MMBD3004/CA/CC/SE 350mW SMD Switching Diode
Small Signal Diode
SOT-23
A F
Features
Fast switching speed Surface device type mounting Moisture sensitivity level 1 Matte Tin(Sn) lead finish with Nickel(Ni) underplate Pb free version and RoHS compliant Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code
B
E
C
D
Mechanical Data
Case :SOT-23 small outline plastic package Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed High temperature soldering guaranteed: 260°C/10s Weight : 0.008gram (approximately) Marking Code : HC.PZ.RA.PY.
Dimensions A B C D E F
Unit (mm) Min 2.80 1.20 0.30 1.80 2.25 0.90 Max 3.00 1.40 0.50 2.00 2.55 1.20
Unit (inch) Min 0.110 0.047 0.012 0.071 0.089 0.035 Max 0.118 0.055 0.020 0.079 0.100 0.043
Pin Configuration
MMBD3004
MMBD3004CA
MMBD3004CC
MMBD3004SE
Ordering Information
Part No. MMBD3004 MMBD3004CA MMBD3004SE MMBD3004 MMBD3004CA MMBD3004SE Package SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 Packing Code RF RF RF RF RFG RFG RFG RFG Packing 3K / 7" Reel 3K / 7" Reel 3K / 7" Reel 3K / 7" Reel 3K / 7" Reel 3K / 7" Reel 3K / 7" Reel 3K / 7" Reel Marking HC PZ RA PY HC PZ RA PY
Suggested PAD Layout
0.95 0.037
MMBD3004CC SOT-23
2.0 0.079 0.9 0.035 0.8 0.031
MMBD3004CC SOT-23
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number Power Dissipation Repetitive Peak Reverse Voltage Repetitive Peak Forward Current Mean Forward Current Non-Repetitive Peak Forward Surge Current Pulse width= 1μs Pulse width= 1s Thermal Resistance (Junction to Ambient) Junction and Storage Temperature Range IFSM RθJA TJ, TSTG 4 1 357 -65 to + 150 A °C/W °C Version : A11 Symbol PD VRRM IFRM IO Value 350 350 625 225 Units mW V mA mA
Note1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary despending on application.
MMBD3004/CA/CC/SE 350mW SMD Switching Diode
Small Signal Diode Electrical Characteristics
Type Number Reverse Breakdown Voltage Forward Voltage Reverse Leakage Current IR= IF= IF= 100μA 100mA 200mA Symbol V(BR) VF IR CJ Trr Min 350 Max 1.00 1.25 0.1 100.0 5 50.0 Units V V V μA pF ns
VR= 240V VR= 240V,Tj=150 f=1.0MHz
VR=1V, Junction Capacitance Reverse Recovery Time IF=IR=30mA, RL=100Ω, IRR=0.1IR
Tape & Reel specification
Item Carrier width Carrier length Carrier depth Sprocket hole Reel outside diameter Reel inner diameter Feed hole width Sprocket hole position Punch hole position Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width Symbol A B C d D D1 D2 E F P0 P1 T W W1 Dimension(mm) 3.15 ±0.10 2.77 ±0.10 1.22 ±0.10 1.50 ± 0.10 178 ± 1 55 Min 13.0 ± 0.20 1.75 ±0.10 3.50 ±0.05 4.00 ±0.10 2.00 ±0.05 0.229 ±0.013 8.10 ±0.20 12.30 ±0.20
TSC label
Top Cover Tape
Carieer Tape Any Additional Label (If Required)
P0 d T A C B
P 1
E F W
W1
D
D2
D1
Direction of Feed
Version : A11
MMBD3004/CA/CC/SE 350mW SMD Switching Diode
Small Signal Diode Rating and Sharacteristic Curves
FIG 1 Typical Forward Characteristics Instantaneous Forward Current (mA)
1000
FIG 2 Typical Reverse Characteristics Instantaneous Reverse Current (mA)
1000 100 10 1
100
T Ta=25°Cj=25 C
o
10
1
Tj=25 C
0.1 0.01 0.001 0 0.5 1 1.5 2 2.5 3 3.5
o
0.1
0.01 0
Instantaneous Forward Voltage (V)
0.3 0.6 0.9 1.2
1.5
1.8
2.1
Inataneous Forward Voltage (V)
Inataneous Reverse Voltage (V)
FIG 3 Admissible Power Dissipation Curve
400 350 300 250 200 150 100 50 0 0 25 50 75 100 125 150 175 200
1.1
FIG4 Typical Capacitance vs Reverse Voltage
CT Total Capacitance (pF)
Power Dissipation (mW)
1
0.9
0.8
0.7 0.01
0.1
1
10
100
Ambient Temperature (°C)
Reverse Voltage (V)
Version : A11