TSM1N60S
600V N-Channel Power MOSFET
TO-92
Pin Definition: 1. Gate 2. Drain 3. Source
PRODUCT SUMMARY VDS (V)
600
RDS(on)(Ω)
11 @ VGS =10V
ID (A)
0.3
General Description
The TSM1N60S is used an advanced termination scheme to provide enhanced voltage-blocking capability without degrading performance over time. In addition, this advanced MOSFET is designed to withstand high energy in avalanche and commutation modes. The new energy efficient design also offers a drain- to-source diode with a fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional and safety margin against unexpected voltage transients.
Features
● ● ● ● ● Robust high voltage termination Avalanche energy specified Diode is characterized for use in bridge circuits Source to Drain diode recovery time comparable to a discrete fast recovery diode. IDSS and VDS(on) specified at elevated temperature
Block Diagram
Ordering Information
Part No.
TSM1N60SCT B0 TSM1N60SCT A3
Package
TO-92 TO-92
Packing
1Kpcs / Bulk 2Kpcs / Ammo N-Channel MOSFET
Absolute Maximum Rating (Ta = 25oC unless otherwise noted)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Continuous Source Current (Diode Conduction) Single Pulse Drain to Source Avalanche Energy (VDD = 100V, VGS=10V, IAS=2A, L=10mH, RG=25Ω) Total Power Dissipation @TC = 25 C Operating Junction Temperature Operating Junction and Storage Temperature Range Lead Temperature (1/8” from case)
o a,b
Symbol
VDS VGS ID IDM IS EAS PDTOT TJ TJ, TSTG TL
Limit
600 ±30 0.3 1.2 1 50 3 +150 -55 to +150 10
Unit
V V A A A mJ
o o
W C C S
1/8
Version: C07
TSM1N60S
600V N-Channel Power MOSFET
Thermal Performance
Parameter
Thermal Resistance - Junction to Ambient Thermal Resistance - Junction to Case Thermal Resistance - Junction to Lead Notes: Surface mounted on FR4 board t ≤ 10sec
Symbol
RӨJA RӨJC RӨJL
Limit
125 50 40
Unit
o o o
C/W C/W C/W
Electrical Specifications (Ta=25oC, unless otherwise noted)
Parameter
Static Drain-Source Breakdown Voltage Drain-Source On-State Resistance Gate Threshold Voltage Zero Gate Voltage Drain Current Gate Body Leakage Forward Transconductance Diode Forward Voltage Dynamic
b
Conditions
VGS = 0V, ID = 250uA VGS = 10V, ID = 0.3A VDS = VGS, ID = 250uA VDS = 600V, VGS = 0V VGS = ±20V, VDS = 0V VDS ≧50V, ID = 0.3A IS = 1A, VGS = 0V
Symbol
BVDSS RDS(ON) VGS(TH) IDSS IGSS gfs VSD Qg Qgs Qgd Ciss Coss Crss td(on)
Min
600 -2.0 ---------------
Typ
-11 ---5 -4.5 1.1 2 155 20 3 10 20 25 24
Max
-13 4.0 10 ± 100 -1.5 6 --200 26 4 30 50 45 60
Unit
V Ω V uA nA S V
Total Gate Charge Gate-Source Charge Gate-Drain Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Switching
c
VDS = 400V, ID = 1A, VGS = 10V VDS = 25V, VGS = 0V, f = 1.0MHz
nC
pF
Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time VGS = 10V, ID = 1A, VDS = 300V, RG = 6Ω
tr td(off)
nS
Turn-Off Fall Time tf Notes: a. Pulse test: pulse width
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