TLP3406SRH(TP,E

TLP3406SRH Photocouplers Photorelay AR Y TLP3406SRH ATE (Automatic Test Equipment) • Measuring Instruments • High-Speed Logic IC Testers • High-Speed Memory Testers uc Probe Cards • rod • ts. 1. Applications rp 2. General ou The TOSHIBA TLP3406SRH photorelay consists of a photo MOSFET optically coupled to an infrared light gy emitting diode. It is housed in a S-VSON4T package. The TLP3406SRH features a very small on-resistance and 3. Features Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig nin on/off switching off current as high as 1.5 A, making it ideal for switching applications in high-speed testers. S-VSON4T: 2.0 (L) mm × 1.45 (W) mm × 1.3 (H) mm (2) Normally opened (1-Form-A) (3) OFF-state output terminal voltage: 30 V (min) (4) Operating voltage: 3 V (max) (5) ON-state current: 1.5 A (max) IN (1) (6) ON-state resistance: 0.1 Ω (typ.), 0.2 Ω (max) (7) Isolation voltage: 500 Vrms (min) PR EL IM 4. Packaging and Pin Assignment 11-2E2 ©2018-2019 Toshiba Electronic Devices & Storage Corporation 1: Anode 2: Cathode 3: Drain 4: Drain Start of commercial production 1 2019-02 2019-01-09 Rev.0.0 TLP3406SRH AR Y 5. Internal Circuit Input power dissipation ON-state current derating ON-state current (pulsed) Output power dissipation Junction temperature Common Storage temperature Operating temperature uc rod ∆PD/∆Ta -0.5 mW/ Tj 125  VOFF 30 V ION 1.5 A ∆ION/∆Ta -15 mA/ IONP 4.5 A PO 240 mW (Ta ≥ 25 ) ∆PO/∆Ta -2.4 mW/ Tj 125  Tstg -40 to 125  Topr -40 to 110 (10 s) Tsol AC, 60 s, R.H. ≤ 60 % BVS (Note 1) 260 500 Vrms Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together. PR EL Note: mW 50 (Ta ≥ 25 ) Lead soldering temperature Isolation voltage V (t = 100 ms, Duty = 1/10) IM Output power dissipation derating 6 PD IN ON-state current VR Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig Junction temperature Detector OFF-state output terminal voltage (Ta ≥ 25 ) 6 Unit ou VIN Input reverse voltage Input power dissipation derating Rating gy Applied input forward voltage Note nin LED Symbol rp Characteristics ts. 6. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Note: This device is sensitive to electrostatic discharge (ESD). Extreme ESD conditions should be guarded against by using proper antistatic precautions for the worktable, operator, solder iron, soldering equipment and so on. 7. Recommended Operating Conditions (Note) Characteristics Supply voltage Symbol Applied input forward voltage Note Min Typ. Max Unit V VDD   24 VIN  3.3 6 ON-state current ION   1.5 A Operating temperature Topr -20  100  Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. ©2018-2019 Toshiba Electronic Devices & Storage Corporation 2 2019-01-09 Rev.0.0 TLP3406SRH 8. Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Note Test Condition Min Typ. Max Unit Input reverse current IR VR = 5 V   10 µA Input capacitance Ct V = 0 V, f = 1 MHz  30  pF IOFF VOFF = 20 V   1 nA COFF V = 0 V, f = 1 MHz, t < 1 s  120 150 pF Max Unit 3 V Detector OFF-state current Output capacitance AR Y LED Symbol Test Condition Min Typ. Operating voltage VFON ION = 100 mA  1.4 Turn-off voltage VFOFF IOFF = 10 µA 0.8 1.4 ION = 1.5 A, VIN = 5 V, t < 1 s  0.1 0.2 Ω Typ. Max Unit  1  pF  1014  Ω 500   Vrms Isolation voltage Test Condition CS (Note 1) VS = 0 V, f = 1 MHz RS (Note 1) VS = 500 V, R.H. ≤ 60 % BVS IN Isolation resistance Note Min Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig Total capacitance (input to output) Symbol gy 10. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics (Note 1) AC, 60 s  ou RON nin ON-state resistance uc Note rod Symbol rp Characteristics ts. 9. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together. 11. Switching Characteristics (Unless otherwise specified, Ta = 25 ) Turn-on time Note Test Condition tON tOFF See Fig. 11.1. RL = 200 Ω, VDD = 20 V, VIN = 5 V Min Typ. Max Unit  0.7 2 ms  0.1 0.2 PR EL Turn-off time Symbol IM Characteristics Fig. 11.1 Switching Time Test Circuit and Waveform ©2018-2019 Toshiba Electronic Devices & Storage Corporation 3 2019-01-09 Rev.0.0 TLP3406SRH gy ou rp rod uc ts. AR Y 12. Characteristics Curves (Note) Fig. 12.2 ION - VON IM IN Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig nin Fig. 12.1 ION - Ta PR EL Fig. 12.3 RON - Ta Fig. 12.5 tON, tOFF - VIN ©2018-2019 Toshiba Electronic Devices & Storage Corporation Fig. 12.4 VFON - Ta Fig. 12.6 tON, tOFF - Ta 4 2019-01-09 Rev.0.0 rp rod uc ts. AR Y TLP3406SRH Fig. 12.8 IOFF - Ta IM IN Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig nin gy ou Fig. 12.7 IOFF - VOFF Fig. 12.9 COFF/COFF (0 V) - VOFF The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. PR EL Note: ©2018-2019 Toshiba Electronic Devices & Storage Corporation 5 2019-01-09 Rev.0.0 TLP3406SRH 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below. When using soldering reflow AR Y • (See the figure shown below, which is based on the package surface temperature.) Reflow soldering may be performed up to twice. The first reflow soldering should be performed within 168 hours after opening the moisture-proof packaging. When using soldering Iron IN • Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig nin gy ou rp rod uc ts. The second reflow soldering must be performed within 168 hours of the first reflow. Complete soldering within 10 seconds for lead temperature not exceeding 260 . PR EL IM Heating by soldering iron must be done only once per lead. ©2018-2019 Toshiba Electronic Devices & Storage Corporation 6 2019-01-09 Rev.0.0 TLP3406SRH 13.2. Precautions for General Storage • Avoid storage locations where devices may be exposed to moisture or direct sunlight. • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during AR Y • storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. • Do not allow loads to be applied directly to devices while they are in storage. • If devices have been stored for more than two years under normal storage conditions, it is recommended ts. that you check the leads for ease of soldering prior to use. Follow the precautions printed on the packing label of the device for transportation and storage. • Thermal stress may cause a crack in surface-mount products during surface-mount assembly if they have rod uc • rp absorbed atmospheric moisture. To prevent a crack, please observe the following precautions. ou 1. Moisture-proof bags may be stored unopened for up to 12 months under the following conditions. gy Temperature: 5  to 30  nin Humidity: 90 % (max) Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig 2. After opening the moisture-proof bag, the devices should be assembled within 168 hours in an environment of 5  to 30 /70 %RH or below. IN 3. If, upon opening, the moisture indicator card shows a humidity of 30 % or above (i.e., has turned pink) or the expiration date has passed, the devices should be baked in tape and reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60±5 , for 64 to 72 hours. Expiration date: 12 months from the sealing date, which is imprinted on the label affixed. 4. Repeated baking can affect the peeling strength of taping and cause a trouble during mounting. Furthermore, protect the devices against static electricity for baking. IM 5. If the laminated packing material is broken, its hermeticity deteriorates. Therefore, do not throw or drop the packed devices. PR EL 6. When restoring devices after removal from their packing, use anti-static containers. ©2018-2019 Toshiba Electronic Devices & Storage Corporation 7 2019-01-09 Rev.0.0 gy nin rp ou ts. uc rod AR Y IN IM 15. Marking Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig PR EL TLP3406SRH 14. Land Pattern Dimensions (for reference only) ©2018-2019 Toshiba Electronic Devices & Storage Corporation 8 2019-01-09 Rev.0.0 TLP3406SRH 16. Embossed-Tape Packing (TP) Specification for Mini-Flat Photorelays 16.1. Applicable Package Product Type S-VSON4T Photorelay AR Y Package Name 16.2. Product Naming Conventions Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification ts. is as below. rod uc Example) TLP3406SRH(TP,E rp Part number: TLP3406SRH ou Tape type: TP nin gy [[G]]/RoHS COMPATIBLE: E (Note 1) IN Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 16.3. Tape Dimensions Specification Tape Type Division TP  Packing Amount (A unit per reel) 2500 IM 16.3.1. Orientation of Device in Relation to Direction of Feed PR EL Device orientation in the carrier cavities as shown in the following figure. Device Orientation 16.3.2. Empty Cavities Characteristics Occurrences of 2 or more successive empty cavities Single empty cavity Criterion Remarks 0 device Within any given 40-mm section of tape, not including leader and trailer 6 devices (max) per reel Not including leader and trailer 16.3.3. Tape Leader and Trailer The start end of the tape has 40 or more empty cavities. The hub end of the tape has 40 or more empty cavities and one-third empty turns only for a cover tape. ©2018-2019 Toshiba Electronic Devices & Storage Corporation 9 2019-01-09 Rev.0.0 TLP3406SRH 16.3.4. Tape Dimensions A 1.6  2.25  3.5 Center line of embossed cavity and sprocket hole E F G 4.0 4.0 1.5 Distance between tape edge and sprocket hole center Cumulative error +0.2/-0.2 per 10 empty cavities holes Cumulative error +0.2/-0.2 per 10 sprocket holes Internal space PR EL IM K0 1.75 IN B D Remark gy Dimension Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig Symbol ou Tape Dimensions (unit: mm, tolerance: ±0.1) nin Table rp rod uc ts. AR Y Tape material: Plastic (for protection against static electricity) ©2018-2019 Toshiba Electronic Devices & Storage Corporation 10 2019-01-09 Rev.0.0 TLP3406SRH 16.3.5. Reel Specification IN Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig nin gy ou rp rod uc ts. AR Y Material: Plastic (for protection against static electricity) Table Dimension A φ180 ± 3 B φ60 ± 1 IM Symbol C φ13 ± 0.5 E 2.0 ± 0.5 U 4.0 ± 0.5 W1 9.0 ± 0.3 W2 11.4 ± 1.0 PR EL 16.4. Packing (Note) Reel Dimensions (unit: mm) 1 reel/carton (unit: mm) Note: Taping reel diameter: φ180 mm 16.5. Label Format The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. ©2018-2019 Toshiba Electronic Devices & Storage Corporation 11 2019-01-09 Rev.0.0 TLP3406SRH 16.6. Ordering Information When placing an order, please specify the part number, tape type and quantity as shown in the following example. Part number: TLP3406SRH Tape type: TP [[G]]/RoHS COMPATIBLE: E (Note 1) ts. Quantity (must be a multiple of 2500): 2500 pcs AR Y Example) TLP3406SRH(TP,E 2500 pcs PR EL IM IN Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig nin gy ou rp rod uc Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. ©2018-2019 Toshiba Electronic Devices & Storage Corporation 12 2019-01-09 Rev.0.0 Weight: 0.01 g (typ.) gy nin rp ou ts. uc rod AR Y IN Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig IM PR EL TLP3406SRH Package Dimensions Unit: mm Package Name(s) TOSHIBA: 11-2E2 ©2018-2019 Toshiba Electronic Devices & Storage Corporation 13 2019-01-09 Rev.0.0 TLP3406SRH RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". AR Y • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. nin gy ou rp rod uc ts. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. IN Do Ple not as de e c sig on n y tac ou ty rp ou rod r T uc os ts hib or a s sy ale ste s r ms ep ba res se en d o tat n ive the for inf up orm da at ted ion inf on orm th ati is do on cu be me for nt ed . es ig • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative or contact us via our website. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. IM • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. PR EL • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. https://toshiba.semicon-storage.com/ ©2018-2019 Toshiba Electronic Devices & Storage Corporation 14 2019-01-09 Rev.0.0