TLP3475(TP,F

TLP3475 Photocouplers Photorelay TLP3475 1. Applications • Measuring Instruments • High-Speed Logic IC Testers • High-Speed Memory Testers • ATE (Automatic Test Equipment) 2. General The TLP3475 photorelay consists of a photo MOSFET optically coupled to an infrared LED. It is housed in a VSON4 package. The TLP3475 features a low CR product and extremely low on-state resistance, and thus delivers high on-state current. Additionally, the TLP3475 offers low insertion loss of a high-frequency signal and thus prevents the degradation of a rapidly rising signal. The TLP3475 also features low off-state current and low output pin capacitance, making it suitable for high-frequency measuring instrument applications. 3. Features (1) Normally opened (1-Form-A) (2) OFF-state output terminal voltage: 50 V (min) (3) Trigger LED current: 3 mA (max) (4) ON-state current: 300 mA (max) (5) ON-state resistance: 1.0 Ω (typ.), 1.5 Ω (max) (6) Output capacitance: 12 pF(typ.), 20 pF(max) (7) Isolation voltage: 500 Vrms (min) (8) ERT (Equivalent Rise Time): 40 ps(typ.), 90 ps(max) 4. Packaging and Pin Assignment 1: Anode 2: Cathode 3: Drain 4: Drain 11-2D1A Start of commercial production ©2016-2020 Toshiba Electronic Devices & Storage Corporation 1 2014-05 2020-02-20 Rev.9.0 TLP3475 5. Internal Circuit 6. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Rating Unit IF 30 mA ∆IF/∆Ta -0.3 mA/ VR 5 V Input forward current Input forward current derating (Ta ≥ 25 ) Input reverse voltage Input power dissipation Input power dissipation derating (Ta ≥ 25 ) Note PD 50 mW ∆PD/∆Ta -0.5 mW/ Tj 125  VOFF 50 V Junction temperature Detector OFF-state output terminal voltage ON-state current ION 300 mA ON-state current derating (Ta ≥ 25 ) ∆ION/∆Ta -3.0 mA/ ON-state current (pulsed) (t = 100 ms, Duty = 1/10) IONP 900 mA PO 240 mW ∆PO/∆Ta -2.4 mW/ Tj 125  Tstg -40 to 125 Topr -40 to 110 Output power dissipation Output power dissipation derating (Ta ≥ 25 ) Junction temperature Common Storage temperature Operating temperature Lead soldering temperature Isolation voltage (10 s) Tsol AC, 60 s, R.H. ≤ 60 % BVS 260 (Note 1) 500 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together. Note: This device is sensitive to electrostatic discharge (ESD). Extreme ESD conditions should be guarded against by using proper antistatic precautions for the worktable, operator, solder iron, soldering equipment and so on. 7. Recommended Operating Conditions (Note) Characteristics Symbol Supply voltage VDD Input forward current Note Min Typ. Max Unit   40 V IF 5 7.5 20 mA ON-state current ION   300 mA Operating temperature Topr -20  85  Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. ©2016-2020 Toshiba Electronic Devices & Storage Corporation 2 2020-02-20 Rev.9.0 TLP3475 8. Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Note Test Condition Min Typ. Max Unit Input forward voltage VF IF = 10 mA 1.1 1.27 1.4 V Input reverse current IR VR = 5 V   10 µA Ct Input capacitance Detector OFF-state current Output capacitance V = 0 V, f = 1 MHz  30  pF IOFF VOFF = 50 V   1 nA COFF V = 0 V, f = 100 MHz, t < 1 s  12 20 pF 9. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Trigger LED current Symbol Note Test Condition Min Typ. Max Unit  3 mA IFT ION = 100 mA  Return LED current IFC IOFF = 10 µA 0.1   ON-state resistance RON ION = 300 mA, IF = 5 mA, t < 1 s  1.0 1.5 Ω Min Typ. Max Unit  1.0  pF  1014  Ω 500   Vrms 10. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Total capacitance (input to output) Isolation resistance Isolation voltage Symbol CS RS BVS Note Test Condition (Note 1) VS = 0 V, f = 1 MHz (Note 1) VS = 500 V, R.H. ≤ 60 % (Note 1) AC, 60 s Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together. ©2016-2020 Toshiba Electronic Devices & Storage Corporation 3 2020-02-20 Rev.9.0 TLP3475 11. Switching Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Turn-on time tON Turn-off time tOFF Turn-on time tON Turn-off time tOFF Equivalent rise time ERT Note Test Condition Min Typ. Max Unit See Fig. 11.1. RL = 200 Ω, VDD = 20 V, IF = 5 mA   500 µs   400 See Fig. 11.1. RL = 200 Ω, VDD = 20 V, IF = 10 mA   250   400 See Fig. 11.2. IF = 5 mA, VDD = 0.25 V, tr(in) = 25 ps  40 90 ps Fig. 11.1 Switching Time Test Circuit and Waveform Fig. 11.2 ERT (Equivalent Rise Time) ©2016-2020 Toshiba Electronic Devices & Storage Corporation 4 2020-02-20 Rev.9.0 TLP3475 12. Characteristics Curves (Note) Fig. 12.1 IF - Ta Fig. 12.2 ION - Ta Fig. 12.3 IF - VF Fig. 12.4 ION - VON Fig. 12.5 RON - Ta Fig. 12.6 IFT - Ta ©2016-2020 Toshiba Electronic Devices & Storage Corporation 5 2020-02-20 Rev.9.0 TLP3475 Fig. 12.7 tON, tOFF - IF Fig. 12.8 tON, tOFF - Ta Fig. 12.9 IOFF - VOFF Fig. 12.10 IOFF - Ta Fig. 12.11 COFF/COFF(0 V) - VOFF Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. ©2016-2020 Toshiba Electronic Devices & Storage Corporation 6 2020-02-20 Rev.9.0 TLP3475 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below. • When using soldering reflow (See the figure shown below, which is based on the package surface temperature.) Reflow soldering may be performed up to twice. The first reflow soldering should be performed within 168 hours after opening the moisture-proof packaging. The second reflow soldering must be performed within 168 hours of the first reflow. • When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 . Heating by soldering iron must be done only once per lead. ©2016-2020 Toshiba Electronic Devices & Storage Corporation 7 2020-02-20 Rev.9.0 TLP3475 13.2. Precautions for General Storage • Avoid storage locations where devices may be exposed to moisture or direct sunlight. • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. • Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. • Do not allow loads to be applied directly to devices while they are in storage. • If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. • Follow the precautions printed on the packing label of the device for transportation and storage. • Thermal stress may cause a crack in surface-mount products during surface-mount assembly if they have absorbed atmospheric moisture. To prevent a crack, please observe the following precautions. 1. Moisture-proof bags may be stored unopened for up to 12 months under the following conditions. Temperature: 5  to 30  Humidity: 90 % (max) 2. After opening the moisture-proof bag, the devices should be assembled within 168 hours in an environment of 5  to 30 /70 %RH or below. 3. If, upon opening, the moisture indicator card shows a humidity of 30 % or above (i.e., has turned pink) or the expiration date has passed, the devices should be baked in tape and reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60±5 , for 64 to 72 hours. Expiration date: 12 months from the sealing date, which is imprinted on the label affixed. 4. Repeated baking can affect the peeling strength of taping and cause a trouble during mounting. Furthermore, protect the devices against static electricity for baking. 5. If the laminated packing material is broken, its hermeticity deteriorates. Therefore, do not throw or drop the packed devices. 6. When restoring devices after removal from their packing, use anti-static containers. ©2016-2020 Toshiba Electronic Devices & Storage Corporation 8 2020-02-20 Rev.9.0 TLP3475 14. Land Pattern Dimensions (for reference only) Unit: mm 15. Marking 16. Ordering Information When placing an order, please specify the part number, tape type and quantity as shown in the following example. Example) TLP3475(TP,F 3000 pcs Part number: TLP3475 Tape type: TP [[G]]/RoHS COMPATIBLE: F (Note 1) Quantity (must be a multiple of 3000): 3000 pcs Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. ©2016-2020 Toshiba Electronic Devices & Storage Corporation 9 2020-02-20 Rev.9.0 TLP3475 Package Dimensions Unit: mm Weight: 10 mg (typ.) Package Name(s) TOSHIBA: 11-2D1A ©2016-2020 Toshiba Electronic Devices & Storage Corporation 10 2020-02-20 Rev.9.0 TLP3475 RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. https://toshiba.semicon-storage.com/ ©2016-2020 Toshiba Electronic Devices & Storage Corporation 11 2020-02-20 Rev.9.0