TLP3914
TOSHIBA PHOTOCOUPLER
IRED & PHOTO−DIODE ARRAY
TLP3914
TELECOMMUNICATION
PROGRAMMABLE CONTROLLERS
MOSFET GATE DRIVER
Unit: mm
4.2
φ1.4
②
④
①
3.65
1.9
0.15
1.8
The TOSHIBA SSOP coupler TLP3914 is a small outline coupler, suitable for
surface mount assembly.
The TLP3914 consists of an infrared emitting diode, optically coupled to a series
connected photo diode array which is suitable for MOSFET gate drive.
③
0.2
3.8
0.2
1.27
(0.3)
2.04
Features
(0.46)
● 4 pin SSOP (SSOP4) : 1.8 mm high, 1.27 mm pitch
● Open Voltage
: 7 V (min)
● Short Current
: 20 μA (min)
● Isolation Voltage
: 1500 Vrms (min)
● UL-recognized
: UL 1577, File No.E67349
There is a detail drawing in P6.
TOSHIBA
11-2B1
Weight: 0.03 g (typ.)
Pin Configuration (top view)
1
2
4
3
1. ANODE
2. CATHODE
3. CATHODE
4. ANODE
Start of commercial production
2004-06
© 2017 - 2019
Toshiba Electronic Devices & Storage Corporation
1
2019-06-24
TLP3914
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
IF
30
mA
ΔIF / °C
-0.3
mA / °C
Reverse Voltage
VR
5
V
Diode power dissipation
PD
50
mW
ΔPD /°C
-0.5
mW/°C
Tj
125
°C
Forward Current
IFD
50
μA
Reverse Voltage
VRD
10
V
Output power dissipation
PO
0.5
mW
Junction Temperature
Tj
125
°C
Storage Temperature Range
Tstg
-55 to 125
°C
Operating Temperature Range
Topr
-40 to 85
°C
Forward Current
Forward Current
Derating (Ta ≥ 25°C)
LED
Diode power dissipation derating (Ta ≥ 25°C)
Junction Temperature
DETECTOR
Lead Soldering Temperature (10 s)
Isolation Voltage (AC, 60 s, R.H. ≤ 60 %)
(Note 1)
Tsol
260
°C
BVS
1500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two terminal device: Pins 1 and 2 shorted together and pins 3 and 4 shorted together.
Caution
This device is sensitive to electrostatic discharge. When using this device, please ensure that all tools and equipment
are earthed.
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ.
Max
Unit
IF
7
—
20
mA
Topr
-25
—
65
°C
Forward Current
Operating Temperature
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Electrical Characteristics (Ta = 25°C)
Characteristic
LED
DETECTOR
Symbol
Test Condition
Min
Typ.
Max
Unit
1.15
1.30
1.45
V
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
—
—
10
μA
Capacitance
CT
V = 0 V, f = 1 MHz
—
30
—
pF
Forward Voltage
VFD
IFD = 10 μA
—
9.6
—
V
Reverse Current
IRD
VRD = 10 V
—
1
—
nA
Capacitance
(Anode to Cathode)
CTD
V = 0 V, f = 1 MHz
—
2.5
—
pF
© 2017 - 2019
Toshiba Electronic Devices & Storage Corporation
2
2019-06-24
TLP3914
Coupled Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Open-Circuit Voltage
VOC
IF = 10 mA
7
—
—
V
Short-Circuit Current
ISC
IF = 10 mA
20
—
—
μA
Min
Typ.
Max
Unit
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Capacitance Input to Output
CS
VS = 0 V, f = 1 MHz
Isolation Resistance
RS
VS = 500 V, R.H. ≤ 60 %
Isolation Voltage
BVS
—
0.8
—
pF
5×1010
1014
—
Ω
1500
—
—
Vrms
AC, 60 s
Switching Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Turn-on Time
tON
—
0.6
—
ms
Turn-off Time
tOFF
IF = 10 mA, RSH = 300 kΩ
(Note 1)
CL = 1000 pF
—
0.3
—
ms
Note 1: SWITCHING TIME TEST CIRCUIT
IF
VOUT
RSH
IF
CL
VOUT
0V
RSH: External Shunt Resistance
© 2017 - 2019
Toshiba Electronic Devices & Storage Corporation
3
5V
1V
tON
tOFF
2019-06-24
TLP3914
I F - Ta
I F - VF
100
I F (mA)
FORWARD CURRENT
40
30
20
10
0
-20
0
20
40
60
80
AMBIENT TEMPERATURE
-60
20 mA
-80
25 mA
0
2
4
6
8
OUTPUT VOLTAGE
Vo (V)
13
I S C (µA)
RSH = OPEN
9
8
2.2MΩ
7
1MΩ
6
510kΩ
5
4
300kΩ
3
2
1
0
1
3
1
1.1
5
FORWARD CURRENT
1.2
10
1.3
1.4
I F (mA)
1.6
VF (V)
Ta = 25 °C
I F = 10 mA
tON
tOFF
30
10
RSH=2.2MΩ
1MΩ
510kΩ
300kΩ
3
300kΩ
510kΩ
1MΩ
1
2.2MΩ
0.3
0.1
0.03
0.01
102
103
300
104
3000
CL (pF)
ISC - I F
Ta = 25 °C
50
30
10
5
3
1
30
1.5
tON,tOFF - CL
100
11
10
3
LOAD CAPACITANCE
Ta = 25 °C
12
VOC (V)
10
VOC - I F
14
OPEN VOLTAGE
tON,tOFF (ms)
15 mA
SHORT CURRENT
I O (μA)
OUTPUT CURRENT
10 mA
-40
5
100
5 mA
-20
10
FORWARD VOLTAGE
IF =0 mA
0
30
Ta (°C)
Ta = 25 °C
20
Ta = 25 °C
50
1
120
I O – VO
40
-100
100
SWITCHING TIME
ALLOWABLE FORWARD CURRENT
I F (mA)
50
1
3
5
10
FORWARD CURRENT
30
50
100
I F (mA)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production
test, unless otherwise noted.
© 2017 - 2019
Toshiba Electronic Devices & Storage Corporation
4
2019-06-24
TLP3914
VOC - Ta
ISC - Ta
14
50
I F = 10 mA
I SC (µA)
I F = 10 mA
12
11
10
SHORT CURRENT
OPEN VOLTAGE
VOC (V)
13
9
8
7
6
5
4
-20
0
20
40
60
AMBIENT TEMPERATURE
80
40
30
20
10
0
-20
100
Ta (°C)
0
20
40
60
AMBIENT TEMPERATURE
80
100
Ta (°C)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production
test, unless otherwise noted.
© 2017 - 2019
Toshiba Electronic Devices & Storage Corporation
5
2019-06-24
TLP3914
OUTLINE DRAWING
4.2
Unit: mm
φ1.4
Unless otherwise specified: ±0.1
③
②
④
①
3.65
0.2
0.15
1.8
1.9
3.8
0.2
1.27
(0.3)
2.04
(0.46)
© 2017 - 2019
Toshiba Electronic Devices & Storage Corporation
6
2019-06-24
TLP3914
RESTRICTIONS ON PRODUCT USE
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Hardware, software and systems described in this document are collectively referred to as “Product”.
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
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written permission, reproduction is permissible only if reproduction is without alteration/omission.
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complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to
property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the
Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information,
including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and
conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product
will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited
to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the
applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any
other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
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OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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© 2017 - 2019
Toshiba Electronic Devices & Storage Corporation
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2019-06-24