TLP3231

TLP3231 TOSHIBA PHOTOCOUPLER PHOTO RELAY TLP3231 Measuring Instruments Logic IC Testers / Memory Testers Board Testers / Scanners ③ Unit: mm 4.2 φ1.4 ② The TOSHIBA TLP3231 is an ultra-small photorelay suitable for surface-mount assembly. The TLP3231 consists of a GaAs infrared-emitting diode optically coupled to a photo-MOSFET and is housed in a 4-pin package. Its features include low Off-state current and low output pin capacitance, enabling it to be used for high-frequency measuring instrument applications. ④ ① 3.65 1.9 1.8 0.15 0.2 3.8 0.2 1.27 2.04 0.3 (0.46) Features • • • • • • • • 4-pin SSOP (SSOP4): 1.8-mm high, 1.27-mm pitch 1-Form-A Peak Off-State Voltage: 20 V (min) Trigger LED Current: 4 mA (max) On-State Current: 450 mA (max) On-State Resistance: 1.2 Ω (max), 0.8 Ω (typ.) Output Capacitance: 12 pF (max), 5 pF (typ.) Isolation Voltage: 1500 Vrms (min) JEDEC JEITA TOSHIBA 11-2B1 Weight: 0.03 g (typ.) Pin Configuration (Top View) 1 4 Schematic 1 4 2 1 : ANODE 2 : CATHODE 3 : DRAIN 4 : DRAIN 3 2 3 1 2008-03-03 TLP3231 Absolute Maximum Ratings (Ta = 25°C) CHARACTERISTIC Forward Current LED Forward Current Derating (Ta ≥ 25°C) Reverse Voltage Junction Temperature DETECTOR Off-State Output Terminal Voltage On-State Current On-State Current Derating (Ta ≥ 25°C) Junction Temperature SYMBOL IF ΔIF/°C VR Tj VOFF ION ΔION/°C Tj Tstg Topr Tsol BVS RATING 50 −0.5 5 125 20 450 −4.5 125 −40 to 125 −20 to 85 260 1500 UNIT mA mA/°C V °C V mA mA/°C °C °C °C °C Vrms Storage Temperature Range Operating Temperature Range Lead Soldering Temperature (10 s) Isolation Voltage (AC, 1 minute, R.H. ≤ 60%) (Note 1) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Device considered a two-terminal device: Pins 1 and, 2 shorted together, and pins 3 and 4 shorted together. Caution This device is sensitive to electrostatic discharge. When using this device, please ensure that all tools and equipment are earthed. Recommended Operating Conditions CHARACTERISTIC Supply Voltage Forward Current On-State Current Operating Temperature SYMBOL VDD IF ION Topr MIN ⎯ ⎯ ⎯ -20 TYP. ⎯ ⎯ ⎯ ⎯ MAX 20 30 450 65 UNIT V mA mA °C Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Individual Electrical Characteristics (Ta = 25°C) CHARACTERISTIC Forward Voltage LED Reverse Current Capacitance DETECTOR Off-State Current Capacitance SYMBOL VF IR CT IOFF COFF TEST CONDITION IF = 10 mA VR = 5 V V = 0, f = 1 MHz VOFF = 20 V, Ta = 50°C V = 0, f = 100 MHz, t < 1 s MIN 1.0 ⎯ ⎯ ⎯ ⎯ TYP. 1.15 ⎯ 15 ⎯ 5 MAX 1.3 10 ⎯ 1000 12 UNIT V μA pF pA pF 2 2008-03-03 TLP3231 Coupled Electrical Characteristics (Ta = 25°C) CHARACTERISTIC Trigger LED Current Return LED Current On-State Resistance SYMBOL IFT IFC RON TEST CONDITION ION = 100 mA IOFF = 10 μA ION = 450 mA, IF = 5 mA, t < 1 s MIN ⎯ 0.2 ⎯ TYP. ⎯ 0.75 0.8 MAX 4 ⎯ 1.2 UNIT mA mA Ω Isolation Characteristics (Ta = 25°C) CHARACTERISTIC Capacitance Input to Output Isolation Resistance SYMBOL CS RS TEST CONDITION VS = 0 V, f = 1 MHz VS = 500 V, R.H. ≤ 60% AC, 1 minute Isolation Voltage BVS AC, 1 second (in oil) DC, 1 minute (in oil) MIN ⎯ 5 × 10 10 TYP. 0.3 10 14 MAX ⎯ ⎯ ⎯ ⎯ ⎯ UNIT pF Ω Vrms Vdc 1500 ⎯ ⎯ ⎯ 3000 3000 Switching Characteristics (Ta = 25°C) CHARACTERISTIC Turn-on Time Turn-off Time SYMBOL tON tOFF TEST CONDITION RL = 200 Ω VDD = 10 V, IF = 5 mA (Note) MIN ⎯ ⎯ TYP. 200 200 MAX 500 500 UNIT μs Note: SWITCHING TIME TEST CIRCUIT IF VDD IF VOUT 2 3 10% tON tOFF VOUT 90% 1 4 RL 3 2008-03-03 TLP3231 I F ─ Ta 100 I ON ─ Ta 600 (mA) (mA) 80 500 ION Allowable On-sate current 60 40 20 0 -20 0 20 40 60 80 100 120 IF 400 Allowable forward current 300 200 100 0 -20 0 20 40 60 80 100 120 Ambient temperature Ta (°C) Ambient temperature Ta (°C) I F ─ VF 100 50 Ta = 25 °C I ON ─ VON 500 400 Ta = 25 °C I F = 5 mA (mA) I ON On-sate current 0.8 1 1.2 1.4 1.6 1.8 (mA) 30 10 5 3 1 0.5 0.3 0.1 0.6 300 200 100 0 -100 -200 -300 -400 -500 -1 Forward current IF -0.5 0 0.5 1 Forward voltage VF (V) On-sate voltage VON (V) RON ─ Ta 3 I ON = 450 mA I FT ─ Ta 5 I ON = 100 mA (Ω) I F = 5 mA t < 1s (mA) I FT Trigger LED current 20 40 60 80 100 4 t < 1s RON 2 3 On-sate resistance 2 1 1 0 -20 0 0 -20 0 20 40 60 80 100 Ambient temperature Ta (°C) Ambient temperature Ta (°C) 4 2008-03-03 TLP3231 tON,tOFF ─ I F 1000 Ta = 25 °C tON,tOFF ─ Ta 400 350 300 250 t OFF V DD = 10 V, I F = 10 mA RL = 200 Ω (µs) V DD = 10 V, RL = 200 Ω t OFF 100 tON,tOFF Switching time tON,tOFF 300 (µs) 200 150 100 50 0 -20 0 20 40 60 80 100 t ON Switching time t ON 30 10 1 3 10 30 100 Forward current IF (mA) Ambient temperature Ta (°C) I OFF ─ VOFF 15 Ta = 25 °C C OFF ─ VOFF 1 Ta = 25 °C (pA) I OFF 10 Output terminal capacitance COFF / COFF (0V) 0.8 0.6 Off-state current 0.4 5 0.2 0 5 10 15 20 0 10 20 30 Off-state output voltage VOFF (V) Off-state output voltage VOFF (V) 5 2008-03-03 TLP3231 Package Dimensions 4.2 φ1.4 Unit: mm Tolerance: ±0.1 ③ ② ①: ANODE ②: CATHODE ③: DRAIN ④: DRAIN ④ ① 3.65 1.9 1.8 0.15 0.2 3.8 0.2 1.27 2.04 0.3 (0.46) 6 2008-03-03 TLP3231 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 7 2008-03-03