ABS8

ABS2 THRU ABS10 Single Phase 1.0 AMP. Glass Passivated Bridge Rectifiers Voltage Range 200 to 1000 Volts Current 1.0 Ampere Features Glass passivated junction Ideal for printed circuit board Reliable low cost construction utilizing molded plastic technique High temperature soldering guaranteed: 260℃ / 10 seconds / 0.375” ( 9.5mm ) lead length at 5 lbs., ( 2.3 kg ) tension Small size, simple installation Leads solderable per MIL-STD-202, Method 208 High surge current capability Thin Mini-Dip 0.177(4.5) 0.169(4.3) 0.252(6.4) 0.236(6.0) 0.010(0.25) 0.006(0.15) 0.002(0.05) 0.006(0.15) 0.136(3.45) 0.128(3.25) 0.161(4.1) 0.154(3.9) 0.028(0.7) 0.024(0.6) 0.028(0.7) 0.012(0.3) 0.055(1.40) MAX. DETAIL "A", SCALE=20/1 0.056(1.42) 0.048(1.22) 0.006(0.15) 0.002(0.05) 0.20(5.1) 0.193(4.9) A 0.033(0.85) 0.026(0.65) Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25℃ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Symbol ABS2 ABS4 Type Number Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current On glass-epoxy P.C.B. On aluminum substrate Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) Maximum Instantaneous Forward Voltage @ 0.4A Maximum DC Reverse Current @ TA=25℃ at Rated DC Blocking Voltage Typical Thermal resistance Junction to Lead On aluminum substrate On Glass-Epoxy substrate Operating Temperature Range Storage Temperature Range ABS6 ABS8 ABS10 Units 600 420 600 0.8 1.0 30 095 10 800 560 800 1000 700 1000 V V V A A V uA ℃/W ℃ ℃ VRRM VRMS VDC I(AV) IFSM VF IR RθJL RθJA TJ TSTG 200 140 200 400 280 400 25 62.5 80 -55 to +150 -55 to +150 - 694 - 0~10 O RATINGS AND CHARACTERISTIC CURVES (ABS2 THRU ABS10) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE 1.6 1.4 FIG.2- TYPICAL FORWARD CHARACTERISTICS 50 1.2 INSTANTANEOUS FORWARD CURRENT. (A) AVERAGE FORWARD CURRENT. (A) 10 SIN 1.0 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 O Tj=150 0C 1 Tj=25 0C 120 140 160 0.1 0.0 0.2 0.4 LEAD TEMPERATURE. ( C) 0.6 0.8 1.0 FORWARD VOLTAGE. (V) 1.2 1.4 1.6 FIG.3- MAXIMUM FORWARD CURRENT DERATING CURVE 1.6 1.4 FIG.4- FORWARD POWER DISSIPATION 2.5 FORWARD POWER DISSIPATION (pF) SIN 2.0 AVERAGE FORWARD CURRENT. (A) 1.2 SIN 1.0 0.8 0.6 0.4 0.2 0 0 20 40 ALUMINA SUBSTRATE 50.8mm X 50.8mm SOLDERING LAND 1mm X 1mm CONDUCTOR LAYER 20 mm SUBSTRATE THICKNESS 0.64mm 1.5 Tj=150 0C 1.0 0.5 60 80 100 O 120 140 160 0 0.0 AMBIENT TEMPERATURE. ( C) 0.2 0.4 0.6 0.8 1.0 AVERAGE RECTIFIED FORWARD CURRENT. (A) 1.2 FIG.5- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 35 PEAK FORWARD SURGE CURRENT. (A) 30 25 20 15 10 5 0 IFSM 10ms 10ms 1 Cycle Ta=40 C NON-REPETITIVE, Single Half Sine-Wave SINE WAVE, Method) (JEDEC O Tj = 25 C BEFORE SURGE CURRENT IS APPLIED 1 10 NUMBER OF CYCLES (CYCLE) 100 - 695 -