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TSM4435CSRL

TSM4435CSRL

  • 厂商:

    TSC

  • 封装:

  • 描述:

    TSM4435CSRL - 30V P-Channel MOSFET - Taiwan Semiconductor Company, Ltd

  • 详情介绍
  • 数据手册
  • 价格&库存
TSM4435CSRL 数据手册
T S M4 4 3 5 30V P-Channel MOSFET PRODUCT SUMMARY VDS (V) RDS(on)(mΩ) - 30 21 @ VGS = -10V 35 @ VGS = -4.5V SOP-8 Pin Definition: 1. Source 2. Source 3. Source 4. Gate 5, 6, 7 , 8. Drain ID (A) -9.1 -6.9 Features ● ● Advance Trench Process Technology High D ensity Cell Design for Ultr a Low On-resistance Block Diagram Application ● ● DC-DC Conversion Battery Sw itch P-Channel MOSFET Ordering Information Part No. TSM4435C S RL Package SOP-8 Packi ng 2.5Kpcs / 13” Reel Absolute Maximum Rating (Ta = 25oC unless otherwise noted) Parameter Drain-Source Voltage Gate- Source Voltage Continuous Drain Current Pulsed Drain Current Continuous Source Current (D iode Conduc tion) Maximum Power Dissipation Operating Junction Temperature Operating Junction and Storage Temperature Range a,b o o Symbol VDS VGS ID IDM IS PD TJ TJ, TSTG Ta = 25 C Ta = 75 C Limit - 30 ± 20 -9.1 - 50 -2.1 2.5 1.6 +1 5 0 - 55 to +150 Unit V V A A A W o o C C Thermal Performance Parameter Junction to Foot (Drain) Thermal R esistance Junction to Ambient Ther mal Resis tance (PC B mounted) Notes: a. Pulse width limited by the Maximum junction temper ature b. Sur face Mounted on FR4 Board, t ≤ 10 sec . Symbol R ӨJ F R ӨJ A Limit 22 50 Unit o o C/W C/W 1/ 6 Version: A07 T S M4 4 3 5 30V P-Channel MOSFET Electrical Specifications Parameter Static Drain-Source Breakdown Voltage Gate Threshold Voltage Gate Body Leakage Zero Gate Voltage Drain Current On-State Drain Current a a Conditi ons VGS = 0V, ID = -250uA VDS = VGS, ID = -250µ A VGS = ±20V, VDS = 0V VDS = -30V, VGS = 0V VDS = -5V, VGS = -10V VGS = -10V, ID = -9.1A VGS = -4.5V, ID = -6.9A VDS = -10V, ID = -9.1A IS = -2.1A, VGS = 0V Symbol BVDSS VGS(TH) IGSS IDSS ID(ON) RDS(ON) gf s VSD Qg Qgs Qgd Ciss Coss Crss td(on) tr td(off) Mi n - 30 -1 --- 40 --------------- Ty p -----17 25 24 -0.8 33 5.8 8.6 1573 319 211 10 15 110 70 Max --3 ± 100 -1.0 -21 35 --1.2 70 --1900 -295 15 25 170 110 Unit V V nA µA A mΩ S V Drain-Source On-State R esistance Forward Transconduc tance Diode Forward Voltage Dynamic b a Total Gate Charge Gate- Source Charge Gate-Drain C harge Input Capacitance Output Capacitance Reverse Trans fer C apacitance Switching c VDS = -15V, ID = -9.1A, VGS = -10V VDS = -15V, VGS = 0V, f = 1.0MHz nC pF Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time VDD = -15V, RL = 15Ω, ID = -1A, VGEN = -10V, nS R G = 6Ω Turn-Off Fall Time tf Notes: a. pulse tes t: PW ≤ 300µ S, duty cycle ≤2% b. For D ESIGN AID ONLY, not subjec t to produc tion testing. b. Switching time is essentially independent of operating temperature. 2/ 6 Version: A07 T S M4 4 3 5 30V P-Channel MOSFET Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted) Output C haracterist ics Transf er C haracteristics On-Resistance vs. Drain Current Gate C harge On-Resistance vs. Junct ion Temperature Source-Drain D iode Forward Voltage 3/ 6 Version: A07 T S M4 4 3 5 30V P-Channel MOSFET Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted) On-Resistance vs. Gate- Source Voltage Threshold Voltage Single Pulse Power Normalized Thermal Transient Impedance, Junction-to-Ambient 4/ 6 Version: A07 T S M4 4 3 5 30V P-Channel MOSFET SOP-8 Mechanical Drawing DIM A B C D F G K M P R SOP-8 DIMEN SION MILLIMETER S INCH ES MIN MAX MIN MAX. 4.80 5.00 0.189 0.196 3.80 4.00 0.150 0.157 1.35 1.75 0.054 0.068 0.35 0.49 0.014 0.019 0.40 1.25 0.016 0.049 1.27BSC 0.05BSC 0.10 0.25 0.004 0.009 0º 7º 0º 7º 5.80 6.20 0.229 0.244 0.25 0.50 0.010 0.019 Marking Diagram Y = Year Code M = Month C ode (A=Jan, B =Feb, C=Mar, D=Apl, E=May, F=Jun, G=Jul, H=Aug, I=Sep, J=Oct, K=Nov , L=Dec) L = Lo t C ode 5/ 6 Version: A07 T S M4 4 3 5 30V P-Channel MOSFET Notice Specifications of the produc ts displayed herein are s ubject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Infor mation contained herein is intended to pr ovide a product description only. N o license, express or implied, to any intellectual proper ty rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products , TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a par ticular purpose, merchantability, or infringement of any patent, copyright, or other intellectual proper ty right. The products shown herein are not designed for use in medical, life-saving, or life-sus taining applications . C ustomers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6/ 6 Version: A07
TSM4435CSRL
物料型号: - TSM4435CS RL SOP-8

器件简介: - TSM4435是一款30V P-Channel MOSFET,采用先进的沟槽工艺技术和高密度单元设计,具有超低导通电阻。

引脚分配: - 1. Source - 2. Source - 3. Source - 4. Gate - 5, 6, 7, 8. Drain

参数特性: - 漏源电压(VDS):-30V - 栅源电压(VGS):±20V - 连续漏极电流(ID):-9.1A - 脉冲漏极电流(IDM):-50A - 连续源极电流(IS):-2.1A - 最大功率耗散(PD):2.5W @ Ta = 25°C - 工作结温范围(TJ, TSTG):-55 to +150°C - 封装热阻(RӨJF):22°C/W

功能详解: - TSM4435适用于DC-DC转换、电池开关等应用。 - 特点包括高密度单元设计、超低导通电阻和先进的沟槽工艺技术。

应用信息: - 适用于DC-DC转换和电池开关等应用。

封装信息: - SOP-8封装,2.5Kpcs/13英寸卷装。
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