IEC
4
16 15 14 13 12 11 10
1
Safety Standards (2)
TÜV
VDE
BSI
5
TLP525G-2
1
UL/c-UL
3
TLP525G
8
I FT (Max)
Rank
2
3
Note 2: BSI and IEC:
: Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
35
4
Selection Guide
Triac-Output Photocouplers for AC 100 to 120 V Lines (Continued)
Part Number
Pin Configuration
6
Features
I FT (Max)
Rank
4
VTM (Max)
@ITM
VDRM
BVs
3V
100 mA 400 V
2500
Vrms
/–
−
10 mA
IFT7
7 mA
IFT5
5 mA
−
10 mA
3V
100 mA 400 V
5000
Vrms
/
−
5 mA
3V
100 mA 400 V
5000
Vrms
/
−
10 mA
3V
100 mA 400 V
5000
Vrms
/
−
5 mA
3V
100 mA 400 V
5000
Vrms
/
DIP6
TLP561G
ZC
1
2
General-purpose
Zero cross
3
UL/c-UL
Safety Standards (2)
TÜV
VDE
BSI
IEC
Safety Standards (2)
TÜV
VDE
BSI
IEC
DIP6
TLP3022(S)
TLP3022F(S)
6
4
Direct replacement
for XXX3020/3021/3022
SEMKO-approved
Non-zero cross
DIP6
TLP3023(S)
TLP3023F(S)
1
2
3
Direct replacement
for XXX3023
SEMKO-approved
Non-zero cross
DIP6
TLP3042(S)
TLP3042F(S)
6
4
Direct replacement
for XXX3040/3041/3042
SEMKO-approved
Zero cross
ZC
DIP6
TLP3043(S)
TLP3043F(S)
1
2
3
Direct replacement
for XXX3043
SEMKO-approved
Zero cross
Triac-Output Photocouplers for AC 200 to 240 V Line
Part Number
Pin Configuration
6
Features
DIP6
General-purpose
Non-zero cross
2
6
VDRM
BVs
3V
100 mA 600 V
2500
Vrms
/–
3V
100 mA 600 V
2500
Vrms
/–
UL/c-UL
−
10 mA
IFT7
7 mA
−
10 mA
3
4
DIP6
TLP561J
ZC
1
VTM (Max)
@ITM
4
TLP560J
1
IFT (Max)
Rank
2
6
General-purpose
Zero cross
IFT7
7 mA
−
10 mA
3V
100 mA 600 V
4000
Vrms
/–
−
10 mA
3V
100 mA 600 V
4000
Vrms
/–
−
10 mA
3V
100 mA 600 V
5000
Vrms
/
3
4
DIP6
TLP762J
TLP762JF
Internal creepage: 4 mm (min)
SEMKO-approved
Non-zero cross-on
1
2
6
3
4
DIP6
TLP763J
TLP763JF
ZC
1
2
6
Internal creepage: 4 mm (min)
SEMKO-approved
Zero cross
3
4
DIP6
TLP3052(S)
TLP3052F(S)
High VDRM
SEMKO-approved
Non-zero cross-on
1
2
3
Note 2: BSI and IEC:
: Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
36
Triac-Output Photocouplers for AC 200 to 240 V Line (Continued)
Pin Configuration
Part Number
IFT (Max)
Rank
Features
VTM (Max)
@ITM
VDRM
BVs
UL/c-UL
Safety Standards (2)
TÜV
VDE
BSI
IEC
DIP6
TLP3062(S)
TLP3062F(S)
−
10 mA
3V
100 mA 600 V
5000
Vrms
/
−
5 mA
3V
100 mA 600 V
5000
Vrms
/
−
3 mA
3V
100 mA 600 V
5000
Vrms
/
−
10 mA
3V
100 mA 600 V
5000
Vrms
/
−
10 mA
3V
100 mA 800 V
5000
Vrms
/
DIP6
−
10 mA
3V
100 mA 800 V
5000
Vrms
/
High impulse noise immunity
VN = 1500 V (typ.)
Zero cross
−
5 mA
3V
100 mA 800 V
5000
Vrms
/
SEMKO-approved
High VDRM
Zero cross
DIP6
TLP3063(S)
TLP3063F(S)
SEMKO-approved
High VDRM
Zero cross
DIP6
TLP3064(S)
TLP3064F(S)
6
SEMKO-approved
Low trigger current
Zero cross
4
ZC
TLP3762(S)
TLP3762F(S)
2
1
DIP6
Zero cross
High impulse noise immunity
VN = 2000 V (typ.)
3
TLP3082(S)
TLP3082F(S)
DIP6
Zero cross
TLP3782(S)
TLP3782F(S)
TLP3783(S)
TLP3783F(S)
Note 2: BSI and IEC:
: Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
7 Thyristor-Output Photocouplers
Replacement Devices
Package
New Device
TLP148G
TLP548J
TLP549J
TLP748J
Features
VDRM
Isolation
voltage
MFSOP6
400 V
2500 Vrms
TLP148G
600 V
TLP548J
TLP748J
2500 Vrms
4000 Vrms
Part Number
DIP6
Pin Configuration
6
5
Features
DIP8
TLP549J
I FT
(Max)
VTM (Max)
@ITM
VDRM
BVs
10 mA
1.45 V 100 mA
400 V
2500
Vrms
/–
7 mA
1.45 V 100 mA
600 V
2500
Vrms
/–
7 mA
1.45 V 100 mA
600 V
2500
Vrms
/–
10 mA
1.45 V 100 mA
600 V
4000
Vrms
/–
Mini-flat
MFSOP6
6
5
Safety Standards (2)
VDE
BSI
TÜV
IEC
4
DIP6
TLP548J
Low trigger current
1
2
7
3
6
5
DIP8
Long
anode-cathode
distance (SCR)
TLP549J
2
3
5
4
4
TLP748J
TLP748JF
DIP6
SEMKO-approved
1
UL/cUL
3
1
6
TLP747G/J
The new and discontinued devices are not exactly identical in terms of
electrical characteristics. For device replacement, hardware evaluation
must be performed in the real-world environment.
4
TLP148G
1
Discontinued Devices
TLP141G
TLP541J
TLP545J
TLP542G
TLP543J
TLP641G/J TLP741G/J
2
3
Note 2: BSI and IEC:
: Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
37
4
Selection Guide
8 Photovoltaic-Output photocouplers
Package
Features
SSOP4
Short-Circuit
Current
Open
Voltage
1500 Vrms
TLP3904
5 μA
7V
12 μA
7V
20 μA
7V
24 μA
7V
4 μA
30 V
MFSOP6
DIP6
2500 Vrms
TLP3902
TLP190B
TLP590B
TLP191B*
TLP591B*
TLP3914
TLP3924
*Built-in shunt resistor
Part Number
Pin Configuration
6
Safety Standards (2)
UL/cUL TÜV VDE
BSI
Short-Circuit Current (Min) Open-Circuit Voltage (Min)
BVs
@IF
@IF
Rank
Features
IEC
4
TLP190B
1
3
6
4
TLP191B
3
1
6
Mini-flat
MFSOP6
—
12 μA
10 mA
7V
10 mA
2500
Vrms
/
Mini-flat
MFSOP6
Built-in shunt resistor
—
24 μA
20 mA
7V
20 mA
2500
Vrms
/
—
12 μA
10 mA
7V
10 mA
20 μA
2500
Vrms
/–
C20
—
24 μA
20 mA
7V
20 mA
2500
Vrms
/–
4
TLP590B
DIP6
2
1
3
6
4
DIP6
Built-in shunt resistor
TLP591B
2
1
6
—
5 μA
10 mA
7V
10 mA
2500
Vrms
/–
SSOP4
—
5 μA
10 mA
7V
10 mA
1500
Vrms
/–
SSOP4
—
20 μA
10 mA
7V
10 mA
1500
Vrms
/–
SSOP4
High open-circuit voltage
—
4 μA
10 mA
30 V
10 mA
1500
Vrms
/–
3
TLP3914
1
Mini-flat
MFSOP6
3
TLP3904
4
40 μA
4
TLP3902
1
C40
3
2
TLP3924
Note 2: BSI and IEC:
: Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
9 Products Manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. (TST)
Transistor-Output and Darlington-Transistor-Output Photocouplers
Part Number
Pin Configuration
6
4
Features
1
3
6
4
AC input
SEMKO-approved
1
3
80 V
3750
Vrms
80 V
3750
Vrms
UL
c-UL
Safety Standards (2)
TÜV
VDE
BSI
IEC
(1)
(1)
Mini-flat
MFSOP6
TLP181
BVs
@1 Minute
Mini-flat
MFSOP6
TLP180
VCEO
Transistor output
General-purpose
(1)
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales
representative.
38
Transistor-Output and Darlington-Transistor-Output Photocouplers (Continued)
Part Number
Pin Configuration
6
Features
BVs
@1 Minute
80 V
3750
Vrms
(1)
(1)
80 V
3750
Vrms
(1)
(1)
80 V
2500
Vrms
(1)
(1)
80 V
2500
Vrms
80 V
3750
Vrms
(1)
(1)
80 V
3750
Vrms
(1)
(1)
55 V
5000
Vrms
—
55 V
5000
Vrms
SO6 (reinforced insulation)
AC input
1
3
6
4
SO6 (reinforced insulation)
TLP185*
1
3
4
3
—
300 V
5000
Vrms
—
300 V
5000
Vrms
—
80 V
2500
Vrms
(2)
80 V
2500
Vrms
(2)
SOP4
TLP280
Lead pitch = 1.27 mm
AC input
1
2
4
3
1
2
Lead pitch = 1.27 mm
General-purpose
SEMKO-approved
4
3
SOP4 (reinforced insulation)
Lead pitch = 1.27 mm
Creepage/clearance ≥ 5 mm
Isolation thickness ≥ 0.4 mm
AC input
TLP284
1
2
4
3
Lead pitch = 1.27 mm
Creepage/clearance ≥ 5 mm
Isolation thickness ≥ 0.4 mm
SEMKO-approved
1
2
4
3
Transistor output
AC input
SEMKO-approved
1
2
7
6
5
2
3
4
3
Dual-channel version of
the TLP620
SEMKO-approved
4
DIP4
Darlington transistor output
High VCEO
SEMKO-approved
TLP627
1
2
7
6
5
DIP8
Dual-channel version of
the TLP627
SEMKO-approved
TLP627-2
2
3
4
16 15 14 13 12 11 10
9
TLP290-4*
1 2 3 4 5 6 7
16 15 14 13 12 11 10
8
9
SO16
4-channel version
Lead pitch = 1.27 mm
AC input
SO16
TLP291-4*
4-channel version
Lead pitch = 1.27 mm
2
3
4
5
(1)
DIP8
TLP620-2
1
IEC
DIP4
TLP620
1
BSI
SOP4 (reinforced insulation)
TLP285
8
c-UL
SOP4
TLP281
1
UL
4
TLP184*
8
Safety Standards (2)
TÜV
VDE
VCEO
6
7
8
Photocouplers for IGBT/MOSFET Gate Drive
Part Number
Pin Configuration
6
5
Features
Propagation
Delay Time
(Max)
Safety Standards (2)
I FHL
(Max)
BVs
Peak output
current (max): 7.5 mA
±0.6 A
3750
Vrms
Output
UL/cUL TÜV
VDE
BSI
IEC
4
SO6 (reinforced Insulation)
Topr = 100°C (max)
Direct drive of a
small-power
IGBT/MOSFET
TLP155E
1
0.2 μs
/
3
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales
representative.
39
4
Selection Guide
Triac-Output Photocouplers
Tingger LED Current,
IFT
Part Number
Pin Configuration
4
Features
Rank
Max
–
10 mA
IFT7
7 mA
–
10 mA
IFT7
7 mA
DIP4
Non-zero cross
1
2
4
3
DIP4
Zero cross
DIP4
Zero cross
High impulse noise
immunity
VN = 2000 V (typ.)
2
1
6
TP560G
–
10 mA
–
IFT7
IFT5
–
IFT7
–
IFT7
IFT5
–
IFT7
10 mA
7 mA
5 mA
10 mA
7 mA
10 mA
7 mA
5 mA
10 mA
7 mA
DIP6
SEMKO-approved
–
10 mA
Non-zero cross
–
5 mA
–
10 mA
4
DIP6
General-purpose
Non-zero cross
TP560J
1
2
6
TP561G
3
4
DIP6
ZC
TP561J
1
2
TLP3023 (S)
TLP3023F (S)
TLP3052 (S)
TLP3052F (S)
1
4
2
General-purpose
Zero cross
3
TLP3022 (S)
TLP3022F (S)
6
High VDRM
SEMKO-approved
Non-zero cross
10 mA
TLP3043 (S)
Zero cross
–
5 mA
DIP6
SEMKO-approved
–
10 mA
High VDRM
Zero cross
–
5 mA
DIP6
SEMKO-approved
–
3 mA
–
10 mA
DIP6
–
10 mA
High impulse noise
immunity
VN = 1500 V (typ.)
–
5 mA
6
4
ZC
TLP3064 (S)
TLP3782 (S)
TLP3782F (S)
TLP3783 (S)
TLP3783F (S)
c-UL TÜV VDE
BSI
IEC
2
600 V
3.0 V
100 mA
3.0 V
100 mA
600 V
400 V
600 V
3
100 mA
600 V
5000
Vrms
100 mA
600 V
400 V
600 V
3.0 V
5000
Vrms
100 mA
Zero cross
DIP6
Zero cross
2500
Vrms
400 V
3.0 V
DIP6
3
–
TLP3082 (S)
100 mA
3.0 V
DIP6
SEMKO-approved
1
3.0 V
UL
400 V
TLP3042 (S)
TLP3062 (S)
TLP3062F (S)
TLP3063 (S)
TLP3063F (S)
@ITM
Safety Standards(2)
5000
Vrms
ZC
TLP363J
TLP363JF
Max
Off-State
Output
BVs
Terminal @1 Minute
Voltage
VDRM
3
TLP360J
TLP360JF
TLP361J
TLP361JF
Peak On-State
Voltage, VTM
600 V
600 V
Note 2: BSI and IEC:
: Approved (supplementary or basic insulation)
: Approved (reinforced insulation)
: Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
: Design which meets safety standard/approval pending as of January 2011
TÜV and VDE: : Approved
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales
representative.
40
5
Part Naming Conventions
1. Transistor-Output, Darlington-Transistor-Output and IC-Output Photocouplers
TLP
F (
–
–
, F)
,
RoHS COMPATIBLE *
Part number
Revision code
The revision code may be added to identify a
revision of a device. For details, contact your
nearest Toshiba sales representative.
Wide-spaced leads
Specify this option, if necessary.
Lead form option for DIP packages
Select one of the lead form options shown on page 40.
Carrier tape option
Select one of the carrier tape options shown on pages 51.
Safety standard option
Specify either “D4” or “V4” for
EN60747-5-2-approved devices.
Example 2: TLP781F(GR,F)
Example 1: TLP781(D4-GB-TP6,F
[D4] = EN60747-5-2 option
[F] = Wide-spaced leads
[GB] = CTR rank
[GR] = CTR rank
[TP6] = LF6 lead form
[,F] = RoHS COMPATIBLE*
Tape-and-reel packing
[,F] = RoHS COMPATIBLE*
The right parenthesis is omitted due to the limit to the number of characters.
CTR rank
See respective datasheets.
2. Triac-Output and Thyristor-Output Photocouplers
TLP
F (
–
–
,
, F)
Part number
RoHS COMPATIBLE*
VDRM
G: 400 V
J: 600 V
L: 800 V
Revision code
Lead form option for DIP packages
Carrier tape option
Wide-spaced leads
Example 3: TLP361J(D4-IFT7-TP1,S,F)
Safety standard option
TLP361J(D4T7TP1S,F)
IFT rank
No character: No IFT rank specified
IFTx: For example, IFT5 denotes the 5-mA rank.
The available IFT ranks differ from product to product.
See datasheets.
(Abbreviated due to the limit to
the number of characters.)
[J] = VDRM: 600 V
[D4] = EN60747-5-2 option
[IFT7] = [T7] = IFT = 7 mA
[TP1] = LF1 lead form
Tape-and-reel packing
[,S] = [S] = Revision code: S
[,F] = RoHS COMPATIBLE*
3. Photorelays
TLP
F (
–
,
Part number
VOFF
A: 60 V
D: 200 V
G: 350 V
GA: 400 V
J: 600 V
Some photorelays do not have
a VOFF code in their names.
See respective datasheets.
Wide-spaced leads
Safety standard option
, F)
RoHS COMPATIBLE*
Revision code
Lead form option for DIP packages
Carrier tape option
Example 5: TLP3110(TP,F)
Example 4: TLP227A(TP1,F)
[A] = VOFF: 60 V
[TP] = Tape-and-reel packing
[TP1] = LF1 lead form
[,F] = RoHS COMPATIBLE*
Tape-and-reel packing
[,F] = RoHS COMPATIBLE*
*: “F” identifies the indication of product Labels with “[[G]]/RoHS COMPATIBLE”.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
Note: The length of part names is limited to 18 characters. Longer names are abbreviated by omitting the “-“ character and/or using shorthand symbols. However, be sure to give
full part names when you have any inquiries. For details, please contact your nearest Toshiba sales representative.
41
6
Package Information
1 Lead Form Options for DIP Packages
The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The
electrical characteristics are identical, regardless of these options.
Lead Form
Surface-Mount
Wide-Spaced
Appearance
Lead Form Code
(LF1)
(LF4)
(LF5)
(LF2)
Carrier Tape Code
(TP1)
(TP4)
(TP5)
Not available*
4-pin DIP
4 3
8-pin DIP
8
5
10.16
A
1
2
1
6-pin DIP
6 5 4
4
B
16-pin DIP
16
9
C
Package Outlines
1
2
3
1
10 to 12
8
Dimensions
Unit: mm
Version
(LF1)
(LF4)
(LF5)
Min
Max
Min
Max
Min
Max
A
–
10.0
–
12.0
–
10.0
B
(0.35 typ.)
–
0.2
6.4
–
Dimension
C
6.4
–
(0.25 typ.)
8.0
–
All other package dimensions are the same as for each standard package
specification.
* Tape-and-reel packing is not available with (LF2).
Example 1: Standard part: TLP620(F)
Surface-mount option: TLP620(LF1,F): Packed in stick magazines (see page 49).
Surface-mount and tape-and-reel options: TLP620(TP1,F): Packed in tape-and-reel (see page 51).
■ Standard part names should be used when applying for safety standard approval.
■ The package dimensions and lead form options of the TLP781, TLP785 differ from those shown above.
See the TLP781, TLP785 datasheet.
42
2 Package Dimensions (4-Pin DIP)
Standard
DIP4
DIP4 (LF1) / (TP1)
3
Unit: mm
Unit: mm
4
3
1
2
7.62 ± 0.25
4.58 ± 0.25
1.2 ± 0.15
2.5 min
7.85 to 8.80
2.54 ± 0.25
DIP4 (LF2)
1
2
4
3
1
2
4.58 ± 0.25
+0.1
0.5 ± 0.15
0.25 -0.05
2.5 min
0.5 ± 0.1
2.54 ± 0.25
2.54 ± 0.25
10 to 12
DIP4 (LF5) / (TP5)
3
1
2
Unit: mm
+0.25
3.85 -0.20
7.62 ± 0.25
0.5 ± 0.1
2.54 ± 0.25
1.2 ± 0.15
1.0 min
10.0 max
0.2 max
+0.1
0.25 -0.05
3.65 -0.25
4.58 ± 0.25
+0.15
6.4 ± 0.25
4
7.62 ± 0.25
3.65 +0.15
-0.25
1.2 ± 0.15
Unit: mm
6.4 ± 0.25
+0.15
3.65 -0.25
10.16 ± 0.25
7.62 ± 0.25
0.25 min
4.58 ± 0.25
+0.25
DIP4 (LF4) / (TP4)
Unit: mm
3.9 +0.25
-0.20
3
6.4 ± 0.25
4
1.0 min
10.0 max
43
1.2 ± 0.15
0.75 ± 0.25
12.0 max
+0.1
0.5 ± 0.1
2.54 ± 0.25
+0.1
0.25 -0.05
0.25 -0.05
1.2 ± 0.15
7.62 ± 0.25
4.0 -0.20
0.8 ± 0.25
4.58 ± 0.25
3.65 +0.15
-0.25
2
3.65 +0.15
-0.25
1
6.4 ± 0.25
6.4 ± 0.25
4
6
Package Information
2 Package Dimensions (6-Pin DIP)
Standard
DIP6
5
Unit: mm
4
Unit: mm
6
5
4
1
2
3
1.2 ± 0.15
2.54 ± 0.25
10.0 max
DIP6 (LF4) / (TP4)
4
Unit: mm
Unit: mm
6
5
4
1
2
3
1.2 ± 0.15
2.54 ± 0.25
+0.1
0.5 ± 0.1
0.25 -0.05
2.5 min
0.5 ± 0.1
2.54 ± 0.25
10 to 12
DIP6 (LF5) / (TP5)
Unit: mm
5
4
1
2
3
1.2 ± 0.15
1.0 min
10.0 max
+0.25
3.85 -0.20
+0.1
0.25 -0.05
7.62 ± 0.25
0.2 max
0.5 ± 0.1
2.54 ± 0.25
3.65 -0.25
7.12 ± 0.25
+0.15
6.4 ± 0.25
6
44
1.2 ± 0.15
+0.1
0.75 ± 0.25
12.0 max
+0.25
7.62 ± 0.25
3.9 -0.20
+0.15
7.12 ± 0.25
0.25 -0.05
0.25 min
7.12 ± 0.25
10.16 ± 0.25
7.62 ± 0.25
3.65 -0.25
3
+0.15
2
3.65 -0.25
1
6.4 ± 0.25
6.4 ± 0.25
5
1.0 min
1.2 ± 0.15
2.54 ± 0.25
7.85 to 8.80
DIP6 (LF2)
6
+0.25
+0.1
0.25 -0.05
2.5 min
0.5 ± 0.1
7.62 ± 0.25
4.0 -0.20
7.12 ± 0.25
3.65 -0.25
7.62 ± 0.25
0.8 ± 0.25
7.12 ± 0.25
+0.15
3
+0.15
2
3.65 -0.25
1
6.4 ± 0.25
6.4 ± 0.25
6
DIP6 (LF1) / (TP1)
2 Package Dimensions (8-Pin DIP)
Standard
DIP8 (LF1) / (TP1)
DIP8
6
Unit: mm
5
Unit: mm
8
7
6
5
1
2
3
4
6.4 ± 0.25
2.5 min 0.8 ± 0.25
1.2 ± 0.15
0.5 ± 0.1
2.54 ± 0.25
+0.1
0.25 -0.05
1.0 min
2.54 ± 0.25
7.85 to 8.80
1.2 ± 0.15
DIP8 (LF2)
DIP8 (LF4) / (TP4)
5
Unit: mm
Unit: mm
8
7
6
5
1
2
3
4
6.4 ± 0.25
4
2.5 min 0.25 min
3.65
9.66 ± 0.25
10.16 ± 0.25
7.62 ± 0.25
0.5 ± 0.1
2.54 ± 0.25
1.2 ± 0.15
9.66 ± 0.25
0.75 ± 0.25
+0.1
0.25 -0.05
1.2 ± 0.15
10 to 12
2.54 ± 0.25
DIP8 (LF5) / (TP5)
Unit: mm
7
6
5
1
2
3
4
2.54 ± 0.25
1.2 ± 0.15
10.0 max
3.85 +0.25
-0.20
+0.1
1.0 min
0.2 max
7.62 ± 0.25
0.25 -0.05
3.65 -0.25
9.66 ± 0.25
+0.15
6.4 ± 0.25
8
7.62 ± 0.25
45
12.0 max
+0.25
3
3.9 -0.20
2
+0.15
-0.25
1
+0.1
6
10.0 max
+0.15
-0.25
7
6.4 ± 0.25
8
7.62 ± 0.25
3.65
9.66 ± 0.25
4.0 +0.25
-0.20
7.62 ± 0.25
3.65
9.66 ± 0.25
+0.15
-0.25
4
3
3.65
2
+0.15
-0.25
1
0.25 -0.05
7
6.4 ± 0.25
8
6
Package Information
2 Package Dimensions (Other DIP Packages)
5-pin DIP6
5-pin DIP6 (LF2)
1
3
Unit: mm
1
2
1.2 ± 0.15
2.54 ± 0.25
6.4 ± 0.25
7.85 to 8.80
0.5 ± 0.1
2.54 ± 0.25
1.2 ± 0.15
5-pin DIP (with Pin 5 Cut)
10 to 12
DIP16
Unit: mm
1
16 15 14 13 12 11 10
9
1
8
Unit: mm
6.4 ± 0.25
2
+0.1
0.25 -0.05
2.54 ± 0.25
6
7
+0.15
5
3.65 -0.25
4
19.82 ± 0.25
2.5 min 0.8 ± 0.25
3.65 -0.25
1.2 ± 0.15
3
+0.1
0.25 -0.05
2.5 min
0.5 ± 0.1
2
7.62 ± 0.25
0.8 ± 0.25
4
6
7.12 ± 0.25
+0.15
6.4 ± 0.25
3
10.16 ± 0.25
7.62 ± 0.25
+0.15
+0.1
0.25 -0.05
2.5 min
0.5 ± 0.1
4
6
7.12 ± 0.25
0.25 min
0.8 ± 0.25
7.62 ± 0.25
3.65 -0.25
3.65 -0.25
+0.15
4
6
7.12 ± 0.25
Unit: mm
2.5 min
2
6.4 ± 0.25
3
0.5 ± 0.1
7.85 to 8.80
1.2 ± 0.15
2.54 ± 0.25
7.62 ± 0.25
+0.1
0.25 -0.05
7.85 to 8.80
2 Package Dimensions (Surface Mount)
SO6
SO8
4
8
7
6
5
2
3
4
1
1
3
+ 0.25
3.7 − 0.15
5.1 ± 0.2
6.0 ± 0.2
2.5 ± 0.2
0.15
0.1 2.1 ± 0.1
7.0 ± 0.4
0.4
Unit: mm
3.95 ± 0.25
Unit: mm
0.5 min
1.27 ± 0.15
1.27
2.54
0.38
46
0.1 ± 0.1
5
4.55 + 0.25
− 0.15
6
0.305 min
2 Package Dimensions (Surface Mount) (Continued)
SDIP6
SDIP6 (F type)
4.58 ± 0.25
6.8 ± 0.2
2
3
1.25 ± 0.2
11.7 ± 0.3
3
5
4
Unit: mm
4.4 ± 0.25
1
5-pin MFSOP6
6
Unit: mm
4.4 ± 0.25
4
1
3
3.6 ± 0.2
0.15
0.1 2.5 ± 0.2
7.0 ± 0.4
0.1 2.5 ± 0.2
7.0 ± 0.4
3.6 ± 0.2
0.4 ± 0.1
0.4 ± 0.1
0.5 min
2.54 ± 0.25
4-pin MFSOP6 (with Pin 5 Cut)
4
3
1
2
4.4 ± 0.25
3.6 ± 0.2
7.0 ± 0.4
2.1 max
2.6 ± 0.25
0.15
0.1 2.5 ± 0.2
0.4 ± 0.1
Unit: mm
0.5 min
0.4 ± 0.1
1.27 ± 0.2
1.27 ± 0.2
2.54 ± 0.25
47
7.0 ± 0.4
1.9
6
Unit: mm
0.1 ± 0.1
4
SOP4
4.4 ± 0.25
1
0.5 min
1.27 ± 0.2
2.54 ± 0.25
3
0.75 ± 0.25
0.4 ± 0.1
4-pin MFSOP6
6
7.62 ± 0.2
1.27 ± 0.2
9.7 ± 0.3
0.4 ± 0.1
+0.15
-0.25
1
3.65
+0.10
0.25 -0.05
1.27 ± 0.2
4.0 +0.25
-0.20
+0.15
-0.25
3.65
7.62 ± 0.25
3.9 +0.25
-0.20
3
0.15
2
Unit: mm
0.15
1
4.58 ± 0.25
6 5 4
Unit: mm
+0.10
4
0.25 -0.05
5
6.8 ± 0.2
6
0.6 ± 0.3
6
Package Information
2 Package Dimensions (Surface Mount) (Continued)
2.54SOP4
2.54SOP6
Unit: mm
3
1
2
Unit: mm
6
5
4
1
2
3
6.3 ± 0.25
7.0 ± 0.4
7.0 ± 0.4
0.4 ± 0.1
2.54 ± 0.25
0.6 ± 0.3
0.6 ± 0.3
0.1 ± 0.1
0.1 ± 0.1
0.15
0.15
3.9 ± 0.25
2.1 max
2.1 max
4.4 ± 0.25
4.4 ± 0.25
4
2.54 ± 0.25
0.4 ± 0.1
2.54SOP8
SOP16
Unit: mm
5
1
2
3
4
Unit: mm
16 15 14 13 12 11 10 9
4.4 ± 0.25
7.0 ± 0.4
0.4 ± 0.1
4
6
7
8
7.0 ± 0.4
0.4 ± 0.1
1.27 ± 0.2
SSOP4
Unit: mm
Unit: mm
3.25
φ1.4
1
4
2
3
φ1.2
3
2
4
1
2.05
1.8
0.15
1.65
3.65
0.4
0.3
1.27
2.04
0.6 ± 0.3
USOP4
4.2
1.9
5
2.1 max
0.6 ± 0.3
0.1 ± 0.1
2.54 ± 0.25
3
10.3 ± 0.25
0.15
9.4 ± 0.25
2
1.9
2.1 max
1
0.15
6
0.1 ± 0.1
7
4.4 ± 0.25
8
0.2
3.8
0.2
0.2
0.2
1.27
2.2
0.46 ± 0.2
Unless Otherwise Specified, Tolerance ±0.1 mm
4
0.35
1
3
2
Unless Otherwise Specified, Tolerance ±0.2 mm
48
3 Rank Marking
Transistor-output photocouplers are ranked according to their CTR ranges, whereas thyristor-output and triac-output photocouplers
are ranked according to their maximum IFT value. The following gives the rank classifications and rank marks printed on packages.
Note that the rank classifications differ from product to product. For details, please refer to the relevant technical datasheets.
1. CTR Rank Name and Rank Marking
Available CTR Rank Selection ( ●: Available, ▲: Contact Toshiba)
Part Number
Rank Name
None
GB
Y
GR
BL
YH
GRL
GRH
BLL
Rank Marking
Group
TLP180
TLP181
TLP280
TLP280-4
TLP281
TLP281-4
TLP531/532
TLP620
TLP620-2
TLP620-4
TLP630
TLP631/632
TLP731/732
TLP733F/734F
1
2
1
3
1
3
1
1
3
3
1
2
2
2
✽ Part Marking when No CTR Rank Is Specified
Rank
Name
None
CTR
50 to 600%
CTR Rank
Other than
TLP421
TLP421
✽See the
right-side
tables
Blank,Y,Y+,YE,
G,G+,GR,B,B+,
BL,GB
Part Number
None
TLP180
Blank,
TLP280
GR,
BL,
GB
TLP620-4
Y
50 to 150%
YE
YE
100 to 300%
GR
GR
TLP630
GB
100 to 600%
GB
GB
TLP181
BL
200 to 600%
BL
BL
TLP281
GRL
100 to 200%
G
G
TLP531
Y■,
GRH
150 to 300%
G■
G+
TLP621
YE,
TLP731
TLP732
TLP733F
TLP734F
49
TLP281-4
1
TLP620-2
GR
TLP632
Part Number
Blank,
Y,
G,
G■,
GR,
B,
B ■,
BL,
GB
None
Rank
Marking
Group
Blank,
GB
3
TLP280-4
YE,
TLP531/532
TLP631
Rank
Marking
Group
2
6
Package Information
2. LED Trigger Current (IFT) Ranking and Marking
Rank Name
I FT
None
I FT max
I FT7
7 mA max
T7, T5
I FT5
5 mA max
T5
I FT2
2 mA max
T2 (only for photorelays)
IFT Rank Marking
Blank, T7, T5
3. Marking Examples
(a) 4-pin mini-flat 1-channel type
or
Lot No.
Example: TLP626: P626
Part number minus "TL"
CTR or IFT rank marking
P
TLP620: P620
TLP181: P181
P620
TLP620
Pin No. 1
(b) TLP421, TLP421F
Pin No. 1
Lot No. (Monthly code)
P421F
Part number (P421 or P421F)
Lot No.
CTR rank marking
(c) TLP280, TLP281
Pin No. 1
CTR rank marking
P280
Part number (P280 or P281)
Lot No.
(d) Others
or
Lot No.
TLP
Examples: TLP620: TLP620
Part number
TLP666GF: TLP666GF
TLP620
TLP620
CTR or IFT rank marking
Pin No. 1
Note: When ordering a standard photocoupler, add a CTR or IFT rank in parentheses to the standard part number.
Examples: TLP181(GB) TLP532(GR)
Use the standard part number when applying for safety standard approval.
Example
Part number
TLP181(GB)
Use this part number
TLP181
50
7
Packing Information
1 Photocoupler Magazine Packing Specifications
Standard DIP
DIPs with LF1, LF2, LF4 and LF5 Lead Forming
Unit: mm
Unit: mm
9.5
4.4
Magazine
Dimensions
2.7
10.3
9.3
4.5
4.3
1.4
6.7
5.5
5.5
10.3
14
11.3
Length = 525
Thickness = 0.5
Device
Quantities
per Magazine
Length = 525
Thickness = 0.5
Package Pin Count
4
6
8
12
16
Quantity (pcs)
100
50
50
25
25
Y
B
Y
B
X
Packing
Dimensions
X
C
C
A
A
Number of
Magazines
Dimensions
(A x B x C)
Label
Position
Number of
Magazines
Dimensions
(A x B x C)
Label
Position
4
50 x 12 x 531
Y
4
60 x 13 x 531
Y
20
67 x 51 x 559
Y
40
135 x 58 x 568
X
60
123 x 76 x 568
X
51
Packing Information
Mini-Flat Coupler (MFP)
Unit: mm
Unit: mm
MFSOP6
(0.8)
4.2
2.8
1.8
6.2
1.3
6.2
3.4
1.7
6.2
Magazine
Dimensions
10.5
4.4
3.4
10.5
4.9
3.4
10.5
4.8
Unit: mm
SO8
6.2
SO6
3.4
Unit: mm
SOP Photocoupler
1.6
7
4.7
4.7
Length = 555
Thickness = 0.5
4.3
Length = 555
Thickness = 0.5
5.2
10.5
Length = 555
Thickness = 0.5
Length = 555
Thickness = 0.5
Package
Pin Count
Device
Quantities
per Magazine
Package
Pin Count
Quantity (pcs)
5
(SO6)
125
Package
Pin Count
4
(MFSOP6)
Quantity (pcs)
Package
Pin Count
150
Quantity (pcs)
8
(SO8)
100
4
(SOP4)
16
(SOP16)
150
50
Quantity
(pcs)
4
Package
6
8
Pin Count (2.54SOP4) (2.54SOP6) (2.54SOP8)
Quantity
(pcs)
100
Y
B
75
50
Y
B
X
X
C
C
A
A
Packing
Dimensions
Package
SO6
MFSOP6
SO8
Number of
Magazines
Dimensions
(A x B x C)
Label
Position
Number of
Magazines
Dimensions
(A x B x C)
Label
Position
40
70 x 55 x 585
X
4
29 x 13 x 563
4
29 x 13 x 563
Y
Y
24
77 x 31 x 586
Y
40
67 x 55 x 586
X
24
77 x 31 x 586
Y
40
67 x 55 x 586
X
24
75 x 29 x 579
X
Photocoupler Package Type
Typical Devices
MFSOP6
TLP160J, TLP180, TLP190B
SO6
TLP104, TLP109, TLP116A
SO8
TLP2105, TLP2108, TLP2116, TLP2118E, TLP2405, TLP2408
SOP4
TLP280, TLP281
SOP16
TLP280-4, TLP281-4, TLP270D, TLP270G
2.54SOP4
TLP176G, TLP176A
2.54SOP6
TLP197G
2.54SOP8
TLP206G, TLP206A
52
2 Tape-and-Reel Specifications
The tape specifications differ for photocouplers manufactured in Thailand.
1. Embossed Tape Specifications for Surface-Mount Lead Form Options
Photocoupler Package Types
Tape Option Symbol
MFSOP6, SO6
(TPL) or (TPR)
SO8
(TP)
TLP2105, TLP2108, TLP2405, TLP2408
Typical Devices
TLP165J, TLP181, TLP190B
SOP4
(TP)
TLP280, TLP281
SOP16
(TP)
TLP280-4, TLP281-4
2.54SOP4
(TP)
TLP176G, TLP176A, TLP176D
2.54SOP6
(TP)
TLP197G
2.54SOP8
(TP)
TLP200D,TLP206A,TLP206G
SSOP4
(TP15)
SDIP6
(TP)
DIP(LF1, LF5)
(TP1) or (TP5)
DIP(LF4)
(TP4)
TLP3212 to 3217, TLP3230 to TLP3250
TLP701, TLP705, TLP719
TLP550, TLP560G
TLP560G
2. Tape Dimensions
Unit: mm
2.0 ± 0.1
F
G
KO
C
B
D
J
E
t
A
K
Unit: mm
Photocoupler
Package Type
Tape Option
MFSOP6
(TPL), (TPR) (TPL), (TPR)
4.2 ± 0.1
A
4.0 ± 0.1
7.6 ± 0.1
B
SO8
SOP4
(TP)
(TP)
SOP16 2.54SOP4 2.54SOP6 2.54SOP8 SSOP4
(TP)
(TP)
6.5 ± 0.1 3.1 ± 0.1 7.5 ± 0.1
4.3 ± 0.1
5.6 ± 0.1 7.5 ± 0.1 10.5 ± 0.1
7.5 ± 0.1
(TP)
(TP)
7.5 ± 0.1
6.7 ± 0.1
10.5 ± 0.1
(TP15)
SDIP6
DIP(LF1, LF5) DIP(LF4)
(TP)
(TP)
(TP1), (TP5)
(TP4)
10.4 ± 0.1
12.3 ± 0.1
✽1
✽1
12.0 ± 0.1
16.0 ± 0.1
2.35 ± 0.2 10.4 ± 0.1 12.3 ± 0.1
4.5 ± 0.1
5.1 ± 0.1
C
12.0 ± 0.3
16.0 ± 0.3 12.0 ± 0.3
16.0 ± 0.3
12.0 ± 0.3
16.0 ± 0.3
D
5.5 ± 0.1
7.5 ± 0.1
7.5 ± 0.1
5.5 ± 0.1
7.5 ± 0.1
E
F
G
Dimensions
Symbol (See figure above)
SO6
SDIP6
F type
5.5 ± 0.1
1.75 ± 0.1
8.0 ± 0.1
12.0 ± 0.1
8.0 ± 0.1
12.0 ± 0.1
4.0 ± 0.1 12.0 ± 0.1 16.0 ± 0.1
4.0 ± 0.1
+ 0.1
1.5 – 0
J
K
3.15 ± 0.2
2.9 ± 0.2
3.4 ± 0.2 2.5 ± 0.2 2.4 ± 0.2
K0
2.8 ± 0.1
2.6 ± 0.1
3.1 ± 0.1 2.3 ± 0.1 2.2 ± 0.1
2.6 ± 0.2
2.5 ± 0.2
2.4 ± 0.2
2.4 ± 0.2
2.4 ± 0.1
2.3 ± 0.1
2.2 ± 0.1
2.1 ± 0.1
0.3 ± 0.05
t
4.55 ± 0.2
4.1 ± 0.1
0.4 ± 0.05
✽1: Typical devices
DIP4
DIP6 (short package)
DIP8
TLP620
5.1 ± 0.1
TLP631, TLP734, TLP747G
7.6 ± 0.1
TLP555, TLP2601
10.1 ± 0.1 (TP4) is not available
53
7
Packing Information
3. Reel Dimensions
W1
W2
C
C
B
A
E
B
A
U
E
W1
W2
ø380 mm
ø330 mm
ø180 mm
Unit: mm
MFSOP, SO6
SO8
SOP4
Tape Option
(TPL), (TPR)
(TP)
(TP)
A
ø380 ± 2
SOP16 2.54SOP4 2.54SOP6 2.54SOP8 SSOP4
(TP)
(TP)
SDIP6
(TP15)
(TP)
SDIP6 F type DIP(LF1, LF5) DIP(LF4)
(TP)
(TP1), (TP5)
ø330 ± 2
+0
180 – 4
B
ø80 ± 1
ø60
ø80 ± 1
C
ø13 ± 0.5
ø13
ø13 ± 0.5
2.0 ± 0.5
2 ± 0.5
2.0 ± 0.5
E
Dimensions
Symbol (See figure above)
Photocoupler
Package Type
4.0 ± 0.5
4.0 ± 0.5
W1
13.5 ± 0.5
17.5 ± 0.5 13.5 ± 0.5
17.5 ± 0.5
13 ± 0.3
17.5 ± 0.5
W2
17.5 ± 1.0
21.5 ± 1.0 17.5 ± 1.0
21.5 ± 1.0
15.4 ± 1.0
21.5 ± 1.0
U
4.0 ± 0.5
ø380 ± 2
Photocouplers Manufactured in Thailand
MFSOP
DIP6(LF1,LF5,LF4)
DIP4(LF1,LF5,LF4)
DIP8(LF1,LF5)
Tape Option
(TPL), (TPR)
(TP1), (TP5), (TP4)
(TP1), (TP5), (TP4)
(TP1), (TP5)
A
ø380 ± 2
ø330 ± 2
B
ø80 ± 1
C
ø13 ± 0.5
E
U
Dimensions
Symbol (See figure above)
Photocoupler
Package Type
2.0 ± 0.5
4.0 ± 0.5
W1
13.5 ± 0.5
17.5 ± 0.5
W2
17.5 ± 1.0
21.5 ± 1.0
54
(TP4)
4. Other Packing Information
a) Device orientation on tape
Photocouplers are oriented in cavity, as shown below.
User direction of feed
A)
B)
Photocoupler Package Type
Tape Option
MFSOP6, SO6
TPR
Photocoupler Package Type
Tape Option
A)
MFSOP6, SO6
TPL
SOP4, 2.54SOP4
TP
SSOP4
TP15
Photocoupler Package Type
Tape Option
SOP16, SO8
TP
2.54SOP6/8
TP
SDIP6
TP
DIP(LF1, LF5)
DIP(LF4)
TP1, TP5
C)
B)
C)
TP4
b) Tape Specifications
■ Quantities Per Reel
Photocoupler Package Type
MFSOP6, SO6 SOP4, SO8
Quantity (pcs)
3000
2500
SOP16
2.54SOP4/6/8
SSOP4
SDIP6
2500
2500
1500
1500
SDIP6 F type DIP(LF1, LF5) DIP(LF4)
1000
1500
1000
Photocouplers Manufactured in Thailand
Photocoupler Package Type
MFSOP
DIP4/6(LF1,LF5)
DIP4/6(LF4)
DIP8(LF1,LF5)
Quantity (pcs)
3000
1500
1000
1000
■ Empty Cavities
Item
Specification
Note
Consecutive empty cavities
Zero
Non-consecutive empty cavities
0.2% max/reel ✽2
Any 40-mm portion of tape except leader and trailer.
Except leader and trailer.
✽2: 6 pcs max/reel for DIP and SDIP packages
c) Packing boxes
e) Purchase order
One or five reels per box
Two or five reels per box for photocouplers manufactured
in Thailand
Specify the part number, tape and quantity as follows.
Example
TLP181(GB-TPR, F ) 3000 units
*1
Quantity
d) Label
RoHS COMPATIBLF
The reel label includes the following information:
1. Part number 2. Tape type 3. Quantity 4. Lot number
*2
Tape option
CTR rank
Photocoupler part number
*1: Must be a multiple of the quantity per-reel.
*2: “F” identifies the indication of product Labels with “[[G]]/RoHS COMPATIBLE”.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
55
8
Board Assembly
1 Example Land Patterns
Below are the example land patterns for surface-mount packages.
Mini-flat and SOP couplers
Unit: mm
1.2
0.8
1.2
0.8
0.8
6.3
1.27
3.73
1.27
6.3
1.27
6.3
1.2
0.8
0.95
SSOP4 [e.g., TLP3213]
2.54
2.54
MFSOP6 (5-Pin) [e.g., TLP114A]
SOP4 [e.g., TLP280]
0.8
1.2
0.8
1.2
MFSOP6 (4-Pin) [e.g., TLP181]
2.54SOP4 [e.g., TLP197G]
SO6 (4-Pin) [e.g., TLP265J]
1.27
1.27
5.5
6.3
1.27
1.27
1.27
1.27
2.54
SO8 [e.g., TLP2105]
SO6 (5-Pin) [e.g., TLP109]
Surface-Mount Lead-Formed Photocouplers
Example: 6-pin DIP package
Example: 6-pin SDIP package
Unit: mm
1.5
0.8
2.54
0.8
1.6
1.7
10.4
8.8
10.4
8.7
1.6
1.6
1.5
Unit: mm
2.54
2.54
(LF1)&(LF5) [e.g., TLP734(LF1)]
1.27 1.27
2.54
1.27 1.27
(LF4) [e.g., TLP734(LF4)]
SDIP6 [e.g., TLP719]
For the example land patterns for the TLP781, see its datasheet.
56
SDIP6 (F type) [e.g., TLP719F]
2 Board Assembly Considerations
1. Soldering
2. Flux Cleaning
●When cleaning circuit boards to remove flux, make sure that
no residual reactive ions such as sodium(Na+) or chloride(Cl–)
ions remain. Note that organic solvents react with water to
generate hydrogen chloride and other corrosive gases, which
can degrade device performance.
●Washing devices with water will not cause any problems.
However, make sure that no reactive ions such as
sodium(Na+) or chloride(Cl–) ions are left as residue. Also, be
sure to dry devices sufficiently after washing.
●Do not rub device markings with a brush or with your hand
during cleaning or while the devices are still wet from the
cleaning agent. Doing so can rub off the markings.
●Dip cleaning, shower cleaning and steam cleaning processes
all involve the chemical action of a solvent. Use only
recommended solvents for these cleaning methods. When
immersing devices in a solvent or steam bath, make sure
that the temperature of the liquid is 50°C or below and that
the circuit board is removed from the bath within one minute.
●If a device package allows ultrasonic cleaning, keep the
duration of ultrasonic cleaning as short as possible, since
long hours of ultrasonic cleaning degrade the adhesion
between the mold resin and the frame material.
When using a soldering iron or medium infrared ray/hot air reflow,
avoid a rise in device temperature as much as possible by
observing the following conditions.
1.1) Using a soldering iron
a. Solder once within 10 seconds for a lead temperature of
up to 260°C.
b. Solder once within 3 seconds for a lead temperature of up
to 350°C.
1.2) Using medium infrared ray/hot air reflow
a. Complete the infrared ray/hot air reflow process at once
within 30 seconds at a package surface temperature
between 210°C and 240°C.
b. Example of temperature profile of lead (Pb) solder
Package surface
temperature
(°C)
240
210
150
60 to 90 seconds
30 seconds or less
■ The following ultrasonic cleaning conditions
are recommended.
Time
Frequency: 27 kHz to 29 kHz
Ultrasonic output power: 300 W or less (0.25 W/cm2 or less)
Cleaning time: 30 seconds or less
Example of temperature profile of lead (Pb) solder
c. Example of temperature profile of lead (Pb)-free solder
The profile below shows only the typical temperature profile
and conditions, which might not apply to all Toshiba
photocouplers. Temperature profiles and conditions may
differ from product to product. Refer to the relevant technical
datasheets and databooks when mounting a device.
Suspend the circuit board in the solvent bath during ultrasonic
cleaning in such a way that the ultrasonic vibrator does not come
into direct contact with the circuit board or the device.
Conventional cleaning solvents that contain freon are not
recommended due to its adverse effection the earth’s ozone layer.
Alternative freon-free products are available on the market. Some
of these alternative cleaning agents are listed in the table below.
Contact Toshiba or a Toshiba distributor regarding cleaning
conditions and other relevant information for each product type.
Package surface
temperature
(°C)
260
230
Examples of Alternative Cleaning Agents
190
Technocare
FRW-1, FRW-17,
FRV-100
GE Toshiba Silicon
Asahi Clean
AK-225AES
Asahi Glass Co., Ltd
Clean Through
750H
Kao Co., Ltd.
Pine Alpha
ST-100S,
ST-100SX
Arakawa Chemical Co., Ltd.
180
60 to 120 seconds
30 to 50 seconds
Time
Example of temperature profile of lead (Pb)-free solder
d. Precautions for heating
Keeping packages at high temperature for a long period of
time can degrade the quality and reliability of devices.
Soldering time has to be kept as short as possible to
avoid a rise in package temperature.
When using a halogen lamp or infrared heater, avoid
direct irradiation of packages, since this may cause a rise
in package temperature.
1.3) Dip soldering (flow soldering)
The thermal shock of dip soldering increases thermal stress
on devices. To avoid stress, the use of a soldering iron or
medium infrared ray/hot air reflow is recommended. If you
want to use dip soldering, contact your nearest Toshiba
sales representative.
57
9
Device Degradation
1 Projected Operating Life Based on LED Light Output Degradation
Toshiba photocouplers use one of four types of LEDs and a projection of the operating life has been made for each LED. The table on
page 57 shows the types of LED used in photocouplers and the figures on pages 58 to 60 show projections of long-term light output
performance and operating life. Note that these operating life data are estimates extrapolated from long-term light output degradation
over a single wafer lot and are shown as reference only.
Projected Operating Life
Ta = 40°C, IF = 20 mA, failure criteria:
degradation rate Δ PO < –50%
Photocouplers
F50% operating life
F0.1% operating life
1,300,000 h
260,000 h
2 GaA As(SH) LED
540,000 h
100,000 h
3 GaA As(DH) LED
1,000,000 h
200,000 h
4 GaA As(MQW) LED
Ask your local Toshiba sales representative.
1 GaAs LED
Mainly for phototransistor output devices
and phototriac output devices
Mainly for photo-IC couplers
Mainly for photorelays (MOSFET output),
photovoltaic couplers and photo-IC couplers
Mainly for photo-IC couplers
F50% (cumulative failure rate 50%) operating life: Time period until the projected long-term light output degradation curve of
the average light output change ( X ) shown on pages 58 to 60 reaches the
failure criteria.
F0.1% (cumulative failure rate 0.1%) operating life: Time period until the projected long-term light output degradation curve of
X - 3σ shown on pages 58 to 60 reaches the failure criteria.
The relationship between LED light output degradation and optical coupling characteristics is shown below.
(1) The relationship between LED light output degradation
and current transfer ratio (CTR)/short circuit current (ISC) is 1:1.
CTR (t)
CTR (o)
=
Po (t)
Po (o)
(2) The relationship between a reciprocal value of LED light output degradation
and I FT/I FLH/I FHL/I FH change is 1:1.
I FT (t)
I FT (o)
=
58
(
Po (t)
Po (o)
)
-1
LEDs Used in Photocouplers
LED: 1 GaAs LED
2
GaA As (SH) LED
3
4
Photocouplers
LED
GaA As (MQW) LED
Photocouplers
LED
4N25 (SHORT)
1
TLP160 Series
1
TLP363 Series
1
TLP599 Series
1
TLP2630
2
4N25A (SHORT)
1
TLP161 Series
1
TLP371
1
TLP620 Series
1
TLP2631
2
4N26 (SHORT)
1
TLP163
1
TLP372
1
TLP621 Series
1
TLP3022(S) Series
1
4N27 (SHORT)
1
TLP165J
1
TLP373
1
TLP624 Series
1
TLP3042(S) Series
1
4N28 (SHORT)
1
TLP166J
1
TLP421 Series
1
TLP626 Series
1
TLP3063(S) Series
3
4N29 (SHORT)
1
TLP168J
3
TLP504A
1
TLP627 Series
1
TLP31xx Series
1
4N29A (SHORT)
1
TLP172 Series
1
TLP512
2
TLP628 Series
1
TLP32xx Series
1
4N30 (SHORT)
1
TLP174G
1
TLP513
2
TLP629 Series
1
TLP3230
1
4N31 (SHORT)
1
TLP176 Series
1
TLP521-1
1
TLP630
1
TLP3231
1
4N32 (SHORT)
1
TLP180
1
TLP521-2
1
TLP631
1
TLP3240
3
4N32A (SHORT)
1
TLP181
1
TLP521-4
1
TLP632
1
TLP3241
3
4N33 (SHORT)
1
TLP190B
3
TLP523 Series
1
TLP641 Series
1
TLP3250
3
4N35 (SHORT)
1
TLP191B
3
TLP525G Series
1
TLP651
2
TLP3762(S) Series
1
4N36 (SHORT)
1
TLP192 Series
1
TLP531
1
TLP700
3
TLP3904
1
4N37 (SHORT)
1
TLP197 Series
1
TLP532
1
TLP701
2
TLP3914
3
4N38 (SHORT)
1
TLP200D
1
TLP541G
1
TLP702
2
TLP3924
3
4N38A (SHORT)
1
TLP202 Series
1
TLP542G
1
TLP705
2
TLP4xxx Series
1
6N135
2
TLP206 Series
1
TLP543J
1
TLP706
2
TLP104
4
6N136
2
TLP222 Series
1
TLP545J
1
TLP716
2
TLP118
4
6N137
2
TLP224G Series
1
TLP550
2
TLP719
2
TLP151
4
6N138
2
TLP225A
1
TLP551
2
TLP731
1
TLP350H
4
6N139
2
TLP227 Series
1
TLP552
2
TLP732
1
TLP351H
4
TLP102
2
TLP250 Series
2
TLP553
2
TLP733 Series
1
TLP700H
4
TLP106
2
TLP251 Series
2
TLP554
2
TLP734 Series
1
TLP701H
4
TLP112
2
TLP260J
1
TLP555
2
TLP741 Series
1
TLP708
4
TLP112A
3
TLP270 Series
1
TLP557
2
TLP747 Series
1
TLP714
4
TLP113
2
TLP280 Series
1
TLP558
2
TLP750 Series
2
TLP754
4
TLP114A
3
TLP281 Series
1
TLP559
2
TLP751 Series
2
TLP2168
4
TLP115
2
TLP283 Series
1
TLP560 Series
1
TLP759 Series
2
TLP2368
4
TLP115A
3
TLP296G
1
TLP561 Series
1
TLP762J Series
1
TLP2404
4
TLP116
3
TLP320 Series
1
TLP570
1
TLP763J Series
1
TLP2409
4
TLP117
3
TLP330
1
TLP571
1
TLP797 Series
1
TLP2418
4
TLP124
1
TLP331
1
TLP572
1
TLP798GA
3
TLP2451
4
TLP126
1
TLP332
1
TLP590B
3
TLP2066
3
TLP2468
4
TLP127
1
TLP350
2
TLP591B
3
TLP2200
2
TLP2768
4
TLP130
1
TLP351
2
TLP592 Series
1
TLP2530
2
TLP131
1
TLP351A
2
TLP594 Series
1
TLP2531
2
TLP137
1
TLP360 Series
1
TLP597 Series
1
TLP2601
2
TLP361 Series
1
TLP598 Series
3
TLP260J
1
TLP141G
1
Photocouplers
LED
GaA As (DH) LED
59
Photocouplers
LED
Photocouplers
LED
9
1
GaAs LED Projected Light Output Degradation Data
Light output (PO) relative change (%)
Device Degradation
140
Test conditions: I F = 20 mA, Ta = 40°C
Light output (PO) relative change (%)
Test conditions: I F = 50 mA, Ta = 40°C
120
100
X
80
60
40
X-3σ
20
0
10
1
100
1000
10000
100000
140
120
X
100
80
X-3σ
60
40
20
0
10
1
100
Test time (h)
1000
10000
100000
Test time (h)
Light output (PO) relative change (%)
Test conditions: I F = 10 mA, Ta = 40°C
140
120
X
100
80
X-3σ
60
40
20
0
10
1
100
1000
10000
100000
Test time (h)
1
GaAs LED Projected Operating Life Data
Failure criteria light output degradation Δ PO < –50%
Failure criteria light output degradation Δ PO < –30%
IF = 10 mA
10000000
10000000
IF = 10 mA
1000000
100000
IF = 10 mA
IF = 30 mA
IF = 40 mA
IF = 50 mA
IF = 20 mA
IF = 30 mA
IF = 40 mA
IF = 50 mA
Projected operating life (h)
Projected operating life (h)
IF = 20 mA
10000
Projected F50%
operating life
1000
IF = 20 mA
1000000
IF = 10 mA
100000
10000
IF = 30 mA
IF = 40 mA
IF = 50 mA
IF = 20 mA
IF = 30 mA
IF = 40 mA
IF = 50 mA
Projected F50%
operating life
1000
Projected F0.1%
operating life
Projected F0.1%
operating life
100
2.0
227
3.0
150
100 85
60
4.0
25
0
100
2.0
5.0
1 / K (x10-3)
–30
–50
–73
227
Ambient Temperature (°C)
3.0
150
100 85
60
4.0
25
0
5.0
1 / K (x10-3)
–30
–50
–73
Ambient Temperature (°C)
The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as
reference only. Operating conditions exceeding the maximum ratings are not guaranteed.
60
2
GaA As (SH) LED Projected Light Output Degradation Data
Test conditions: I F = 20 mA, Ta = 40°C
Light output (PO) relative change (%)
Light output (PO) relative change (%)
Test conditions: I F = 50 mA, Ta = 40°C
140
120
100
80
X
60
40
X-3σ
20
0
10
1
100
1000
10000
140
120
80
60
X-3σ
40
20
0
100000
X
100
10
1
100
Test time (h)
1000
10000
100000
Test time (h)
Light output (PO) relative change (%)
Test conditions: I F = 10 mA, Ta = 40°C
140
120
X
100
80
X-3σ
60
40
20
0
10
1
100
1000
10000
100000
Test time (h)
2
GaA As (SH) LED Projected Operating Life Data
Failure criteria light output degradation Δ PO < –30%
Failure criteria light output degradation Δ PO < –50%
10000000
10000000
IF = 10 mA
IF = 10 mA
IF = 10 mA
100000
10000
Projected operating life (h)
Projected operating life (h)
IF = 20 mA
1000000
IF = 30 mA
IF = 40 mA
IF = 50 mA
IF = 20 mA
IF = 30 mA
IF = 40 mA
IF = 50 mA
Projected F50%
operating life
1000
1000000
IF = 20 mA
IF = 10 mA
IF = 30 mA
IF = 40 mA
IF = 50 mA
100000
10000
IF = 20 mA
IF = 30 mA
IF = 40 mA
IF = 50 mA
Projected F50%
operating life
1000
Projected F0.1%
operating life
Projected F0.1%
operating life
100
2.0
227
3.0
150
100 85
60
4.0
25
0
100
2.0
5.0
1 / K (x10-3)
–30
–50
–73
227
Ambient Temperature (°C)
3.0
150
100 85
60
4.0
25
0
5.0
1 / K (x10-3)
–30
–50
–73
Ambient Temperature (°C)
The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are
shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed.
61
9
Device Degradation
GaA As (DH) LED Projected Light Output Degradation Data
3
Test conditions: I F = 20 mA, Ta = 40°C
Light output (PO) relative change (%)
Light output (PO) relative change (%)
Test conditions: I F = 50 mA, Ta = 40°C
140
120
100
X
80
60
40
X-3σ
20
0
10
1
100
1000
10000
140
120
X
100
80
X-3σ
60
40
20
0
100000
10
1
100
Test time (h)
1000
10000
100000
Test time (h)
Light output (PO) relative change (%)
Test conditions: I F = 10 mA, Ta = 40°C
140
120
X
100
80
X-3σ
60
40
20
0
1
10
100
1000
10000
100000
Test time (h)
GaA As (DH) LED Projected Operating Life Data
3
Failure criteria light output degradation Δ PO < –30%
Failure criteria light output degradation Δ PO < –50%
IF = 10 mA
10000000
10000000
IF = 10 mA
IF = 20 mA
100000
IF = 10 mA
IF = 20 mA
IF = 30 mA
IF = 40 mA
IF = 50 mA
10000
Projected F50%
operating life
1000
IF = 20 mA
1000000
IF = 30 mA
IF = 40 mA
IF = 50 mA
Projected operating life (h)
Projected operating life (h)
1000000
IF = 30 mA
IF = 40 mA
IF = 50 mA
IF = 10 mA
100000
10000
IF = 20 mA
IF = 30 mA
IF = 40 mA
IF = 50 mA
Projected F50%
operating life
1000
Projected F0.1%
operating life
100
2.0
227
3.0
150
100 85
60
4.0
25
0
Projected F0.1%
operating life
100
2.0
5.0
1 / K(×10−3)
–30
–50
–73
227
Ambient Temperature (°C)
3.0
150
100 85
60
4.0
25
0
5.0
1 / K(×10−3)
–30
–50
–73
Ambient Temperature (°C)
The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are
shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed.
62
4
GaA As (MQW) LED Projected Light Output Degradation and Operating Life Data
Toshiba is now preparing the light output degradation and operating life data for GaA As LEDs.
These data are available for individual LEDs. Ask your local Toshiba sales representative.
Note
63
9
Device Degradation
Reading the Projected LED Operating Life Graph
For example, let's calculate the operating life of the GaAs LED, based on the data shown on page 60.
Here is an example of how to read an operating life, assuming that the ambient temperature (Ta) is 40°C and that the failure
criterion is a 30% decrease in light output.
Suppose that the initial LED current, IF, is 20 mA. Since the horizontal axis of the failure criteria graph is the reciprocal of absolute
temperature, it is necessary to convert the ambient temperature (Ta) to the reciprocal of absolute temperature (T):
T=
1
1
=
Ta + 273.15
40 + 273.15
3.19 × 10−3
The graph shows the projected lifetimes for F50% and F0.1% cumulative failure probabilities in solid and dashed lines respectively.
Normally, it is recommended to use F0.1% lines.
As X = 3.19, its intersection with the IF = 20 mA line for F0.1% is approximately 80,000 hours. (This figure is for reference only.)
Failure criteria for light output degradation Δ PO < –30%
10000000
IF = 10mA
IF = 20mA
Projected operating life (h)
1000000
IF = 30mA
IF = 10mA
IF = 40mA
100000
80000
IF = 20mA
IF = 30mA
IF = 50mA
IF = 40mA
IF = 50mA
10000
Projected F50%
operating life
1000
Projected F0.1%
operating life
100
2.0
227
3.0 3.19
150
100 85
60 40
4.0
25
0
5.0
1/K(×10–3)
−20
−50
−73
Ambient Temperature (°C)
You can also estimate the projected operating life from the projected light output degradation data.
Light output (PO) relative change (%)
Test conditions: I F = 20 mA, Ta = 40°C
140
120
X
100
–30%
80
70
60
X-3σ
40
20
0
1
10
100
1000
Test time (h)
64
10000
100000
80000
10
Safety Standard Approvals
Toshiba offers a wide selection of photocouplers with a transistor output, IC output, thyristor output and triac output, as well as photorelays certified to UL (USA), cUL (Canada), VDE (Germany), BSI (Britain) and SEMKO (Sweden).
Safety Standard Approvals for Photocouplers (DIN EN60747-5-2)
Reflective Photocouplers in
Single-Molded Packages
Mechanical Construction
Coupling Medium
(Window)
Transmissive Photocouplers in Single-Molded Packages
Package
(Body)
Coupling Medium
(Window)
Photo Detector Chip
Package
(Body)
Internal
Construction
Lead
Lead
LED Chip
Package
Isolation Creepage
Path (mm)
Construction Isolation Clearance
(mm)
Mechanical
Ratings
Isolation Thickness
(min)
(mm)
Internal Creepage
Path (mm)
Max.
VDE/TÜV Working Insulation
DIN
Voltage (Viorm)
EN
Highest Allowable
Overvoltage
60747-5-2
(Viotm)
Photo Detector Chip
SOP4/SOP16
LED Chip
MFSOP6
(2 ch)
2.54SOP
4/6/8
DIP
(F type)
Certified
Devices
Triac/Thyrsitor
Output
DIP
4.0
5.0
4.0
4.0
4.2
4.0
6.4/7.0
8.0
4.0
5.0
4.0
4.0
4.2
4.0
6.4/7.0
8.0
0.4
0.4
0.4
–
–
–
(0.4)
(0.4)
–
–
–
–
–
–
–
–
565 Vpk
707 Vpk
565 Vpk
565 Vpk
565 Vpk
565 Vpk
630 Vpk
/890 Vpk
1140 Vpk
4000 Vpk
6000 Vpk
6000 Vpk
4000 Vpk
4000 Vpk
2500 Vpk
4000 Vpk
6000 Vpk
TLP350
TLP351
TLP2105
TLP2108
TLP2166A
TLP2116
TLP2117
IC Output
Transistor Output
SO8
MFSOP6
TLP280
TLP280-4
TLP281
TLP281-4
TLP284
TLP284-4
TLP285
TLP285-4
TLP180
TLP181
TLP127
TLP260J
TLP261J
TLP160G
TLP160J
TLP161G
TLP161J
TLP560G
TLP560J
TLP561G
TLP561J
TLP176A
TLP176D
TLP176G
TLP197G
TLP206G
Photorelay
TLP350F
TLP351F
TLP227G
TLP227G-2
TLP597G
The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest
information, please contact your nearest Toshiba sales representative.
65
10
Safety Standard Approvals
Safety Standard Approvals for Photocouplers (DIN EN60747-5-2) (Continued)
Transmissive Photocouplers with an Insulating Film in
Single-Molded Packages
Mechanical Construction
Coupling Medium
(Window)
Photo Detector Chip
Internal
Construction
LED Chip
Package
Isolation Creepage
Path (mm)
Construction Isolation Clearance
(mm)
Mechanical
Ratings Isolation Thickness
(min)
(mm)
Internal Creepage
Path (mm)
VDE/TÜV
DIN
EN
60747-5-2
Max.
Working Insulation
Voltage (Viorm)
Highest Allowable
Overvoltage
(Viotm)
SO8
Transmissive Photocouplers in
Double-Molded Packages
Package
(Body)
Package
(Body)
Lead
Lead
Film
SDIP6
LED Chip
DIP
SDIP6
(F type)
DIP
(F type)
MFSOP6
SO6
DIP
(F type)
4.2
7.0
8.0
6.4/7.0
8.0
4.0
5.0
6.5/7.0
8.0
4.2
7.0
8.0
6.4/7.0
8.0
4.0
5.0
6.5/7.0
8.0
0.4
0.4
0.4
0.4/0.5
0.4/0.5
–
0.4
0.4/0.5
0.4/0.5
–
–
–
–
–
–
–
4.0
4.0
565 Vpk
890 Vpk
1140 Vpk
890 Vpk
1140 Vpk
565 Vpk
707 Vpk
890 Vpk
/1130 Vpk
890 Vpk
/1130 Vpk
6000 Vpk
8000 Vpk
8000 Vpk
6000 Vpk
/8000 Vpk
6000 Vpk
/8000 Vpk
4000 Vpk
/6000 Vpk
6000 Vpk
6000 Vpk
/8000 Vpk
6000 Vpk
/8000 Vpk
TLP701
TLP705
TLP715
TLP716
TLP718
TLP719
TLP701F
TLP705F
TLP715F
TLP716F
TLP718F
TLP719F
TLP350HF
TLP351HF
TLP750F
TLP751F
TLP759F
Transistor
Output
TLP620
TLP620-2
TLP620-4
TLP627
TLP627-2
TLP627-4
TLP731
TLP732
TLP620F
TLP620F-2
TLP621F
TLP621F-2
Triac/Thyrsitor
Output
TLP360J
TLP361J
TLP363J
TLP3022(S)
TLP3023(S)
TLP3042(S)
TLP3043(S)
TLP3052(S)
TLP3062(S)
TLP3063(S)
TLP3064(S)
TLP3082(S)
TLP3762(S)
TLP3782(S)
TLP3783(S)
TLP360JF TLP165J
TLP361JF TLP166J
TLP363JF
TLP3022F(S)
TLP3023F(S)
TLP3042F(S)
TLP3043F(S)
TLP3052F(S)
TLP3062F(S)
TLP3063F(S)
TLP3064F(S)
TLP3082F(S)
TLP3762F(S)
TLP3782F(S)
TLP3783F(S)
Certified
Devices
DIP
(1 ch)
TLP350H
TLP351H
TLP750
TLP751
TLP759
IC Output
Coupling Medium
(Window)
Photo Detector Chip
TLP2403
TLP2405
TLP2408
TLP2409
TLP105
TLP108
TLP114A
TLP116
TLP117
TLP2066
TLP109
TLP116A
TLP104
TLP151
TLP265J
TLP266J
TLP733
TLP734
TLP781
TLP733F
TLP734F
TLP781F
TLP762J
TLP763J
TLP748J
TLP762JF
TLP763JF
TLP748JF
The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest
information, please contact your nearest Toshiba sales representative.
66
11
Photocoupler Application Circuit Examples
1 Digital Interface Applications
High Speed
TLP118, TLP2601
VCC
5V
VCC
VCC
5V
7.5 mA
0.1 μF
The TLP2601 allows high-speed data
transmission at up to approximately 5 MHz.
Data rate of left-side circuit
1 kΩ
390 Ω
f (typ.): 5 Mbit/s (duty cycle ≅ 1/2)
LSTTL
LSTTL
Low Input Current Drive
TLP553
VCC
5V
VCC
5V
0.5 mA
4.7 kΩ
The high-CTR (current transfer ratio) TLP553
allows operation with low input current (0.5 mA)
and direct driving with a CMOS signal.
510 kΩ
Data rate of left-side circuit
6.8 kΩ
15 kΩ
0.1 μF
LSTTL
f (typ.): 50 kbit/s (duty cycle ≅ 1/2)
CMOS
No Pull-up Resistor Required
TLP2200
VCC
5V
VCC
VCC
5V
2 kΩ
When the TLP2200 with a 3-state output is used,
the next-stage logic gate can be actuated
without using a pull-up resistor.
1.6 mA
Data rate of left-side circuit
LSTTL
120 pF
f (typ.): 1 Mbit/s (duty cycle ≅ 1/2)
LSTTL
High VCC Tolerance
By using the TLP558 which tolerates VCC up to
20 V, CMOS logic gates and other components
can be driven without design restrictions on VCC.
TLP558
VCC
VCC
VCC
5V
3 mA
RL
1.1 kΩ
Data rate of left-side circuit
0.1 μF
CMOS
f (typ.): 1 Mbit/s (duty cycle ≅ 1/2)
LSTTL
VCC = 5 V
RL = 3 kΩ
VCC = 20 V RL = 12 kΩ
67
11
Photocoupler Application Circuit Examples
2 Inverter and AC-DC Servo Applications
[Photo-IC couplers: high-speed base/gate drive applications]
TLP109 / TLP2409
TLP550 / TLP559
TLP759
GTR Direct Drive
TLP557
IGBT /
Power MOS Direct Drive
(for medium-power IGBTs): TLP350/ TLP358/ TLP700
High-Speed
TLP118 / TLP554
(for small-power IGBTs): TLP351 / TLP701 / TLP705
AC Servo
Inverter (PWM)
DC Servo
(Numerical control, Robotics)
M
M
Base/Gate Drive Circuit
Base/Gate Drive Circuit
Driving the Base of a 15-A-Class GTR (Giant Transistor) Module
TLP557
VCC 8 mA
5V
390 Ω
VCC
Rex 4.3 Ω
The TLP557 drives the base of a GTR directly.
An external resistor, Rex, is connected between
6V
pins 6 and 7. This resistor causes the base current
to become constant and stabilizes the GTR drive.
LSTTL
47 μF
Driving the Base of a 100-A-Class GTR Module
TLP557
VCC 8 mA
5V
390 Ω
VCC
Rex 4.3 Ω
2Ω
8V
The TLP557 photo-IC coupler and two booster
transistors can drive a high-power GTR.
150 Ω
LSTTL
100 μF
Driving the Gate of a 15-A-Class IGBT (Insulated Gate Bipolar Transistor) Module
TLP351 / TLP2541
8 mA
5V
390 Ω
1
2
3
4
The TLP151, TLP351, TLP701, TLP705 and
8
TLP2541 high-speed photo-IC photocouplers can
VCC
7
0.1 μF
drive a low-power IGBT directly.
6
5
VEE
LSTTL
68
Driving the Gate of a 50-A-Class IGBT Module
The TLP350 and TLP700 can drive a medium-power
TLP350
8 mA
5V
390 Ω
IGBT directly.
8
1
2
VCC
0.1 μF
7
3
6
5
4
VEE
LSTTL
Driving the Gate of a 400-A-Class IGBT Module
The TLP351, TLP701, TLP705or TLP2541
TLP351/ TLP2541
8 mA
5V
390 Ω
high-speed photo-IC photocoupler and two booster
8
1
2
0.1 μF
transistors can drive a high power IGBT.
VCC
7
3
6
5
4
VEE
LSTTL
Driving the Gate of an IGBT Module Using an IGM Photocoupler
TLP109 (IGM)
TLP559 (IGM)
TLP759 (IGM)
IGM photocouplers are suitable for driving an
intelligent power module (IPM). These
photocouplers guarantee symmetrical low-to-high
20 kΩ
and high-to-low propagation delays (l tPLH - tPHL l)
and provides a high common mode transient
+15 V
immunity.
0.1 μF
10 mA
–10 V
IGM Selection
Part Number
TLP109 (IGM)
Package
SO6
BVs
(Vrms)
VO/VCC
CTR
20 V / 30 V
max
25% min
75% max
@IF = 10 mA
VCC = 4.5 V
VO = 0.4 V
3750
TLP559 (IGM)
DIP8
2500
TLP759 (IGM)
DIP8
5000
69
tPLH – tPHL
0.7 μs max
@IF = 10 mA
RL = 20 kΩ
CMH
CML
10000 V / μs min
@IF = 0 mA
RL = 20 kΩ
VCM = 1500 Vp-p
– 10000 V / μs min
@IF = 10 mA
RL = 20 kΩ
VCM = 1500 Vp-p
11
Photocoupler Application Circuit Examples
3 Home Appliance Applications
Electric Oven/Grills
Magnetron
Thermo-Switch
Door-Open
Monitor Switch
H.V. Transformer
Magnetron Tube
Blower Motor
Turntable Motor
Grill Heater
OvenCavity
Lamp
TLP560G
H
TLP560J
M
120 Vac
50/60 Hz
Door-Detector Circuit
Weight Sensor
TLP560G
Microcontroller
Gas Sensor
Control Panel
Refrigerator Block Diagram
Photocouplers
used for control applications
Interior Fan
TLP560G + main triac
Interior Lamp
TLP560G + main triac
Defroster Heater
(for Freezer Compartment)
TLP560G + main triac
Damper Motor
(for refrigerator/
freezer compartment)
TLP560G + main triac
Defroster Heater
(for refrigerator/
freezer compartment)
TLP560G + main triac
Panel Input
Microcontroller
Door Switch
Temperature Sensor
Compressor
70
(TLP560G)
Automatic Washing Machines
PC1
RT
Operating Panel (Key Input)
Th1
TLP560G
M
IF
Operation Modes (Manual/automatic)
Water Flow Speed
PC2
RT
Spinning Period
Number of Rinsing
TLP560G
IF
PC3
RT
Drain Valve
Microcontroller
Th2
Th3
TLP560G
IF
TLP560J
IF
Washing Period
Operation Detection
Water Supply
Valve
AC-Input Photocoupler
TLP620 (GB)
Microcontroller
Power
Supply
Circuit Configuration
100 Vac
Fan Heaters
(1)Block Diagram
Burner Overheat Prevention Switch
Temperature Limit Switch
TLP561G
Electric Heater
(1 kW)
Panel
ZC
Main Switch
IF1
TLP561J
Adjustment Switches
VT1
Burner Motor
(60 W)
M
ZC
Display
Room
Temperature
Sensor
Microcontroller
Speaker
IM1
IF2
TLP561J
Fan Motor
(30 W)
VT2
M
ZC
IM2
TLP781
Electromagnetic
Fuel Pump
Drive
Circuit
Preheat
Sensor
P
TLP373
Earthquake
Sensor
Ignition
IG
71
100 Vac
11
Photocoupler Application Circuit Examples
4 Home Appliance Applications (Continued)
(2)Waveform Examples
1. Example of Operating Waveform for Burner Motor
2. Example of Operating Waveform for Fan Motor
Trigger Point
Trigger Point
waveforms
Top:
Medium:
Bottom:
Horizontal:
IF1
VT1
IM1
time
20 mA/div
100 V/div
1 A/div
50 ms/div
waveforms
Top:
Medium:
Bottom:
Horizontal:
IF2
VT2
IM2
time
20 mA/div
100 V/div
0.5 A/div
50 ms/div
Inverter Air Conditioners
Temperature Fuse
100 Vac
Remote Control
Panel
Fan Motor for
Room Unit
Microcontroller
for Indoor
Unit
Control Panel
TLP560G
Room Temperature
Sensor
Temperature Sensor
M
Motor for Air-Flow
Direction Control
TLP781
TLP548J
M
Indoor Unit
Outdoor Unit
TLP781
TLP548J
Filter
ZC
Fan Motor for
Outdoor Unit
M
Microcontroller
for Outdoor
Unit
TLP560G
Two-Way Valve /
Four-Way Valve
Rectifier
IGBT Module
IGBT Gate
Drive Circuit
VCC
VO
Compressor
Motor
TLP351 x 6
72
5 Programmable Controller Applications
DC Output for Sequencers
TLP127 /TLP627
TLP127 /TLP627
IF = 2 mA
IF = 10 mA
+100 V
Load
+100 V
Load
TLP225A /TLP222A
IF = 10 mA
+48 V
Load
AC Input for Sequencers
VCC
TLP280-4
O1
1
O2
2
Limit Switches
Thermostats
● Transducer
●
●
●
●
DC-AC
Inputs
O3
3
Logic
Processor
Logic
Outputs
O4
4
COMMON
GND
120-/240-Vac Output for Sequencers and Solid State Relays (SSRs)
TLP160G /TLP525G
120 VAC
Motor
Transformer
● Lamp
●
Logic
Processor
●
TLP166J /TLP561J
Logic
Inputs
ZC
73
240 VAC
AC
Outputs
11
Photocoupler Application Circuit Examples
6 SSR and Power Control Circuit Applications
Zero-Crossing Phototriac Output: TLP561G/TLP561J and Mini-Flat TLP161G/TLP166J
TLP161G/ TLP561G/ TLP3042(S)
TLP166J / TLP561J / TLP3062(S) / TLP3082(S) / TLP3782(S)
VCC
AC Load
RF
RS
CS
ZC
G: 120 Vac
J: 240 Vac
TNR
RG
Lamp Load (1-A tungsten lamp)
Waveforms
Top:
IF
20 mA/div
Medium:
VT
100 V/div
Bottom:
IT
5 A/div
L load (2.5-A pure inductive load)
Recommended
conditions
IF
= 20 mA
RG = 47 Ω
RS = 47 Ω, CS = 0.033 μF
Non-Zero Crossing Phototriac Output: TLP560G/TLP560J and Mini-Flat TLP160G/TLP260J
TLP160G / TLP560G / TLP3022(S)
TLP260J / TLP560J / TLP3052(S)
RT
AC Load
VCC
RF
G : 100 Ω
J : 200 Ω
RS
CS
G: 120 Vac
J: 240 Vac
TNR
RG
Lamp Load (1-A tungsten lamp)
L load (2.5-A pure inductive load)
IF
Top:
Waveforms
IF
20 mA/div
Medium: VT
100 V/div
Bottom:
5 A/div
IT
Recommended
conditions
= 20 mA
RT = 100 Ω/200 Ω
RG = 47 Ω
RS = 47 Ω, CS = 0.033 μF
74
7 Switching Power Supply Circuit Application
+
Regulated
Voltage
Filter
−
+
TLP181
TLP285
TLP781
−
Switching
Error Amplification Feedback
Control Circuit
(IC)
+
−
TLP148G
TLP548J
TLP549J
TLP748J
Overvoltage Protection
■ Transistor Output ( : Approved, as of January 2010)
CTR (IC / IF) Rank (%)
Safety Standard Approvals
Part Number
TLP181/TLP285
TLP781
TLP750 (high-speed)
Package
Type
MFSOP6/SOP4
DIP4
DIP8
Isolation
Voltage
UL
BSI
EN60747
1577
7002(EN60950)
(Note 1)
(Note 2)
3750 Vrms
5000 Vrms
Nordic
SEMKO
*
5000 Vrms
Min
Max
50
100
600
600
(GR) Rank
50
100
150
300
(BL) Rank
200
600
(GRL) Rank
100
200
(GRH) Rank
(O) Rank
150
19
300
–
10
–
No Rank
(GB) Rank
(Y) Rank
No Rank
■ Thyristor Output ( : Approved, as of January 2010)
Safety Standard Approvals
Part Number
TLP148G
TLP548J
TLP748J
Package
Type
MFSOP6
DIP6
Isolation
Voltage
UL
EN60747
1577
(Note 1)
2500 Vrms
4000 Vrms
I FT (mA)
VDRM (V)
10
400
7
600
600
10
Note 1: EN60747-approved with option (D4)
Note 2: The EN60747-5-2 safety standard for compact packages is different from those for standard DIP packages. Since the mini-flat package is a compact package,
please contact your nearest Toshiba sales representative for more details.
*: Double protection
75
11
Photocoupler Application Circuit Examples
8 Push-Button Telephone Application
A variety of photocouplers are used to isolate between telephone lines (L1 and L2) and a CPU.
Line Detector
Ring Detector
Dial Pulsing
Line Switch
TLP222G-2
L1
L2
TLP627
TLP629
TLP320
TLP180
TLP620
Dial
Circuit
+V
Line
Control
Circuit
+V
Push-Button
Telephone
CPU
Main Unit
Part Number
Application
Package Type
Features
DC Input
Ring
Detector
Dial
Pulsing
Line
Detector
Line
Switch
AC Input
TLP620
General single transistor output in
compact packages
Good cost performance
DIP4
TLP781
MFSOP6 SOP4
TLP181
DIP4
TLP627
MFSOP6
TLP127
High-VCEO (300 V) Darlington transistor
output in compact packages
Suitable to generate a pulse dial signal
DIP4
TLP628
High-VCEO (350 V) single transistor output
DIP4
TLP629
DIP4
TLP222G*
TLP227G*
DIP6
TLP592G*
TLP597G*
DIP8 (Dual)
TLP222G-2*
TLP227G-2*
2.54SOP4
TLP170G*
TLP176D**
2.54SOP6
TLP192G*
TLP197G*
2.54SOP8 (Dual)
TLP200D**
TLP202G*
TLP281
TLP285
TLP180 TLP280
TLP320
High LED current rating = 150 mA
Directly connectable to telephone lines
MOSFET-output photorelay
with VOFF = 400 V
Crosspoint relay replacement
TLP176G*
(*: VOFF = 350 V, **: VOFF = 200 V)
TLP206G*
76
9 Photovoltaic Coupler Applications
TLP190B
TLP590B
This is the simplest power MOSFET drive circuit.
The resistor RSH for discharging the gate capacitor
reduces turn-off time.
RSH is not required for the TLP591B, which has a
built-in resistor.
(TON, TOFF ≅ several ms)
RSH
TLP191B
TLP591B
Both AC and DC drivers become possible by
connecting power MOSFETs in a common-source
configuration.
Transformerless AC-DC converter
TLP590B x n
100 Aac
DC Outputs
Photovoltaic couplers in a parallel-serial
configuration convert AC power to DC without a
transformer.
This type of configuration requires tens to hundreds
of photovoltaic couplers.
10 Photorelays for Tester Application
TLP3120 /TLP3122 /TLP3542
Power Source
CPU
Timing Generator
Waveform Squaring Circuit
Pattern Generator
Logic Comparator
TLP3113 to TLP3116
TLP3130 /TLP3131
TLP3213 to TLP3216
TLP3230 to TLP3231
TLP3240 /TLP3241
TLP3250
TLP3312 /TLP3375
OUT
DC Test Unit
11 Photorelay (MOSFET Output) Application
TLP222G-2
TLP227G-2
L1
Switch Signal
+5 V
TLP227G-2
TLP222G-2
+5V
Switch Signal
FAX
L2
Example of Terminal Switching Application
77
11
Photocoupler Application Circuit Examples
12 NCU Circuit (Fax Modem Card) Application
● No
● No
NCU circuit (fax modem card)
need for output snubber circuit
need for reverse-blocking diode in input side
Off-Hook Relay
Dial Pulsing Relay
Line transformer
shorting
L1
Line
L2
TLP280
TLP281
+5 V
+5 V
TLP172G/170G
176G/192G
176D/197G
SOP
Photorelay
Half-Pitch
Mini-Flat
Coupler
Controller
Ring Detector
13 Competitor Part Number Cross Reference Search
The Toshiba Semiconductor webpage at
http://www.semicon.toshiba.co.jp/eng/product/opto/selection/coupler/xref/index.html
offers a cross reference search tool for photocouplers and photorelays.
78
Modem
CPU
12
Competitor Cross Reference
NEC
Part Number
PS2501-1
PS2561-1
PS2571-1
PS2581L1
PS2505-1
PS2565-1
PS2502-1
PS2562-1
PS2532-1
PS2533-1
PS2521-1
PS2525-1
PS2701-1
PS2761-1
PS2705-1
PS2765-1
PS2702-1
PS2801-1
PS2801-4
PS2861-1
PS2805-1
PS2805-4
PS2865-1
PS8601
PS8602
PS9613
PS8701
PS8101
PS9713
PS9113
PS9601
PS9614
PS9714
PS9114
PS9715
PS9115
PS9701
PS7141-1A
PS7141-2A
PS7141-1B
PS7141-2B
PS7141-1C
PS7341C-1A
PS7141C-2A
PS7241-1A
PS7241-2A
PS7241-1B
PS7241-2B
PS7241-1C
Panasonic
Toshiba Part Number
TLP781
TLP781
TLP781
TLP781F
TLP620
TLP620
TLP627
TLP627
TLP627
TLP627
TLP629
TLP320
TLP181
TLP181
TLP180
TLP180
TLP127
TLP281
TLP281-4
TLP281
TLP280
TLP280-4
TLP280
TLP759
TLP759
TLP759 (IGM)
TLP109
TLP109
TLP109 (IGM)
TLP109 (IGM)
TLP554
TLP554
TLP118
TLP118
TLP118
TLP118
TLP118
TLP597GA
TLP227GA-2
TLP4597G
TLP4227G-2
TLP4006G
TLP594G
TLP224G-2
TLP176GA
TLP206GA
TLP4176G
TLP4206G
TLP4026G
SHARP
Part Number
Toshiba Part Number
Part Number
AQV210
AQV210E
AQV210EH
AQV210S
AQV212
AQV212S
AQV214
AQV214E
AQV214EH
AQV214H
AQV214S
AQV215
AQV216
AQV217S
AQV410EH
AQV414
AQV414E
AQV414S
AQW210
AQW210S
AQW212
AQW214
AQW214S
AQW215
AQW217
AQW414
AQW610S
AQW614
AQY210EH
AQY210LS
AQY210S
AQY214EH
AQY214S
AQY410EH
AQY414EH
AQY414S
AQY221N1S
AQY221N2S
AQY221R2V
AQY221N2V
TLP592G
TLP597G
TLP797GA
TLP192G
TLP592A
TLP197A
TLP597GA
TLP597G
TLP797GA
TLP797GA
TLP197GA
TLP597A
TLP797J
TLP197D
TLP4592G
TLP4592G
TLP4597G
TLP4197G
TLP222G-2
TLP202G
TLP222A-2
TLP227GA-2
TLP206GA
TLP222A-2
TLP222G-2
TLP4222G-2
TLP4026G
TLP4007G
TLP227G
TLP174G
TLP174G
TLP227G
TLP176GA
TLP4227G
TLP4227G
TLP4176G
TLP3113 /TLP3116
TLP3113 /TLP3116
TLP3215
TLP3216
PC123
PC817
PC813
PC815
PC357NT
PC354NT
PC355NT
PC3H7
PC3H3
PC3H21
PC410
PC942
PC923
S2S3
S2S4
PR36MF11NSZ
PR36MF12NSZ
S21MD3V
S201D01
S201D02
Part Number
TLP781
TLP781
TLP620
TLP627
TLP181
TLP180
TLP127
TLP281
TLP280
TLP525G
TLP118
TLP351
TLP351
TLP260J
TLP161J
TLP3506
TLP3506
TLP3051 (S)
TLP3526
TLP3527
Fairchild
Part Number
FOD617
FOD814
FOD815
FOD817
FOD852
FODM3021
FODM3022
FODM3051
FODM3052
H11A617
H11A817
H11AA814
H11B815
HMA121
HMA124
HMA2701
HMHA2801
HMHA281
HMAA2705
HMHAA280
H11A1
H11AA1
H11AG1
H11B1
H11C1
H11D1
H11G1
MOC3021-M
MOC3022-M
MOC3023-M
MOC3041-M
MOC3042-M
MOC3043-M
MOC3051-M
MOC3052-M
MOC3061-M
MOC3062-M
MOC3063-M
Vishay
SFH614A
SFH615A
SFH617A
SFH618A
TCET1100
SFH690xT
TCMT1100
TCMT4100
SFH628A
K815P
SFH612A
SFH619A
SFH655A
SFH692AT
TCED1100
IL66
IL66B
IL255
Avago
Toshiba Part Number
Toshiba Part Number
TLP628
TLP781
TLP781
TLP624
TLP781
TLP181
TLP281
TLP281-4
TLP620
TLP627
TLP627
TLP627
TLP627
TLP127
TLP627
TLP371
TLP372
TLP330
Note: For details of equivalent devices such as electrical performance and package dimensions,
please refer to the latest datasheets.
79
Toshiba Part Number
TLP781
TLP620
TLP627
TLP781
TLP627
TLP160G
TLP160G
TLP160J
TLP160J
TLP781
TLP781
TLP620
TLP627
TLP181
TLP124
TLP181
TLP281
TLP281
TLP180
TLP280
TLP631
TLP630
TLP331
TLP571
TLP541G
TLP371
TLP371
TLP3021 (S)
TLP3022 (S)
TLP3023 (S)
TLP3041 (S)
TLP3042 (S)
TLP3043 (S)
TLP3051 (S)
TLP3052 (S)
TLP3061 (S)
TLP3062 (S)
TLP3063 (S)
Part Number
HCPL-M600
HCPL-M601
HCPL-M611
HCPL-M452
HCPL-M453
HCPL-M456
HCPL-2601
HCPL-2611
HCPL-2201
HCPL-2530
HCPL-2531
HCPL-2630
HCPL-2631
HCPL-3120
HCPL-3140
HCPL-3150
HCPL-3180
HCPL-314J
HCPL-4504
HCPL-0708
HCPL-181
HCPL-354
HCPL-814
Toshiba Part Number
TLP118
TLP118
TLP118
TLP109
TLP109
TLP109
TLP2601
TLP2601
TLP555
TLP2530
TLP2531
TLP2631
TLP2631
TLP350
TLP351
TLP351
TLP350
TLP701 x2
TLP559
TLP116A
TLP181
TLP180
TLP620
LITEON
Part Number
LTV-123
LTV-816
LTV-817
LTV-851
LTV-356T
LTV-357T
LTV-814
LTV-814H
LTV-354T
LTV-815
LTV-852
LTV-352T
LTV-355T
MOC3020
MOC3021
MOC3022
MOC3023
MOC3051
MOC3052
MOC3061
MOC3062
MOC3063
Toshiba Part Number
TLP781
TLP781
TLP781
TLP628
TLP181
TLP181
TLP620
TLP320
TLP180
TLP627
TLP627
TLP127
TLP127
TLP3020 (S)
TLP3021 (S)
TLP3022 (S)
TLP3023 (S)
TLP3051 (S)
TLP3052 (S)
TLP3061 (S)
TLP3062 (S)
TLP3063 (S)
COSMO
Part Number
K1010
K2010
K3010
KP3020
KP4010
KP4020
K5010
K6010
KPS2801
KPC354NT
KPC355NT
KPC357NT
KPC452
Toshiba Part Number
TLP781
TLP631
TLP620
TLP620-2
TLP627
TLP627-2
TLP371
TLP630
TLP281
TLP180
TLP127
TLP181
TLP127
OVERSEAS SUBSIDIARIES AND AFFILIATES
Toshiba America
Electronic Components, Inc.
• Irvine, Headquarters
Tel: (949)623-2900 Fax: (949)474-1330
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(As of February 14, 2011)
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• Düsseldorf Head Office
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Tel: (0211)5296-0 Fax: (0211)5296-400
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Tel: (1)47282181
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Tel: (91)660-6798 Fax: (91)660-6799
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Tel: (0870)060-2370 Fax: (01252)53-0250
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Tel: (6278)5252 Fax: (6271)5155
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Tel: (02)501-1635 Fax: (02)501-1638
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• Kuala Lumpur Head Office
Tel: (03)5631-6311 Fax: (03)5631-6307
• Penang Office
Tel: (04)226-8523 Fax: (04)226-8515
Tel: 2375-6111 Fax: 2375-0969
2011-3
BCE0034G
• Beijing Office
Tel: (010)6590-8796 Fax: (010)6590-8791
• Chengdu Office
Tel: (028)8675-1773 Fax: (028)8675-1065
• Qingdao Office
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Tel: (0755)2399-6897 Fax: (0755)2399-5573
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• Shanghai PUXI Branch
Tel: (021)6139-3888 Fax: (021)6190-8288
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Tel: (0571)8717-5004 Fax: (0571)8717-5013
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Tel: (0411)8368-6882 Fax: (0411)8369-0822
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Tel: (0592)226-1398 Fax: (0592)226-1399
Toshiba Electronics do Brasil Ltda.
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Tel: (011)2539-6681 Fax: (011)2539-6675
Tel: (0124)499-6600 Fax: (0124)499-6611
• Seoul Head Office
Tel: (02)3484-4334 Fax: (02)3484-4302
• Daegu Office
• Taipei Head Office
Tel: (02)2508-9988 Fax: (02)2508-9999
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software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is
permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and
for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could
cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or
incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without
limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor
Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the
applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c)
validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
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not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use,
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applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for
damages or losses occurring as a result of noncompliance with applicable laws and regulations.
2011
Previous edition: BCE0034F
2011-3(5k)SO-DQ
Semiconductor Company
Website: http://www.semicon.toshiba.co.jp/eng
Photocouplers and Photorelays
Tel: (053)428-7610 Fax: (053)428-7617
Toshiba Electronics Taiwan Corporation