TLP700(F)

TLP700 TOSHIBA Photocoupler GaAℓAs IRED + Photo IC Unit: mm 4.58±0.25 Guaranteed performance over temperature: -40 to 100°C • Supply current: 2.0 mA (max) • Power supply voltage: 15 to 30 V • Threshold input current: IFLH = 5 mA (max) • Switching time (tpLH / tpHL): 500 ns (max) • Common mode transient immunity: ±15 kV/μs (min) • Isolation voltage: 5000 Vrms (min) • UL recognized: UL1577, File No. E67349 • c-UL approved : CSA Component Acceptance Service • Option (D4) VDE 3 ±2.0 A (max) No. 5A, File No.E67349 approved : EN60747-5-5 EN60065 EN60950-1(Note 1) EN62368-1(Pending) Note 1: When a EN60747-5-5 approved type is needed, please designate the “Option(D4)” 1.27±0.2 0.4±0.1 9.7±0.3 11-5J1 TOSHIBA 11-5J1 Weight: 0.26 g (t yp .) Pin Configuration (Top View) 1 6 2 5 3 SHIELD Truth Table LED M1 M2 Output H ON ON OFF H L OFF OFF ON L +0.25 1.25±0.25 4 1: ANODE 2: N.C 3: CATHODE 4: GND 5: VO ( OUTPUT ) 6: VCC Schematic Input 4.0 -0.20 7.62±0.25 -0.05 Peak output current: • 1 2 0.25 +0.10 • 4 6.8±0.25 TLP700 consists of a GaAℓAs light-emitting diode and an integrated photodetector. This unit is 6-lead SDIP package. The TLP700 is 50% smaller than the 8-pin DIP and meets the reinforced insulation class requirements of international safety standards. Therefore the mounting area can be reduced in equipment requiring safety standard certification. The TLP700 is suitable for gate driving circuits for IGBTs or power MOSFETs. In particular, the TLP700 is capable of “direct” gate driving of low-power IGBTs. 6 5 3.65 +0.15 -0.25 Industrial inverters Inverter for air conditioners IGBT/Power MOSFET gate drive TLP700 1＋ ICC VCC (M1) IF VF (M2) 3－ 6 IO VO 5 SHIELD GND 4 Note: A 0.1-μF bypass capacitor must be connected between pins 6 and 4. Start of commercial production 2007-08 1 2017-05-24 TLP700 Absolute Maximum Ratings (Ta = 25 °C) Characteristics Symbol Rating Unit IF 20 mA ∆IF/∆Ta -0.54 mA/°C IFP 1 A Forward current Forward current derating (Ta ≥ 85°C) LED Peak transient forward current (Note 1) Reverse voltage VR 5 V Diode power dissipation PD 40 mW ∆PD/∆Ta -1.0 mW/°C Tj 125 °C IOPH -2.0 A IOPL 2.0 A Diode power dissipation derating (Ta ≥ 85 °C) Junction temperature Detector “H” peak output current Ta=-40 to 100 °C (Note 2) “L” peak output current Output voltage VO 35 V Supply voltage VCC 35 V PC 400 mW Tj 125 °C f 50 kHz Operating temperature range Topr -40 to 100 °C Storage temperature range Tstg -55 to 125 °C Power dissipation Junction temperature Operating frequency (Note 3) Lead soldering temperature (10 s) (Note 4) Tsol 260 °C Isolation voltage (AC, 60 s, R.H. ≤ 60%) (Note 5) BVS 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note: A ceramic capacitor (0.1 μF) should be connected from pin 6 to pin 4 to stabilize the operation of the high gain linear amplifier. Failure to provide the bypassing may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm. Note 1: Pulse width PW ≤ 1 μs, 300 pps Note 2: Exponential waveform pulse width PW ≤ 0.3 μs, f ≤15 kHz Note 3: Exponential waveform IOPH ≥ -1.5 A (≤ 0.3 μs), IOPL ≤ +1.5 A (≤ 0.3 μs), Ta=100°C Note 4: For the effective lead soldering area Note 5: Device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively. Recommended Operating Conditions Characteristics Input current, ON (Note 1) Input voltage, OFF Supply voltage (Note 2)(Note 3) Peak output current Operating temperature Symbol Min Typ. Max Unit IF (ON) 7.5 ― 10 mA VF (OFF) 0 ― 0.8 V VCC 15 ― 30 V IOPH / IOPL ― ― ±1.5 A Topr -40 ― 100 °C Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Note 1: Input signal rise time (fall time) ≤ 0.5 μs. Note 2: This item denotes operating ranges, not meaning of recommended operating conditions. Note 3: If the VCC rise slope is sharp, an internal circuit might not operate with stability. Please design the VCC rise slope under 3.0 V/μs. 2 2017-05-24 TLP700 Electrical Characteristics (Ta = -40 to 100 °C, unless otherwise specified) Symbol Test Circuit VF ― ∆VF/∆Ta Input reverse current Input capacitance Characteristics Forward voltage Temperature coefficient of forward voltage “H” Level Output current (Note 1) “L” Level “H” Level Min Typ. Max Unit IF = 10 mA, Ta = 25 °C ― 1.57 1.75 V ― IF = 10 mA ― -1.8 ― mV/°C IR ― VR = 5 V, Ta = 25 °C ― ― 10 μA CT ― V = 0 V, f = 1 MHz, Ta = 25 °C ― 100 ― pF 1 VCC = 15 V IF = 5 mA V6-5 = 3.5 V ― -1.4 -1.0 V6-5 = 7 V ― ― -1.5 2 VCC = 15 V IF = 0 mA V5-4 = 2.5 V 1.0 1.4 ― V5-4 = 7 V 1.5 ― ― 3 VCC1=+15V, VEE1=-15V RL = 200Ω, IF = 5 mA 11 13.7 ― VCC1=+15V, VEE1=-15V RL = 200Ω, VF = 0.8 V ― -14.9 -12.5 IF = 10 mA ― 1.3 2.0 IF = 0 mA ― 1.3 2.0 IOPH1 IOPH2 IOPL1 IOPL2 VOH Output voltage Test Condition A V “L” Level VOL 4 “H” Level ICCH 5 “L” Level ICCL 6 VCC = 30 V VO=Open Threshold input current L→H IFLH ― VCC = 15 V, VO > 1 V ― 1.8 5 mA Threshold input voltage H→L VFHL ― VCC = 15 V, VO < 1 V 0.8 ― ― V VCC ― 15 ― 30 V VUVLO+ ― VO > 2.5V, IF = 5 mA 11.0 12.5 13.5 V VUVLO- ― VO < 2.5V, IF = 5 mA 9.5 11.0 12.0 V UVLOHYS ― ― 1.5 ― V Supply current Supply voltage UVLO thresh hold UVLO hysteresis ― ― mA Note: All typical values are at Ta = 25°C Note: This product is more sensitive than conventional products to electrostatic discharge (ESD) owing to its low power consumption design. It is therefore all the more necessary to observe general precautions regarding ESD when handling this component. Note 1: Duration of Io time ≤ 50 μs, 1 pulse Isolation Characteristics (Ta = 25 °C) Characteristic Capacitance input to output Isolation resistance Symbol CS RS Test Condition Min Typ. Max Unit (Note 1) ― 1.0 ― pF (Note 1) 1×1012 1014 ― Ω 5000 ― ― AC, 1 s, in oil ― 10000 ― DC, 60 s, in oil ― 10000 ― Vs = 0 V, f = 1MHz R.H. ≤ 60 %, VS = 500 V AC, 60 s Isolation voltage Note 1: BVS Vrms Vdc Device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively. 3 2017-05-24 TLP700 Switching Characteristics (Ta = -40 to 100 °C, unless otherwise specified) Characteristics Propagation delay time Test Circuit Symbol L→H tpLH H→L tpHL Output rise time (10-90 %) tr Output fall time (90-10 %) tf Switching time dispersion between ON and OFF | tpHL-tpLH | 7 Test Condition VCC = 30 V Rg = 20 Ω Cg = 10 nF Common mode transient immunity at HIGH level output CMH Common mode transient immunity at LOW level output CML 8 Min Typ. Max IF = 0 → 5 mA 50 ― 500 IF = 5 → 0 mA 50 ― 500 IF = 0 → 5 mA ― 50 ― IF = 5 → 0 mA ― 50 ― IF = 0 ↔ 5 mA ― ― 250 -15 ― ― 15 ― ― IF = 5 mA VCM =1000 Vp-p VO (min) = 26 V Ta = 25 °C IF = 0 mA VCC = 30 V VO (max) = 1 V Unit ns kV/μs Note: All typical values are at Ta = 25 °C. Test Circuit 1: IOPH 1 Test Circuit 2: IOPL 1 6 6 0.1μF IOPL A V6-5 A IF IOPH 0.1μF 3 VCC VCC 3 4 Test Circuit 3: VOH 1 Test Circuit 4: VOL 1 6 0.1μF IF RL V VOH 3 VCC1 0.1μF 3 VCC1 VEE1 4 Test Circuit 6: ICCL ICCH 1 A 6 ICCL A 0.1μF 0.1μF IF RL V VOL VEE1 4 6 6 VF Test Circuit 5: ICCH 1 V5-4 4 VCC VCC 3 3 4 4 4 2017-05-24 TLP700 Test Circuit 7: tpLH, tpHL, tr, tf, | tpHL-tpLH | 0.1 μF (f=25kHz, duty=50%, less than tr=tf=5ns) 6 1 IF VO Cg = 10nF Rg = 20 Ω 3 IF VCC tr VOH tf 90% 50% 10% VO 4 tpHL tpLH VOL Test Circuit 8: CMH, CML IF 1 6 VCM SW A 0.1μF VO B tf • SW A: IF = 5 mA VO VCM + 10% tr VCC 4 3 1000 V 90% - 1V • SW B: IF = 0 mA CMH = CML = CMH 26V CML 800 V tf (μs) 800 V tr (μs) Note: CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with the output voltage in the LOW (HIGH) state. 5 2017-05-24 TLP700 IF － VF ∆VF/∆Ta [mV/°C] Ta=100°C 10 Coefficient F o r w a r d C u r r e n t IF [mA] Ta=-40°C Ta=25°C 1 0.1 1 1.2 1.4 1.6 1.8 -2.4 -2 -1.6 -1.2 0.1 1 F o r w a r d C u r r e n t IF [mA] VOL － Ta VOH － Ta 30 VF=0.8V, RL=200Ω -20 VCC1=15V, VEE1=-15V -15 -10 VCC1=7.5V, VEE1=-7.5V -5 0 -40 -20 0 20 40 60 80 100 25 IF=5mA, RL=200Ω 20 VCC1=15V, VEE1=-15V 15 10 VCC1=7.5V, VEE1=-7.5V 5 0 -40 -20 Ambient Temperature Ta [°C] 0 IF=0mA VCC=30V 3 2 1 0 -40 -20 0 20 40 40 60 80 100 ICCH － Ta High level supply current ICCH [mA] Low level supply current ICCL [mA] 4 20 Ambient Temperature Ta [°C] ICCL － Ta 5 10 F o r w a r d Vo l t a g e VF [V] High Level Output Voltage VOH [V] Low Level Output Voltage VOL [V] -2.8 2 -30 -25 ∆VF/∆Ta － IF -3.2 100 60 80 100 Ambient Temperature Ta [°C] 5 4 IF=10mA VCC=30V 3 2 1 0 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta [°C] 6 2017-05-24 TLP700 Propagation delay time tpHL, tpLH [ns] 500 tpHL, tpLH － VCC IF=5mA, VCC=30V Rg=20Ω, Cg=10nF 400 tpHL 300 200 tpLH 100 0 -40 -20 500 0 20 40 60 80 Threshold input current IFLH [mA] tpHL 100 8 10 12 14 16 18 tpLH 100 0 15 20 25 30 4 VCC=15V, VO>1V IO=0mA 3 2 1 0 -40 -20 20 0 20 40 60 80 Forward current IF [mA] Ambient Temperature Ta [°C] IOPL－ Ta IOPH－ Ta IF=0mA, VCC=15V 4 3 V5-4=7.0V 2 V5-4=2.5V IOPL MAX 1 0 -40 -20 200 5 200 5 tpHL IFLH － Ta tpLH 6 300 tpHL, tpLH － IF Rg=20Ω, Cg=10nF 4 Cg=10nF Supply Voltage VCC [V] 300 0 400 Ambient Temperature Ta [°C] VCC=30V 400 500 I =5mA F IF=5mA, Rg=20Ω 100 High Level Peak Output Current IOPH [A] Low Level Peak Output Current IOPL [A] Propagation delay time tpHL, tpLH [ns] Propagation delay time tpHL, tpLH [ns] tpHL, tpLH － Ta 0 20 40 60 80 100 Ambient Temperature Ta [°C] 0 100 IF=5mA, VCC=15V V6-5=-3.5V -1 -2 IOPH MAX -3 V6-5=-7.0V -4 -5 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta [°C] 7 2017-05-24 TLP700 V5-4 － IOPL V6-5 － IOPH 6 0 IF=0mA, VCC=15V Output Voltage V6-5 [V] Output Voltage V5-4 [V] 7 Ta=100°C 5 Ta=25°C 4 Ta=-40°C 3 2 -2 Ta=-40°C -3 -4 Ta=100°C -5 Ta=25°C -6 1 0 IF=5mA, VCC=15V -1 0.5 1 1.5 -7 2 Low Level Output Peak Current IOPL [A] 0 -0.5 -1 -1.5 -2 High Level Output Peak Current IOPH [A] Output Voltage VO(VUVLO) [V] VO(VUVLO)** - VCC 14 12 IF=5mA **Test Circuit : VO(VUVLO) - VCC UVLOHYS 10 1 8 6 VO IF +VUVLO -VUVLO 6 VCC 4 3 2 0 5 10 15 4 20 Supply Voltage VCC [V] *: The above graphs show typical characteristics. 8 2017-05-24 TLP700 Soldering and Storage (1) Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. 1) When Using Soldering Reflow The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.)  An example of a temperature profile when Sn-Pb eutectic solder is used: (°C) This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.  An example of a temperature profile when lead(Pb)-free solder is used: (°C) This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.  Reflow soldering must be performed once or twice.  The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)  Apply preheating of 150 °C (package surface temperature) for 60 to 120 seconds.  Mounting condition of 260 °C or less within 10 seconds is recommended.  Flow soldering must be performed once 3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)  Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds not exceeding 350 °C.  Heating by soldering iron must be only once per 1 lead 9 2017-05-24 TLP700 (2) Precautions for General Storage 1) Do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) When transportation or storage of devices, follow the cautions indicated on the carton box. 3) The storage area temperature should be kept within a temperature range of 5 °C to 35 °C, and relative humidity should be maintained at between 45% and 75%. 4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions. 5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) When repacking devices, use anti-static containers. 7) Do not apply any external force or load directly to devices while they are in storage. 8) If devices have been stored for more than two years, even though the above conditions have been followed, it is recommended that solderability of them should be tested before they are used. 10 2017-05-24 TLP700 Embossed-Tape Packing (TP) Specifications for SDIP6 Type Photocouplers 1. Applicable Package Package Name Product Type SDIP6 Photocouplers 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP700 (TP, F) [[G]]/RoHS COMPATIBLE (Note 1) Tape type Device name Note 1: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 3. Tape Dimensions 3.1 Orientation of Devices in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Tape feed Figure 1 Device Orientation 3.2 Tape Packing Quantity: 1500 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table 1 Empty Device Recesses Standard Occurrences of 2 or more successive empty device recesses Single empty device recesses 3.4 0 device 6 devices (max) per reel Remarks Within any given 40-mm section of tape, not including leader and trailer Not including leader and trailer Start and End of Tape: The start of the tape has 30 or more empty holes. The end of the tape has 30 or more empty holes and two empty turns only for a cover tape. 11 2017-05-24 TLP700 2.0 ± 0.1 G F K0 φ1.6 ± 0.1 16.0 ± 0.3 +0.1 0.4 ± 0.05 φ1.5 -0 E Tape material: Plastic (protection against electrostatics) Dimensions: The tape dimensions are as shown in Figure 2 and Table 2. D (1) (2) Tape Specification B 3.5 A 4.55 ± 0.2 Figure 2 Tape Forms Table 2 Tape Dimension Unit: mm Unless otherwise specified: ±0.1 Symbol Dimension Remark A 10.4  B 5.1  D 7.5 Center line of indented square hole and sprocket hole E 1.75 Distance between tape edge and hole center F 12.0 G 4.0 Cumulative error +0.1 per 10 feed holes -0.3 +0.1 Cumulative error -0.3 per 10 feed holes K0 4.1 Internal space 12 2017-05-24 TLP700 3.6 Reel (1) (2) Material: Plastic Dimensions: The reel dimensions are as shown in Figure 3 and Table 3. Table 3 Reel Dimension A C U B Unit: mm E 記 号 寸 法 A φ380 ± 2 B φ80 ± 1 C φ13 ± 0.5 E 2.0 ± 0.5 U 4.0 ± 0.5 W1 17.5 ± 0.5 W2 21.5 ± 1.0 W1 W2 Figure 3 Reel Forms 4. Packing Either one reel or five reels of photocouplers are packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Method When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example) TLP700 (TP, F) 1500 pcs Quantity (must be a multiple of 1500) [[G]]/RoHS COMPATIBLE (Note 1) Tape type Device name Note 1: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 13 2017-05-24 TLP700 EN60747-5-5 Option (D4) Specification Types : TLP700 Type designations for “option: (D4)”, which are tested under EN60747 requirements. Ex.: TLP700 (D4-TP,F) D4 : EN60747 option TP : Standard tape & reel type F : [[G]]/RoHS COMPATIBLE (Note 1) Note: Use TOSHIBA standard type number for safety standard application. Ex.: TLP700 (D4-TP,F) → TLP700 Note 1: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. EN60747 Isolation Characteristics Description Symbol Rating Unit Application classification for rated mains voltage ≤ 300Vrms for rated mains voltage ≤ 600Vrms Climatic classification Pollution degree TLPxxx type Maximum operating insulation voltage TLPxxxFtype VIORM TLPxxx type Input to output test voltage, method A Vpr=1.6 × VIORM, type and sample test tp=10 s, partial discharge