BAV19W/BAV20W/BAV21W 410mW High Voltage SMD Switching Diode
Small Signal Diode
SOD-123F
B
Features
These diodes are also available in DO-35, LL34 Package Surface device type mounting Moisture sensitivity level 1 Matte Tin(Sn) lead finish with Nickel(Ni) underplate Pb free version and RoHS compliant Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code
C
A
D E F
Mechanical Data
Case : Flat lead SOD-123F small outline plastic package Terminal: Matte tin plated, solderable per MIL-STD-202, Method 208 guaranteed High temperature soldering guaranteed: 260°C/10s Polarity : Indicated by cathode band Weight : 4.85±0.5 mg Marking Code : H1, H2, H3
Dimensions (mm) A B C D E F
Unit (mm) Min 1.5 3.3 0.5 2.5 0.8 0.05 Max 1.7 3.9 0.7 2.7 1.15 0.2
Unit (inch) Min Max 0.059 0.067 0.130 0.154 0.020 0.028 0.098 0.106 0.031 0.045 0.002 0.008
Ordering Information
Part No. BAV19W BAV20W BAV21W BAV19W BAV20W BAV21W Package Packing Code Packing SOD-123F RH 3K / 7" Reel SOD-123F SOD-123F SOD-123F SOD-123F SOD-123F RH RH RHG RHG RHG 3K / 7" Reel 3K / 7" Reel 3K / 7" Reel 3K / 7" Reel 3K / 7" Reel Marking H1 H2 H3 H1 H2 H3
Pin Configuration
Suggested PAD Layout
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number Power Dissipation Repetitive Peak Reverse Voltage Repetitive Peak Forward Current Mean Forward Current Non-Repetitive Peak Forward Surge Current Pulse width= 1μs Pulse width= 1s Thermal Resistance (Junction to Ambient) Junction and Storage Temperature Range IFSM RθJA TJ, TSTG 4 1 375 -65 to + 150 A °C/W °C Symbol PD VRRM IFRM IO Value 410 250 625 200 Units mW V mA mA
Note1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary despending on application.
Version : D10
BAV19W/BAV20W/BAV21W 410mW High Voltage SMD Switching Diode
Small Signal Diode Electrical Characteristics
Type Number Reverse Breakdown Voltage Forward Voltage BAV19W BAV20W BAV21W (Note 2) Symbol V(BR) VF Min 120 200 250 Max 1.00 1.25 100 5.0 50 Units V V
Reverse Leakage Current Junction Capacitance Reverse Recovery Time
IF= 100mA IF= 200mA BAV19W BAV20W (Note 3) BAV21W VR=0, f=1.0MHz (Note 4)
IR CJ Trr
nA pF ns
Tape & Reel specification
TSC label Top Cover Tape
Carieer Tape Any Additional Label (If Required)
Item Carrier depth Sprocket hole Reel outside diameter Reel inner diameter Feed hole width Sprocke hole position Punch hole position Sprocke hole pitch Embossment center Overall tape thickness Tape width Reel width
Symbol K D A D1 D2 E F P0 P1 T W W1
Dimension(mm) 2.40 Max. 1.5 ± 0.1 178 ± 1 50 Min. 13.0 ± 0.5 1.75 ±0.10 3.50 ±0.05 4.00 ±0.10 2.00 ±0.10 0.6 Max. 8.30 Max. 14.4 Max
W1
A
D2
D1
User Direction of Feed
Note 2: Test Condition : IR=100μA Note 3: Test Condition : BAV19W @ V R=100V, BAV20W @ V R=150V, BAV21W @ V R=200V Note 4: Test Condition : I F=IR=30mA, RL=100Ω, IRR=3mA Note 5: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10° within the determined cavity. Note 6: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.
Version : D10
BAV19W/BAV20W/BAV21W 410mW High Voltage SMD Switching Diode
Small Signal Diode Rating and Characteristic Curves
FIG 1 Admissible Power Dissipation Curve
300 1000
FIG 2 Typical Forward Characterisics
Power Dissipation (mW)
200 150 100 50 0 0 25 50 75 100 125 150
Forward Current (mA)
250
100 10 1 0.1
Tj=25°C
0.01 0 1 2
Ambient Temperature (°C)
Forward Voltage (V)
FIG 3 Leakage Current vs Junction Temperature
100
Leakage Current (uA)
10
1
0.1
0.01 0 100 200
Junction Temperature (℃)
Version : D10
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