TLP350H(TP1,F)

TLP350H,TLP350HF Photocouplers GaAℓAs Infrared LED & Photo IC TLP350H,TLP350HF 1. Applications • Industrial Inverters • Air Conditioner Inverters • MOSFET Gate Drivers • IGBT Gate Drivers • Induction Cooktop and Home Appliances 2. General The TLP350H is a photocoupler in a DIP8 package that consists of a GaAℓAs infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance and specifications at temperatures up to 125 .The TLP350H has an internal Faraday shield that provides a guaranteed Common-mode transient immunity of ±20 kV/µs. It has a totem-pole output that can both sink and source current. The TLP350H is ideal for IGBT of small capacity to middle capacity and power MOSFET gate drive. 3. Features (1) Buffer logic type (totem pole output) (2) Output peak current: ±2.5 A (max) (3) Operating temperature: -40 to 125  (4) Supply current: 3 mA (max) (5) Supply voltage: 15 to 30 V (6) Threshold input current: 5 mA (max) (7) Propagation delay time: 500 ns (max) (8) Common-mode transient immunity: ±20 kV/µs (min) (9) Isolation voltage: 3750 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1) CQC-approved: GB4943.1, GB8898 Japan Factory Note 1: When a VDE approved type is needed, please designate the Option (D4) (D4). Start of commercial production ©2016 Toshiba Corporation 1 2011-08 2016-04-18 Rev.8.0 TLP350H,TLP350HF 4. Packaging (Note) TLP350H TLP350H(LF1,TP1) 11-10C401S 11-10C4S TLP350HF 11-10C405S TLP350HF(LF4,TP4) 11-10C402S Note: TLP350H(LF5,TP5) 11-10C404S Through-hole type: TLP350H, TLP350HF Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 5. Pin Assignment 1: N.C. 2: Anode 3: Cathode 4: N.C. 5: GND 6: VO (Output) 7: N.C. 8: VCC ©2016 Toshiba Corporation 2 2016-04-18 Rev.8.0 TLP350H,TLP350HF 6. Internal Circuit (Note) Note: A 0.1-µF bypass capacitor must be connected between pin 8 and pin 5. 7. Principle of Operation 7.1. Truth Table Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L 7.2. Mechanical Parameters 7.62 mm Pitch TLP350H 10.16 mm Pitch TLP350HF Unit Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) Characteristics ©2016 Toshiba Corporation 3 2016-04-18 Rev.8.0 TLP350H,TLP350HF 8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward current Input forward current derating (Ta ≥ 116 ) Unit IF 20 mA -0.6 mA/ 1 A -25 mA/ IFPT (Ta ≥ 110 ) Rating ∆IF/∆Ta Peak transient input forward current Peak transient input forward current derating Note (Note 1) ∆IFPT/∆Ta Input reverse voltage VR 5 V Input power dissipation PD 40 mW (Ta ≥ 110 ) ∆PD/∆Ta -1.0 mW/ (Ta = -40 to 125 ) IOPH (Note 2) -2.5 A (Ta = -40 to 125 ) IOPL (Note 2) +2.5 Input power dissipation derating Detector Peak high-level output current Peak low-level output current Output voltage VO 35 Supply voltage VCC 35 Output power dissipation Output power dissipation derating (Ta ≥ 110 ) PO 260 mW ∆PO/∆Ta -6.5 mW/ Topr -40 to 125  Tstg -55 to 150 Common Operating temperature Storage temperature Lead soldering temperature Isolation voltage V (10 s) Tsol (Note 3) 260 AC, 60 s, R.H. ≤ 60 % BVS (Note 4) 3750 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) ≤ 1 µs, 300 pps Note 2: Exponential waveform. Pulse width ≤ 0.3 µs, f ≤ 15 kHz Note 3: ≥ 2 mm below seating plane. Note 4: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 9. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Input on-state current IF(ON) (Note 1) 6.5 Input off-state voltage VF(OFF) 0 15  30   -2.0   +2.0   50 Supply voltage VCC Peak high-level output current IOPH Peak low-level output current IOPL Operating frequency f (Note 2) (Note 3) Max Unit  10 mA  0.8 V A kHz Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this datasheet should also be considered. Note: A ceramic capacitor (0.1 µF) should be connected between pin 8 and pin 5 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1: The rise and fall times of the input on-current should be less than 0.5 µs. Note 2: Denotes the operating range, not the recommended operating condition. Note 3: Exponential waveform. IOPH ≥ -2.0 A (≤ 0.3 µs), IOPL ≤ 2.0 A (≤ 0.3 µs), Ta = 125  ©2016 Toshiba Corporation 4 2016-04-18 Rev.8.0 TLP350H,TLP350HF 10. Electrical Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 ) Characteristics Symbol Input forward voltage Input forward voltage temperature coefficient VF ∆VF/∆Ta Input reverse current IR Input capacitance Peak high-level output current Peak low-level output current Test Circuit Note Ct IOPH (Note 1) IOPL (Note 1) Fig. 13.1.1 Fig. 13.1.2 Test Condition Min Typ. Max IF = 10 mA, Ta = 25  1.4 1.55 1.7 V IF = 10 mA  -2.0  mV/ VR = 5 V, Ta = 25    10 µA V = 0 V, f = 1 MHz, Ta = 25   95  pF IF = 5 mA, VCC = 30 V, V8-6 = -3.5 V  -1.6 -1.0 A IF = 5 mA, VCC = 15 V, V8-6 = -7.0 V   -2.0 IF = 0 mA, VCC = 30 V, V6-5 = 2.5 V 1.0 1.6  IF = 0 mA, VCC = 15 V, V6-5 = 7.0 V 2.0   High-level output voltage VOH Fig. 13.1.3 IF = 5 mA, RL = 200 Ω, VCC1 = +15 V, VEE1 = -15 V 11.0 13.7  Low-level output voltage VOL Fig. 13.1.4 VF = 0.8 V, RL = 200 Ω, VCC1 = +15 V, VEE1 = -15 V  -14.9 -12.5 High-level supply current ICCH Fig. 13.1.5 IF = 10 mA, VCC = 30 V, VO = Open  1.5 3.0 Low-level supply current ICCL Fig. 13.1.6 IF = 0 mA, VCC = 30 V, VO = Open  1.5 3.0 Threshold input current (L/H) IFLH VCC = 15 V, VO > 1 V  1.0 5 Threshold input voltage (H/L) VFHL VCC = 15 V, VO < 1 V 0.8   VCC  Supply voltage UVLO threshold voltage UVLO hysteresis 15  30 VUVLO+ IF = 5 mA , VO > 2.5 V 11.0 12.5 13.5 VUVLO- IF = 5 mA, VO < 2.5 V 9.5 11.0 12.0   1.5  UVLOHYS Unit V mA V Note: Note: All typical values are at Ta = 25 . This device is designed for low power consumption, making it more sensitive to ESD than its predecessors. Extra care should be taken in the design of circuitry and pc board implementation to avoid ESD problems. Note 1: IO application time ≤ 50 µs, single pulse. 11. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Total capacitance (input to output) Isolation resistance Isolation voltage Symbol CS RS BVS Note Test Conditions Min Typ. Max Unit  1.0  pF 1014  Ω 3750   Vrms AC, 1 s in oil  10000  DC, 60 s in oil  10000  (Note 1) VS = 0 V, f = 1 MHz (Note 1) VS = 500 V, R.H. ≤ 60 % (Note 1) AC, 60 s 1× 1012 Vdc Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. ©2016 Toshiba Corporation 5 2016-04-18 Rev.8.0 TLP350H,TLP350HF 12. Switching Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 ) Characteristics Symbol Note Propagation delay time (L/H) tpLH (Note 1) Propagation delay time (H/L) tpHL Test Circuit Min Typ. Max Unit IF = 0 → 5 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF 50  500 ns (Note 1) IF = 5 → 0 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF 50  500 |tpHL-tpLH| (Note 1) IF = 0 ←→ 5 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF   350 Rise time tr (Note 1) IF = 0 → 5 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF  15  Fall time tf (Note 1) IF = 5 → 0 mA, VCC = 30 V, Rg = 20 Ω, Cg = 10 nF  8  Common-mode transient immunity at output high CMH (Note 2) VCM = 1000 Vp-p, IF = 5 mA, VCC = 30 V, Ta = 25 , VO(min) = 26 V ±20 ±25  Common-mode transient immunity at output low CML (Note 3) VCM = 1000 Vp-p, IF = 0 mA, VCC = 30 V, Ta = 25 , VO(max) = 1 V ±20 ±25  Pulse width distortion Fig. 13.1.7 Fig. 13.1.8 Test Condition kV/µs Note: All typical values are at Ta = 25 . Note 1: Input signal ( f = 25 kHz, duty = 50 %, tr = tf = 5 ns or less ). CL is approximately 15 pF which includes probe and stray wiring capacitance. Note 2: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic high state (VO > 26 V). Note 3: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic low state (VO < 1 V). ©2016 Toshiba Corporation 6 2016-04-18 Rev.8.0 TLP350H,TLP350HF 13. Test Circuits and Characteristics Curves 13.1. Test Circuits Fig. 13.1.1 IOPH Test Circuit Fig. 13.1.2 IOPL Test Circuit Fig. 13.1.3 VOH Test Circuit Fig. 13.1.4 VOL Test Circuit Fig. 13.1.5 ICCH Test Circuit Fig. 13.1.6 ICCL Test Circuit Fig. 13.1.7 Switching Time Test Circuit and Waveform Fig. 13.1.8 Common-Mode Transient Immunity Test Circuit and Waveform ©2016 Toshiba Corporation 7 2016-04-18 Rev.8.0 TLP350H,TLP350HF 13.2. Characteristics Curves (Note) Fig. 13.2.1 IF - VF Fig. 13.2.2 IF - Ta Fig. 13.2.3 PO - Ta Fig. 13.2.4 IFLH - Ta Fig. 13.2.5 ICCL - Ta Fig. 13.2.6 ICCH - Ta ©2016 Toshiba Corporation 8 2016-04-18 Rev.8.0 TLP350H,TLP350HF Fig. 13.2.7 VOL - Ta Fig. 13.2.8 VOH - Ta Fig. 13.2.9 VOL - IOPL Fig. 13.2.10 (VOH-VCC) - IOPH Fig. 13.2.11 VO(VUVLO) - VCC Fig. 13.2.12 tpLH,tpHL,|tpHL-tpLH| - Ta ©2016 Toshiba Corporation 9 2016-04-18 Rev.8.0 TLP350H,TLP350HF Fig. 13.2.13 tpLH,tpHL,|tpHL-tpLH| - IF Fig. 13.2.14 tpLH,tpHL,|tpHL-tpLH| - VCC NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. ©2016 Toshiba Corporation 10 2016-04-18 Rev.8.0 TLP350H,TLP350HF 14. Soldering and Storage 14.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. • When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 14.1.1 An example of a temperature profile when Sn-Pb eutectic solder is used • Fig. 14.1.2 An example of a temperature profile when lead(Pb)-free solder is used When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds. Mounting condition of 260  within 10 seconds is recommended. Flow soldering must be performed once. • When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not exceeding 350  Heating by soldering iron must be done only once per lead. 14.2. Precautions for General Storage • Avoid storage locations where devices may be exposed to moisture or direct sunlight. • Follow the precautions printed on the packing label of the device for transportation and storage. • Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %, respectively. • Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. • Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. • When restoring devices after removal from their packing, use anti-static containers. • Do not allow loads to be applied directly to devices while they are in storage. • If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. ©2016 Toshiba Corporation 11 2016-04-18 Rev.8.0 TLP350H,TLP350HF 15. Land Pattern Dimensions (for reference only) Unit: mm TLP350H TLP350HF Fig. 15.1 Lead forming and taping option (LF1), (TP1), (LF5), (TP5) Fig. 15.2 Lead forming and taping option (LF4), (TP4) 16. Marking (Note) TLP350H Note: TLP350HF A different marking is used for photocouplers that have been qualified according to option (D4) of EN60747. See Fig.17.4 and Fig.17.5. ©2016 Toshiba Corporation 12 2016-04-18 Rev.8.0 TLP350H,TLP350HF 17. EN60747-5-5 Option (D4) Specification • Part number: TLP350H, TLP350HF (Note 1) • The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN60747. Example: TLP350H(D4-TP1, F) D4: EN60747 option TP: Tape type F: [[G]]/RoHS COMPATIBLE (Note 2) Note 1: Use TOSHIBA standard type number for safety standard application. e.g., TLP350H(D4-TP1,F) → TLP350H Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. Fig. 17.1 EN60747 Isolation Characteristics ©2016 Toshiba Corporation 13 2016-04-18 Rev.8.0 TLP350H,TLP350HF Fig. 17.2 Insulation Related Specifications (Note) Note: Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e. g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall take suitable measures. This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 17.3 Marking on Packing for EN60747 Fig. 17.4 Marking Example (Note) Note: Fig. 17.5 Marking Example (Note) The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747. ©2016 Toshiba Corporation 14 2016-04-18 Rev.8.0 TLP350H,TLP350HF Fig. 17.6 Measurement Procedure ©2016 Toshiba Corporation 15 2016-04-18 Rev.8.0 TLP350H,TLP350HF Package Dimensions Unit: mm TLP350H Weight: 0.54 g (typ.) Package Name(s) TOSHIBA: 11-10C4S ©2016 Toshiba Corporation 16 2016-04-18 Rev.8.0 TLP350H,TLP350HF Package Dimensions Unit: mm TLP350H(LF1,TP1) Weight: 0.53 g (typ.) Package Name(s) TOSHIBA: 11-10C401S ©2016 Toshiba Corporation 17 2016-04-18 Rev.8.0 TLP350H,TLP350HF Package Dimensions Unit: mm TLP350H(LF5,TP5) Weight: 0.53 g (typ.) Package Name(s) TOSHIBA: 11-10C405S ©2016 Toshiba Corporation 18 2016-04-18 Rev.8.0 TLP350H,TLP350HF Package Dimensions Unit: mm TLP350HF Weight: 0.54 g (typ.) Package Name(s) TOSHIBA: 11-10C402S ©2016 Toshiba Corporation 19 2016-04-18 Rev.8.0 TLP350H,TLP350HF Package Dimensions Unit: mm TLP350HF(LF4,TP4) Weight: 0.53 g (typ.) Package Name(s) TOSHIBA: 11-10C404S ©2016 Toshiba Corporation 20 2016-04-18 Rev.8.0 TLP350H,TLP350HF RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. 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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. ©2016 Toshiba Corporation 21 2016-04-18 Rev.8.0