TLP559
TOSHIBA Photocoupler IRED & Photo IC
TLP559
Digital Logic Ground Isolation
Line Receiver
Microprocessor System Interfaces
Switching Power Supply Feedback Control
Transistor Inverter
Unit: mm
The TOSHIBA TLP559 consists of a high−output infrared emitting diode
and a high speed detector of one chip photo diode−transistor. This unit is
8−lead DIP package.
TLP559 has no internal base connection, and a Faraday shield integrated
on the photodetector chip provides an effective common mode noise
transient immunity.
So this is suitable for application in noisy environmental condition.
•
Isolation voltage: 2500 Vrms (min)
•
Switching speed: tpHL = 0.2μs (typ.)
tpLH = 0.3μs (typ.) (RL = 1.9kΩ)
TOSHIBA
11−10C4S
Weight: 0.54 g (typ.)
•
TTL compatible
•
UL-recognized: UL 1577, File No.E67349.
•
cUL-recognized: CSA Component Acceptance Service No.5A
File No.E67349.
Pin Configuration (top view)
8
1
2
7
3
6
4
5
Shield
1 : N.C.
2 : Anode
3 : Cathode
4 : N.C.
5 : Emitter
6 : Collector
7 : N.C.
8 : VCC
Schematic
ICC
2
VF
IF
8
VCC
IO
3
6
Shield
5
VO
GND
Start of commercial production
1987-09
© 2019
Toshiba Electronic Devices & Storage Corporation
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2019-06-24
TLP559
Absolute Maximum Ratings (Ta = 25°C)
LED
Characteristic
Symbol
Rating
Unit
Forward current
(Note 1)
IF
25
mA
Pulse forward current
(Note 2)
IFP
50
mA
Peak transient forward current
(Note 3)
IFPT
1
A
VR
5
V
Reverse voltage
PD
45
mW
Output current
IO
8
mA
Peak output current
IOP
16
mA
Output voltage
VO
−0.5 to 15
V
Supply voltage
VCC
−0.5 to 15
V
PO
100
mW
Operating temperature range
Topr
−55 to 100
°C
Storage temperature range
Tstg
−55 to 125
°C
Detector
Diode power dissipation
(Note 4)
Output power dissipation
(Note 5)
Lead solder temperature (10 s)
(Note 6)
Tsol
260
°C
Isolation voltage (AC, 60 s, R.H. ≤ 60 %)
(Note 7)
BVS
2500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1)
Derate 0.8mA above 70 °C.
(Note 2)
50 % duty cycle,1 ms pulse width.Derate 1.6 mA / °C above 70 °C.
(Note 3)
Pulse width ≤ 1μs, 300 pps.
(Note 4)
Derate 0.9 mW / °C above 70 °C.
(Note 5)
Derate 2 mW / °C above 70 °C.
(Note 6)
Soldering portion of lead: up to 2 mm from body of the devise.
(Note 7)
Device considered a two-terminal device: Pins 1, 2, 3 and 4 shorted together and pins 5, 6, 7 and 8 shorted
together.
© 2019
Toshiba Electronic Devices & Storage Corporation
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TLP559
Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
LED
Typ.
Max
Unit
IF = 16 mA
―
1.65
1.85
V
ΔVF / ΔTa
IF = 16 mA
―
−2
―
mV / °C
Reverse current
IR
VR = 5 V
―
―
10
μA
Capacitance between terminal
CT
VF = 0 V, f = 1 MHz
―
45
―
pF
IOH (1)
IF = 0 mA, VCC = VO = 5.5 V
―
3
500
nA
IOH (2)
IF = 0 mA, VCC = VO = 15 V
―
―
5
IOH
IF = 0 mA, VCC = 15 V
VO = 15 V, Ta = 70 °C
―
―
50
High level supply voltage
ICCH
IF = 0 mA, VCC = 15 V
―
0.01
1
μA
Supply voltage
VCC
ICC = 0.01 mA
15
―
―
V
Output voltage
VO
IO = 0.5 mA
15
―
―
V
Min
Typ.
Max
Unit
IF = 16 mA, VCC = 4.5 V,
VO = 0.4 V
20
40
―
IF = 16 mA, VCC = 4.5 V,
VO = 0.4 V, Ta = 0 to 70 °C
15
―
―
IF = 16 mA, VCC = 4.5 V, IO = 2.4 mA
―
―
0.4
V
Min
Typ.
Max
Unit
―
0.8
―
pF
High level output current
Detector
Min
VF
Forward voltage
Forward voltage
temperature coefficient
Test Condition
μA
Coupled Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Current transfer ratio
IO/IF
Low level output voltage
VOL
Test Condition
%
Isolation Characteristics (Ta = 25°C)
Characteristics
Capacitance (input-output)
Resistance (input-output)
Isolation voltage
Symbol
(Note 7)
(Note 7)
(Note 7)
Test Condition
CS
VS = 0 V, f = 1 MHz
RS
R.H. ≤ 60 %, VS = 500 VDC
5×
1010
1014
―
Ω
BVS
AC, 60 s
2500
―
―
Vrms
Min
Typ.
Max
Unit
―
0.2
0.8
μs
―
0.3
0.8
μs
IF = 0 mA, VCM = 400 Vp−p
RL = 4.1 kΩ
2000
10000
―
V / μs
IF =16 mA, VCM = 400 Vp−p
RL = 4.1kΩ
−2000 −10000
―
V / μs
Switching Characteristics (Ta = 25°C、VCC = 5V)
Characteristic
Propagation delay time
Symbol
(H→ L)
tpHL
(L→ H)
tpLH
Common mode transient immunity
at logic high output
(Note 8)
CMH
Common mode transient immunity
at logic high output
(Note 8)
CML
Propagation delay time
Test
Circuit
1
2
Test Condition
IF = 16 mA, RL = 1.9 kΩ
(Note 8) CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage
in the logic low state (VO < 0.8 V).
CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage
in the logic high state (VO > 2.0 V).
© 2019
Toshiba Electronic Devices & Storage Corporation
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TLP559
Test Circuit 1: Switching Time Test Circuit
IF
Pulse input
51Ω
PW=100μs
Duty ratio=1 / 10
IF monitor
VCC = 5V
1
8
2
7
3
6
VO
4
5
Output
monitor
IF
0
RL
VO
5V
1.5V
1.5V
VOL
tpLH
tpHL
Test Circuit 2: Common Mode Noise Immunity Test Circuit
IF
VCC=5V
1
8
2
7
3
6
VO
4
5
Output
monitor
90%
VCM
RL
10%
tr
VO
(IF=0mA)
VCM
VO
(IF=16mA)
Pulse generator
ZO=50Ω
tf
400V
0V
5V
2V
0.8V
VOL
320(V)
320(V)
CMH =
, CML =
t r (µs)
t f (µs)
© 2019
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TLP559
IF – VF
(mA)
10
Forward current IF
50
30
3
5
1
0.5
0.3
0.1
0.05
0.03
0.01
1.0
ΔVF / ΔTa – IF
−2.6
Ta = 25°C
Forward voltage temperature
coefficient ΔVF / ΔTa (mV / °C)
100
1.4
1.2
1.6
Forward voltage
VF
−2.2
−2.0
−1.8
−1.6
−1.4
0.1
2.0
1.8
−2.4
0.3
0.5
1
3
Forward current
(V)
30
(mA)
lO – I F
IOH (1) – Ta
10
300
Output current IO (mA)
100
High level output current
IOH (μA)
IF
10
5
50
30
10
5
3
VCC = 5V
5
VO = 0.4V
3
Ta = 25°C
1
0.5
0.3
0.1
0.05
0.03
1
0.6
0
40
80
120
0.01
0.1
160
0.3 0.5
1
10
IF
30 50 100
300
(mA)
IO / IF – Ta
IO / IF – IF
1.2
VCC = 5V
VO = 0.4V
50
1.0
30
IO / IF
Ta = –25°C
25°C
10
100°C
Normalized
Current transfer ratio
IO / IF (%)
5
Forward current
Ambient temperature Ta (°C)
100
3
5
0.8
0.6
Normalized To :
0.4
IF = 16mA
VCC = 4.5V
3
VO = 0.4V
0.2
Ta = 25°C
1
0.3
0.5
1
3
Forward current
5
10
IF
(mA)
30
0
−40
50
−20
0
20
40
60
80
100
Ambient temperature Ta (°C)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
© 2019
Toshiba Electronic Devices & Storage Corporation
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TLP559
IO – VO
VO – IF
5
30mA VCC = 5V
Ta = 25°C
10
15mA
4
10mA
IF=5mA
2
0
1
2
3
4
Output voltage
5
VO
RL
(V)
VO
20mA
6
0
4
Output voltage
Output current IO (mA)
25mA
8
VCC =5V
IF
6
VO
3
Ta=25°C
2
3.9kΩ
(V)
10kΩ
1
0
7
RL=2kΩ
0
4
8
12
Forward current
16
IF
20
24
(mA)
tpHL, tpLH – RL
5
Propagation delay time
tpLH, tpHL (μs)
3
IF = 16mA
VCC = 5V
Ta = 25°C
tpLH
1
0.5
0.3
tpHL
0.1
1
3
5
10
30
50
100
Load resistance RL (kΩ)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
© 2019
Toshiba Electronic Devices & Storage Corporation
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TLP559
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
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TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
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Toshiba Electronic Devices & Storage Corporation
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