UM61512AV-15

UM61512A Series 64K X 8 BIT HIGH SPEED CMOS SRAM Features Single +5V power supply Access times: 15/20/25ns (max.) Current: Operating: 160mA (max.) Standby: 10mA (max.) Full static operation, no clock or refreshing required All inputs and outputs are directly TTL compatible Common I/O using three-state output Output enable and two chip enable inputs for easy application Data retention voltage: 3V (min.) Available in 32-pin SKINNY DIP, TSOP, SOP, SOJ and both 300/400 mil packages General Description The UM61512A is a low operating current 524,288-bit static random access memory organized as 65,536 words by 8 bits and operates on a single 5V power supply. It is built using UMC's high performance CMOS process. Inputs and three-state outputs are TTL compatible and allow for direct interfacing with common system bus structures. Two chip enable inputs are provided for POWER-DOWN and device enable and an output enable input is included for easy interfacing. Data retention is guaranteed at a power supply voltage as low as 3V. Pin Configurations SKINNY/SOJ/SOP 1 2 3 4 5 6 VCC A15 CE2 WE A13 A8 A9 A11 OE A10 CE1 I/O8 I/O7 I/O6 I/O5 I/O4 17 32 16 1 TSOP (forward type) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NC NC A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 GND 32 31 30 29 28 27 Pin Name A11 A9 A8 A13 WE CE2 A15 VCC NC NC A14 A12 A7 A6 A5 A4 Pin No. 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Pin Name A3 A2 A1 A0 I/O1 I/O2 I/O3 GND I/O4 I/O5 I/O6 I/O7 I/O8 CE1 A10 OE UM61512AV UM61512A 7 8 9 10 11 12 13 14 15 16 26 25 24 23 22 21 20 19 18 17 1 UM61512A Block Diagram A0 VCC GND 512 X 2048 DECODER A13 A14 A15 MEMORY ARRAY I/O1 INPUT DATA CIRCUIT I/O8 COLUMN I/O CE2 CE1 OE WE CONTROL CIRCUIT Pin Descriptions Pin No. 1, 2 3 - 12, 23, 25 - 28, 31 13 - 15, 17 - 21 16 22 24 29 30 32 SKINNY/SOJ/SOP Symbol NC A0 - A15 I/O1 - I/O8 GND CE1 OE WE CE2 VCC Description No Connection Address Inputs Data Input/Outputs Ground Chip Enable Output Enable Write Enable Chip Enable Power Supply Pin Description Pin No. 1 - 4, 7, 11 - 20, 31 5 6 8 9, 10 21 - 23, 25 - 29 24 30 32 TSOP Symbol A0 - A15 WE CE2 VCC NC I/O1 - I/O8 GND CE1 OE Description Address Inputs Write Enable Chip Enable Power Supply No Connection Data Input/Outputs Ground Chip Enable Output Enable 2 UM61512A Recommended DC Operating ConditionsTA = 0°C to + 70 °C) ( Symbol VCC GND VIH VIL CL TTL Parameter Supply Voltage Ground Input High Voltage Input Low Voltage Output Load Output Load Min. 4.75 0 2.2 -0.3 Typ. 5.0 0 3.5 0 Max. 5.25 0 VCC + 0.3 +0.8 30 1 Unit V V V V pF - Absolute Maximum Ratings* VCC to GND . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC +0.5V Operating Temperature, Topr . . . . . . . . . . 0 °C to +70 °C Storage Temperature, Tstg . . . . . . . . . . -55 °C to +125 °C Temperature Under Bias, Tbias . . . . . . . -10 °C to +85 °C Power Dissipation, Pt . . . . . . . . . . . . . . . . . . . . . . 1.0W Soldering Temp. & Time . . . . . . . . . . . . . 260 °C, 10 sec *Comments Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics (TA = 0°C to + 70 °C, VCC = 5V ± 5%, GND = 0V) Symbol Parameter UM61512A-15/20/25 Min. ILI ILO Input Leakage Current Output Leakage Current Max. 2 2 µA µA VIN = GND to VCC CE1 = VIH or CE2 = V IL or OE = VIH or WE = VIL VI/O = GND to VCC CE1 = VIL, CE2 = VIH II/O = 0 mA CE1 = VIH or CE2 = V IL CE1 ≥ VCC - 0.2V, CE2 ≥ VCC - 0.2V, VIN ≤ 0.2V or V IN ≥ VCC - 0.2V Unit Conditions ICC1 (1) ISB ISB1 Dynamic Operating Current - 160 30 20 mA mA mA Standby Power Supply Current ISB2 20 mA CE1 ≤ 0.2V, CE2 ≤ 0.2V IOL = 8 mA IOH = -4 mA VIN ≤ 0.2V or V IN ≥ VCC - 0.2V VOL VOH Output Low Voltage Output High Voltage 2.4 0.4 - V V Note: 1. I CC1 is dependent on output loading, cycle rates, and Read/Write patterns. 3 UM61512A Truth Table Mode Standby CE1 H X Output Disable Read Write Note: X = H or L L L L CE2 X L H H H OE X X H L X WE X X H H L I/O Operation High Z High Z High Z DOUT DIN Supply Current ISB, ISB1 ISB, ISB2 ICC1 ICC1 ICC1 Capacitance (TA = 25°C, f = 1.0 MHz) Symbol CIN * CI/O * Parameter Input Capacitance Input/Output Capacitance Min. Max. 8 10 Unit pF pF Conditions VIN = 0V VI/O = 0V * These parameters are sampled and not 100% tested. AC Characteristics (TA = 0°C to +70 °C, VCC = 5V ± 10%) Symbol Parameter UM61512A-15 Min. Read Cycle tRC tAA tACE1 tACE2 tOE tCLZ1 tCLZ2 tOLZ tCHZ1 tCHZ2 tOHZ tOH Output Disable to Output in High Z Output Hold from Address Change Output Enable to Output in Low Z Chip Disable to Output in High Z CE1 CE2 Output Enable to Output Valid Chip Enable to Output in Low Z CE1 CE2 Read Cycle Time Address Access Time Chip Enable Access Time CE1 CE2 15 5 5 2 2 3 15 15 15 7 10 10 9 20 5 5 2 2 5 20 20 20 9 * 10 10 9 25 5 5 2 2 5 25 25 25 12 15 15 10 ns ns ns ns ns ns ns ns ns ns ns ns Max. UM61512A-20 Min. Max. UM61512A-25 Min. Max. Unit 4 UM61512A AC Characteristics (continued) Symbol Parameter UM61512A-15 Min. Write Cycle tWC tCW tAS tAW tWP tWR tWHZ tDW tDH tOW Write Cycle Time Chip Enable to End of Write Address Setup Time of Write Address Valid to End of Write Write Pulse Width Write Recovery Time Write to Output in High Z Data to Write Time Overlap Data Hold from Write Time Output Active from End of Write 15 12 0 12 9 0 0 7 0 5 20 15 0 15 8 20 15 0 15 11 0 0 7 0 5 25 20 0 20 13 25 20 0 20 13 13 ns ns ns ns ns ns ns ns ns ns Max. UM61512A-20 Min. Max. UM61512A-25 Min. Max. Unit Notes: tCHZ1, tCHZ2, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. Timing Waveforms Read Cycle 1 (1,2,4) tRC Address tAA tOH tOH DOUT 5 UM61512A Timing Waveforms (continued) Read Cycle 2 (1,3,4,6) CE1 tACE1 tCLZ15 tCHZ15 DOUT Read Cycle 3 (1,4,7,8) CE2 tACE2 tCLZ25 tCHZ25 DOUT 6 UM61512A Timing Waveforms (continued) Read Cycle 4 (1) tRC Address tAA OE tOE tOLZ5 CE1 tOH tACE1 tCLZ25 tCHZ15 CE2 tACE2 tCLZ25 DOUT tOHZ5 tCHZ25 Notes: 1. 2. 3. 4. 5. 6. 7. 8. WE is high for Read Cycle. Device is continuously enabled CE1 = VIL and CE2 = V IH. Address valid prior to or coincident with CE1 transition low. OE = VIL. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. CE2 is high. CE1 is low. Address valid prior to or coincident with CE2 transition high. 7 UM61512A Timing Waveforms (continued) Write Cycle 1 (Write Enable Controlled) (6) tWC Address tAW tCW5 CE1 (4) tWR3 CE2 (4) tAS1 tWP2 WE tDW DIN tWHZ tDH tOW DOUT 8 UM61512A Timing Waveforms (continued) Write Cycle 2 (Chip Enable Controlled) tWC Address tAW tCW5 CE1 tAS1 (4) tWR3 CE2 (4) tCW5 tWP2 WE tDW tDH DIN tWHZ7 DOUT Notes: 1. 2. 3. 4. tAS is measured from the address valid to the beginning of Write. A Write occurs during the overlap (t WP) of a low CE1, a high CE2 and a low WE . tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after the WE transition, outputs remain in a high impedance state. 5. tCW is measured from the later of CE going low or CE2 going high to the end of Write. 6. OE is continuously low. ( OE = VIL) 7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. 9 UM61512A AC Test Conditions Input Pulse Levels Input Rise and Fall Time Input and Output Timing Reference Levels Output Load 0V to 3.0V 5 ns 1.5V See Figures 1 and 2 +5V 480Ω I/O I/O +5V 480Ω 255 Ω 30pF* 255 Ω 5pF* * Including scope and jig. * Including scope and jig. Figure 1.Output Load Figure 2. Output Load for t LZ1, C tCLZ2, tOLZ, tCHZ1, tCHZ2, tOHZ, tWHZ, and tOW Data Retention Characteristics (TA = 0°C to 70 °C) Symbol VDR1 VCC for Data Retention VDR2 3 5.25 V Parameter Min. 3 Max. 5.25 Unit V Conditions CE1 ≥ VCC - 0.2V CE2 ≥ VCC - 0.2V or CE2 ≤ 0.2V CE2 ≤ 0.2V CE1 ≥ VCC - 0.2V or CE1 ≤ 0.2V VCC = 3.0V CE1 ≥ VCC - 0.2V CE2 ≥ VCC - 0.2V VIN ≥ VCC - 0.2V or VIN ≤ 0.2V VCC = 3.0V CE2 ≤ 0.2V CE1 ≤ 0.2V VIN ≥ VCC - 0.2V or VIN ≤ 0.2V See Retention Waveform 5 ms ICCDR1 - 5 mA Data Retention Current ICCDR2 5 mA tCDR tR Chip Disable to Data Retention Time Operation Recovery Time 0 - ns 10 UM61512A Low VCC Data Retention Waveform (1) CE1 Controlled) ( DATA RETENTION MODE VCC 4.75V tCDR VDR ≥ 3V 4.75V tR CE1 VIH CE1 ≥ VDR - 0.2V VIH Low VCC Data Retention Waveform (2) (CE2 Controlled) DATA RETENTION MODE VCC 4.75V tCDR VDR ≥ 3V 4.75V tR CE2 VIL CE2 ≤ 0.2V VIL Ordering Information Part No. UM61512AK-15 UM61512AK-20 UM61512AS-15 UM61512AS-20 UM61512ASW-15 UM61512ASW-20 UM61512AM-25 UM61512AV-15 Access Time (ns) 15 20 15 20 15 20 25 15 Operating Current Max. (mA) 160 160 160 160 160 160 160 160 Standby Current Max. (mA) 10 10 10 10 10 10 10 10 Package 32L SKINNY 32L SKINNY 32L SOJ (300 mil) 32L SOJ (300 mil) 32L SOJ (400 mil) 32L SOJ (400 mil) 32L SOP 32L TSOP 11 UM61512A Package Information SKINNY 32L Outline Dimensions D 32 17 unit: inches/mm E1 1 S 16 E C A2 A A1 Base Plane L Seating Plane B B1 e1 £\ eA Symbol A A1 A2 B B1 C D E E1 e1 L £\ eA S Dimensions in inches 0.200 Max. 0.015 Min. 0.130¡Ó 0.010 0.018 +0.004 -0.002 0.050 +0.004 -0.002 0.010 +0.004 -0.002 1.600 Typ. (1.620 Max.) 0.310¡Ó 0.010 0.288 Typ. (0.300 Max.) 0.100¡Ó 0.007 0.130¡Ó 0.010 0° ~ 15° 0.355¡Ó 0.035 0.059 Max. Dimensions in mm 5.08 Max. 0.38 Min. 3.30¡Ó 0.25 0.46 +0.10 -0.05 1.27 +0.10 -0.05 0.25 +0.10 -0.05 40.64 Typ. (41.15 Max.) 7.87¡Ó 0.25 7.32 Typ. (7.62 Max.) 2.54¡Ó 0.18 3.30¡Ó 0.25 0° ~ 15° 9.02¡Ó 0.89 1.50 Max. Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E 1 does not include resin fins. 3. Dimension S includes end flash. 12 UM61512A Package Information SOJ 32/32LD (300mil BODY) Outline Dimensions D 32 17 b unit: inches/mm F F DETAIL "A" BASE METAL WITH PLATING SECTION F-F 1 16 E DETAIL "A" HE b1 A2 A s SEATING PLANE b e MIN 0.026" y y e1 0.004 y Symbol A A1 A2 b b1 c D HE E e1 e s y Dimensions in inches Min. 0128 0.052 0.095 0.016 0.026 0.006 0.820 0.330 0.295 0.260 Nom. 0.132 0.100 0.018 0.028 0.008 0.825 0.335 0.300 0.267 0.050 Max. 0.140 0.105 0.020 0.032 0.012 0.830 0.340 0.305 0.274 0.048 0.004 D A1 Dimensions in mm Min. 3.25 2.08 2.41 0.41 0.66 0.15 20.83 8.39 7.49 6.61 Nom. 3.35 2.54 0.46 0.71 0.20 20.96 8.51 7.62 6.78 1.27 Max. 3.56 2.67 0.51 0.81 0.30 21.08 8.63 7.75 6.96 1.22 0.10 Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E doesn't include resin fins. 3. Dimension e 1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. 13 c UM61512A Package Information SOJ 32/32LD (400mil BODY) Outline Dimensions D 32 17 b b1 unit: inches/mm E1 F F DETAIL "A" BASE METAL WITH PLATING SECTION F-F 1 16 DETAIL "A" E b2 A2 A S SEATING PLANE b e MIN 0.025" y y E2 0.004 y Symbol A A1 A2 b b2 c D E E1 E2 e S y Dimensions in inches Min. 0.131 0.082 0.105 0.016 0.026 0.006 0.820 0.435 0.395 0.360 Nom. 0.138 0.110 0.018 0.028 0.008 0.825 0.440 0.400 0.370 0.050 Max. 0.145 0.115 0.020 0.032 0.011 0.830 0.445 0.405 0.380 0.045 0.004 D A1 Dimensions in mm Min. 3.35 2.08 2.67 0.41 0.66 0.15 20.83 11.05 10.03 9.15 Nom. 3.51 2.79 0.46 0.71 0.20 20.96 11.18` 10.16 9.40 1.27 Max. 3.68 2.91 0.51 0.81 0.28 21.08 11.31 10.29 9.65 1.14 0.10 Notes: 1. Dimension D includes end flash. 2. Dimension E doesn't include resin fins. 3. Dimension E 1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. 14 c1 c UM61512A Package Information SOP (W.B.) 32L Outline Dimensions 32 17 e1 ~ ~ unit: inches/mm HE E L 1 b 16 Detail F e1 c A2 A D s Seating Plane y D e A1 LE See Detail F Symbol A A1 A2 b c D E e e1 HE L LE S y θ Dimensions in inches 0.118 Max. 0.004 Min. 0.106¡Ó 0.005 0.016 +0.004 -0.002 0.008 +0.004 -0.002 0.805 Typ. (0.820 Max.) 0.445¡Ó 0.010 0.050 ¡Ó 0.006 0.525 NOM. 0.556¡Ó 0.010 0.031¡Ó 0.008 0.055¡Ó 0.008 0.044 Max. 0.004 Max. 0° ~ 10° Dimensions in mm 3.00 Max. 0.10 Min. 2.69¡Ó 0.13 0.41 +0.10 -0.05 0.20 +0.10 -0.05 20.45 Typ. (20.83 Max.) 11.30¡Ó 0.25 1.27¡Ó 0.15 13.34 NOM. 14.12¡Ó 0.25 0.79¡Ó 0.20 1.40¡Ó 0.20 1.12 Max. 0.10 Max. 0° ~ 10° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension e 1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. 15 UM61512A Package Information TSOP 32L TYPE I (8 X 20mm) Outline Dimensions D unit: inches/mm e A2 12.0 ¢X c A GAUGE PLANE E A1 £c 0.25 BSC L LE HD Detail "A" Detail "A" y D S b 0.10(0.004) M Symbol A A1 A2 b c D E e HD L LE S Y θ Dimensions in inches 0.047 Max. 0.004¡Ó 0.002 0.039¡Ó 0.002 0.008¡Ó 0.001 0.006¡Ó 0.001 0.724¡Ó 0.004 0.315¡Ó 0.004 0.020 TYP. 0.787¡Ó 0.007 0.020¡Ó 0.004 0.031 TYP. 0.0167 TYP. 0.004 Max. 0° ~ 6 ° Dimensions in mm 1.20 Max. 0.10¡Ó 0.05 1.00¡Ó 0.05 0.20¡Ó 0.03 0.15¡Ó 0.02 18.40¡Ó 0.10 8.00¡Ó 0.10 0.50 TYP. 20.00¡Ó 0.20 0.50¡Ó 0.10 0.80 TYP. 0.425 TYP. 0.10 Max. 0° ~ 6 ° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension e 1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. 16