TSM3441
-20V P-Channel Enhancement-Mode MOSFET
SOT-26 Pin assignment: 1. Drain 6. Drain 2. Drain 5, Drain 3. Gate 4. Source
VDS = -20V RDS (on), Vgs @ -4.5V, Ids @ -3A =100mΩ RDS (on), Vgs @ -2.5V, Ids @ -2.0A =150mΩ
Features
Advanced trench process technology High density cell design for ultra low on-resistance Fully Characterized Avalanche Voltage and Curren t Improved Shoot-Through FO M
Block Diagram
P-C hannel MOSFET
Ordering Information
Part No . T S M3 4 4 1 C X 6 Packing T a p e & Re e l 3,000/per reel Pa c k a ge SOT-26
Absolute Maximum Rating (Ta = 25 oC unless otherwise noted)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Cu rrent, Pulsed Drain Current, Maximum Power Dissipation Operating Junction Tempera ture Operating Junction and S torage Temperatu re Range Ta = 25 C Ta = 70 C
o o
Symbol
VDS VGS ID IDM PD TJ TJ, TSTG
Limit
-20V ±8 -3 -10 2 1.3 +150 - 55 to +150
Unit
V V A A W
o o
C C
Thermal Performance
Parameter
Junction to Foot (Drain ) Thermal Resistance Junction to Ambient Thermal Resistance (PCB mounted) Note: Surface mounted on FR4 board t
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