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ES3A_1

ES3A_1

  • 厂商:

    TSC

  • 封装:

  • 描述:

    ES3A_1 - 3.0 AMPS. Surface Mount Super Fast Rectifiers - Taiwan Semiconductor Company, Ltd

  • 详情介绍
  • 数据手册
  • 价格&库存
ES3A_1 数据手册
ES3A - ES3J 3.0 AMPS. Surface Mount Super Fast Rectifiers SMC/DO-214AB .126(3.20) .114(2.90) .245(6.22) .220(5.59) Features G lass passivated junction chip For surface mounted applications Low profile package Built-in strain relief Ideal for automated placement Easy pick and place Super fast recovery time for high efficiency G lass passivated chip junction H igh temperature soldering: 260oC/10 seconds at terminals Plastic material used carries Underwriters Laboratory Classification 94V-0 .280(7.11) .260(6.60) .012(.31) .006(.15) .103(2.62) .079(2.00) .061(1.56) .050(1.26) .008(.20) .004(.10) .063(1.6) .039(1.0) M echanical Data C ases: Molded plastic Terminals: Pure tin plated, lead free. Polarity: Indicated by cathode band Packaging: 16mm tape per EIA STD RS-481 W eight: 0.21 gram .320(8.13) .305(7.75) Dimensions in inches and (millimeters) M aximum Ratings and Electrical Characteristics Rating at 25 oC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Symbol ES ES ES ES Type Number 3A Maximum Recurrent Peak Reverse Voltage M aximum RMS Voltage Maximum DC Blocking Voltage M aximum Average Forward Rectified Current See Fig. 1 Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) @TL = 100 oC Maximum Instantaneous Forward Voltage @ 3.0A Maximum DC Reverse Current @ TA =25 oC at Rated DC Blocking Voltage @ TA=100 oC Maximum Reverse Recovery Time ( Note 1 ) Typical Junction Capacitance ( Note 2 ) Typical Thermal Resistance (Note 3) Operating Temperature Range Storage Temperature Range Notes: 3B 3C 3D ES 3F ES 3G ES 3H ES 3J Units V V V A A VRRM VRMS VDC I(AV) IFSM VF IR Trr Cj RθJA RθJL TJ 50 35 50 100 150 200 300 400 500 600 70 105 140 210 280 350 420 100 150 200 300 400 500 600 3.0 100 0.95 10 500 35 45 47 12 -55 to +150 -55 to +150 30 o 1.3 1.7 V uA uA nS pF C /W o o TSTG 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A 2. Measured at 1 MHz and Applied VR=4.0 Volts 3. Units Mounted on P.C.B. with 0.6” x 0.6”(16mm x 16mm) Copper Pad Areas C C - 184 - Version: B07 RATINGS AND CHARACTERISTIC CURVES (ES3A THRU ES3J) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE 3 RESISTIVE OR INDUCTIVE LOAD 2 150 PEAK FORWARD SURGE CURRENT. (A) 125 100 75 50 25 0 80 90 100 110 120 130 o LEAD TEMPERATURE. ( C) 140 150 1 10 NUMBER OF CYCLES AT 60Hz 100 8.3ms Single Half Sine Wave o (JEDEC Method) at TL=120 C AVERAGE FORWARD CURRENT. (A) FIG.2- MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 1 P.C.B. MOUNTED ON 0.6X0.6"(16X16mm) COPPER PADS 0 100 FIG.3- TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS FIG.4- TYPICAL REVERSE CHARACTERISTICS 1000 INSTANTANEOUS REVERSE CURRENT. ( A) INSTANTANEOUS FORWARD CURRENT. (A) 10 Tj=25 C PULSE WIDTH-300 S 1% DUTY CYCLE 0 100 Tj=100 0C ES 3A -D -G E S 3F 10 Tj=75 0C 1 E S 3H -J 1 Tj=25 0C 0.1 0.1 0.01 0.4 0.6 0.8 1.0 1.2 1.4 FORWARD VOLT AGE. (V) 1.6 1.8 0.01 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLT AGE. (%) 100 TRANSIENT THERMAL IMPEDANCE ( OC/W) 105 JUNCTION CAPACITANCE.(pF) 90 75 60 45 30 FIG.5- TYPICAL JUNCTION CAPACIT ANCE Tj=25 0C f=1.0MHz Vsig=50mVp-p FIG.6- TYPICAL TRANSIENT THERMAL IMPEDANCE 10 ES3 ES3 F-J 1 A- D 15 0 1 10 REVERSE VOLTAGE. (V) 100 0.1 0.01 0.1 1 T, HEATING TIME (sec.) 10 100 FIG.7- REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM 50W NONINDUCTIVE 10W NONINDUCTIVE +0.5A (-) DUT (+) 50Vdc (approx) (-) PULSE GENERATOR (NOTE 2) 1W NON INDUCTIVE OSCILLOSCOPE (NOTE 1) (+) 0 -0.25A trr NOTES: 1. Rise Time=7ns max. Input Impedance= 1 megohm 22pf 2. Rise Time=10ns max. Sourse Impedance= 50 ohms -1.0A 1cm SET TIME BASE FOR 5/ 10ns/ cm Version: B07
ES3A_1
1. 物料型号: - 型号为ES3A至ES3J,这些是表面贴装超快速整流器,封装为SMC/DO-214AB。

2. 器件简介: - 器件为玻璃钝化结芯片,适用于表面贴装应用。 - 低轮廓封装,内置应力消除,适合自动化放置,便于拾取和放置。 - 超快速恢复时间,用于高效率。

3. 引脚分配: - 阴极带标识了极性。 - 引脚为纯锡镀层,无铅。

4. 参数特性: - 器件具有玻璃钝化芯片结和高温焊接能力,能在260°C/10秒的条件下焊接。 - 使用的塑料材料通过了UL认证,符合94V-0等级。

5. 功能详解: - 提供了最大正向电流降额、最大非重复峰值正向浪涌电流、典型瞬态正向特性、典型反向特性、典型结电容和瞬态热阻等功能曲线。

6. 应用信息: - 适用于单相、半波、60Hz的电阻性或感性负载。 - 对于电容性负载,需要将电流降低20%。

7. 封装信息: - 封装为模塑塑料。 - 尺寸以英寸和毫米表示。 - 重量为0.21克。 - 包装为每16mm胶带,符合EIA STD RS-481标准。
ES3A_1 价格&库存

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ES3ABF
  •  国内价格
  • 1+0.19973
  • 30+0.19285
  • 100+0.17907
  • 500+0.1653
  • 1000+0.15841

库存:1000