TSM13N50CZC0

TSM13N50CZC0

  • 厂商:

    TSC

  • 封装:

  • 描述:

    TSM13N50CZC0 - 500V N-Channel Power MOSFET - Taiwan Semiconductor Company, Ltd

  • 详情介绍
  • 数据手册
  • 价格&库存
TSM13N50CZC0 数据手册
Preliminary TSM13N50 500V N-Channel Power MOSFET TO-220 ITO-220 Pin Definition: 1. Gate 2. Drain 3. Source PRODUCT SUMMARY VDS (V) 500 RDS(on)(Ω) 0.48 @ VGS =10V ID (A) 6.5 General Description The TSM13N50 N-Channel enhancement mode Power MOSFET is produced by planar stripe DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switch mode power supply, power factor correction, electronic lamp ballast based on half bridge. Features ● ● ● ● Low RDS(ON) 0.48Ω (Max.) Low gate charge typical @ 36nC (Typ.) Low Crss typical @ 23pF (Typ.) Fast Switching Block Diagram Ordering Information Part No. TSM13N50CZ C0 TSM13N50CI C0 Package TO-220 ITO-220 Packing 50pcs / Tube 50pcs / Tube N-Channel MOSFET Absolute Maximum Rating (Ta = 25oC unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current * Avalanche Current (Single) (Note 2) Single Pulse Avalanche Energy (Note 2) Avalanche Current (Repetitive) (Note 1) Repetitive Avalanche Energy (Note 1) Maximum Power Dissipation @Ta = 25 C Operating Junction Temperature Storage Temperature Range * Limited by maximum junction temperature o Symbol VDS VGS ID IDM IAS EAS IAR E AR PD TJ TSTG Limit 500 ±30 13 52 13 751 13 19.5 40 150 -55 to +150 Unit V V A A A mJ A mJ W ºC o C 1/7 Version: Preliminary Preliminary TSM13N50 500V N-Channel Power MOSFET Thermal Performance Parameter Thermal Resistance - Junction to Case Thermal Resistance - Junction to Ambient Notes: Surface mounted on FR4 board t ≤ 10sec TO-220 ITO-220 Symbol RӨJC RӨJA Limit 1.92 3.12 62.5 Unit o o o C/W C/W C/W Electrical Specifications (Ta = 25oC unless otherwise noted) Parameter Static Drain-Source Breakdown Voltage Drain-Source On-State Resistance Gate Threshold Voltage Zero Gate Voltage Drain Current Gate Body Leakage Forward Transconductance Diode Forward Voltage Dynamic b Conditions VGS = 0V, ID = 250uA VGS = 10V, ID = 6.5A VDS = VGS, ID = 250uA VDS = 500V, VGS = 0V VGS = ±30V, VDS = 0V VDS = 10V, ID = 6.5A IS = 12A, VGS = 0V Symbol BVDSS RDS(ON) VGS(TH) IDSS IGSS gfs VSD Qg Qgs Qgd Ciss Coss Crss td(on) Min 500 -2.0 ----------------- Typ -0.4 ---15 -36 8.3 9.8 1960 190 23 25 100 130 100 410 4.5 Max -0.48 4.0 1 ±100 -1.4 45 --2450 237 29 ------- Unit V Ω V uA nA S V Total Gate Charge Gate-Source Charge Gate-Drain Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Switching c VDS = 400V, ID = 13A, VGS = 10V VDS = 25V, VGS = 0V, f = 1.0MHz nC pF Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Reverse Recovery Time VGS = 0V, IS = 13A, VGS = 10V, ID = 13A, VDD = 300V, RG = 25Ω tr td(off) tf t fr nS nS uC dIF/dt = 100A/us Reverse Recovery Charge Q fr Notes: 1. Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature 2. VDD = 50V, IAS=13A, L=8mH, RG=25Ω 3. Pulse test: pulse width ≤300uS, duty cycle ≤2% 4. Essentially Independent of Operating Temperature 5. For design reference only, not subject to production testing. 6. Switching time is essentially independent of operating temperature. 2/7 Version: Preliminary Preliminary TSM13N50 500V N-Channel Power MOSFET Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveform EAS Test Circuit & Waveform 3/7 Version: Preliminary Preliminary TSM13N50 500V N-Channel Power MOSFET Diode Reverse Recovery Time Test Circuit & Waveform 4/7 Version: Preliminary Preliminary TSM13N50 500V N-Channel Power MOSFET TO-220 Mechanical Drawing DIM A B C D E F G H J K L M N O P TO-220 DIMENSION MILLIMETERS INCHES MIN MAX MIN MAX 10.000 10.500 0.394 0.413 3.740 3.910 0.147 0.154 2.440 2.940 0.096 0.116 6.350 0.250 0.381 1.106 0.015 0.040 2.345 2.715 0.092 0.058 4.690 5.430 0.092 0.107 12.700 14.732 0.500 0.581 14.224 16.510 0.560 0.650 3.556 4.826 0.140 0.190 0.508 1.397 0.020 0.055 27.700 29.620 1.060 1.230 2.032 2.921 0.080 0.115 0.255 0.610 0.010 0.024 5.842 6.858 0.230 0.270 5/7 Version: Preliminary Preliminary TSM13N50 500V N-Channel Power MOSFET ITO-220 Mechanical Drawing DIM A B C D E F G H I J K L M N O ITO-220 DIMENSION MILLIMETERS INCHES MIN MAX MIN MAX 10.04 10.07 0.395 0.396 6.20 (typ.) 0.244 (typ.) 2.20 (typ.) 0.087 (typ.) ∮1.40 (typ.) ∮0.055 (typ.) 15.0 15.20 0.591 0.598 0.52 0.54 0.020 0.021 2.35 2.73 0.093 0.107 13.50 13.55 0.531 0.533 1.11 1.49 0.044 0.058 2.60 2.80 0.102 0.110 4.49 4.50 0.176 0.177 1.15 (typ.) 0.045 (typ.) 3.03 3.05 0.119 0.120 2.60 2.80 0.102 0.110 6.55 6.65 0.258 0.262 6/7 Version: Preliminary Preliminary TSM13N50 500V N-Channel Power MOSFET Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 7/7 Version: Preliminary
TSM13N50CZC0
1. 物料型号: - TSM13N50CZ C0:TO-220封装,每管50pcs。 - TSM13N50CI C0:ITO-220封装,每管50pcs。

2. 器件简介: - TSM13N50是台湾半导体生产的N沟道增强型功率MOSFET,采用平面条纹DMOS技术。该技术特别设计以最小化导通电阻,提供优越的开关性能,并能在雪崩和换向模式下承受高能量脉冲。这些器件非常适合用于高效率的开关电源、功率因数校正、基于半桥的电子镇流器。

3. 引脚分配: - 1. Gate(栅极) - 2. Drain(漏极) - 3. Source(源极)

4. 参数特性: - 漏源电压(Vos):500V - 栅源电压(VGs):±30V - 连续漏电流(ID):13A - 脉冲漏电流(IDM):52A - 雪崩电流(IAs):13A - 单脉冲雪崩能量(EAS):751mJ - 重复雪崩电流(IAR):13A - 重复雪崩能量(EAR):19.5mJ - 最大功率耗散@Ta = 25°C(PD):40W - 工作结温(TJ):150℃ - 存储温度范围(TSTG):-55至+150℃

5. 功能详解: - 低导通电阻(RDS(ON))最大0.48Ω - 低门电荷典型值@36nC - 低Crss典型值@23pF - 快速开关

6. 应用信息: - 适用于高效率开关电源、功率因数校正、基于半桥的电子镇流器。

7. 封装信息: - TO-220和ITO-220两种封装方式,详细机械尺寸图纸已提供。
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