TLP785(GR,F(C

TLP785,TLP785F TOSHIBA Photocoupler GaAs IRED & Photo−Transistor TLP785, TLP785F Office Equipment Household Appliances Solid State Relays Switching Power Supplies Various Controllers Signal Transmission between Different Voltage Circuits TLP785 Unit: mm The TOSHIBA TLP785 consists of a silicone phototransistor optically coupled to a gallium arsenide (GaAs) infrared emitting diode in a four lead plastic DIP (DIP4) with having high isolation voltage (AC: 5kVRMS (min)). TLP785F is a lead forming type for the long creepage surface mounting of TLP785. • TLP785: 7.62mm pitch type DIP4 • TLP785F: 10.16mm pitch type DIP4 • Collector-emitter voltage: 80V (min) • Current transfer ratio: 50% (min) TOSHIBA 11-5L1 Weight: 0.32 g (typ.) TLP785F Unit: mm Rank GB: 100% (min) • Isolation voltage: 5000Vrms (min) • UL approved: UL1577, file No. E67349 • BSI under application: BS EN60065:2002 BS EN60950-1:2006 • SEMKO under application:EN60065:2002 • EN60950-1:2001, EN60335-1:2002 Option(D4)type VDE approved: DIN EN60747-5-2 (Note): When an EN60747-5-2 approved type is needed, Please designate “Option (D4)” • Construction mechanical rating 7.62mm Pitch Standard Type 10.16mm Pitch TLPxxxF Type Creepage distance 7.0mm(min) 8.0mm(min) Clearance 7.0mm(min) 8.0mm(min) Insulation thickness 0.4mm(min) 0.4mm(min) Inner creepage distance 4.0mm(min) 4.0mm(min) Pin Configurations (top view) 1 4 2 3 1 : Anode 2 : Cathode 3 : Emitter 4 : Collector TOSHIBA 11-5L102 Weight: 0.32g (typ.) Start of commercial production 2010/11 1 2014-09-22 TLP785,TLP785F Current Transfer Ratio Type Classification (Note 1) Current Transfer Ratio (%) (IC / IF) IF = 5mA, VCE = 5V, Ta = 25°C Min Max None TLP785 50 600 Marking of Classification Blank Rank Y 50 150 YE Rank GR 100 300 GR Rank BL 200 600 BL Rank GB 100 600 GB Rank YH 75 150 Y+ Rank GRL 100 200 G Rank GRH 150 300 G+ Rank BLL 200 400 B (Note 1): Ex. rank GB: TLP785 (GB) (Note 2): Application type name for certification test, please use standard product type name, i. e. TLP785 (GB): TLP785 Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit IF 60 mA ∆IF / °C −0.7 mA / °C IFP 1 A PD 90 mW ∆PD / °C −0.9 mW / °C Reverse voltage VR 5 V Junction temperature Tj 125 °C Collector−emitter voltage VCEO 80 V Emitter−collector voltage VECO 7 V Collector current IC 50 mA Power dissipation (single circuit) PC 150 mW ∆PC / °C −1.5 mW / °C Tj 125 °C Operating temperature range Topr −55 to 110 °C Storage temperature range Tstg −55 to 125 °C Lead soldering temperature (10s) Tsol 260 °C Total package power dissipation PT 240 mW ∆PT / °C −2.4 mW / °C BVS 5000 Vrms Forward current Forward current derating (Ta ≥ 39°C) LED Pulse forward current (Note 3) Power dissipation Detector Power dissipation derating Power dissipation derating (Ta ≥ 25°C) Junction temperature Total package power dissipation derating (Ta ≥ 25°C) Isolation voltage (Note 4) (Note): Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (Note 3): 100 μs pulse, 100 Hz frequency (Note 4): AC, 1 min., R.H.≤ 60%. Apply voltage to LED pin and detector pin together. 2 2014-09-22 TLP785,TLP785F Recommended Operating Conditions (Note) Characteristic Symbol Min Typ. Max Unit Supply voltage VCC ― 5 24 V Forward current IF ― 16 25 mA Collector current IC ― 1 10 mA Topr −25 ― 85 °C Operating temperature (Note): Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Individual Electrical Characteristics (Ta = 25°C) Detector LED Characteristic Symbol Test Condition Min Typ. Max Unit Forward voltage VF IF = 10 mA 1.0 1.15 1.3 V Reverse current IR VR = 5 V ― ― 10 μA Capacitance CT V = 0V, f = 1 MHz ― 30 ― pF Collector−emitter breakdown voltage V(BR) CEO IC = 0.5 mA 80 ― ― V Emitter−collector breakdown voltage V(BR) ECO IE = 0.1 mA 7 ― ― V VCE = 24 V ― 0.01 0.1 μA VCE = 24 V ,Ta = 85°C ― 0.6 50 μA V = 0V, f = 1 MHz ― 6 ― pF Min Typ. Max Unit 50 ― 600 100 ― 600 ― 60 ― 30 ― ― IC = 2.4 mA, IF = 8 mA ― ― 0.4 IC = 0.2 mA, IF = 1 mA ― 0.2 ― ― ― 0.4 Min Typ. Max Unit ― 0.8 ― pF ― Ω Collector dark current Capacitance (collector to emitter) ID(ICEO) CCE Coupled Electrical Characteristics (Ta = 25°C) Characteristic Current transfer ratio Saturated CTR Collector−emitter saturation voltage Symbol IC / IF IC / IF (sat) VCE (sat) Test Condition IF = 5 mA, VCE = 5 V Rank GB IF = 1 mA, VCE = 0.4 V Rank GB Rank GB % % V Isolation Characteristics (Ta = 25°C) Characteristic Capacitance (input to output) Isolation resistance Symbol CS RS Test Condition VS = 0V, f = 1 MHz VS = 500 V AC, 1 minute Isolation voltage BVS 12 1×10 10 14 5000 ― ― AC, 1 second, in oil ― 10000 ― DC, 1 minute, in oil ― 10000 ― 3 Vrms Vdc 2014-09-22 TLP785,TLP785F Switching Characteristics (Ta = 25°C) Characteristics Symbol Rise time tr Fall time tf Turn−on time ton Test Condition VCC = 10 V, IC = 2 mA RL = 100Ω Min Typ. Max ― 2 ― ― 3 ― ― 3 ― Turn−off time toff ― 3 ― Turn−on time ton ― 1.5 ― Storage time ts ― 25 ― Turn−off time toff ― 50 ― RL = 1.9 kΩ VCC = 5 V, IF = 16 mA (fig. 1) Unit μs μs IF IF VCC RL ts VCE VCC 4.5V VCE 0.5V ton toff (fig. 1): Switching time test circuit Surface-Mount Lead Form Option TLP785(LF6) 11-5L106 TOSHIBA Weight: TLP785F(LF7) Unit: mm 11-5L107 TOSHIBA 0.31g (typ.) Weight: 4 Unit: mm 0.31g (typ.) 2014-09-22 TLP785,TLP785F Option: Specifications for Embossed-Tape Packing; (TP6)/(TP7) 1. Applicable Package Package Name Product Type DIP4LF6 TLP785 DIP4LF7 TLP785F 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP785 (BL−TP6,F [[G]]/RoHS COMPATIBLE Tape type CTR Rank Device name (Example2) TLP785F (BL−TP7,F [[G]]/RoHS COMPATIBLE Tape type CTR Rank Device name 3. Tape Dimensions 3.1 Orientation of Device in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 2. Tape feed P 1pin indication Figure2 Device Orientation 3.2 Tape Packing Quantity:2000 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table1 Empty Device Recesses Occurrences of 2 or more successive empty device recesses Single empty recesses device Standard Remarks 0 Within any given 40-mm section of tape, not including leader and trailer 6 devices (max.) per reel Not including leader and trailer 3.4 Start and End of Tape The start of the tape has 30 or more empty holes. The end of the tape has 50 or more empty holes. 5 2014-09-22 TLP785,TLP785F 3.5 Tape Specification [1] TLP785(TP6) / TLP785F(TP7) (1)Tape material: Plastic (2)Dimensions: The tape dimensions are as shown in Figure 3. Unit: mm Figure 3 Tape Forms A B W F T TP6 Type 5.1±0.1 10.6±0.1 16.0±0.3 7.5±0.1 4.2±0.15 6 TP7 Type 5.05±0.1 12.35±0.1 24.0±0.3 11.5±0.1 4.4±0.1 2014-09-22 TLP785,TLP785F 3.6 Reel Specification [1] TLP785(TP6) / TLP785F(TP7) (1)Material: Plastic (2)Dimensions: The reel dimensions are as shown in Figure 4. 4.0±0.5 2.0±0.5 W2 φ330 max φ100±1.5 φ13.0±0.5 W1 W1 W2 TP6 Type 16.5ｔｙｐ 23max TP7 Type 24.4typ 30.4max Unit: mm Figure 4 Reel Forms 4. Packing Two reels of photocouplers are packed in a shipping carton. 5. Label Indication The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name. 6. Ordering Information When placing an order, please specify the product number, the CTR rank, the tape type and the quantity as shown in the following example. (Example) TLP785(BL−TP6,F 4000pcs. Quantity (must be a multiple of 4000) [[G]]/RoHS COMPATIBLE Tape type CTR Rank Device name (Note): The order code may be suffixed with a letter or a digit. Please contact your nearest Toshiba sales representative for more details. 7 2014-09-22 TLP785,TLP785F Soldering and Storage 1. Soldering 1.1 Soldering When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) Using solder reflow ·Temperature profile example of lead (Pb) solders (°C) This profile is based on the devices maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. Package surface temperature 240 210 160 140 less than 30s 60 to 120s Time (s) Temperature profile example of using lead (Pb)-free solders (°C 260 This profile is based on the devices maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. Package surface temperature 230 190 180 60 to 120s 30 to 50s Time (s) 2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder) Please preheat it at 150°C between 60 and 120 seconds. Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once. 3) Using a soldering iron Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may be heated at most once. 8 2014-09-22 TLP785,TLP785F 2. Storage 1) Avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) Follow the precautions printed on the packing label of the device for transportation and storage. 3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%, respectively. 4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. 5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) When restoring devices after removal from their packing, use anti-static containers. 7) Do not allow loads to be applied directly to devices while they are in storage. 8) If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 9 2014-09-22 TLP785,TLP785F EN60747-5-2 ‘Option: (D4)’ Attachment: Specification for EN60747-5-2 option: (D4) Types: TLP785, TLP785F Type designations for ‘option: (D4) ’, which are tested under EN60747 requirements. Ex.: TLP785(D4-GR-LF6,F D4: EN60747 option GR: CTR rank name LF6: standard lead bend name F: [[G]]/RoHS COMPATIBLE Note: Use TOSHIBA standard type number for safety standard application. Ex. TLP785(D4-GR-LF6,F  TLP785 EN60747 Isolation Characteristics Description Symbol Rating Unit Application classification for rated mains voltage ≤ 300 Vrms for rated mains voltage ≤ 600 Vrms Climatic classification Pollution degree Maximum operating insulation voltage TLP785 TLP785F Input to output test voltage, Vpr = 1.5×VIORM, type and sample test tp = 10s, partial discharge < 5pC TLP785 Input to output test voltage, Vpr = 1.875×VIORM, 100% production test tp = 1s, partial discharge < 5pC TLP785 TLP785F TLP785F Highest permissible overvoltage (transient overvoltage, tpr = 60s) Safety limiting values (max. permissible ratings in case of fault) current (input current) Psi = 0mW power (output or total power dissipation) temperature Insulation resistance, ― I−IV I−III VIO = 500V, Ta=25°C VIORM Vpr Vpr ― 2 ― 890 1140 1335 1710 1670 2140 Vpk Vpk Vpk VTR 8000 Vpk Isi Psi Tsi 400 700 175 mA mW °C Rsi 10 55 / 115 / 21 ≥10 12 Ω 2014-09-22 TLP785,TLP785F Insulation Related Specifications 7.62mm pitch TLPxxx type 10.16mm pitch TLPxxxF type Minimum creepage distance Cr 7.0mm 8.0mm Minimum clearance Cl 7.0mm 8.0mm Minimum insulation thickness ti 0.4 mm CTI 175 Comparative tracking index (1) If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.g.at a standard distance between soldering eye centres of 7.5mm). If this is not permissible, the user shall take suitable measures. (2) This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. VDE test sign: Marking on product for EN60747 4 Marking on packing for EN60747 Marking Example: TLP785, TLP785F P Lot No. Device Name CTR Rank Marking 4: Mark for option (D4) 1pin indication 11 2014-09-22 TLP785,TLP785F Figure 1 Partial discharge measurement procedure according to EN60747 Destructive test for qualification and sampling tests. Method A (for type and sampling tests, destructive tests) t1, t2 t3, t4 tp(Measuring time for partial discharge) tb tini Figure VINITIAL(8kV) V Vpr(1335V for TLP785) (1710V for TLP785F) = 1 to 10 s =1s = 10 s = 12 s = 60 s VIORM(890V for TLP785) (1140V for TLP785F) 0 tini t1 t3 tP t2 tb 2 Partial discharge measurement procedure according to EN60747 Non-destructive test for100% inspection. Method B t3, t4 tp(Measuring time for partial discharge) tb Vpr(1670V for TLP785) (2140V for TLP785F) V (for sample test,nondestructive test) VIORM(890V for TLP785) (1140V for TLP785F) = 0.1 s =1s = 1.2 s Isi (mA) t tP t3 Figure t t4 tb t4 3 Dependency of maximum safety ratings on ambient temperature 500 1000 400 800 Psi (mW) 600 300  Isi 400 200 Psi  100 0 0 25 50 75 100 200 125 150 0 175 Ta (°C) 12 2014-09-22 TLP785,TLP785F I F - Ta P C - Ta 200 100 (mW) This curve shows the maximum 160 PC Collector power dissipation Forward current I F (mA) limit to the forward current. 80 60 40 20 0 -20 0 20 40 60 Ambient temperature 80 Ta 100 120 80 This curve shows the 40 maximum limit to the collector power dissipation. 0 120 -20 0 20 60 80 Ambient temperature (˚C) Ta 100 120 (˚C) IF-VF ∆ V F / ∆ Ta - I F 100 -3 Ta=25˚C (mA) -2.6 10 IF -2.2 -1.8 Forward current Forward voltage temperature coefficient ΔVF/ΔTa (mV/°C) 40 -1.4 -1 1 0.1 -0.6 0.1 1 Forward current 10 IF 100 0.4 (mA) 0.9 1.4 Forward voltage VF 1.9 (V) IFP – VFP 1000 Pulse width≤10μs (mA) Repetitive frequency=100Hz IFP 100 Pulse forward current Ta=25°C 10 1 0 0.4 0.8 1.2 Pulse forward voltage 1.6 VFP 2 2.4 (V) *The above graphs show typical characteristic. 13 2014-09-22 TLP785,TLP785F IC-VCE I C E O - Ta 80 10 Ta=25˚C (mA) 60 50 30 IC 0.1 Collector current ID (mA) 1 Collector dark current VCE =24V 0.01 0.001 20 15 40 10 20 5 I F= 2 m A 0.0001 0 0 20 40 60 Ambient temperature 80 100 0 2 4 6 8 Collector-emitter voltage Ta (°C) VCE 10 (V) IC-IF IC-VCE 100 40 Ta=25˚C Ta=25˚C 30 20 Collector current IC Collector current (mA) 30 IC (mA) 50 15 20 10 5 10 10 1 I F= 2 m A 0 0 0.2 0.4 0.6 0.8 Collector-emitter voltage 1 VCE 0.1 1.2 (V) VCE=5V VCE=0.4V 0.01 0.1 IC/IF -IF 1 Collector-emitter voltage 10 VCE 100 (V) 1000 Current transfer ratio IC / IF (%) Ta=25˚C 100 10 VCE=5V VCE=0.4V 1 0.1 1 Forward current 10 IF 100 (mA) *The above graphs show typical characteristic. 14 2014-09-22 TLP785,TLP785F I C - Ta V C E ( s a t ) - Ta 0.2 100 IF=5mA, 20 Collector-Emitter saturation Voltage VCE(sat) (V) Collector current IC (mA) 10 5 10 1 1 IF=0.5mA VCE=5V IC=1mA 0.16 0.12 0.08 0.04 0 0.1 -40 -20 0 20 40 Ambient temperature 60 Ta 80 -40 100 (°C) -20 0 20 40 Ambient temperature 60 Ta 80 100 (°C) Switching time - RL 1000 Ta=25˚C IF=16mA VCC=5V toff Switching time (μs) 100 ts 10 ton 1 1 10 Load resistance 100 RL (kΩ) *The above graphs show typical characteristic. 15 2014-09-22 TLP785,TLP785F RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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For details, please contact your TOSHIBA sales representative. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. 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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 16 2014-09-22