TLP781F(GRH,F)

TLP781/TLP781F TOSHIBA Photocoupler GaAs IRED & Photo Transistor TLP781,TLP781F TLP781 Office Equipment Household Appliances Unit in mm Solid State Relays Switching Power Supplies Various Controllers Signal Transmission Between Different Voltage Circuits The TOSHIBA TLP781 consists of a silicone photo transistor optically coupled to a gallium arsenide infrared emitting diode in a four lead plastic DIP (DIP4) with having high isolation voltage (AC: 5kVRMS (min)). TOSHIBA Weight: 0.25g (typ.) TLP781 : 7.62mm pitch type DIP4 TLP781F : 10.16mm pitch type DIP4 Unit in mm TLP781F Collector-emitter voltage: 80V (min.) Current transfer ratio: 50% (min.) Rank GB: 100% (min.) Isolation voltage: 5000Vrms (min.) UL recognized: UL1577, file No. E67349 BSI approved: BS EN60065:2002 Approved no.8961 BS EN60950-1:2006 Approved no.8962 SEMKO approved:EN60065:2002 Approved no.800514 EN60950-1:2001, EN60335-1:2002 Approved no.800517 Option(D4)type VDE approved : DIN EN60747-5-2 TOSHIBA Certificate No. 40021173 (Note): When an EN60747-5-2 approved type is needed, Weight: 0.25g (typ.) Please designate “Option (D4)” Pin Configurations (top view) Construction mechanical rating 7.62mm Pitch Standard Type 10.16mm Pitch TLPxxxF Type Creepage distance 6.5mm(min) 8.0mm(min) Clearance 6.5mm(min) 8.0mm(min) Insulation thickness 0.4mm(min) 0.4mm(min) 1 4 2 3 1 : Anode 2 : Cathode 3 : Emitter 4 : Collector 1 2008-01-17 TLP781/TLP781F Current Transfer Ratio Type TLP781 Current Transfer Ratio (%) (IC / IF) IF = 5mA, VCE = 5V, Ta = 25°C Min Max Classi fication (Note 1) Marking Of Classification (None) 50 600 Blank, Y, Y+, YE,G, G+, B, B+,BL,GB Rank Y 50 150 YE Rank GR 100 300 GR Rank BL 200 600 BL Rank GB 100 600 GB Rank YH 75 150 Y+ Rank GRL 100 200 G Rank GRH 150 300 G+ Rank BLL 200 400 B (Note 1): Ex. rank GB: TLP781 (GB) (Note 2): Application type name for certification test, please use standard product type name, i. e. TLP781 (GB): TLP781 Absolute Maximum Ratings (Ta = 25°C) Characteristic Forward current Forward current derating (Ta 39°C) Pulse forward current Symbol Rating IF 60 mA 0.7 mA / °C I FP 1 A PD 100 mW 1.0 mW / °C VR 5 V IF / °C (Note 3) Power dissipation Power dissipation derating PD / °C Reverse voltage Junction temperature Unit Tj 125 °C Collector emitter voltage VCEO 80 V Emitter collector voltage VECO 7 V Collector current IC 50 mA Power dissipation (single circuit) PC 150 mW 1.5 mW / °C Tj 125 °C Operating temperature range Topr 55 to 110 °C Storage temperature range Tstg 55 to 125 °C Lead soldering temperature (10s) Tsol 260 °C Total package power dissipation PT 250 mW 2.5 mW / °C 5000 Vrms Power dissipation derating (Ta 25°C)(single circuit) PC / °C Junction temperature Total package power dissipation derating (Ta 25°C) Isolation voltage PT / °C (Note 4) BVS (Note): Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (Note 3): 100 s pulse, 100 Hz frequency (Note 4): AC, 1 min., R.H. 60%. Apply voltage to LED pin and detector pin together. 2 2008-01-17 TLP781/TLP781F Recommended Operating Conditions Characteristic Symbol Min Typ. Max Unit Supply voltage VCC 5 24 V Forward current IF 16 25 mA Collector current IC 1 10 mA 85 °C Operating temperature Topr 25 (Note): Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Individual Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Forward voltage VF IF = 10 mA Reverse current IR VR = 5 V Capacitance CT V = 0, f = 1 MHz Min Typ. Max Unit 1.0 1.15 1.3 V 10 A 30 pF Collector emitter breakdown voltage V(BR) CEO IC = 0.5 mA 80 V Emitter collector breakdown voltage V(BR) ECO IE = 0.1 mA 7 V Collector dark current Capacitance (collector to emitter) ID(ICEO) CCE VCE = 24 V 0.01 0.1 VCE = 24 V Ta = 85°C 0.6 50 V = 0, f = 1 MHz 10 A A pF Coupled Electrical Characteristics (Ta = 25°C) Characteristic Current transfer ratio Saturated CTR Symbol I C / IF IC / IF (sat) Test Condition IF = 5 mA, VCE = 5 V IF = 1 mA, VCE = 0.4 V Min Rank GB Typ. 50 600 100 600 60 Rank GB VCE (sat) IC = 0.2 mA, IF = 1 mA Unit % % 30 IC = 2.4 mA, IF = 8 mA Collector emitter saturation voltage Max 0.4 V 0.2 Rank GB 0.4 Isolation Characteristics (Ta = 25°C) Characteristic Capacitance (input to output) Isolation resistance Symbol CS RS Test Condition BVS Typ. VS = 0, f = 1 MHz VS = 500 V AC, 1 minute Isolation voltage Min 0.8 1×10 12 Unit pF 14 10 5000 AC, 1 second, in oil 10000 DC, 1 minute, in oil 10000 3 Max Vrms Vdc 2008-01-17 TLP781/TLP781F Switching Characteristics (Ta = 25°C) Characteristics Symbol Rise time Test Condition Min tr Fall time tf Turn on time ton Turn off time toff Turn on time tON Storage time ts Turn off time tOFF Typ. Max Unit 2 3 VCC = 10 V, IC = 2 mA RL = 100 s 3 3 2 RL = 1.9 k VCC = 5 V, IF = 16 mA (Note 5) s 25 50 IF IF RL VCC ts VCE VCC 4.5V VCE 0.5V tON tOFF (Note 5): Switching time test circuit Surface-Mount Lead Form Options TLP781(LF6) TLP781F(LF7) Unit in mm TOSHIBA TOSHIBA Weight : Unit in mm Weight : 0.24g (typ.) 4 0.24g (typ.) 2008-01-17 TLP781/TLP781F Specifications for Embossed-Tape Packing: (TP6), (TP7) 1. Applicable Package Package Name Product Type DIP4LF6 TLP781 DIP4LF7 TLP781F 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example 1) Tape type CTR rank Device name (Example 2) F Tape type CTR rank Device name 3. Tape Dimensions 3.1 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Tape feed Figure1 Device Orientation 3.2 Tape Packing Quantity:2000 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table1 Empty Device Recesses Occurrences of 2 or more successive empty device recesses Single empty recesses device Standard Remarks 0 Within any given 40-mm section of tape, not including leader and trailer 6 devices (max.) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 30 or more empty holes. The end of the tape has 50 or more empty holes. 5 2008-01-17 TLP781/TLP781F 3.5 Tape Specification [1] TLP781 (TP6) (1)Tape material: Plastic (2)Dimensions: The tape dimensions are as shown in Figure 2. Figure 2 Tape Forms [2] TLP781F (TP7) (1)Tape material: Plastic (2)Dimensions: The tape dimensions are as shown in Figure 3. Figure 3 Tape Forms 6 2008-01-17 TLP781/TLP781F 3.6 Reel Specification [1] TLP781 (TP6) (1)Material: Plastic (2)Dimensions: The reel dimensions are as shown in Figure 4. Unit: mm Figure 4 Reel Forms [2] TLP781F (TP7) (1)Material: Plastic (2)Dimensions: The reel dimensions are as shown in Figure 5. Figure 5 Reel Forms 4. Packing One reel of photocouplers is packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Information When placing an order, please specify the product number, the CTR rank, the tape type and the quantity as shown in the following example. (Example) 2000Pcs. Quantity (must be a multiple of 2000) Tape type CTR rank Device name (Note): The order code may be suffixed with wither a letter or a digit. Please contact your nearest Toshiba sales representative for more details. 7 2008-01-17 TLP781/TLP781F Soldering and Storage 1. Soldering 1.1 Soldering When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) Using solder reflow ·Temperature profile example of lead (Pb) solder (°C) This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. 240 210 160 140 less than 30s 60 to 120s Time (s) ·Temperature profile example of using lead (Pb)-free solder (°C) This profile is based on the device’s maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. 260 230 190 180 60 to 120s 30 to 50s Time (s) 2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder) Please preheat it at 150°C between 60 and 120 seconds. Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once. 3) Using a soldering iron Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may be heated at most once. 8 2008-01-17 TLP781/TLP781F 2. Storage 1) Avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) Follow the precautions printed on the packing label of the device for transportation and storage. 3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%, respectively. 4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. 5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) When restoring devices after removal from their packing, use anti-static containers. 7) Do not allow loads to be applied directly to devices while they are in storage. 8) If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 9 2008-01-17 TLP781/TLP781F EN60747 Isolation Characteristics Types: TLP781, TLP781F Type designations for ‘option: (D4) ’, which are tested under EN60747 requirements. Ex.: TLP781 (D4-GR-LF6) D4: EN60747 option GR: CTR rank name LF6: standard lead bend name Note: Use TOSHIBA standard type number for safety standard application. TLP781 Ex. TLP781 (D4-GR-LF6) Description Symbol Rating Unit Application classification for rated mains voltage for rated mains voltage 300 Vrms 600 Vrms I IV I III Climatic classification 55 / 115 / 21 Pollution degree 2 Maximum operating insulation voltage V IORM 890 Vpk Input to output test voltage, Vpr = 1.5×VIORM, type and sample test tp = 10s, partial discharge < 5pC Vpr 1335 Vpk Input to output test voltage, Vpr = 1.875×VIORM, 100% production test tp = 1s, partial discharge < 5pC Vpr 1670 Vpk Highest permissible overvoltage (transient overvoltage, tpr = 60s) VTR 6000 Vpk Safety limiting values (max. permissible ratings in case of fault) current (input current IF, Psi = 0) power (output or total power dissipation) temperature Isi Psi Tsi 300 500 150 mA mW C Insulation resistance, Rsi 10 VIO = 500V,Ta=25 10 12 2008-01-17 TLP781/TLP781F Insulation Related Specifications 7.62mm pitch TLPxxx type 10.16mm pitch TLPxxxF type Minimum creepage distance Cr 6.5mm 8.0mm Minimum clearance Cl 6.5mm 8.0mm Minimum insulation thickness ti Comparative tracking index 0.4 mm 175 CTI (1) If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.g.at a standard distance between soldering eye centres of 7.5mm). If this is not permissible, the user shall take suitable measures. (2) This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. VDE test sign: Marking on product for EN60747 4 Marking on packing for EN60747 Marking Example: TLP781, TLP781F Lot No. P Device Name CTR Rank Marking 4: Mark for option (D4) 1pin indication 11 2008-01-17 TLP781/TLP781F IF – Ta PC – Ta 200 160 120 80 40 0 20 Ambient temperature Ta 0 ( ) 20 40 60 Ambient temperature Ta VF / Ta – IF 100 80 ( 120 ) IF – VF 0.1 Forward current IF (mA) Forward voltage VF (V) IFP – VFP Pulse width 10 s Repetitive frequency=100Hz Ta = 25 Pulse forward voltage VFP (V) *: The above graphs show typical characteristics. 12 2008-01-17 TLP781/TLP781F ID – Ta IC – VCE 50 30 20 15 10 5 IF= 2 mA Ambient temperature Ta ( Collector-emitter voltage ) IC – VCE VCE (V) IC – IF 50 30 20 15 10 5 IF= 2 mA Collector-emitter voltage VCE (V) IC /IF – IF Ta = 25°C VCE = 5V VCE = 0.4V Forward current IF (mA) Ta = 25°C VCE = 5V VCE = 0.4V Forward current IF (mA) *: The above graphs show typical characteristics. 13 2008-01-17 TLP781/TLP781F IC – Ta VCE(sat) – Ta IF = 5 mA IC = 1 mA VCE = 5V 20mA 10mA 5mA 1mA IF= 0.5 mA 0.1 Ambient temperature Ta Ambient temperature ( ) Ta ( ) Switching Time – RL Ta = 25°C IF = 16mA VCC = 5V tOFF tS tON Load resistance RL (k ) *: The above graphs show typical characteristics. 14 2008-01-17 TLP781/TLP781F RESTRICTIONS ON PRODUCT USE Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 15 2008-01-17