AGR09130EU

t Copy Only AGR09130E 130 W, 921 MHz—960 MHz, N-Channel E-Mode, Lateral MOSFET Introduction The AGR09130E is a high-voltage, laterally diffused metal oxide semiconductor (LDMOS) RF power transistor suitable for cellular band, code division multiple access (CDMA), global system for mobile communication (GSM), enhanced data for global evolution (EDGE), and time division multiple access (TDMA) single and multicarrier class AB wireless base station amplifier applications. This device is manufactured on an advanced LDMOS technology offering stateof-the-art performance, and reliability. Packaged in an industry-standard package incorporating internal matching and capable of delivering a minimum output power of 130 W, it is ideally suited for today's RF power amplifier applications. 7 Table 1. Thermal Characteristics Parameter Thermal Resistance, Junction to Case: AGR09130EU AGR09130EF Sym Value Unit R JC 0.5 0.5 °C/W Table 2. Absolute Maximum Ratings* Parameter Drain-source Voltage Gate-source Voltage Drain Current—Continuous Total Dissipation at TC = 25 °C: AGR09130EU AGR09130EF Derate Above 25 C: AGR09130EU AGR09130EF Operating Junction Temperature Storage Temperature Range Sym Value VDSS 65 VGS –0.5, 15 ID 15 PD 350 350 2.0 2.0 200 Unit Vdc Vdc Adc W W/°C °C °C TJ AGR09130EU 48 AGR09130EF 5 TSTG –65, 150 Figure 1. Available Pa ckages Features Typical performance ratings are for the EDGE format: 3GPP GSM 05.05: — Output power (POUT): 50 W. — Power gain: 17.8 dB. — Modulation spectrum: @ ±400 kHz = –60 dBc. @ ±600 kHz = –72 dBc. — Error vector magnitude (EVM) = 1.8%. — Return loss: –10 dB. High-reliability, gold-metalization process. Internally matched. High gain, efficiency, and linearity. Integrated ESD protection. Si LDMOS. Industry-standard packages. P1dB of 130 W minimum output power. * Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Table 3. ESD Rating* AGR09130E HBM MM CDM Minimum (V) 500 50 1500 Class 1B A 4 * Although electrostatic discharge (ESD) protection circuitry has been designed into this device, proper precautions must be taken to avoid exposure to ESD and electrical overstress (EOS) during all handling, assembly, and test operations. PEAK Devices Agere employs a human-body model (HBM), a machine model (MM), and a charged-device model (CDM) qualification requirement in order to determine ESD-susceptibility limits and protection design evaluation. ESD voltage thresholds are dependent on the circuit parameters used in each of the models, as defined by JEDEC's JESD22-A114B (HBM), JESD22-A115A (MM), and JESD22-C101A (CDM) standards. Caution: MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed. Draft Copy Only AGR09130E 130 W, 921 MHz—960 MHz, N-Channel E-Mode, Lateral MOSFET Electrical Characteristics Recommended operating conditions apply unless otherwise specified: TC = 30 °C. Table 4. dc Characteristics Parameter Off Characteristics 200 Drain-source Breakdown Voltage (VGS = 0, ID = 4 00 µA) Gate-source Leakage Current (VGS = 5 V, VDS = 0 V) Zero Gate Voltage Drain Leakage Current (VDS = 28 V, VGS = 0 V) On Characteristics Forward Transconductance (VDS = 10 V, ID = 1 A) Gate Threshold Voltage (VDS = 10 V, ID = 400 µA) Gate Quiescent Voltage (VDS = 26 V, IDQ = 1000 mA) Drain-source On-voltage (VGS = 10 V, ID = 1 A) Table 5. RF Characteristics Parameter Dynamic Characteristics Output Capacitance (VDS = 28 Vdc, VGS = 0, f = 1 MHz) Transfer Capacitance (VDS = 28 Vdc, VGS = 0, f = 1 MHz) COSS CRSS — — 72 3.0 — — pF pF Symbol Min Typ Max Unit GFS VGS(TH) VGS(Q) VDS(ON) — — — — 9 — 3.8 0.08 — 4.8 — — S Vdc Vdc Vdc Symbol V(BR)DSS IGSS IDSS Min 65 — — Typ — — — Max — 4 200 12 Unit Vdc µAdc µAdc Functional Tests (in Supplied Test Fixture) Agere Systems Supplied Test Fixture) (Test frequencies (f) = 920 MHz, 940 MHz, 960 MHz) Linear Power Gain (VDS = 26 V, POUT = 50 W, IDQ = 1000 mA) Output Power (VDS = 26 V, 1 dB compression, IDQ = 1000 mA) Drain Efficiency (VDS = 26 V, POUT = P1dB, IDQ = 1000 mA) Third-order Intermodulation Distortion (100 kHz spacing, VDS = 26 V, POUT = 120 WPEP, IDQ = 1000 mA) Input VSWR Ruggedness (VDS = 26 V, POUT = 130 W, IDQ = 1000 mA, f = 940 MHz, VSWR = 5:1, all angles) IM3 VSWRI — GL P1dB 16 130 — — — 18 150 55 30 2:1 — — — — — dB W % dBc — No degradation in output power. AGR09130E 130 W, 921 MHz—960 MHz, N-Channel E-Mode, Lateral MOSFET Draft Copy Only Test Circuit Illustrations for AGR09130E VGG R4 R3 FB2 C24 R3 FB1 C23 C29 C12 C11 VDD C25 R2 C10 C9 C8 Z16 Z11 C17 C19 C26 C20 C28 C21 C22 C27 Z12 C15 Z13 Z14 C16 Z15 Z17 R1 Z1 C1 Z2 C2 Z3 Z4 Z5 Z6 Z7 C13 C14 Z10 RF OUTPUT Z8 Z9 2 1 3 DUT RF INPUT PINS: 1. DRAIN 2. GATE 3. SOURCE C3 C4 C7 C5 C6 A. Schematic 2 3 1 MHz Parts List: Microstrip line: Z1 0.834 in. x 0.066 in.; Z2 0.066 in. x 0.066 in.; Z3 0.290 in. x 0.066 in.; Z4 0.050 in. x 0.180 in.; Z5 0.650 in. x 0.180 in.; Z6 0.050 in. x 0.800 in.; Z7 0.132 in. x 0.800 in.; Z8 0.105 in. x 0.800 in.; Z9 0.050 in. x 0.800 in.; Z10 0.423 in. x 0.700 in.; Z11 0.227 in. x 0.700 in.; Z12 0.920 in. x 0.180 in.; Z13 0.040 in. x 0.180 in.; Z14 0.470 in. x 0.066 in.; Z15 0.495 in. x 0.066 in.; Z16 1.340 in. x 0.050 in.: Z17 1.100 in. x 0.050 in. AT C ® chip capacitor: C1, C8, C16, C17: 47 pF 100B470JW; C3 1.5 pF 100B1R5BW; C4: 6.8 pF 100B6R8BW; C13, C14: 12 pF 100B120JW; C5, C6, 10 pF 100B100JW; C7 5.6 pF 100B5R6BW; C9: 100 pF 100B101JW. 0603 chip capacitor: C10, C19: 220 pF. K emet®: chip capacitor, C11, C26: 0.01 µF C1206C103KRAC7800; C12, C20, C23, C28, C29: 0.1 µF C1206C104KRAC7800. J ohans on G iga-Trim® variable capacitor, 27291SL: C2, C15: 0.8 pF to 8 pF. S prague ® tantalum chip capacitor (35 V): C21, C24, C25, C27 10 µF; C22 22 µF. 1206 size fixed film chip resistor (0.25 W): R1: 51 RM73B2B510J; R2 56 k RM73B2B563J; R3 12 RM73B2B120J; R4 1.2 k RM73B2B122J; R5 RM73B2B4R3J 4.3 . K reger ® ferrite bead: FB1 2743019447; FB2 2743021447. Taconic ® ORCER RF-35: board material, 1 oz. copper, 30 mil thickness, r = 3.5. B. Component Layout Figure 2. AGR09130E Test Circuit Draft Copy Only AGR09130E 130 W, 921 MHz—960 MHz, N-Channel E-Mode, Lateral MOSFET Typical Performance Characteristics 0.11 0.12 0.38 0.13 0.37 0.14 0.36 0.1 50 45 9 0.0 0.4 0.39 100 0.9 90 1.0 0.15 0.35 80 0.6 60 0.4 12 0 0. 07 13 5 65 0. 0. 0. 06 0. 44 43 0 T CI PA CA E IV TA EP SC SU Yo) jB/ E (+ NC 0.7 2 0.2 70 0.0 0.4 75 EN T (+ j X/ Z ,O o) R 14 5 0.4 0 5 0.0 6 15 0 CE CO M 0.4 PO N 0.6 4 0.0 Ð > W A V EL E N GTH S TOW A RD 0.0 0.49 GEN ERA 0.48 ± 180 TO 170 RÐ 0.4 > 7 160 90 80 0.8 RE AC TA N 85 U CT IVE f3 f1 0.6 1. 0 0 ZL 0.4 IN D 0.1 0.9 1.0 1.2 1. 0.2 0.5 0.6 0.7 0.8 1.4 1.8 0.3 0.4 Z0 = 5 Ω A D