TMC2130-TA-T

APPLICATION NOTE AN005: IC Package / PCB Footprint Guidelines - eTQFP48 Document Revision V1.00 • 2017-June-13 This application note is meant to be a practical guideline for a specific TRINAMIC IC package and its PCB footprint. The document covers package dimensions, example footprint and general information on PCB footprints. Contents 1 Figures Index 1 2 Tables Index 1 3 Overview 2 4 eTQFP48Package Details 4.1 eTQFP48 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 3 4 5 General PCB Footprint Information Resources 5.1 QFP Packages . . . . . . . . . . . . . . . . . . . . . . . . 5.2 QFN Packages . . . . . . . . . . . . . . . . . . . . . . . . 5.3 FBGA Packages . . . . . . . . . . . . . . . . . . . . . . . 5.4 IPC-7351B Standard and Land Pattern Calculator Tool 5.5 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 5 6 6 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Revision History 1 7 Figures Index 1 2 3 4 2 eQFP48 example . . . . . . . . . . . . eTQFP48 package outline drawings . eTQFP48 example land patterns (unit: mm) . . . . . . . . . . . . . . . . . . . . EIA Standard Board Layout of Soldered Pad for QFP Devices (unit: mm) 2 3 5 6 4 Board Layout of Soldered Pad for QFN Devices according to Intersil TB389 . EIA Standard Board Layout of Soldered Pad for FBGA Devices (unit: mm) 6 Document Revision . . . . . . . . . . . 7 6 5 Tables Index 1 2 eTQFP48 dimensions (unit: mm) . . . EIA Standard Board Layout of Soldered Pad for QFP Devices (unit: mm) 4 5 ©2017 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany Download newest version at: www.trinamic.com 3 AN005: IC Package / PCB Footprint Guidelines - eTQFP48 • Application Note • Document Revision V1.00 • 2017-June-13 3 2/7 Overview This application note is meant to be a practical guideline for a specific TRINAMIC IC package and its PCB footprint. The document covers package dimensions, example footprint and general information on PCB footprints. An overview of all available combinations of TRINAMIC IC products and package options is given in application note "‘AN048: Overview of TRINAMIC ICs, Available Packages, and Order Code"’. 4 4.1 eTQFP48Package Details eTQFP48 Figure 1: eQFP48 example ©2017 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany Terms of delivery and rights to technical change reserved. Download newest version at www.trinamic.com Read entire documentation. AN005: IC Package / PCB Footprint Guidelines - eTQFP48 • Application Note • Document Revision V1.00 • 2017-June-13 4.2 Dimensions Figure 2: eTQFP48 package outline drawings ©2017 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany Terms of delivery and rights to technical change reserved. Download newest version at www.trinamic.com Read entire documentation. 3/7 AN005: IC Package / PCB Footprint Guidelines - eTQFP48 • Application Note • Document Revision V1.00 • 2017-June-13 Parameter Ref Nom Max total thickness A – 1.2 stand off A1 – 0.15 mold thickness A2 1 1.05 lead width (plating) b 0.22 0.27 lead width b1 0.2 0.23 lead frame thickness (plating) c – 0.2 lead frame thickness c1 – 0.16 body size X (over pins) D 9.0 – body size Y (over pins) E 9.0 – body size X D1 7.0 – body size Y E1 7.0 – lead pitch e 0.5 – lead L 0.6 0.75 footprint L1 1 REF – Θ 3.5◦ 7◦ Θ1 – – Θ2 12◦ 13◦ Θ3 12◦ 13◦ R1 – – R2 – 0.2 S – – exposed die pad size X M 5 5.1 exposed die pad size Y N 5 5.1 package edge tolerance aaa – 0.2 lead edge tolerance bbb – 0.2 coplanarity ccc – 0.08 lead offset ddd – 0.08 mold flatness eee – 0.05 Table 1: eTQFP48 dimensions (unit: mm) 4.3 Land Pattern Figure 3: eTQFP48 example land patterns (unit: mm) ©2017 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany Terms of delivery and rights to technical change reserved. Download newest version at www.trinamic.com Read entire documentation. 4/7 AN005: IC Package / PCB Footprint Guidelines - eTQFP48 • Application Note • Document Revision V1.00 • 2017-June-13 5 5/7 General PCB Footprint Information Resources These guidelines and information are proposals and suggestions as they are proven and work well with TRINAMIC modules. 5.1 QFP Packages These guidelines are for Quad Flat Packages in general (PQFP, LQFP, TQFP) and are derived from the EIA/JEDEC standard. Figure 4: EIA Standard Board Layout of Soldered Pad for QFP Devices (unit: mm) PQ160 PQ160 PQ/ PQ/ 3.2mm 3.9mm RQ208 RQ240 28.4 28.4 29.2 28.2 32.2 13.8 14.4 28.4 28.4 29.2 28.2 32.2 0.65 0.65 0.65 0.65 0.5 0.5 Dim. PQ100 PQ144 Md 20.4 Me e b2 l2 0.3-0.5 1.8 0.3-0.5 1.8 0.3-0.5 1.8 0.3-0.5 1.8 0.3-0.4 1.6 0.3-0.4 1.6 VQ80 VQ/ VQ128 VQ176 TQ64 TQ144 TQ176 13.8 13.8 19.8 10.1 19.8 23.8 13.8 13.8 13.8 19.8 10.1 19.8 23.8 0.65 0.5 0.5 0.5 0.5 0.3-0.4 0.3-0.4 0.3-0.4 1.6 1.6 1.6 0.3-0.5 1.8 TQ100 0.4 0.4 0.25- 0.25- 0.30 0.30 1.6 1.6 0.3-0.4 1.6 Table 2: EIA Standard Board Layout of Soldered Pad for QFP Devices (unit: mm) 5.2 QFN Packages These are basic guidelines for Quad Flat No Leads Packages (QFNs). They are derived from the Technical Brief TB389 from Intersil (http://www.intersil.com/data/tb/TB389.pdf). ©2017 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany Terms of delivery and rights to technical change reserved. Download newest version at www.trinamic.com Read entire documentation. AN005: IC Package / PCB Footprint Guidelines - eTQFP48 • Application Note • Document Revision V1.00 • 2017-June-13 6/7 Figure 5: Board Layout of Soldered Pad for QFN Devices according to Intersil TB389 5.3 FBGA Packages These guidelines are for Fine Line Ball Grid Arrays (FBGAs) with 1mm ball pitch and are derived from the EIA/JEDEC standard. Figure 6: EIA Standard Board Layout of Soldered Pad for FBGA Devices (unit: mm) 5.4 IPC-7351B Standard and Land Pattern Calculator Tool The IPC-7351B Land Pattern Calculator is based upon algorithms and engineering goals established in the IPC-7351B standard. Mentor Graphics provides a similar free tool. The IPC-7351B standard as well as the Calculator Tool are available online: http://www.ipc.org/ContentPage.aspx?pageid=Land-Pattern-Calculator http://www.mentor.com/products/pcb-system-design/library-tools/lp-wizard/lp-viewer-download ©2017 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany Terms of delivery and rights to technical change reserved. Download newest version at www.trinamic.com Read entire documentation. AN005: IC Package / PCB Footprint Guidelines - eTQFP48 • Application Note • Document Revision V1.00 • 2017-June-13 7/7 IPC-7351B Description (Source: IPC Online Store, https://portal.ipc.org/Association/Index.htm): “IPC-7351B includes both the standard and an IPC-7351B land pattern calculator for accessing component and land pattern dimensional data. The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately. The tool also allows for modification of dimensional attributes of IPC approved land patterns. This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density. Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SODFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards. Purchasers also receive a 30-day trial of the IPC-7351 Land Pattern Wizard developed by Mentor Graphics, which is an advanced version of the IPC-7351B Land Pattern Calculator. The IPC-7351B Land Pattern Wizard tool enables users to not only save their land patterns within new land pattern library files, but also to instantly export land patterns to their preferred CAD format, such as Allegro, Board Station, Expedition, PADS, CADSTAR, OrCAD, Pantheon and P-CAD. 102 pages. Released June 2010.” 5.5 Disclaimer TRINAMIC Motion Control GmbH & Co. KG does not authorize or warrant any of its products for use in life support systems, without the specific written consent of TRINAMIC Motion Control GmbH & Co. KG. Life support systems are equipment intended to support or sustain life, and whose failure to perform, when properly used in accordance with instructions provided, can be reasonably expected to result in personal injury or death. Information given in this application note is believed to be accurate and reliable. However, no responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. All trademarks used are property of their respective owners. 6 Revision History Version Date Author Description V1.00 20.05.2017 SK V1.00 release version Table 3: Document Revision ©2017 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany Terms of delivery and rights to technical change reserved. Download newest version at www.trinamic.com Read entire documentation.