TMPN3150B1AF

TMPN3150B1AF TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TMPN3150B1AF Neuron ® Chip For Distributed Intelligent Control Networks (LONW ORKS®) The TMPN3150B1AF is a Neuron Chip which configures LONWORKS nodes in combination with external memory. Neuron Chips have all the built-in communications and control functions required to implement LONWORKS nodes. These nodes may then be easily integrated into highly-reliable distributed intelligent control networks. The typical functions for this chip are explained below. FEATURES l I / O Functions · Eleven programmable I / O pins. · Two programmable 16-bit timers and counters built in. · 34 different types of I / O functions to handle a wide range of input and output. · ROM firmware image containing pre-programmed I / O drivers, greatly simplifying application programs. ( Stored in external ROM ) l Network functions · Two CPUs for communication protocol processing built in. The communications and application CPUs execute in parallel. · Equipped with a built-in LonTalk protocol which supports all seven levels of the OSI reference model with ISO. · Highly reliable communication protocol is supplied as firmware. · Built-in twisted-pair wire transceiver · Equipped with communications modes and communication speeds which support various types of external transceivers. Supports twisted-pair wire, power line, radio ( RF ), infrared, coaxial cables and fiber optics. · Communication port transceiver modes and logical addresses stored within the EEPROM. Can be amended via the network. Weight : 1.0g (Typ.) 000707EBA1 · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 2001-02-21 1/9 TMPN3150B1AF l Other functions · Application programs are also stored within the EEPROM. Can be updated by downloading over the network. EEPROM can be externally added. · Built-in watch-dog timer. · Each chip has a unique ID number. Effective during the logical installation of networks. · Low electrical consumption mode supported with a sleep mode. · Built-in low-voltage detection circuit. Prevents incorrect operations and writing errors in the EEPROM during drops in power voltage. · The package is QFP64-P-1414-0.80A. . 2001-02-21 2/9 TMPN3150B1AF BLOCK DIAGRAM ITEM CPU RAM ROM EEPROM 16-bit Timer / Counter External Memory Interface Package TMPN3150B1AF 8-bit CPU×3 2,048 bytes ― 512 bytes 2 channels Available 64-pin SOP 2001-02-21 3/9 TMPN3150B1AF PIN ASSIGNMENT 2001-02-21 4/9 TMPN3150B1AF PIN FUNCTION PIN No. 24 23 6 PIN NAME CLK1 CLK2 ~RESET I/O Input Output I/O (built-in pull-up) I/O (built-in configurable pull-up) I/O PIN FUNCTION Oscillator connection, or external clock input. Oscillator connection. Leave open when external clock is input to CLK1. Reset pin. ( Active low ) 17 ~SERVICE Service pin. Indicator output during operation. Large current sink capacity ( 20mA ). General I / O port. General I / O port. One of IO4 to IO7 can be specified as No.1 timer / counter input. Output signal can be output to IO0. IO4 can be used as the No.2 timer / counter input with IO1 as output. General I / O port. Can be used for serial communication with other device. Data bus for memory expansion Output port for controlling read / write for memory expansion Output port for controlling memory expansion Address output port for memory expansion Power input ( 5.0V Typ. ) Power input (0V GND ) Do not connect anything. Leave pins open. Bidirectional port for communications. Supports several communications protocols by specifying mode. 2~5 IO0~IO3 10~13 IO4~IO7 I/O (built-in configurable pull-up) 14~16 43, 42, 38~33 45 46 47, 50~64 7, 20, 22, 26, 40, 41, 44 8, 9, 19, 21, 25, 39 1, 18, 27, 48, 49 28~32 IO8~IO10 D0, D1, D2~D7 R / ~W ~E A15, A14~A0 VDD VSS NC CP0~CP4 I/O I/O Output Output Output Input Input ― I/O *: ● The ~SERVICE and IO4 ~ IO7 terminals are programmable pull-ups. ● All VDD terminals must be externally connected. ● All VSS terminals must be externally connected. 2001-02-21 5/9 TMPN3150B1AF MAXIMUM RATINGS ( VSS = 0V, VSS typ.) CHARACTERISTICS Power Supply Voltage Input Voltage Power Dissipation Storage Temperature SYMBOL VDD VIN PD Tstg RATING −0.3~7.0 −0.3~VDD+0.3 800 −65~150 UNIT V V mW °C OPERATING CONDITIONS ITEM Operating Voltage Input Voltage ( TTL ) SYMBOL MIN TYP. MAX UNIT VDD VIH(1) V IL(1) V IH(2) V IL(2) 4.5 2.0 VSS VDD−0.8 VSS 0.625 −40 5.0 ― ― ― ― ― ― 5.5 VDD 0.8 VDD 0.8 10 85 V V V V V MHz °C Input Voltage ( CMOS ) Operating Frequency Operating Temperature fosc Topr ( Above operating conditions apply unless otherwise states. ) CHARACTERISTICS LOW Output Voltage (1) SYMBOL VOL (1) PINS IO0~IO3 TEST ELECTRICAL CHARACTERISTICS DC characteristic ( VDD = 5.0 V ± 10%, VSS = 0 V, Ta = −40~85°C ) CONDITION MIN 0 0 IOL=20mA IOL=10mA 0 0 0 0 VDD −0.4 VDD −0.4 VDD −1.0 VDD −0.4 −10 −30 ― 3.8 MAX 0.8 0.4 0.8 0.4 1.0 0.4 VDD VDD VDD VDD +10 −300 4.5 UNIT V V V V V V V V V V µA µA V IOL=20mA IOL=10mA Duty cycle=50% IOL=40mA IOL=1.4mA IOH=−1.4mA IOH=−1.4mA IOH=−40mA IOH=−1.4mA VIN=VSS~VDD (Note 3) VIN=0V LOW Output Voltage (2) LOW Output Voltage (3) LOW Output Voltage (4) HIGH Output Voltage (1) HIGH Output Voltage (2) HIGH Output Voltage (3) HIGH Output Voltage (4) Input Current Pull-up Current Low-voltage Level Detection VOL (2) VOL (3) VOL (4) VOH (1) VOH (2) VOH (3) VOH (4) ~SERVICE CP2, CP3 Others (Note 1) IO0~IO3 ~SERVICE CP2, CP3 Others (Note 1) (Note 2) IO4~IO7 ~SERVICE, ~RESET VDD IIN IPU VLVD Note1 : Output voltage characteristics exclude the ~RESET pin and CLK2 pin. Note2 : Excludes pull-up input pins. Note3 : The IO4 to IO7 and ~SERVICE pins have programmable pull-ups. ~RESET has a fixed pull-up. 2001-02-21 6/9 TMPN3150B1AF ITEM 10 MHz Clock Operating Mode Current Consumption 5 MHz Clock 2.5 MHz Clock 1.25 MHz Clock 0.625 MHz Clock Sleep Mode Current Consumption IDD (SLP) IDD (OP) SYMBOL TYP. 18 10 5 2.5 1.5 18 MAX 30 15 8 5 3 100 µA mA UNIT Note: Test conditions for current dissipation VDD=5V, all output=with no load, all input=0.2V or below or VDD−0.2V, programmable pull-up=off, crystal oscillator clock input, differential receiver disabled. The current value ( typ. ) is a typical value when Ta=25°C. The current value ( max ) applies to the rated temperature range at VDD=5.5V. 200µA ( typ. ) to 600µA ( max ) is added to the current of the differential receiver when the receiver is enabled. The differential receiver is enabled by either of the following conditions : ● When the Neuron chip is in Run mode and the communication ports are in Differential mode. ● When the Neuron chip is in Sleep mode, the communication ports are in Differential mode, and the Comm Port Wakeup is not masked. 2001-02-21 7/9 TMPN3150B1AF l Echelon, Neuron, LON, LonTalk, LonBuilder, NodeBuilder, LONWORKS, 3150, 3120 and LonManager are the registered trade marks of America’s Echelon Inc. l The Neuron Chip is manufactured by Toshiba under license from Echelon Corporation, USA. A licensing agreement between the customer and Echelon Corporation must be concluded before purchasing any of the neuron chip products. l The Neuron chip itself does not include the I2C object function. You need the “I2C Library” deliveried by Echelon. The Neuron chip and the I2C Library do not convey nor imply a right under any I2C patent rights of Philips Electronics N.V. ( “Philips” ) to make, use or sell any product employing such patent rights. Please refer all questions with respect to I2C patents and licenses to Philips at: Mr. Gert-Jan Hessenlmann Corporate Intellectual Property Philips International B.V. Prof. Holstlaan 6 Building WAH 1-100 P.O. Box 220 5600 AE, Eindhoven, The Netherlands Phone : +31 40 274 32 61 Fax : +31 40 274 34 89 E-mail: Gert.Jan.Hesselmann@philips.com. 2001-02-21 8/9 TMPN3150B1AF PACKAGE DIMENSONS 2001-02-21 9/9