TLP3061F_07

TLP3061F_07

  • 厂商:

    TOSHIBA(东芝)

  • 封装:

  • 描述:

    TLP3061F_07 - OFFICE MACHINE HOUSEHOLD USE EQUIPMENT TRIAC DRIVER SOLID STATE RELAY - Toshiba Semico...

  • 详情介绍
  • 数据手册
  • 价格&库存
TLP3061F_07 数据手册
TLP3061F(S),TLP3062F(S),TLP3063F(S) TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRIAC TLP3061F(S),TLP3062F(S),TLP3063F(S) OFFICE MACHINE HOUSEHOLD USE EQUIPMENT TRIAC DRIVER SOLID STATE RELAY The TOSHIBA TLP3061F(S), TLP3062F(S), TLP3063F(S) consist of a zero voltage crossing turn-on photo-triac optically coupled to a gallium arsenide infrared emitting diode in a six lead plastic DIP package. All parameters are tested to the specifications of TLP3061(S) TLP3062(S) and TLP3063(S). (both condition and limits) Unit: mm • • Peak Off-State Voltage Trigger LED Current : 600 V (min) : 15 mA (max) (TLP3061F(S)) 10 mA (max) (TLP3062F(S)) 5 mA (max) (TLP3063F(S)) : 100 mA (max) : 5000 Vrms (min) : UL1577, File No. E67349 : SS EN60065 SS EN60950, File No.9841113 : BS EN60065, File No.8385 BS EN60950, File No.8386 JEDEC EIAJ TOSHIBA weight: 0.39g ― ― 11-7A902 • • • • • • On-State Current Isolation Voltage UL Recognized SEMKO Approved BSI Approved Option (D4) type VDE approved: DIN EN60747-5-2 Approved No. 40009302 Maximum operating insulation voltage: 1140VPK Highest permissible over voltage: 8000VPK (Note): When an EN60747-5-2 approved type is needed, please designate the "Option (D4)" • Construction mechanical rating 10.16 mm pitch TLPxxxxF type Creepage Distance Clearance Insulation Thickness 8.0 mm (Min) 8.0 mm (Min) 0.5 mm (Min) Pin Configuration (top view) 1 2 3 ZC 1: Anode 2: Cathode 3: N.C. 4:Terminal 1 6:Terminal 2 ZC:Zero-cross Circuit 6 4 1 2007-10-01 TLP3061F(S),TLP3062F(S),TLP3063F(S) RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 20070701-EN • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 2 2007-10-01
TLP3061F_07
1. 物料型号: - TLP3061F(S) - TLP3062F(S) - TLP3063F(S)

2. 器件简介: - 这些器件是东芝公司生产的光耦合器,包含一个零电压导通光控三极管,与砷化镓红外发光二极管光电隔离,封装在六引脚塑料DIP封装中。

3. 引脚分配: - 1: 阳极(Anode) - 2: 阴极(Cathode) - 3: 空脚(N.C.) - 4: 终端1(Terminal 1) - 6: 终端2(Terminal 2) - ZC: 零交叉电路(Zero-cross Circuit)

4. 参数特性: - 峰值关断电压:600V(最小值) - 触发LED电流:TLP3061F(S) 15mA(最大值),TLP3062F(S) 10mA(最大值),TLP3063F(S) 5mA(最大值) - 导通电流:100mA(最大值) - 隔离电压:5000Vrms(最小值) - 认证:UL1577, SEMKO, EN60950, BSI等

5. 功能详解: - 这些光耦合器用于办公设备和家用电器设备的三极管驱动和固态继电器,提供零电压导通功能,减少噪音和电磁干扰。

6. 应用信息: - 适用于一般电子应用,如计算机、个人设备、办公设备、测量设备、工业机器人、家用电器等。不适用于需要极高质量和/或可靠性的设备,或其故障可能导致人员伤亡的设备。

7. 封装信息: - 封装类型:六引脚塑料DIP封装 - 爬电距离:8.0mm(最小值) - 间隙:8.0mm(最小值) - 绝缘厚度:0.5mm(最小值)
TLP3061F_07 价格&库存

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