TSB772S_10

TSB772S_10

  • 厂商:

    TSC

  • 封装:

  • 描述:

    TSB772S_10 - Low Vcesat PNP Transistor - Taiwan Semiconductor Company, Ltd

  • 详情介绍
  • 数据手册
  • 价格&库存
TSB772S_10 数据手册
TSB772S Low Vcesat PNP Transistor TO-92 Pin Definition: 1. Emitter 2. Collector 3. Base PRODUCT SUMMARY BVCBO BVCEO IC VCE(SAT) -50V -30V -3A -0.5V @ IC / IB = -2A / -200mA Features ● ● Low VCE(SAT) -0.25 @ IC / IB = 2A / 200mA (Typ.) Complementary part with TSD882S Ordering Information Part No. Package Packing 1Kpcs / Bulk 1Kpcs / Bulk 2Kpcs / Ammo 2Kpcs / Ammo Structure ● ● Epitaxial Planar Type PNP Silicon Transistor TSB772SCT B0 TO-92 TSB772SCT B0G TO-92 TSB772SCT A3 TO-92 TSB772SCT A3G TO-92 Note: “G” denotes for Halogen Free Absolute Maximum Rating (Ta = 25oC unless otherwise noted) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Collector Power Dissipation Operating Junction Temperature Operating Junction and Storage Temperature Range Note: Single pulse, Pw≤350us, Duty≤2% DC Pulse Symbol VCBO VCEO VEBO IC PD TJ TSTG Limit -50 -30 -5 -3 -7 (note) 0.625 +150 - 55 to +150 Unit V V V A W o o C C Electrical Specifications (Ta = 25oC unless otherwise noted) Parameter Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage DC Current Transfer Ratio Transition Frequency Conditions IC = -50uA, IE = 0 IC = -1mA, IB = 0 IE = -50uA, IC = 0 VCB = -30V, IE = 0 VEB = 3V, IC = 0 IC / IB = -2A / -200mA IC / IB = -2A / -200mA VCE = -2V, IC = -1A VCE =-5V, IC=-100mA, f=100MHz Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(SAT) *VBE(SAT) *hFE fT Cob Min -50 -30 -5 ----100 --- Typ ------0.3 -1 -80 55 Max ----1 -1 -0.5 -2 500 --- Unit V V V uA uA V V MHz pF Output Capacitance VCB = -10V, f=1MHz * Pulse Test: Pulse Width ≤380uS, Duty Cycle≤2% 1/4 Version: F07 TSB772S Low Vcesat PNP Transistor Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted) Figure 1. DC Current Gain Figure 2. VCE(SAT) v.s. Ic Figure 3. VBE(SAT) v.s. Ic Figure 4. Power Derating Curve 2/4 Version: F07 TSB772S Low Vcesat PNP Transistor TO-92 Mechanical Drawing DIM A B C D E F G H TO-92 DIMENSION MILLIMETERS INCHES MIN MAX MIN MAX 4.30 4.70 0.169 0.185 4.30 4.70 0.169 0.185 14.30(typ) 0.563(typ) 0.43 0.49 0.017 0.019 2.19 2.81 0.086 0.111 3.30 3.70 0.130 0.146 2.42 2.66 0.095 0.105 0.37 0.43 0.015 0.017 Marking Diagram Y = Year Code M = Month Code (A=Jan, B=Feb, C=Mar, D=Apl, E=May, F=Jun, G=Jul, H=Aug, I=Sep, J=Oct, K=Nov, L=Dec) = Month Code for Halogen Free Product (O=Jan, P=Feb, Q=Mar, R=Apl, S=May, T=Jun, U=Jul, V=Aug, W=Sep, X=Oct, Y=Nov, Z=Dec) L = Lot Code 3/4 Version: F07 TSB772S Low Vcesat PNP Transistor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 4/4 Version: F07
TSB772S_10
1. 物料型号: - 型号为:XXXXX

2. 器件简介: - 该器件是一种高性能的集成芯片,用于XXXXX。

3. 引脚分配: - 引脚1:功能描述 - 引脚2:功能描述 - 引脚3:功能描述 - ...

4. 参数特性: - 工作电压:XV - 工作电流:XA - 最大功耗:XW - 工作温度:-X°C至X°C

5. 功能详解: - 该器件具备XXXXX功能,通过XXXXX实现。

6. 应用信息: - 常用于XXXXX领域,适用于XXXXX场景。

7. 封装信息: - 封装类型:XXXXX - 封装尺寸:Xmm x Xmm
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