TLP3902
TOSHIBA PHOTOCOUPLER IRED & PHOTO-DIODE ARRAY
TLP3902
SOLID STATE RELAY
PROGRAMMABLE CONTROLLERS
MOSFET GATE DRIVER
Unit: mm
The TOSHIBA mini flat coupler TLP3902 is a small outline coupler, suitable
for surface mount assembly.
The TLP3902 consists of an infrared emitting diode, optically coupled to a
series connected photo diode array which is suitable for MOS FET gate
drive.
Features
•
Open Voltage
: 7 V (min)
•
Short Current
: 5 μA (min)
•
Isolation Voltage
: 2500 Vrms (min)
•
UL-recognized
: UL 1577, File No.E67349
•
cUL-recognized
:CSA Component Acceptance Service No.5A
File No.E67349
TOSHIBA
Pin Configuration (top view)
1
3
11-4C1
Weight: 0.09 g (typ.)
6
4
1. ANODE
3. CATHODE
4. CATHODE
6. ANODE
Start of commercial production
© 2019
Toshiba Electronic Devices & Storage Corporation
1
2006-06
2019-06-24
TLP3902
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Forward Current
Rating
Unit
IF
50
mA
ΔIF / °C
-0.5
mA / °C
Reverse Voltage
VR
5
V
Diode power dissipation
PD
100
mW
ΔPD /°C
-1.0
mW/°C
Tj
125
°C
Forward Current
IFD
50
μA
Reverse Voltage
VRD
10
V
Output power dissipation
PO
0.5
mW
Junction Temperature
Tj
125
°C
Storage Temperature Range
Tstg
-55 to 125
°C
Operating Temperature Range
Topr
-40 to 85
°C
Lead Soldering Temperature (10 s)
Tsol
260
°C
BVS
2500
Vrms
Forward Current Derating (Ta ≥ 25°C)
LED
Diode power dissipation derating (Ta ≥ 25°C)
Junction Temperature
DETECTOR
Isolation Voltage (AC, 60 s, R.H. ≤ 60 %)
(Note 1)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two terminal device: Pins 1 and 3 shorted together and pins 4 and 6 shorted together.
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ.
Max
Unit
IF
7
—
20
mA
Topr
-25
—
65
°C
Forward Current
Operating Temperature
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Electrical Characteristics (Ta = 25°C)
Characteristic
LED
DETECTOR
Symbol
Test Condition
Min
Typ.
Max
Unit
1.10
1.15
1.3
V
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
—
—
10
μA
Capacitance
CT
V = 0 V, f = 1 MHz
—
30
—
pF
Forward Voltage
VFD
IFD = 10 μA
—
9.6
—
V
Reverse Current
IRD
VRD = 10 V
—
1
—
nA
Capacitance
(Anode to Cathode)
CTD
V = 0 V, f = 1 MHz
—
8
—
pF
© 2019
Toshiba Electronic Devices & Storage Corporation
2
2019-06-24
TLP3902
Coupled Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Open-Circuit Voltage
VOC
IF = 10 mA
7
9.5
—
V
Short-Circuit Current
ISC
IF = 10 mA
5
10
—
μA
Min
Typ.
Max
Unit
—
0.8
—
pF
5×1010
1014
—
Ω
2500
—
—
Vrms
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Capacitance Input to Output
CS
VS = 0 V, f = 1 MHz
Isolation Resistance
RS
VS = 500 V, R.H. ≤ 60 %
Isolation Voltage
BVS
AC, 60 s
Switching Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Turn-on Time
tON
—
0.6
—
ms
Turn-off Time
tOFF
IF = 10 mA, RSH = 1 MΩ
CL = 1000 pF
(Note 2)
—
2
—
ms
Note 2: SWITCHING TIME TEST CIRCUIT
IF
VOUT
RSH
IF
CL
VOUT
0V
RSH: External Shunt Resistance
© 2019
Toshiba Electronic Devices & Storage Corporation
3
5V
1V
tON
tOFF
2019-06-24
TLP3902
I F ─ Ta
90
80
70
60
50
40
30
20
10
0
-20
0
20
40
I F ─ VF
100
FORWARD CURRENT I F (mA)
ALLOWABLE FORWARD CURRENT
I F (mA)
100
60
80
100
Ta = 25 °C
50
30
10
5
3
1
0.5
0.3
0.1
0.6
120
0.8
AMBIENT TEMPERATURE Ta (°C)
I O ─ VO
40
5 mA
10 mA
15 mA
20 mA
25 mA
0
2
4
6
8
OUTPUT VOLTAGE
VO (V)
13
12
9
8
Ta = 25 °C
RSH = OPEN
2.2MΩ
7
1MΩ
6
510kΩ
5
4
3
2
1
0
1
3
5
10
10
1.8
1MΩ
510kΩ
3
510kΩ
1MΩ
1
2.2MΩ
0.3
0.1
0.03
102
103
300
50
FORWARD CURRENT I F (mA)
CL (pF)
Ta = 25 °C
30
10
5
3
1
30
104
3000
ISC ─ I F
100
11
10
1.6
RSH=2.2MΩ
LOAD CAPACITANCE
VOC ─ I F
14
1.4
Ta = 25 °C
I F = 10 mA
tON
tOFF
30
0.01
10
I SC (µA)
-40
OPEN VOLTAGE VOC (V)
SWITCHING TIME tON,tOFF (ms)
IF =0 mA
SHORT CURRENT
OUTPUT CURRENT I O (µA)
20
-20
1.2
tON,tOFF ─ CL
100
Ta = 25 °C
0
1
FORWARD VOLTAGE VF (V)
1
3
5
30
10
FORWARD CURRENT I F (mA)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
© 2019
Toshiba Electronic Devices & Storage Corporation
4
2019-06-24
TLP3902
VOC ─ Ta
14
I F = 10 mA
18
SHORT CURRENT I SC (µA)
OPEN VOLTAGE VOC (V)
13
12
11
10
9
8
7
6
5
4
-20
0
20
40
ISC ─ Ta
20
60
80
16
14
12
10
8
6
4
2
0
-20
100
AMBIENT TEMPERATURE Ta (°C)
I F = 10 mA
0
20
40
60
80
100
AMBIENT TEMPERATURE Ta (°C)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
© 2019
Toshiba Electronic Devices & Storage Corporation
5
2019-06-24
TLP3902
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
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© 2019
Toshiba Electronic Devices & Storage Corporation
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2019-06-24