TLP550(F

TLP550 TOSHIBA Photocoupler Infrared LED + Photo IC TLP550 Digital Logic Isolation Line Receiver Feedback Control Power Supply Control Switching Power Supply Transistor Inverter Unit: mm TLP550 consists of a high emitting diode and a one chip photo diode− transistor. TLP550 has no base connection, and is suitable for application at noisy environmental condition. This unit is 8−lead DIP package.  Isolation voltage : 2500 Vrms (min)  Propagation delay time (tpHL / tpLH): tpHL = 0.5μs (typ.), tpLH = 0.6μs (typ.) (RL=1.9 kΩ) TOSHIBA 11−10C4 Weight: 0.54 g (typ.)  TTL compatible  UL recognized: UL1577, file No. E67349 Pin Configuration (top view) 1 8 2 7 3 6 4 5 1 : N.C. 2 : Anode 3 : Cathode 4 : N.C. 5 : Emitter 6 : Collector 7 : N.C. 8 : Cathode Schematic ICC VCC IF 8 2 VF 3 IO 6 5 VO GND Start of commercial production 1981/09 1 2014-09-01 TLP550 Current Transfer Ratio Classification Current Transfer Ratio (%) (IC/IF) Min Marking of Classification Max (None) 10 ― Blank, O, Y Rank O 19 ― O Rank Y 35 ― Y Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit (Note 1) IF 25 mA Pulse forward current (Note 2) IFP 50 mA Peak transient forward current (Note 3) IFPT 1 A VR 5 V PD 45 mW IO 8 mA Peak output current IOP 16 mA Supply voltage VCC −0.5~15 V Output voltage VO −0.5~15 V PO 100 mW Operating temperature range Topr −55~100 °C Storage temperature range Tstg −55~125 °C Lead solder temperature (10s) Tsol 260 °C BVS 2500 Vrms LED Forward current Reverse voltage Diode power dissipation (Note 4) Detector Output current Output power dissipation (Note 5) Isolation voltage (AC, 1minute, R.H. = 40 to 60%) (Note 6) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (Note 1) Derate 0.8mA above 70°C. (Note 2) 50% duty cycle, 1ms pulse width. Derate 1.6mA / °C above 70°C. (Note 3) Pulse width 1μs, 300pps. (Note 4) Derate 0.9mW / °C above 70°C. (Note 5) Derate 2mW / °C above 70°C. 2 2014-09-01 TLP550 Electrical Characteristics (Ta = 25°C) Characteristic Symbol Detector LED Forward voltage Forward voltage temperature coefficient Test condition Typ. Max Unit VF IF = 16 mA 1.45 1.65 1.85 V ∆VF /∆Ta IF = 16 mA ― −2 ― mV / °C Reverse current IR VR = 5 V ― ― 10 μA Capacitance between terminal CT VF = 0, f = 1MHz ― 60 ― pF IOH (1) IF = 0 mA, VCC = VO = 5.5 V ― 3 500 nA IOH (2) IF = 0 mA, VCC = VO = 15 V ― ― 5 μA IOH IF = 0 mA, VCC = VO = 15 V Ta = 70°C ― ― 50 μA IF = 0 mA, VCC = 15 V ― 0.01 1 μA 10 40 ― Rank: O 19 40 ― Rank: Y 35 50 Ta = 0~70°C 5 ― ― 15 ― ― ― 0.4 V ― Ω ― pF High level output current High level supply voltage ICCH Ta = 25°C Current transfer ratio Coupled Min IO / IF IF = 16 mA VCC = 4.5 V VO = 0.4 V Rank: O, Y % Low level output voltage VOL IF = 16 mA, VCC = 4.5 V IO = 1.1 mA (rank O: IO = 2.4mA) ― Isolation resistance RS R.H. = 40~60%, V = 1kV DC (Note 6) ― Capacitance between input to output CS V = 0, f = 1MHz ― 0.8 Min Typ. Max ― 0.3 0.8 ― 0.5 0.8 ― 1.0 2.0 ― 0.6 1.2 ― 1500 ― V /μs ― −1500 ― V /μs 10 12 Switching Characteristics (Ta = 25°C) Characteristic Symbol Test Condition IF = 0→ 16 mA, VCC = 5V, RL = 4.1 kΩ Propagation delay time (H→ L) tpHL Propagation delay time (L→ H) tpLH Common mode transient immunity at high output level CMH Common mode transient immunity at low output level CML Unit μs (Note 7) Rank O: RL = 1.9 kΩ IF = 16→ 0 mA, VCC = 5V, RL = 4.1 kΩ μs (Note 7) Rank O: RL = 1.9 kΩ IF = 0 mA, VCM = 200 Vp−p RL = 4.1 kΩ (rank O: RL = 1.9 kΩ) (Note 8) IF = 16 mA, VCM = 200 Vp−p RL = 4.1 kΩ (rank O: RL = 1.9 kΩ) (Note 8) (Note 6) Device considered two−terminal device: Pins 1, 2, 3 and 4 shorted together and pin 5, 6, 7 and 8 shorted together. 3 2014-09-01 TLP550 (Note 7) Switching time test circuit. IF IF VCC=5V 1 8 PW = 100μs Duty ratio = 1 / 10 IF monitor 2 7 3 6 VO 51Ω Pulse input 4 5 Output monitor 0 RL VO 5V 1.5V VOL 1.5V tpHL tpLH (Note 8) Common mode transient immunity test circuit. IF 1 8 2 7 VCC=5V 90% VCM 10% RL 3 6 VO 4 5 Output monitor tr VO (IF = 0mA) VCM VO (IF = 16mA) Pulse gen 200V 0V tf 5V 2V 0.8V VOL ZO=50Ω CMH= 160 (V) tf (μs) , CML= 160 (V) tf (μs) (Note 9) Maximum electrostatic discharge voltage for any pins: 100V (C = 200pF, R = 0) 4 2014-09-01 TLP550 IF – V F (mA) 10 Forward current IF 50 30 3 Ta = 25°C 5 1 0.5 0.3 0.1 0.05 0.03 0.01 1.0 ∆VF / ∆Ta – IF −2.6 Forward voltage temperature coefficient ∆VF / ∆Ta (mV / ℃) 100 1.4 1.2 1.6 Forward voltage VF −2.2 −2.0 −1.8 −1.6 −1.4 0.1 2.0 1.8 −2.4 0.3 0.5 1 3 Forward current (V) (mA) 10 (mA) 100 50 IO 30 Output current IOH (μA) High level output current 30 lO – IF IOH (1) – Ta 300 10 5 3 VCC = 5V 5 VO = 0.4V 3 Ta = 25°C 1 0.5 0.3 0.1 0.05 0.03 1 0.6 0 40 80 120 0.01 0.1 160 0.3 0.5 1 IO / IF – IF 100 3 5 10 Forward current Ambient temperature Ta (℃) 30 50 100 IF 300 (mA) IO / IF – Ta 1.2 VCC = 5V VO = 0.4V 50 1.0 30 Ta = −25°C Normalized IO / IF Current transfer ratio IO / IF (%) IF 10 5 100°C 10 25°C 5 3 0.8 0.6 Normalized To : 0.4 IF = 16mA VCC = 4.5V VO = 0.4V 0.2 Ta = 25°C 1 0.3 0.5 1 3 5 Forward current IF 10 30 0 −40 50 −20 0 20 40 60 80 100 (mA) Ambient temperature 5 Ta (℃) 2014-09-01 TLP550 IO – V O VO – IF 5 30mA VCC = 5V 10 4 15mA 4 10mA IF=5mA 2 0 0 RL (V) 20mA Output voltage VO Output current IO (mA) 25mA 8 6 VO 3 Ta=25°C 2 RL=2kΩ 3.9kΩ 10kΩ 1 0 1 2 3 4 5 Output voltage VO VCC = 5V IF Ta = 25°C 6 7 0 (V) 4 8 12 16 Forward current IF 20 24 (mA) tpHL, tpLH – RL 5 Propagation delay time tpLH, tpHL (μs) 3 IF = 16mA VCC = 5V Ta = 25°C tpLH 1 0.5 0.3 tpHL 0.1 1 3 5 10 30 50 100 Load resistance RL (kΩ) 6 2014-09-01 TLP550 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 7 2014-09-01