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TQM7M4006

TQM7M4006

  • 厂商:

    TRIQUINT

  • 封装:

  • 描述:

    TQM7M4006 - 3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module - TriQuint Semiconductor

  • 详情介绍
  • 数据手册
  • 价格&库存
TQM7M4006 数据手册
TQM7M4006 DATASHEET 3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module Functional Block Diagram DCS / PCS in DCS / PCS Out Features • • • • • • • • • • Very compact size – 5×5×1.1 mm3. Positive supply voltage – 3.0 to 4.5 V. High efficiency – typical GSM850 52%, GSM900 57%, DCS 51%, PCS 51%. CMOS internal closed-loop power control. >55 dB dynamic control range. GPRS class 12 compatible. High-reliability InGaP technology. Ruggedness 10:1. 50 Ω input and output impedances. Few external components Band Select Logic TX_EN VBATT VRAMP Power Control VCC GSM 850 / 900 IN GSM 850 / 900 Out Product Description The TQM7M4006 is an advanced, quad-band, ultra-compact, 3V power amplifier module designed for mobile handset applications. The module sets new standards in performance and size by employing the latest technologies in HBT power amplifier design, laminate design and CuFlip™ assembly technology. Highreliability is assured by InGaP HBT technology. This fully integrated module, in a minimal form factor, provides a simple 50 Ω interface on all input and output ports. It includes internal power control with wide dynamic range, and on-board reference voltage. No external matching or bias components are required. Despite its very compact size, the module has exceptional efficiency in all bands. Incorporates two highly-integrated InGaP power amplifier die, a GaAs high Q passive matching die with a CMOS controller. All die are CuFlip™ mounted to minimize thermal excursions. Each amplifier has three gain stages with interstage matching implemented with a high Q passives technology for optimal performance. The CMOS controller implements a fully integrated power control circuit within the module, eliminating the need for external detection to assure the output power level. The latter is set directly from the Vramp input from the DAC. The module has Tx enable and band select inputs and a highly-stable on-board reference voltage. Excellent performance is achieved across the 824 – 849 MHz, 880 – 915 MHz, 1710 – 1785 MHz, and 1850 – 1910 MHz bands. Module construction is a low-profile overmolded land-grid array on laminate. Applications • • GSM handsets GSM wireless cards and data links Package Style Package Size: LGA 5 x 5 x 1.1 mm3 Top View Vcc2D RF_in_DCS BS Tx_En Vbatt Vramp RF_out_DCS Gnd Vcc3 RF_out_GSM Electrical Specifications Parameter Min GSM Pout Efficiency Pin 34.2 44 1.5 850 Band Typ 35 52 5 8 Max Min 34.2 50 1.5 900 Band Typ 35 57 5 8 Max DCS / PCS Band Min 32.5/32 44/44 1.5 Typ 33/32.5 51/51 5 8 Max dBm % dBm Units RF_in_GSM Vcc2G All specifications subject to change without notice 2 For additional information and latest specifications, see our website: www.triquint.com February 22, 2006 (Rev. E) TQM7M4006 DATASHEET 3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module Absolute Maximum Ratings Symbol VBAT IBAT VRAMP δ VSWR TC TSTG PIN ESD ruggedness All ports Supply Voltage DC Supply Current Power Control Voltage Duty Cycle at Max. Power Output Load Case Temperature, Operating Storage Temperature Input Power HBM per EIA/JESD22-A114 CDM per JESD22-C101 Parameter Absolute Maximum Value -0.5 to 5.5 2.5 -0.5 to VBAT 50 10:1 -20 to +100 -55 to +150 12 2000 2000 °C °C dBm V V Units VDC A V % Note: The part will survive over the full range specified for any individual input, while other parameters are nominal and with no RF input. Operating Parameters Parameter Supply Voltage- VBAT Supply Current- IBAT Band Select VoltageGSM DCS/PCS TX Enable Input Low High Leakage Current - IL Load Impedances- Z0 Case Temperature- TC -20 Vbs- L Vbs- H VTX_EN- L VTX_EN- H VTX_EN- L, VRAMP = 0.23V 0 1.2 0 1.2 1 50 +85 Conditions Min. 3.0 Typ/Nom 3.5 1.8 0.5 3.0 0.5 3.0 10 Max. 4.5 Units V A Vdc Vdc Vdc Vdc µA Ω °C All specifications subject to change without notice 3 For additional information and latest specifications, see our website: www.triquint.com February 22, 2006 (Rev. E) TQM7M4006 DATASHEET 3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module GSM850/GSM900 Mode Characteristics Standard Conditions: VBATT=3.5V, Vramp=1.6V, Pin=5 dBm, TX_EN = H, BS = L, TC = 25°C, Duty Cycle = 25%. Parameter Frequency Range- f GSM850 GSM900 Input Power for Pout max.- Pin Output Power- Pout Output Power Degradation Power Added Efficiency- η Power Control Voltage- VRAMP Power Control Range Input VSWR GSM850 Band GSM900 Band Conditions Min. 824 880 1.5 34.2 34.2 32.5 44 50 0.2 Typ/Nom Max. 849 915 Units MHz MHz dBm dBm dBm dBm % % 5.0 35.5 35.2 52 57 8.0 Vbatt=3.0V, Pin=5dBm, Tmin < TC
TQM7M4006
1. 物料型号: - 型号:TQM7M4006 - 描述:3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module

2. 器件简介: - TQM7M4006是一款先进的四频段、超紧凑型3V功率放大器模块,专为移动手持设备应用设计。该模块通过采用最新的HBT功率放大器设计、层压设计和$CuFlip™$组装技术,在性能和尺寸方面树立了新的标准。高可靠性由InGaP HBT技术保证。这个完全集成的模块,在极小的尺寸下,提供了所有输入和输出端口的简单的50Ω接口。它包括内部功率控制和宽动态范围的板上参考电压。不需要外部匹配或偏置组件。尽管尺寸非常紧凑,但该模块在所有频段上都有异常的效率。包含两个高度集成的InGaP功率放大器芯片,一个GaAs高Q被动匹配芯片和一个CMOS控制器。所有芯片都采用$CuFlip™$安装,以最小化热偏移。每个放大器都有三个增益级,通过高Q被动技术实现级间匹配,以获得最佳性能。CMOS控制器实现了模块内的完全集成的功率控制电路,消除了外部检测的需求,以确保输出功率水平。后者直接由DAC的$Vramp$输入设置。

3. 引脚分配: - Pin 1: RFin -DCS/PCS (DCS/PCS power in) - Pin 2: NC (No connect) - Pin 3: Vbs (Band select input) - Pin 4: TXen (Transmit enable) - Pin 5: Y (Supply voltage) - Pin 6: (DAC voltage input) - Pin 7: NC (No connect) - Pin 8: RFin - Cell/GSM (GSM850/900 power in) - Pin 10: V c2G (Vcc voltage input) - Pin 17: RFout Cell/GSM (GSM850/900 power out) - Pin 18: Vcc3 (V.c voltage output) - Pin 20: RFout - DCS/PCS (DCS/PCS power out) - Pin 26: Vcc2D (Vcc voltage input) - 所有其他引脚为地线。

4. 参数特性: - 支持的频段:GSM850 (824-849 MHz), GSM900 (880-915 MHz), DCS (1710-1785 MHz), PCS (1850-1910 MHz) - 输出功率 (GSM Pout):34.2 dBm (最小值) 至 35 dBm (典型值) - 效率:44% (最小值) 至 57% (最大值) - 输入功率 (Pin):1.5 dBm (最小值) 至 5 dBm (典型值) 至 8 dBm (最大值)

5. 功能详解: - 非常紧凑的尺寸:$5 ×5 ×1.1 ~mm^{3}$ - 正供电电压:3.0至4.5 V - 高效率:典型GSM850 52%,GSM900 57%,DCS 51%,PCS 51% - CMOS内部闭环功率控制 - $>55 ~dB$动态控制范围 - GPRS class 12兼容 - 高可靠性InGaP技术 - 坚固性10:1 - 50Ω输入和输出阻抗 - 外部组件少

6. 应用信息: - 适用于GSM手机、GSM无线卡和数据链路。

7. 封装信息: - 封装样式:LGA,尺寸为5 x 5 x 1.1 mm3。
TQM7M4006 价格&库存

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