SD103AXG

SD103AXG Low VF SMD Schottky Barrier Diode Small Signal Diode SOD-523F B C A Features Low power loss,high current capability Low VF, low reverse current Ultra small SMD package Moisture sensitivity level 1 Pb free version and RoHS compliant Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code F E D Mechanical Data Case :Flat lead SOD-523F small outline plastic package Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed High temperature soldering guaranteed: 260 °C/10s Polarity : Indicated by cathode band Weight : 1.50 mg(approach) Marking Code : J Dimensions A B C D E F Unit (mm) Min 0.70 1.50 0.25 1.10 0.60 0.10 Max 0.90 1.70 0.40 1.30 0.70 0.14 Unit (inch) Min Max 0.028 0.035 0.059 0.067 0.010 0.016 0.043 0.051 0.024 0.028 0.004 0.006 Ordering Information Part No. SD103AXG RK SD103AXG RKG Package SOD-523F SOD-523F Packing 3K / 7" Reel 3K / 7" Reel Marking J J Pin Configuration Suggested PAD Layout Maximum Ratings and Electrical Characteristics Rating at 25°C ambient temperature unless otherwise specified. Maximum Ratings Type Number Reverse Voltage Average Forward Current Repetitive Peak Forward Current, tp ≦ 1S Non-Repetitive Peak Forward Surge Current, 8.3 ms Single Half Sine-wave. Thermal Resistance (Junction to Ambient) Junction Temperature Storage Temperature Range Symbol VR IF IFRM IFSM RθJA TJ TJ, TSTG Value 40 200 300 1 625 150 -65 ~ 150 Units V mA mA A °C/W °C °C Notes: The suggested land pattern dimensions have seen provided for reference only,as actual pad layouts may vary despending on application. Version : A10 SD103AXG Low VF SMD Schottky Barrier Diode Small Signal Diode Electrical Characteristics Rating at 25°C ambient temperature unless otherwise specified. Type Number IF= 0.1mA IF= 1mA Forward Voltage IF= 10mA IF= 100mA IF= 200mA Reverse Leakage Current VR= 25V VR=1V, f=1.0MHz Junction Capacitance Symbol Min Max 220.00 290.00 360.00 500.00 600.00 0.5 20 Units mV mV mV mV mV μA pF VF IR CJ Tape & Reel specification TSC label Top Cover Tape Item Carrier depth Sprocket hole Reel outside diameter Reel inner diameter Feed hole width Sprocke hole position Punch hole position Sprocke hole pitch Embossment center Overall tape thickness Tape width Reel width Symbol K D A D1 D2 E F P0 P1 T W W1 Dimension(mm) 2.40 Max. 1.50 +0.10 178 ± 1 50 Min. 13.0 ± 0.5 1.75 ±0.10 3.50 ±0.05 4.00 ±0.10 2.00 ±0.10 0.6 Max. 8.30 Max. 14.4 Max. Carieer Tape Any Additional Label (If Required) W1 A D2 D1 Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10o within the determined cavity. Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders. Version : A10 SD103AXG Low VF SMD Schottky Barrier Diode Small Signal Diode Rating and Characteristic Curves FIG 1 Typical Forward Characteristics 1000 FIG 2 Typical Reverse Characteristics 1000 Average Forward Current (mA) Ta=25 C o Ta=25oC Reverse Current (uA) 100 100 10 10 1 1 0.1 0 0.2 0.4 0.6 0.8 1 1.2 0.1 0 10 20 30 40 Instantanceous Forward Voltage (V) Reverse Voltage (V) FIG 3 Typical Junction Capacitance 20 Juncation Capacitance (pF) 16 f =1 MHz Ta = 25oC 12 8 4 0 0 5 10 15 20 25 30 35 40 Reverse Voltage (V) Version : A10