TSM6988D_08

TSM6988D_08

  • 厂商:

    TSC

  • 封装:

  • 描述:

    TSM6988D_08 - 20V Dual N-Channel MOSFET w/ESD Protected - Taiwan Semiconductor Company, Ltd

  • 详情介绍
  • 数据手册
  • 价格&库存
TSM6988D_08 数据手册
TSM6988D 20V Dual N-Channel MOSFET w/ESD Protected PRODUCT SUMMARY VDS (V) RDS(on)(mΩ) 20 25 @ VGS = 4.5V 33 @ VGS = 2.5V SOT-26 Pin Definition: 1. Gate 2 6. Source 2 2. Drain 5, Drain 3. Gate 1 4. Source 1 ID (A) 5.4 4.3 Features ● ● Advance Trench Process Technology High Density Cell Design for Ultra Low On-resistance Block Diagram Application ● ● Specially Designed for Li-on Battery Packs Battery Switch Application Ordering Information Part No. TSM6988DCX6 RF Package SOT-26 Packing 3Kpcs / 7” Reel Dual N-Channel MOSFET Absolute Maximum Rating (Ta = 25oC unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current, VGS @4.5V. Pulsed Drain Current, VGS @4.5V Continuous Source Current (Diode Conduction) Maximum Power Dissipation Operating Junction Temperature Operating Junction and Storage Temperature Range a,b o o Symbol VDS VGS ID IDM IS PD TJ TJ, TSTG Ta = 25 C Ta = 75 C Limit 20 ±12 6 30 1.4 1.25 0.8 +150 -55 to +150 Unit V V A A A W o o C C Thermal Performance Parameter Junction to Foot (Drain) Thermal Resistance Junction to Ambient Thermal Resistance (PCB mounted) Notes: a. Pulse width limited by the Maximum junction temperature b. Surface Mounted on FR4 Board, t ≤ 5 sec. Symbol RӨJF RӨJA Limit 30 100 Unit o o C/W C/W 1 /6 Version: B07 TSM6988D 20V Dual N-Channel MOSFET w/ESD Protected Electrical Specifications Parameter Static Drain-Source Breakdown Voltage Gate Threshold Voltage Gate Body Leakage Zero Gate Voltage Drain Current On-State Drain Current Drain-Source On-State Resistance Forward Transconductance Diode Forward Voltage Dynamic b Conditions VGS = 0V, ID = 250uA VDS = VGS, ID = 250uA VGS = ±12V, VDS = 0V VDS = 16V, VGS = 0V VDS ≥5V, VGS = 4.5V VGS = 4.5V, ID = 5.4A VGS = 2.5V, ID = 4.5A VDS = 10V, ID = 6.0A IS = 1.5A, VGS = 0V Symbol BVDSS VGS(TH) IGSS IDSS ID(ON) RDS(ON) gfs VSD Qg Qgs Qgd Ciss Coss Crss td(on) tr td(off) Min 20 0.6 --30 --------------- Typ -0.8 ---20 26 30 0.6 15 3.4 1.2 950 450 135 140 210 3700 2000 Max -1.0 ±10 1.0 -25 33 -1.2 20 -----200 250 4800 2600 Unit V V uA uA A mΩ S V Total Gate Charge Gate-Source Charge Gate-Drain Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Switching c VDS = 10V, ID = 6A, VGS = 4.5V VDS = 10V, VGS = 0V, f = 1.0MHz nC pF Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time VDD = 10V, RL = 10Ω, ID = 1A, VGEN = 4.5V, nS RG = 6Ω Turn-Off Fall Time tf Notes: a. pulse test: PW ≤300µS, duty cycle ≤2% b. For DESIGN AID ONLY, not subject to production testing. b. Switching time is essentially independent of operating temperature. 2 /6 Version: B07 TSM6988D 20V Dual N-Channel MOSFET w/ESD Protected Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted) Output Characteristics Transfer Characteristics On-Resistance vs. Drain Current Gate Charge On-Resistance vs. Junction Temperature Source-Drain Diode Forward Voltage 3 /6 Version: B07 TSM6988D 20V Dual N-Channel MOSFET w/ESD Protected Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted) On-Resistance vs. Gate-Source Voltage Threshold Voltage Single Pulse Power Normalized Thermal Transient Impedance, Junction-to-Ambient 4 /6 Version: B07 TSM6988D 20V Dual N-Channel MOSFET w/ESD Protected SOT-26 Mechanical Drawing DIM A A1 B C D E F G H I J SOT-26 DIMENSION MILLIMETERS INCHES MIN MIN TYP MAX TYP 0.95 BSC 1.9 BSC 2.60 1.40 2.80 1.00 0.00 0.35 0.10 0.30 5º 2.80 1.50 2.90 1.10 -0.40 0.15 --3.00 1.70 3.10 1.20 0.10 0.50 0.20 0.60 10º 0.1024 0.0551 0.1101 0.0394 0.00 0.0138 0.0039 0.0118 5º 0.0157 0.0059 --0.0374 BSC MAX 0.0748 BSC 0.1102 0.1181 0.0591 0.1142 0.0433 0.0669 0.1220 0.0472 0.0039 0.0197 0.0079 0.0236 10º Marking Diagram 88 = Device Code Y = Year Code M = Month Code (A=Jan, B=Feb, C=Mar, D=Apl, E=May, F=Jun, G=Jul, H=Aug, I=Sep, J=Oct, K=Nov, L=Dec) L = Lot Code 5 /6 Version: B07 TSM6988D 20V Dual N-Channel MOSFET w/ESD Protected Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 /6 Version: B07
TSM6988D_08
物料型号: - TSM6988D

器件简介: - TSM6988D是一款20V双N沟道MOSFET,具有ESD保护功能。

引脚分配: - 1. Gate 2 - 2. Drain - 3. Gate 1 - 4. Source 1 - 5. Drain - 6. Source 2

参数特性: - 漏源电压(VDs):20V - 漏源导通电阻(RDS(on)):在VGS=4.5V时为25mΩ,在VGS=2.5V时为43mΩ - 连续漏极电流(ID):6A(在VGS=4.5V时),5.4A(在VGS=2.5V时) - 脉冲漏极电流(IDM):30A - 静态功耗(PD):1.25W(在Ta=25°C时),0.8W(在Ta=75°C时) - 最大功耗(Ta=75°C时):0.8W - 工作结温(TJ):+150°C - 工作结温和存储温度范围(TJ, TSTG):-55 to +150°C

功能详解: - 采用先进的沟槽工艺技术和高密度单元设计,实现超低导通电阻。 - 特别为锂离子电池组和电池开关应用而设计。

应用信息: - 适用于锂离子电池组和电池开关应用。

封装信息: - SOT-26封装。 - 封装尺寸和标记图在文档中有详细描述。
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