AGR19060E 60 W, 1930 MHz—1990 MHz, PCS LDMOS RF Power Transistor
Introduction
The AGR19060E is a 60 W, 28 V N-channel laterally diffused metal oxide semiconductor (LDMOS) RF power field effect transistor (FET) suitable for personal communication service (PCS) (1930 MHz— 1990 MHz), global system for mobile communication (GSM/EDGE), time-division multiple access (TDMA), and single-carrier or multicarrier class AB power amplifier applications.
GSM Features
Typical performance over entire GSM band: — P1dB: 60 W typical. — Continuous wave (CW) power gain: @ P1dB = 14.5 dB. — CW efficiency @ P1dB = 53% typical. — Return loss: –12 dB.
Device Performance Features
High-reliability, gold-metalization process. Low hot carrier injection (HCI) induced bias drift over 20 years.
AGR19060EU (unflanged)
AGR19060EF (flanged)
Internally matched. High gain, efficiency, and linearity. Integrated ESD protection. Device can withstand 10:1 voltage standing wave ratio (VSWR) at 28 Vdc, 1930 MHz, 60 W CW output power. Large signal impedance parameters available.
Figure 1. Available Packages
N-CDMA Features
Typical 2 carrier N-CDMA performance: VDD = 28 V, IDQ = 700 mA, f1 = 1958.75 MHz, f2 = 1961.25 MHz, IS-95 CDMA (pilot, sync, paging, traffic codes 8—13). Peak/average (P/A) = 9.72 dB at 0.01% probability on CCDF. 1.2288 MHz transmission bandwidth (BW). Adjacent channel power ratio (ACPR) measured over 30 kHz BW at f1 – 885 kHz and f2 + 885 kHz. Third-order intermodulation distortion (IM3) measured over a 1.2288 MHz BW at f1 – 2.5 MHz and f2 + 2.5 MHz. — Output power (POUT): 12 W. — Power gain: 15.5 dB. — Efficiency: 23.5%. — IM3: –36 dBc. — ACPR: –50.5 dBc.
ESD Rating*
AGR19060E HBM MM CDM Minimum (V) 500 50 1500 Class 1B A 4
EDGE Features
Typical EDGE performance (1960 MHz, 26 V, IDQ = 500 mA): — Output power (POUT): 25 W. — Power gain: 15.3 dB. — Efficiency: 37%. — Modulation spectrum: @ ±400 kHz = –61.0 dBc. @ ±600 kHz = –74.0 dBc. — Error vector magnitude (EVM) = 2.5%.
* Although electrostatic discharge (ESD) protection circuitry has been designed into this device, proper precautions must be taken to avoid exposure to ESD and electrical overstress (EOS) during all handling, assembly, and test operations. PEAK Devices Agere employs a human-body model (HBM), a machine model (MM), and a charged-device model (CDM) qualification requirement in order to determine ESD-susceptibility limits and protection design evaluation. ESD voltage thresholds are dependent on the circuit parameters used in each of the models, as defined by JEDEC's JESD22-A114B (HBM), JESD22-A115A (MM), and JESD22-C101A (CDM) standards. Caution: MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed.
AGR19060E 60 W, 1930 MHz—1990 MHz, PCS LDMOS RF Power Transistor
Electrical Characteristics
Table 1. Thermal Characteristics Parameter Thermal Resistance, Junction to Case: AGR19060EU AGR19060EF Table 2. Absolute Maximum Ratings* Parameter Drain-source Voltage Gate-source Voltage Total Dissipation at TC = 25 °C: AGR19060EU AGR19060EF Derate Above 25 °C: AGR19060EU AGR19060EF Operating Junction Temperature Storage Temperature Range Symbol VDSS VGS PD PD — — TJ TSTG Value 65 –0.5, 15 175 175 1.00 1.00 200 –65, 150 Unit Vdc Vdc W W W/°C W/°C °C °C Symbol Value 1.00 1.00 Unit °C/W °C/W
RθJC RθJC
* Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability.
Recommended operating conditions apply unless otherwise specified: T C = 30 °C. Table 3. dc Characteristics Parameter Off Characteristics = 300µA Drain-source Breakdown Voltage (VGS = 0 V, ID = 90 µA) Gate-source Leakage Current (VGS = 5 V, VDS = 0 V) Zero Gate Voltage Drain Leakage Current (VDS = 28 V, VGS = 0 V) On Characteristics Forward Transconductance (VDS = 10 V, ID = 0.45 A) Gate Threshold Voltage (VDS = 10 V, ID = 180 µA) Gate Quiescent Voltage (VDS = 28 V, ID = 500 mA) Drain-source On-voltage (VGS = 10 V, ID = 0.45 A) Symbol V(BR)DSS IGSS IDSS GFS VGS(th) VGS(Q) VDS(on) Min 65 — — — — — — Typ — — — 4.0 — 3.6 0.08 Max — 1.8 100 5.5 — 4.8 — — Unit Vdc µAdc µAdc S Vdc Vdc Vdc
AGR19060E 60 W, 1930 MHz—1990 MHz, PCS LDMOS RF Power Transistor
Electrical Characteristics (continued)
Recommended operating conditions apply unless otherwise specified: TC = 30 °C. Table 4. RF Characteristics Parameter Symbol Min Typ Max Unit Dynamic Characteristics CRSS — 1.3 — pF Transfer Capacitance (VDS = 28 V, VGS = 0, f = 1 MHz) (Part is internally matched both on input and output.) Functional Tests (in Supplied Test Fixture) Agere Systems Supplied Test Fixture) GPS 14.5 15.5 — dB Common-source Amplifier Power Gain (VDD = 28 Vdc, POUT = 12 W average, 2-Carrier N-CDMA, IDQ = 700 mA, f1 = 1930 MHz, f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 = 1990 MHz) Drain Efficiency η — 23.5 — % (VDD = 28 Vdc, POUT = 12 W average, 2-Carrier N-CDMA, IDQ = 700 mA, f1 = 1930 MHz, f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 = 1990 MHz) Third-order Intermodulation Distortion IM3 — –36 — dBc (VDD = 28 Vdc, POUT = 12 W average, 2-Carrier N-CDMA, IDQ = 700 mA, f1 = 1930 MHz, f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 = 1990 MHz; IM3 measured in a 1.2288 MHz integration BW centered at f1 – 2.5 MHz and f2 + 2.5 MHz, referenced to the carrier channel power) ACPR — –50.5 — dBc Adjacent Channel Power Ratio (VDD = 28 Vdc, POUT = 12 W average, 2-Carrier N-CDMA, IDQ = 700 mA, f1 = 1930 MHz, f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 = 1990 MHz; ACPR measured in a 1.2288 MHz integration BW centered at f1 – 2.5 MHz and f2 + 2.5 MHz, referenced to the carrier channel power) IRL — –12 — dB Input Return Loss (VDD = 28 Vdc, POUT = 12 W average, 2-Carrier N-CDMA, IDQ = 700 mA, f1 = 1930 MHz, f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 = 1990 MHz) Output Power at 1 dB Gain Compression P1dB 60 70 — W (VDD = 28 V, POUT = 60 W CW, f = 1990 MHz, IDQ = 500 mA) Ruggedness Ψ No degradation in output (VDD = 28 V, POUT = 60 W CW, IDQ = 350 mA, f = 1930 MHz, power. VSWR = 10:1 [all phase angles])
AGR19060E 60 W, 1930 MHz—1990 MHz, PCS LDMOS RF Power Transistor
Test Circuit Illustrations for AGR19060E
R3 VGG R2 R1 FB1 + C13 C3 Z13 Z5 2 1 3 DUT Z14 Z6 C12 Z7 C6 C7 C8 C9 C18 + C10 VDD +
C2
C1
C11
Z1 RF INPUT C5
Z2
C4
Z3
Z4
Z8
Z9
Z10 C17
Z11 C16 Z12 RF OUTPUT
PINS: 1. DRAIN, 2. GATE, 3. SOURCE
A. Schematic
Gate Gnd Drain
C2 R2
C12 R1 R3 C3 C6 C7 C8 C9 C18 C10
C11
FB1
C1
C13
C4 C5
S1
S2
C16 C17
B. Component Layout
Parts List: Microstrip line: Z1 0.330 in. x 0.065 in.; Z2 0.470 in. x 0.065 in.; Z3 0.175 in. x 0.065 in.; Z4 0.260 in. x 0.270 in.; Z5 0.410 in. x 0.840 in.; Z6 0.260 in. x 0.970 in.; Z7 0.105 in. x 0.400 in.; Z8 0.330 in. x 0.560 in.; Z9 0.165 in. x 0.240 in.; Z10 0.315 in. x 0.065 in.; Z11 0.260 in. x 0.065 in.; Z12 0.255 in. x 0.065 in.; Z13 0.440 in. x 0.030 in.; Z14 0.695 in. x 0.050 in. ATC ® B case chip capacitors: C3, C6: 8.2 pF, 100B8R2JCA500X; C4, C16: 10 pF, 100B100JCA500X; C7: 1000 pF, 100B102JCA500X. Kemet® B case chip capacitors: C9, C11: 0.10 µF, CDR33BX104AKWS. Johanson Giga-Trim® variable capacitors: C5, C17: 0.4 pF—2.5 pF. Vitramon ® 1206: C2, C8: 22000 pF. Murata ® 0805: C13: 0.01 µF, GRM40X7R103K100AL. Fair-Rite ® ferrite bead: FB1, #2743019447. Sprague® tantalum, SMT, 35 V: C1, C10, C12: 22 µF; C18: 10 µF. Fixed film chip resistors, 0.25 W, 0.08 x 0.13: R1 510 Ω; R2 560 kΩ; R3 4.7 Ω. PCB etched circuit boards. Taconic® ORCER RF-35: board material, 1 oz. copper, 30 mil thickness, εr = 3.5.
Figure 2. AGR19060E Test Circuit Schematic
AGR19060E 60 W, 1930 MHz—1990 MHz, PCS LDMOS RF Power Transistor
Typical Performance Characteristics
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