TW070J120B
MOSFETs
Silicon Carbide N-Channel MOS
TW070J120B
1. Applications
•
Switching Voltage Regulators
2. Features
(1)
Chip design of 2nd generation (Built-in SiC schottky barrier diode)
(2)
Low diode forward voltage: VDSF = -1.35 V (typ.)
(3)
High voltage: VDSS = 1200 V
(4)
Low drain-source on-resistance: RDS(ON) = 70 mΩ (typ.)
(5)
Less susceptible to malfunction due to high threshold voltage: Vth = 4.2 to 5.8 V (VDS = 10 V, ID = 20 mA)
(6)
Enhancement mode.
3. Packaging and Internal Circuit
1: Gate
2: Drain (heatsink)
3: Source
TO-3P(N)
Start of commercial production
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Toshiba Electronic Devices & Storage Corporation
1
2020-08
2020-08-05
Rev.2.0
TW070J120B
4. Absolute Maximum Ratings (Note) (Ta = 25 unless otherwise specified)
Characteristics
Symbol
Rating
Unit
V
Drain-source voltage
VDSS
1200
Gate-source voltage
VGSS
+25/-10
Drain current (DC)
( Tc = 25 )
(Note 1)
ID
36.0
Drain current (DC)
( Tc = 100 )
(Note 1)
ID
25.5
(Note 1)
IDP
72
PD
272
W
Drain current (pulsed)
Power dissipation
( Tc = 25 )
A
Channel temperature
Tch
175
Storage temperature
Tstg
-55 to 175
Mounting torque
TOR
0.8
Note:
Nm
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
5. Thermal Characteristics
Characteristics
Symbol
Max
Unit
Channel-to-case thermal resistance
Rth(ch-c)
0.55
/W
Channel-to-ambient thermal resistance
Rth(ch-a)
50
Note 1: Ensure that the channel temperature does not exceed 175 .
Note:
This transistor is sensitive to electrostatic discharge and should be handled with care.
It should be used for switching applications.
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Toshiba Electronic Devices & Storage Corporation
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2020-08-05
Rev.2.0
TW070J120B
6. Electrical Characteristics
6.1. Static Characteristics (Ta = 25 unless otherwise specified)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
µA
Gate leakage current
IGSS
VGS = +25/-10 V, VDS = 0 V
±0.5
Drain cut-off current
IDSS
VDS = 1200 V, VGS = 0 V
0.2
10
Ta = 175 ,
VDS = 1200 V, VGS = 0 V
3.0
1200
Drain-source breakdown
voltage
Gate threshold voltage
V(BR)DSS
(Note 2)
Drain-source on-resistance
Vth
RDS(ON)
ID = 1 mA, VGS = 0 V
V
VDS = 10 V, ID = 20 mA
4.2
5.8
VGS = 20 V, ID = 18 A
70
90
Ta = 150 ,
VGS = 20 V, ID = 18 A
87
Min
Typ.
Max
Unit
1680
pF
8
109
mΩ
Note 2: Please be sure to IGSS (VGS = 25 V) test before the Vth test.
6.2. Dynamic Characteristics (Ta = 25 unless otherwise specified)
Characteristics
Symbol
Input capacitance
Ciss
Reverse transfer capacitance
Crss
Output capacitance
Coss
Coss stored energy
Eoss
Test Condition
VDS = 800 V, VGS = 0 V,
f = 100 kHz
42
µJ
VDS = OPEN, f = 100 kHz
3.5
Ω
See Fig. 6.5.1
See Fig. 6.5.2
17
ns
7
td(off)
40
tf
35
Turn-on switching loss
Eon
0.380
Turn-off switching loss
Eoff
0.035
Gate resistance
rg
Turn-on delay time
td(on)
Switching time (rise time)
tr
Turn-off delay time
Switching time (fall time)
mJ
6.3. Gate Charge Characteristics (Ta = 25 unless otherwise specified)
Characteristics
Symbol
Total gate charge (gate-source plus
gate-drain)
Qg
Test Condition
VDD ≈ 800 V, VGS = 20 V,
ID = 18 A
Min
Typ.
Max
Unit
67
nC
Gate-source charge 1
Qgs1
13
Gate-drain charge
Qgd
25
6.4. Source-Drain Characteristics (Ta = 25 unless otherwise specified)
Characteristics
Symbol
Diode forward current (DC)
(Note 3)
IF
Diode forward current
(pulsed)
(Note 3)
IFP
Diode forward voltage
VDSF
Reverse recovery time
trr
Reverse recovery charge
Qrr
Peak reverse recovery
current
Irr
Test Condition
Min
Typ.
Max
Unit
Tc = 25
36
A
Tc = 100
29.6
Tc = 25
72
Tc = 100
32
IDR = 10 A, VGS = -5 V
-1.35
-1.80
Ta = 150 ,
IDR = 10 A, VGS = -5 V
-1.70
IDR = 10 A, VGS = 0 V,
VDD = 800 V, -dIDR/dt = 1000 A/µs
22
ns
170
nC
15
A
V
Note 3: Ensure that the channel temperature does not exceed 175 .
©2020
Toshiba Electronic Devices & Storage Corporation
3
2020-08-05
Rev.2.0
TW070J120B
6.5. Test Circuit and Timing Diagram
VGS1 = -5 V
RG1 = 0 Ω
VGS2 = -5 V / +20 V (pulsed)
RG2 = 4.7 Ω
VDD ≈ 800 V
ID = 10 A
L = 100 µH
Fig. 6.5.1 Switching Time Test Circuit
Fig. 6.5.2 Timing Diagram
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Toshiba Electronic Devices & Storage Corporation
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2020-08-05
Rev.2.0
TW070J120B
7. Marking (Note)
Fig. 7.1 Marking
Note:
A line under a Lot No. identifies the indication of product Labels.
Not underlined: [[Pb]]/INCLUDES > MCV
Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
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Toshiba Electronic Devices & Storage Corporation
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2020-08-05
Rev.2.0
TW070J120B
8. Characteristics Curves (Note)
Fig. 8.1 ID - VDS
Fig. 8.2 ID - VDS
Fig. 8.3 ID - VGS
Fig. 8.4 Vth - Ta
Fig. 8.5 RDS(ON) - VGS
Fig. 8.6 RDS(ON) - ID
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2020-08-05
Rev.2.0
TW070J120B
Fig. 8.7 RDS(ON) - ID
Fig. 8.8 RDS(ON) - Ta
Fig. 8.9 VDSS - Ta
Fig. 8.10 Dynamic Input/Output Characteristics
Fig. 8.11 C - VDS
Fig. 8.12 Eoss - VDS
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Toshiba Electronic Devices & Storage Corporation
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2020-08-05
Rev.2.0
TW070J120B
Fig. 8.13 PD - Tc
(Guaranteed Maximum)
Fig. 8.14 IDR - VDS
Fig. 8.15 Rth(ch-c) - tw
(Guaranteed Maximum)
Fig. 8.16 Safe Operating Area
(Guaranteed Maximum)
Note:
Fig. 8.17 Reverse Safe Operating Area
(Guaranteed Maximum)
The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
©2020
Toshiba Electronic Devices & Storage Corporation
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2020-08-05
Rev.2.0
TW070J120B
Package Dimensions
Unit: mm
Weight: 4.6 g (typ.)
Package Name(s)
TOSHIBA: 2-16C1S
Nickname: TO-3P(N)
©2020
Toshiba Electronic Devices & Storage Corporation
9
2020-08-05
Rev.2.0
TW070J120B
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2020-08-05
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