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TLP701(TP,F)

TLP701(TP,F)

  • 厂商:

    TOSHIBA(东芝)

  • 封装:

    OC_6.8X4.58MM_SM

  • 描述:

    光电耦合器GaAℓAs IRED + Photo IC

  • 详情介绍
  • 数据手册
  • 价格&库存
TLP701(TP,F) 数据手册
TLP701 TOSHIBA Photocoupler IRED + Photo IC TLP701 Industrial inverters Inverter for air conditioners IGBT/Power MOS FET gate drive Unit: mm 4.58±0.25 Peak output current • Guaranteed performance over temperature : −40 to 100°C • Supply current : 10 to 30 V • Threshold input current : IFLH = 5 mA (max) • Switching time (tpLH / tpHL) : 700 ns (max) • Common mode transient immunity : ±10 kV/μs (min) • Isolation voltage : 5000 Vrms (min) • Construction mechanical rating Creepage Distance Clearance Insulation Thickness +0.25 4.0 −0.20 −0.05 +0.15 3.65 −0.25 7.62±0.25 1.27±0.2 : 2 mA (max) Power supply voltage 1.25±0.25 0.4±0.1 9.7±0.3 11-5J1 7.62-mm pitch standard type 10.16-mm pitch TLPXXXF type 7.0 mm (min) 7.0 mm (min) 0.4 mm (min) 8.0 mm (min) 8.0 mm (min) 0.4 mm (min) • UL-recognized: UL 1577, File No.E67349 • cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN 60747-5-5 , EN 62368-1 (Note 1) TOSHIBA 11-5J1S Weight: 0.26 g (t yp .) Pin Configuration (Top View) 1 6 2 5 3 SHIELD 4 Schematic Note 1 : When a VDE approved type is needed, please designate the Option(D4). (Tr1) Truth Table Input 3 : ±0.6 A (max) • • 1 2 0.25± +0.10 • 4 6.8±0.25 TLP701 consists of an infrared emitting diode and an integrated photodetector. This unit is 6-lead SDIP package. The TLP701 is 50% smaller than the 8-pin DIP and meets the reinforced insulation class requirements of international safety standards. Therefore the mounting area can be reduced in equipment requiring safety standard certification. The TLP701 is suitable for gate driving circuits for IGBTs or power MOSFETs. In particular, the TLP701 is capable of “direct” gate driving of low-power IGBTs. 6 5 1: ANODE 2: NC 3: CATHODE 4: GND 5: OUTPUT 6: VCC ICC 6 VCC IF LED Tr1 Tr2 1+ Output H ON ON OFF H L OFF OFF ON L VF 3− (Tr2) SHIELD IO 5 VO 4 GND A 0.1-μF bypass capacitor must be connected between pins 6 and 4. Start of commercial production 2004-04 © 2019 Toshiba Electronic Devices & Storage Corporation 1 2019-06-03 TLP701 Absolute Maximum Ratings (Ta = 25 °C) Characteristics Symbol Rating Unit IF 20 mA ∆IF/∆Ta −0.54 mA/°C IFP 1 A Reverse voltage VR 5 V Input power dissipation PD 40 mW ΔPD/ΔTa -1.0 mW/°C Tj 125 °C Forward current Forward current derating (Ta ≥ 85°C) LED Pulse transient forward current (Note 1) Input power dissipation derating (Ta ≥ 85°C) Junction temperature (Note 2) IOPH −0.6 A “L” peak output current (Note 2) IOPL 0.6 A Output voltage VO 35 V Supply voltage VCC 35 V Output power dissipation PO 400 mW ΔPO/ΔTa -1.0 mW/°C Tj 125 °C f 25 kHz Operating temperature range Topr −40 to 100 °C Storage temperature range Tstg −55 to 125 °C Detector “H” peak output current Output power dissipation derating (Ta ≥ 85°C) Junction temperature Operating frequency (Note 3) Lead soldering temperature (10 s) (Note 4) Tsol 260 °C Isolation voltage (AC, 60 s, R.H. ≤ 60 %) (Note 5) BVS 5000 Vr m s Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note: A ceramic capacitor (0.1 μF) should be connected from pin 6 to pin 4 to stabilize the operation of the high gain linear amplifier. Failure to provide the bypassing may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm. Note 1: Pulse width PW ≤ 1 μs, 300 pps Note 2: Exponential waveform pulse width PW ≤ 2 μs, f ≤15 kHz Note 3: Exponential waveform IOPH ≤ −0.3 A (≤ 2 μs), IOPL ≤+0.3 A (≤ 2 μs), Ta = 100 °C Note 4: For the effective lead soldering area Note 5: Device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively. Recommended Operating Conditions Characteristics Input current, ON Input voltage, OFF Supply voltage Peak output current Operating temperature (Note 6) Symbol Min Typ. Max Unit IF (ON) 7.5 ― 10 mA VF (OFF) 0 ― 0.8 V VCC 10 ― 30 V IOPH / IOPL ― ― ± 0.2 A Topr −40 ― 100 °C Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Note 6: Input signal rise time (fall time) < 0.5 μs. © 2019 Toshiba Electronic Devices & Storage Corporation 2 2019-06-03 TLP701 Electrical Characteristics (Ta = −40 to 100 °C, unless otherwise specified) Symbol Test Circuit VF ― ∆VF/∆Ta Input reverse current Input capacitance Characteristics Forward voltage Temperature coefficient of forward voltage “H” Level Min Typ.* Max Unit IF = 5 mA, Ta = 25 °C ― 1.55 1.70 V ― IF = 5 mA ― −2.0 ― mV/°C IR ― VR = 5 V, Ta = 25 °C ― ― 10 μA CT ― V =0 V, f = 1 MHz, Ta = 25 °C ― 45 ― pF VCC = 15 V IF = 5 mA V6-5 = 4 V 1 ― −0.38 −0.2 V6-5 = 10 V ― −0.60 −0.4 V5-4 = 2 V 0.2 0.36 ― V5-4 = 10 V 0.4 0.62 ― IO = −100 mA, IF = 5 mA 6.0 8.5 ― IO = 100 mA, VF = 0.8 V ― 0.4 1.0 ― 1.4 2.0 ― 1.3 2.0 IOPH1 IOPH2 Output current (Note 7) “L” Level IOPL1 2 IOPL2 “H” Level Test Condition VCC = 15 V IF = 0 mA 3 VOH VCC = 10 V Output voltage A V “L” Level VOL 4 “H” Level ICCH 5 “L” Level ICCL 6 VCC = 10 to 30 V IF = 10 mA VO = Open IF = 0 mA Threshold input current L→H IFLH ― VCC = 15 V, VO > 1 V ― 2.5 5 mA Threshold input voltage H→L VFHL ― VCC = 15 V, VO < 1 V 0.8 ― ― V VCC ― 10 ― 30 V Supply current Supply voltage ― mA ( * ): All typical values are at Ta = 25 °C Note: This product is more sensitive than conventional products to electrostatic discharge (ESD) owing to its low power consumption design.It is therefore all the more necessary to observe general precautions regarding ESD when handling this component. Note 7: Duration of IO time ≤ 50 μs, 1 pulse Isolation Characteristics (Ta = 25 °C) Characteristic Symbol Capacitance input to output CS Isolation resistance RS Isolation voltage BVS © 2019 Toshiba Electronic Devices & Storage Corporation Test Condition VS = 0 V , f = 1 MHz (Note 5) R.H. ≤ 60 %, VS = 500 V (Note 5) AC, 60 s 3 (Note 5) Min Typ. Max Unit ― 1.0 ― pF 1×1012 1014 ― Ω 5000 ― ― Vrms 2019-06-03 TLP701 Switching Characteristics (Ta = −40 to 100 °C, unless otherwise specified) Characteristics Propagation delay time Symbol L→H tpLH H→L tpHL tr Output fall time (90−10 %) tf Switching time dispersion between ON and OFF | tpHLtpLH | 7 CMH 8 Common mode transient immunity at LOW level output Test Condition Min Typ.* Max IF = 0 → 5 mA 100 ― 700 IF = 5 → 0 mA 100 ― 700 Rg = 47 Ω IF = 0 → 5 mA ― 50 ― Cg = 3 nF IF = 5 → 0 mA ― 50 ― IF = 0 ⇔ 5 mA ― ― 500 IF = 5 mA VO (min) = 26 V −10000 ― ― IF = 0 mA VO (max) = 1 V 10000 VCC = 30 V Output rise time (10−90 %) Common mode transient immunity at HIGH level output Test Circuit CML VCM = 1000 Vp-p VCC = 30 V Ta = 25 °C Unit ns V/μs ― ― ( * ): All typical values are at Ta = 25 °C. Test Circuit 1: IOPH 1 Test Circuit 2: IOPL 1 6 6 0.1 μF IOPL A V6-5 A IF IOPH 0.1 μF VCC VCC V5-4 3 3 4 Test Circuit 3: VOH 1 6 4 Test Circuit 4: VOL 1 VOH V 6 0.1 μF VOL VF IF IO 0.1 μF 3 VCC 3 4 Test Circuit 5: ICCH 1 6 IO 4 Test Circuit 6: ICCL ICCH 1 6 ICCL A A 0.1 μF 0.1 μF IF VCC V VCC VCC 3 3 4 © 2019 Toshiba Electronic Devices & Storage Corporation 4 4 2019-06-03 TLP701 Test Circuit 7: tpLH, tpHL, tr, tf, PDD 6 1 0.1 μF IF IF VO Rg = 47 Ω Cg = 3 nF 3 tr VOH tf VCC 90% 50% 10% VO tpHL tpLH 4 VOL Test Circuit 8: CMH, CML IF SW A 6 1 VCM 0.1 μF VO B 1000 V 90% 10% tr tf VCC • SW A: IF = 5 mA 4 3 VO VCM + CMH 26 V − 1V CML • SW B: IF = 0 mA CML = CMH = − 800 V tr (μs) 800 V tf (μs) CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with the output voltage in the LOW (HIGH) state. © 2019 Toshiba Electronic Devices & Storage Corporation 5 2019-06-03 TLP701 I F ─ VF ⊿ VF/⊿ Ta- IF 100 C o e f f i c i e n t ⊿ V F / ⊿ Ta ( m V / °C) F o r w a r d C u r r e n t I F (mA) -2.6 Ta = 25 °C 50 30 10 5 3 1 0.5 0.3 0.1 0.05 0.03 0.01 1.0 1.4 1.2 1.8 1.6 -2.4 -2.2 -2.0 -1.8 -1.6 -1.4 0.1 2.0 0.3 0.5 F o r w a r d V o l t a g e VF(V) 30 (mA) VCC=15 V 30 Threshold input current IFLH A l l o w a b l e f o r w a r d c u r r e n t I F (mA) 10 IFLH – Ta 20 10 0 -40 -20 0 20 40 60 VO>1 V 4 3 2 1 0 -40 80 100 120 -20 Ambient Temperature Ta(°C) 0 VOL - Ta High Level Output Voltage VOH[V] VF = 0.8 V IO= 100 mA , VCC=10 V 0.6 0.4 0.2 0 20 40 40 60 80 100 80 100 VOH - Ta 30 -20 20 Ambient Temperature Ta(°C) 1 Low Level Output Voltage VOL[V] 5 5 40 0 -40 3 F o r w a r d C u r r e n t I F (mA) I F - Ta 0.8 1 60 80 25 Ambient Temperature Ta(°C) Io= -100 mA , VCC=10 V 20 15 10 5 0 -40 100 IF = 5 mA -20 0 20 40 60 Ambient Temperature Ta(°C) NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. © 2019 Toshiba Electronic Devices & Storage Corporation 6 2019-06-03 TLP701 I C C L - Ta I C C H - Ta 10 I F=5 mA High level supply current ICCH (mA) VCC=30 V 8 6 4 2 Low level supply current ICCL (mA) 10 0 -40 -20 0 20 40 60 80 VCC=30 V 8 6 4 2 0 -40 100 -20 0 Ambient Temperature Ta(°C) 20 IOPL – Ta 60 80 100 IOPH – Ta 1 0 IF=0 mA, VCC=15 V (Note 7) High level output current IOPH (A) Low level output current IOPL (A) 40 Ambient Temperature Ta(°C) 0.8 V6-5=10.0V 0.6 0.4 V6-5=2.0V 0.2 0 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C) IF=5 mA, VCC=15 V (Note 7) -0.2 V8-6=4.0 V -0.4 V8-6=10 V -0.6 -0.8 -1 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C) t p H L , t p L H - Ta 500 Propagation delay time tPLH, tPHL (ns) IF=5 mA, VCC=30 V Rg=47 Ω, Cg=3 nF 400 300 tpLH 200 tpHL 100 0 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(°C) NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. © 2019 Toshiba Electronic Devices & Storage Corporation 7 2019-06-03 TLP701 RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”. Hardware, software and systems described in this document are collectively referred to as “Product”. • TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative or contact us via our website. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. https://toshiba.semicon-storage.com/ © 2019 Toshiba Electronic Devices & Storage Corporation 8 2019-06-03
TLP701(TP,F)
物料型号:TLP701 器件简介:TLP701是东芝公司生产的一款光耦器件,包含一个红外发射二极管和一个集成的光电探测器。

该器件适用于IGBT或功率MOSFET的门驱动电路,特别是能够直接驱动低功耗IGBT。

引脚分配:1-阳极(ANODE)、2-空脚(NC)、3-阴极(CATHODE)、4-地(GND)、5-输出(OUTPUT)、6-电源(VCC) 参数特性:峰值输出电流±0.6A、工作温度范围-40至100℃、供电电流最大2mA、阈值输入电流5mA、开关时间700ns、隔离电压5000Vrms 功能详解:TLP701能够实现高速响应和高隔离电压,适合工业变频器、空调变频器、IGBT/功率MOSFET门驱动等应用。

应用信息:适用于需要安全标准认证的设备,如工业变频器和空调变频器,可以减少安装面积。

封装信息:6引脚SDIP封装,比8引脚DIP封装小50%,满足国际安全标准加强绝缘等级要求。
TLP701(TP,F) 价格&库存

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TLP701(TP,F)
  •  国内价格
  • 1+5.75300
  • 100+4.78500
  • 750+4.35600
  • 1500+4.18000

库存:103

TLP701(TP,F)
  •  国内价格
  • 1+4.41000
  • 30+4.25250
  • 100+3.93750
  • 500+3.62250
  • 1000+3.46500

库存:0