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TLP372(F)

TLP372(F)

  • 厂商:

    TOSHIBA(东芝)

  • 封装:

    6-DIP(0.300",7.62mm)

  • 描述:

    OPTOISOLTR 5KV DARLINGTON 6-DIP

  • 数据手册
  • 价格&库存
TLP372(F) 数据手册
TLP371,TLP372 TOSHIBA Photocoupler GaAs Ired & Photo−Transistor TLP371, TLP372 Office Machine Household Use Equipment Telecommunication Solid State Relay Programmable Controllers Unit in mm The TOSHIBA TLP371 and TLP372 consists of a gallium arsenide infrared emitting diode optically coupled to a darlington connected photo−transistor which has an integrated base−emitter resistor to optimize switching speed and elevated temperature characteristics in a six lead plastic DIP package. TLP372 is no−base internal connection for high−EMI environments. • Current transfer ratio: 1000% (min) (IF = 1mA) • Isolation voltage: 5000 Vrms (min) • UL recognized: UL1577, file no. E67349 TOSHIBA 11−7A8 Weight: 0.4g (typ.) Pin Configurations (top view) TLP372 TLP371 1 6 2 5 3 4 1 : Anode 2 : Cathode 3 : NC 4 : Emitter 5 : Collector 6 : Base 1 6 2 5 3 4 1 : Anode 2 : Cathode 3 : NC 4 : Emitter 5 : Collector 6 : NC 1 2007-10-01 TLP371,TLP372 Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit IF 60 mA ΔIF / °C −0.7 mA / °C Peak forward current (100μs pulse, 100pps) IFP 1 A Reverse voltage VR 5 V Junction temperature Tj 125 °C Collector−emitter voltage VCEO 300 V Collector−base voltage (TLP371) VCBO 300 V Emitter−collector voltage VECO 0.3 V Emitter−base voltage (TLP371) VEBO 7 V Collector current IC 150 mA Power dissipation PC 300 mW ΔPC / °C −3.0 mW / °C Tj 125 °C Storage temperature range Tstg −55~125 °C Operating temperature range Topr −55~100 °C Lead soldering temperature (10 s) Tsold 260 °C PT 350 mW ΔPT / °C −3.5 mW / °C BVS 5000 Vrms Forward current Detector LED Forward current derating (Ta ≥ 39°C) Power dissipation derating (Ta ≥ 25°C) Junction temperature Total package power dissipation Total package power dissipation derating (Ta ≥ 25°C) Isolation voltage (AC, 1min., R.H. ≤ 60%) (Note 1) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Device considered a two terminal device: Pins 1, 2 and 3 shorted together and pins 4,5 and 6 shorted together. Recommended Operating Conditions Characteristic Symbol Min Typ. Max Unit Supply voltage VCC ― ― 200 V Forward current IF ― 16 25 mA Collector current IC ― ― 120 mA Topr −25 ― 85 °C Operating temperature Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. 2 2007-10-01 TLP371,TLP372 Individual Electrical Characteristics (Ta = 25°C) Detector LED Characteristic Symbol Test Condition Min Typ. Max Unit Forward voltage VF IF = 10 mA 1.0 1.15 1.3 V Reverse current IR VR = 5 V ― ― 10 μA Capacitance CT V = 0, f = 1 MHz ― 30 ― pF Collector−emitter breakdown voltage V(BR) CEO IC = 0.1 mA 300 ― ― V Emitter−collector breakdown voltage V(BR) ECO IE = 0.1 mA 0.3 ― ― V Collector−base breakdown voltage (TLP371) V(BR) CBO IC = 0.1 mA 300 ― ― V Emitter−base breakdown voltage (TLP371) V(BR) EBO IE = 0.1 mA 7 ― ― V VCE = 200 V ― 10 200 nA VCE = 200 V Ta = 85 °C ― ― 20 μA Collector dark current ICEO Collector dark current (TLP371) ICER VCE = 200 V Ta = 85 °C, RBE = 10 MΩ ― 0.5 10 μA Collector dark current (TLP371) ICBO VCE = 200 V ― 0.1 ― nA DC forward current gain (TLP371) hFE VCE = 5 V, IC = 10 mA ― 7000 ― ― Capacitance (collecter to emitter) CCE V = 0, f = 1 MHz ― 10 ― pF Coupled Electrical Characteristics (Ta = 25°C) Characteristic Current transfer ratio Saturated CTR Base photo−current (TLP371) Collector−emitter saturation voltage Symbol Test Condition MIn Typ. Max Unit % IC / IF IF = 1 mA, VCE = 1 V 1000 4000 ― IC / IF (sat) IF = 10 mA, VCE = 1 V 500 ― ― % IPB IF = 1 mA, VCB = 1 V ― 6 ― μA IC = 10 mA, IF = 1 mA ― ― 1.0 IC = 100 mA, IF = 10 mA 0.3 ― 1.2 VCE (sat) 3 V 2007-10-01 TLP371,TLP372 Isolation Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Capacitance (input to output) CS VS = 0, f = 1 MHz Isolation resistance RS VS = 500 V BVS Typ. Max Unit ― 0.8 ― pF ― Ω 10 5×10 AC, 1 minute Isolation voltage Min 10 14 5000 ― ― AC, 1 second, in oil ― 10000 ― DC, 1 minute, in oil ― 10000 ― Vdc Min Typ. Max Unit ― 40 ― ― 15 ― ― 50 ― ― 15 ― ― 3 ― ― 45 ― ― 90 ― ― 5 ― ― 40 ― ― 80 ― Vrms Switching Characteristics (Ta = 25°C) Characteristic Symbol Rise time tr Fall time tf Turn−on time ton Turn−off time toff Turn−on time tON Storage time ts Turn−off time tOFF Turn−on time tON Storage time ts Turn−off time tOFF Test Condition VCC = 10 V IC = 10 mA RL = 100Ω RL = 180Ω RBE = OPEN VCC = 5 V, IF = 16 mA (Fig.1) RL = 180Ω RBE = 10 MΩ(TLP371) VCC = 10 V, IF = 16 mA (Fig.1) μs μs μs Fig.1: Switching time test circuit IF RL RBE VCC VCE IF VCE tON 4 ts VCC 9V 1V tOFF 2007-10-01 TLP371,TLP372 IF – Ta 80 60 40 20 0 −20 0 20 40 PC – Ta 400 Allowable collector power dissipation PC (mW) Allowable forward current IF (mA) 100 60 80 100 320 240 160 80 0 −20 120 0 Ambient temperature Ta (℃) IFP – DR 5000 40 60 100 80 120 IF – VF Ta = 25°C IF (mA) 50 1000 500 Forward current Pulse forward current IFP (mA) 100 Pulse width ≤ 100μs Ta = 25°C 3000 20 Ambient temperature Ta (℃) 300 100 50 30 30 10 5 3 1 0.5 0.3 10 3 10 −3 3 10 −2 3 10 −1 3 10 0 0.1 0.6 Duty cycle ratio DR 0.8 1.0 1.2 Forward ΔVF / ΔTa – IF 1.8 2.6 3.0 IFP – VFP −2.8 −2.4 −2.0 −1.6 −1.2 −0.8 −0.4 0.1 1.6 1000 Pulse forward current IFP (mA) Forward voltage temperature coefficient ΔVF / ΔTa (mV / ℃) −3.2 1.4 voltage VF (V) 500 300 100 50 30 10 Pulse width ≤ 10μs 5 Repetitive frequency 3 =100Hz Ta = 25°C 0.3 0.5 1 Forward 3 current 10 IF 30 1 0.6 50 (mA) 1.0 1.4 Pulse forward 5 1.8 2.2 voltage VFP (V) 2007-10-01 TLP371,TLP372 IC – VCE 10mA 140 4mA I C – IF 300 Ta = 25°C VCE = 1.2V Collector current IC (mA) Collector current IC (mA) 1V 2mA 120 100 80 1mA 60 40 50 30 10 5 3 IF = 0.5mA 20 100 Ta = 25°C 0 0.6 0.8 1.0 1.2 1.4 1.6 Collector−emitter voltage 1.8 1 0.2 2.0 0.5 1 VCE (V) Switching Time – RL OFF (IF = 16mA) 100 t OFF (IF = 1.6mA) 50 30 t ON (IF = 1.6mA) 10 5 30 50 Ta = 25°C 10000 5000 3000 VCE = 1.2V 1000 1V 500 300 3 t 1 30 50 30000 Current transfer ration IC / IF (%) (μs) Switching time t 30 IF (mA) 50000 Ta = 25°C VCC = 10V 300 10 current I C / IF – I F 1000 500 3 Forward 50 100 300 500 Load ON (IF = 16mA) 1K 3K 5K 100 0.3 10K resistance RL (Ω) 0.5 3 1 Forward 6 5 current 10 IF (mA) 2007-10-01 TLP371,TLP372 10 ICEO – VCE 1 ICEO – Ta Ta = 25°C 10 10 Collector dark current ICEO (μA) Collector dark current ICEO (μA) RBE = OPEN 0 RBE = 10 MΩ (TLP371) 10 10 0 −1 VCE = 200V 10 10 1 150V −2 80V −1 10 10 30 50 300 100 Collector−emitter voltage −3 500 0 20 VCE (V) 40 Ambient temperature Ta IC – Ta VCE = 1V IF = 10mA 100 60 1mA 20 0 (℃) VCE = 1V 1.2 80 40 100 IC – Ta 1.4 Collector current IC Collector current IC (mA) 120 80 60 IF = 10mA 1.0 1mA 0.8 0.6 0.4 −20 0.2 0 20 40 60 80 100 Ambient temperature Ta (℃) −20 0 20 40 60 80 100 Ambient temperature Ta (℃) 7 2007-10-01 TLP371,TLP372 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 8 2007-10-01
TLP372(F) 价格&库存

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