TC3341

TC3341 REV2_20050418 3.3 - 3.7 GHz 2W MMIC FEATURES • • • • • • P-1 dB: 32.5 dBm Small Signal Gain: 27 dB Power Added Efficiency: 30 % IP3: 42 dBm Match to 50 Ω operation Bias condition: 700 mA @ 8 V PHOTO ENLARGEMENT GND GND RF IN Vd1 Vd2 Vg1 Vg2 RF OUT GND GND DESCRIPTION The TC3341 is a 2-stage PHEMT MMIC power amplifier. It is designed for use in low cost and high volume 3.3-3.7 GHz band applications. The MMIC is matched to 50Ω operation. It provides a typical gain of 27 dB and P1dB power of 32.5 dBm. Typical bias condition is 8V at 700 mA. The MMIC is packaged in a copper based ceramic 10 pins power package. The copper based carrier of the package allows direct soldering of the device to the PCB. APPLICATIONS • Wireless Internet Access • Wireless Local Loop • Two way radio ELECTRICAL SPECIFICATIONS (Ta = 25 °C) SYMBOL FREQ SSG GOF P-1 dB P-3 dB IP3 VSWR, IN VDD Vg IDD IDP-1 DESCRIPTION Frequency Range Small Signal Gain Small Signal Gain Flatness Output Power at 1 dB Gain Compression Output Power at 3 dB Gain Compression Third Order Intercept Point Input VSWR Supply Voltage Gate Voltage Current Supply Without RF Current Supply @ Pout=P-1 dB Power Added Efficiency -0.6 31.5 32 40 MIN 3.3 26 27 ±0.5 32.5 33 42 2:1 8 -1.0 700 750 30 -1.5 Volt Volt mA mA % dBm dBm dBm TYP MAX 3.7 UNITS GHz dB ηa TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P1/3 TC3341 REV2_20050418 Absolute Maximum Ratings Symbol Vdd Idd Pin Pt Tch TSTG Parameter/Conditions Drain-Source Voltage Total Drain Current RF Input Power Power Dissipation Operating Channel Temperature Storage Temperature Min. Max. 12 2200 10 12 175 175 Units Volts mA dBm W °C °C Note: 1.This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. 2.Specifications subject to change without notice. -65 TEST CIRCUITS Evaluation Board Schematic EVALUATION BOARD PCB Material: RO4003 ER = 3.38 Thickness = 20 mil Unit: mil * DXF file of the PCB can be downloaded from our web-site at www.transcominc.com.tw * Application Notes: For better heat sinking and grounding, it's recommended to have the via holes beneath TC3341 filled with solder and have two screws installed on required heat sink plate besides TC3341 on the PCB area. TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P2/3 TC3341 REV2_20050418 Evaluation Board Parts List Part Type Reference Designator Capacitor C1, C2, C3, C4 Capacitor C5 Capacitor C6, C7 Capacitor C8 Capacitor C9 Resistor R1 Description 1000pF 0603 0.1 uF 0603 4.7uF Tantalum Cap. 2.5pF 0603 3.3pF 0603 200 ohm 0603 Murata Murata GRM39C0G2R5C50V GRM39C0G3R3C50V Manufacturer Murata Murata Part Number GRM39C0G102J50V GRM39Y5V104Z25V GND GND RF IN 50 ohm LINE 1 2 3 4 10 Vg 9 8 7 6 50 ohm LINE GND GND RF OUT Vd 5 Pin # 1, 2, 6, 7 3 4, 5 9, 10 8 Name GND RF IN Vd Vg RF OUT Description Ground RF input (internally DC blocked) MMIC drain bias MMIC gate bias RF output (internally DC blocked) CONNECTION DIAGRAM AND PIN DESCRIPTIONS PHYSICAL DIMENSIONS (Unit: inch) α H J C DIMENSION MINIMUM NOMINAL MAXIMUM F E TC3341 B A 0.002M AX G D TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 P3/3 I α A B C D E F G H I J 0.054 0.007 0.017 0.267 0.047 0.247 0.267 0.007 0.020 0.073 0° 0.057 0.008 0.020 0.270 0.050 0.250 0.270 0.008 0.080 0.060 0.009 0.023 0.273 0.053 0.253 0.273 0 .009 0.040 0.087 7°