TLP3475R
Photocouplers
Photorelay
TLP3475R
1. Applications
•
Measuring Instruments
•
High-Speed Logic IC Testers
•
High-Speed Memory Testers
•
ATE (Automatic Test Equipment)
2. General
The TLP3475R photorelay consists of a photo MOSFET optically coupled to an infrared LED. It is housed in a
VSONR4 package. TLP3475R has a Built-in input resistor, which eliminates an external input resistor for space
saving. The TLP3475R features a low CR product and extremely low on-state resistance, and thus delivers high
on-state current. Additionally, the TLP3475R offers low insertion loss of a high-frequency signal and thus prevents
the degradation of a rapidly rising signal. The TLP3475R also features low off-state current and low output pin
capacitance, making it suitable for high-frequency measuring instrument applications.
3. Features
(1)
VSONR: 2.8 (L) mm × 1.5 (W) mm × 1.3 (H) mm
(2)
Normally opened (1-Form-A)
(3)
OFF-state output terminal voltage: 50 V (min)
(4)
Operating voltage: 3 V (max)
(5)
ON-state current: 300 mA (max)
(6)
ON-state resistance: 1 Ω (typ.), 1.5 Ω (max)
(7)
Output capacitance: 12 pF (typ.), 20 pF (max)
(8)
Isolation voltage: 500 Vrms (min)
4. Packaging and Pin Assignment
1: Anode
2: Cathode
3: Drain
4: Drain
11-3D1
Start of commercial production
©2016-2020
Toshiba Electronic Devices & Storage Corporation
1
2014-04
2020-02-18
Rev.8.0
TLP3475R
5. Internal Circuit
6. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
LED
Symbol
Note
Rating
Unit
6
V
Applied input forward voltage
VIN
Input reverse voltage
VR
5
Input power dissipation
PD
50
mW
∆PD/∆Ta
-0.5
mW/
Tj
125
Input power dissipation derating
(Ta ≥ 25 )
Junction temperature
Detector OFF-state output terminal voltage
ON-state current
VOFF
50
V
ION
300
mA
ON-state current derating
(Ta ≥ 25 )
∆ION/∆Ta
-3
mA/
ON-state current (pulsed)
(t = 100 ms, Duty = 1/10)
IONP
900
mA
PO
240
mW
(Ta ≥ 25 )
∆PO/∆Ta
-2.4
mW/
Output power dissipation
Output power dissipation derating
Junction temperature
Common Storage temperature
Operating temperature
Lead soldering temperature
Isolation voltage
Tj
125
Tstg
-40 to 125
Topr
-40 to 110
(10 s)
Tsol
260
AC, 60 s, R.H. ≤ 60 %
BVS
(Note 1)
500
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
Note:
This device is sensitive to electrostatic discharge (ESD). Extreme ESD conditions should be guarded against
by using proper antistatic precautions for the worktable, operator, solder iron, soldering equipment and so on.
7. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Supply voltage
VDD
40
V
Applied input forward voltage
VIN
3
3.3
6
V
ON-state current
ION
300
mA
Operating temperature
Topr
-20
85
Note:
The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this data sheet should also be considered.
©2016-2020
Toshiba Electronic Devices & Storage Corporation
2
2020-02-18
Rev.8.0
TLP3475R
8. Electrical Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
LED
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
Input reverse current
IR
VR = 5 V
10
µA
Input capacitance
Ct
V = 0 V, f = 1 MHz
30
pF
IOFF
VOFF = 50 V
1
nA
COFF
V = 0 V, f = 100 MHz, t < 1 s
12
20
pF
Max
Unit
V
Detector OFF-state current
Output capacitance
9. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Operating voltage
VFON
ION = 100 mA
1.8
3
Turn-off voltage
VFOFF
IOFF = 10 µA
0.8
1.8
ION = 300 mA, VIN = 5 V, t < 1 s
1
1.5
Ω
Min
Typ.
Max
Unit
ON-state resistance
RON
10. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Condition
Total capacitance (input to output)
CS
(Note 1) VS = 0 V, f = 1 MHz
1
pF
Isolation resistance
RS
(Note 1) VS = 500 V, R.H. ≤ 60 %
1014
Ω
500
Vrms
Isolation voltage
BVS
(Note 1) AC, 60 s
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
11. Switching Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Turn-on time
tON
Turn-off time
tOFF
Note
Test Condition
See Fig. 11.1.
RL = 200 Ω, VDD = 20 V, VIN = 5 V
Min
Typ.
Max
Unit
500
µs
400
Fig. 11.1 Switching Time Test Circuit and Waveform
©2016-2020
Toshiba Electronic Devices & Storage Corporation
3
2020-02-18
Rev.8.0
TLP3475R
12. Characteristics Curves (Note)
Fig. 12.1 ION - Ta
Fig. 12.2 ION - VON
Fig. 12.3 RON - Ta
Fig. 12.4 VFON - Ta
Fig. 12.5 tON, tOFF - VIN
Fig. 12.6 tON, tOFF - Ta
©2016-2020
Toshiba Electronic Devices & Storage Corporation
4
2020-02-18
Rev.8.0
TLP3475R
Fig. 12.7 IOFF - VOFF
Fig. 12.8 IOFF - Ta
Fig. 12.9 COFF/COFF(0 V) - VOFF
Note:
The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
©2016-2020
Toshiba Electronic Devices & Storage Corporation
5
2020-02-18
Rev.8.0
TLP3475R
13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below.
•
When using soldering reflow
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering may be performed up to twice.
The first reflow soldering should be performed within 168 hours after opening the moisture-proof
packaging.
The second reflow soldering must be performed within 168 hours of the first reflow.
•
When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 .
Heating by soldering iron must be done only once per lead.
©2016-2020
Toshiba Electronic Devices & Storage Corporation
6
2020-02-18
Rev.8.0
TLP3475R
13.2. Precautions for General Storage
•
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
•
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
Do not allow loads to be applied directly to devices while they are in storage.
•
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
•
Follow the precautions printed on the packing label of the device for transportation and storage.
•
Thermal stress may cause a crack in surface-mount products during surface-mount assembly if they have
absorbed atmospheric moisture. To prevent a crack, please observe the following precautions.
1. Moisture-proof bags may be stored unopened for up to 12 months under the following conditions.
Temperature: 5 to 30
Humidity: 90 % (max)
2. After opening the moisture-proof bag, the devices should be assembled within 168 hours in an
environment of 5 to 30 /70 %RH or below.
3. If, upon opening, the moisture indicator card shows a humidity of 30 % or above (i.e., has turned
pink) or the expiration date has passed, the devices should be baked in tape and reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5 , for 64 to 72 hours.
Expiration date: 12 months from the sealing date, which is imprinted on the label affixed.
4. Repeated baking can affect the peeling strength of taping and cause a trouble during mounting.
Furthermore, protect the devices against static electricity for baking.
5. If the laminated packing material is broken, its hermeticity deteriorates. Therefore, do not throw or
drop the packed devices.
6. When restoring devices after removal from their packing, use anti-static containers.
©2016-2020
Toshiba Electronic Devices & Storage Corporation
7
2020-02-18
Rev.8.0
TLP3475R
14. Land Pattern Dimensions (for reference only)
15. Marking
16. Ordering Information
When placing an order, please specify the part number, tape type and quantity as shown in the following example.
Example) TLP3475R(TP,F 3000 pcs
Part number: TLP3475R
Tape type: TP
[[G]]/RoHS COMPATIBLE: F (Note 1)
Quantity (must be a multiple of 3000): 3000 pcs
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
©2016-2020
Toshiba Electronic Devices & Storage Corporation
8
2020-02-18
Rev.8.0
TLP3475R
Package Dimensions
Unit: mm
Weight: 0.01 g (typ.)
Package Name(s)
TOSHIBA: 11-3D1
©2016-2020
Toshiba Electronic Devices & Storage Corporation
9
2020-02-18
Rev.8.0
TLP3475R
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA".
Hardware, software and systems described in this document are collectively referred to as "Product".
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE").
Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in
nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, and devices related to power plant.
IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
For details, please contact your TOSHIBA sales representative or contact us via our website.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
https://toshiba.semicon-storage.com/
©2016-2020
Toshiba Electronic Devices & Storage Corporation
10
2020-02-18
Rev.8.0
