TPCA8102

TPCA8102 TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOSⅢ) TPCA8102 0.5±0.1 Lithium Ion Battery Applications Notebook PC Applications Portable Equipment Applications 6.0±0.3 Unit: mm 1.27 8 0.4±0.1 5 0.05 M A • • • • • Small footprint due to small and thin package Low drain-source ON resistance: RDS (ON) = 4.5mΩ (typ.) High forward transfer admittance: |Yfs| = 60S (typ.) Low leakage current: IDSS = −10 µA (max) (VDS = −30 V) Enhancement mode: Vth = −0.8 to −2.0 V (VDS = −10 V, ID = −1 mA) 5.0±0.2 0.15±0.05 1 0.95±0.05 4 0.595 A 5.0±0.2 S 1 4 0.6±0.1 Absolute Maximum Ratings (Ta = 25°C) 8 4.25±0.2 Characteristics Drain-source voltage Drain-gate voltage (RGS = 20 kΩ) Gate-source voltage Drain current DC (Note 1) Symbol VDSS VDGR VGSS ID IDP PD PD PD EAS IAR Rating −30 −30 ±20 − 40 −120 45 2.8 Unit V V V A W W 1,2,3:SOURCE 4:GATE 5,6,7,8:DRAIN 5 0.8±0.1 JEDEC JEITA TOSHIBA ⎯ ⎯ 2-5Q1A Pulsed (Note 1) Weight: 0.076 g (typ.) Drain power dissipation (Tc=25℃) Drain power dissipation (t = 10 s) (Note 2a) Drain power dissipation (t = 10 s) (Note 2b) Single pulse avalanche energy (Note 3) Avalanche current Repetitive avalanche energy (Tc=25℃) (Note 4) Channel temperature Storage temperature range Circuit Configuration 8 7 6 5 1.6 W 208 − 40 4.5 150 −55 to 150 mJ A mJ °C °C 1 2 3 4 EAR Tch Tstg Note: For Notes 1 to 4, refer to the next page. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). This transistor is an electrostatic-sensitive device. Please handle with caution. 1 2006-11-16 3.5±0.2 1.1±0.2 0.05 S 0.166±0.05 TPCA8102 Thermal Characteristics Characteristics Thermal resistance, channel to case (Tc=25℃) Thermal resistance, channel to ambient (t = 10 s) (Note 2a) Symbol Rth (ch-c) Max 2.78 Unit °C/W Rth (ch-a) 44.6 °C/W Thermal resistance, channel to ambient (t = 10 s) (Note 2b) Rth (ch-a) 78.1 °C/W Marking (Note 5) TPCA 8102 * Type Lot No. Note 1: Ensure that the channel temperature does not exceed 150℃. Note 2: (a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) (a) (b) Note 3: VDD = 24 V,Tch = 25°C (initial),L = 100μH,RG = 25 Ω ,IAR = − 40 A Note 4: Repetitive rating: pulse width limited by max channel temperature Note 5: ” ” on the lower left of the marking indicates Pin 1. * Weekly code (three digits): Week of manufacture (01 for the first week of the year, continuing up to 52 or 53) Year of manufacture (Last digit of the calendar year) 2 2006-11-16 TPCA8102 Electrical Characteristics (Ta = 25°C) Characteristics Gate leakage current Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-ON time Switching time Fall time tf toff Qg Qgs1 Qgd Symbol IGSS IDSS V (BR) DSS V (BR) DSX Vth RDS (ON) |Yfs| Ciss Crss Coss tr ton 0V VGS −10 V ID = −20A VOUT VDS = −10 V, VGS = 0 V, f = 1 MHz Test Condition VGS = ±16 V, VDS = 0 V VDS = −30 V, VGS = 0 V ID = −10 mA, VGS = 0 V ID = −10 mA, VGS = 20 V VDS = −10 V, ID = − 1 mA VGS = −4 V, ID = −20 A VGS = −10 V, ID = −20 A VDS = −10 V, ID = −20 A Min Typ. Max Unit ⎯ ⎯ −30 −15 −0.8 ⎯ ⎯ 30 ⎯ ⎯ ⎯ ⎯ ⎯ 9.0 4.5 60 4600 850 980 10 20 78 ±10 −10 ⎯ ⎯ −2.0 14 6.0 µA µA V V mΩ S ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ VDD ∼ −24 V, VGS = 10 V, − ID = −40 A pF RL = 0.75 Ω 4.7 Ω ns ⎯ ⎯ ⎯ ⎯ ⎯ nC Turn-OFF time Total gate charge (gate-source plus gate-drain) Gate-source charge 1 Gate-drain (“miller”) charge VDD ∼ −15 V − < 1%, tw = 10 µs Duty = 220 109 24 25 ⎯ ⎯ Source-Drain Ratings and Characteristics (Ta = 25°C) Characteristics Drain reverse current Forward voltage (diode) Pulse (Note 1) Symbol IDRP VDSF Test Condition Min Typ. Max Unit A V ⎯ IDR = −40 A, VGS = 0 V ⎯ ⎯ ⎯ ⎯ −120 1.2 3 2006-11-16 TPCA8102 ID – VDS −50 −10 −8 −6 −4.5 −30 −2.8 −4 −3.8 −3.6 Common source Ta = 25°C Pulse test −100 −8 −6 −5 −4.5 −60 −1 ID – VDS −4 −3.8 −3.6 Common source Ta = 25°C Pulse test −3.4 −3.2 −3 −40 −2.8 −2.6 −20 VGS = −2.4 V −40 −80 (A) ID Drain current −20 −2.6 −10 VGS = −2.4V 0 0 Drain current −1 ID (A) 0 0 −3 −0.2 −0.4 −0.6 −0.8 −0.4 −0.8 −1.2 −1.6 −2 Drain-source voltage VDS (V) Drain-source voltage VDS (V) ID – VGS -100 Common source VDS = −10 V Pulse test −1.0 Ta = −55°C 25 100 VDS – VGS Common source Ta = 25°C Pulse test (V) VDS Drain-source voltage -80 −0.8 ID (A) -60 −0.6 Drain current -40 −0.4 -20 −0.2 −10 −20 ID = −40 A 0 0 −1 −2 −3 −4 0 0 −4 −8 −12 −16 −20 Gate-source voltage VGS (V) Gate-source voltage VGS (V) 1000 |Yfs| – ID Common source VDS = −10 V Pulse test Ta = −55°C 100 RDS (ON) – ID Common source Ta = 25°C Pulse test Forward transfer admittance ⎪ Yfs⎪ (S) 100 100 25 Drain-source ON resistance RDS (ON) (mΩ) VGS = −4 V 10 −10 10 1 1 10 100 1 1 10 100 1000 Drain current ID (A) Drain current ID (A) 4 2006-11-16 TPCA8102 RDS (ON) – Ta 20 Common source Pulse test 16 −20 ID = −40 A −10 V 12 VGS = −10 V 8 VGS = −4 V 100 −10 IDR – VDS −5 −3 Drain-source ON resistance RDS (ON) (mΩ) IDR (A) Drain reverse current −1 10 VGS = 0 V 4 ID = −10/ −20 / −40A Common source Ta = 25°C Pulse test 1 0 0.2 0.4 0.6 0.8 1 0 −80 −40 0 40 80 120 160 Ambient temperature Ta (°C) Drain-source voltage VDS (V) Capacitance – VDS 10000 Ciss −2.5 Vth – Ta Common source VDS = −10 V ID = −1 mA Pulse test Vth (V) Gate threshold voltage (pF) −2.0 1000 Coss Crss C −1.5 Capacitance −1.0 100 Common source VGS = 0 V f = 1 MHz Ta = 25°C 10 −0.1 −1 −10 −100 −0.5 0 −80 −40 0 40 80 120 160 Drain-source voltage VDS (V) Ambient temperature Ta (°C) Dynamic input/output characteristics −30 VDS −30 Common source ID = −40 A Ta = 25°C −20 −12 −6 −10 VGS VDD = −24 V −10 Pulse test −20 (V) Drain-source voltage 0 0 40 80 120 160 200 0 Total gate charge Qg (nC) Gate-source voltage VGS (V) VDS 5 2006-11-16 TPCA8102 rth – tw 1000 TRANSIENT THERMAL IMPEDANCE rth (℃/W) (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (2) 100 (Note 2b) (3) Tc=25℃ (1) 10 (3) 1 SINGLE PULSE 0.1 0.001 0.01 0.1 1 10 100 1000 PULSE WIDTH tw (s) PD – Ta 3 (1) (1)Device mounted on a glass-epoxy board(a) (2)Device mounted on a glass-epoxy board(b) ｔ＝ 10s (Note 2b) (Note 2a) PD – Tc 50 2.5 DRAIN POWER DISSIPATION PD (W) DRAIN POWER DISSIPATION PD (W) 40 2 30 1.5 (2) 20 1 0.5 10 0 0 50 100 150 200 0 0 50 100 150 200 AMBIENT TEMPERATURE Ta (°C) CASE TEMPERATURE Tc (°C) SAFE OPERATING AREA −1000 DRAIN CURRENT ID (A) ID max (continuous) −100 ID max (pulsed) * 10ms 1ms −10 DC OPEATION TC = 25°C * SINGLE NONREPETITIVE −1 PULSE Tc=25℃ CURVES MUST BE DERATED LINEARLY WITH INCREASE IN −0.1 −0.1 TEMPERATURE. VDSS max −10 −100 −1 DRAIN-SOURCE VOLTAGE VDS (V) 6 2006-11-16 TPCA8102 RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 030619EAA • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. • TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. 7 2006-11-16