TSM35N03CP

TSM35N03CP

  • 厂商:

    TSC

  • 封装:

  • 描述:

    TSM35N03CP - N-Channel Enhancement Mode MOSFET - Taiwan Semiconductor Company, Ltd

  • 详情介绍
  • 数据手册
  • 价格&库存
TSM35N03CP 数据手册
TSM35N03 Pin assignment: 1. Gate 2. Drain 3. Source Preliminary N-Channel Enhancement Mode MOSFET VDS = 30V ID = 50A RDS (on), Vgs @ 10V, Ids @ 30A = 8.5mΩ RDS (on), Vgs @ 4.5V, Ids @ 30A = 13mΩ Features Advanced trench process technology High Density Cell Design for Ultra Low On-Resistance Fully Characterized Avalanche Voltage and Current Specially Designed for DC/DC Converters and Motor Drivers Block Diagram Ordering Information Part No. TSM35N03CP Packing Tape & Reel Package TO-252 Absolute Maximum Rating (TA = 25 oC unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Maximum Power Dissipation Operating Junction Temperature Operating Junction and Storage Temperature Range Single Pulse Drain to Source Avalanche Energy (VDD = 100V, VGS=10V, IAS=2A, L=10mH, RG=25Ω) TA = 25 oC TA = 100 C o Symbol VDS VGS ID IDM PD TJ TJ, TSTG EAS Limit 30 ±20 50 350 57 23 +150 -55 to +150 300 Unit V V A W W/oC o o C C mJ Thermal Performance Parameter Lead Temperature (1/8” from case) Junction-to-case Thermal Resistance Junction to Ambient Thermal Resistance (PCB mounted) Note: 1. Maximum DC current limited by the package 2. 1-in2 2oz Cu PCB board Symbol TL Rθjc Rθja Limit 10 2.2 50 Unit S o C/W TSM35N03 1-3 2005/04 rev. A Electrical Characteristics TJ = 25 oC, unless otherwise noted Parameter Static Drain-Source Breakdown Voltage Drain-Source On-State Resistance Drain-Source On-State Resistance Gate Threshold Voltage Zero Gate Voltage Drain Current Gate Body Leakage Gate Resisrance Forward Transconductance Conditions Symbol Min Typ Max Unit VGS = 0V, ID = 250uA VGS = 4.5V, ID = 30A VGS = 10V, ID = 30A VDS = VGS, ID = 250uA VDS = 24V, VGS = 0V VGS = ± 20V, VDS = 0V BVDSS RDS(ON) RDS(ON) VGS(TH) IDSS IGSS Rg 30 --1.0 ----- -10.0 6.5 1.6 ----- -13.0 8.5 3.0 1.0 ± 100 --- V mΩ mΩ V uA nA VDS =10V, ID = 35A gfs S Dynamic Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 15V, VGS = 0V, f = 1.0MHz VDD = 15V, RL = 15Ω, ID = 1A, VGEN = 10V, RG = 24Ω VDS = 15V, ID = 35A, VGS = 10V Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss ----------24 5.4 4.0 15 3.2 36 4.8 1940 312 122 ----------pF nS nC Source-Drain Diode Max. Diode Forward Current Diode Forward Voltage IS = 20A, VGS = 0V Note: 1. pulse test: pulse width
TSM35N03CP
### 物料型号 - 型号:TSM35N03 - 封装:TO-252

### 器件简介 TSM35N03是一款N-Channel增强型MOSFET,特别适用于DC/DC转换器和电机驱动器。它采用先进的沟槽工艺技术,具有高密度单元设计,以实现超低导通电阻。

### 引脚分配 - 1. Gate(栅极) - 2. Drain(漏极) - 3. Source(源极)

### 参数特性 - 漏源电压(VDS):30V - 漏极电流(ID):50A - 导通电阻(RDS(on)): - 在Vgs@10V, Ids@30A时为8.5mΩ - 在Vgs@4.5V, Ids@30A时为13mΩ - 最大功耗(PD):在TA=100°C时为23W/°C - 工作结温(TJ):+150°C - 存储和工作温度范围(TJ, TSTG):-55至+150°C - 单脉冲漏源雪崩能量(EAS):300mJ

### 功能详解 TSM35N03具有全特性化的雪崩电压和电流,专为需要高密度单元设计和超低导通电阻的应用而设计。它采用先进的沟槽工艺技术,以提高性能和可靠性。

### 应用信息 TSM35N03适用于DC/DC转换器和电机驱动器等应用,能够在高电流和高电压环境下工作。

### 封装信息 - 封装类型:TO-252 - 尺寸:详细机械图纸提供了TO-252封装的详细尺寸,包括最小和最大尺寸,以英寸和毫米为单位。
TSM35N03CP 价格&库存

很抱歉,暂时无法提供与“TSM35N03CP”相匹配的价格&库存,您可以联系我们找货

免费人工找货